CN207216499U - Industrial computer main board - Google Patents
Industrial computer main board Download PDFInfo
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- CN207216499U CN207216499U CN201721158847.8U CN201721158847U CN207216499U CN 207216499 U CN207216499 U CN 207216499U CN 201721158847 U CN201721158847 U CN 201721158847U CN 207216499 U CN207216499 U CN 207216499U
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- control module
- platform management
- management control
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- 238000012545 processing Methods 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims description 40
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 238000009413 insulation Methods 0.000 claims description 33
- 230000015654 memory Effects 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 239000010410 layer Substances 0.000 claims description 28
- 239000011889 copper foil Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 24
- 230000006855 networking Effects 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000012546 transfer Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 230000006870 function Effects 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000012827 research and development Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
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- 241000894007 species Species 0.000 description 1
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Abstract
The utility model discloses a kind of industrial computer main board, its central data processor is used for data processing, the platform management control module is used for the input-output operation for controlling peripheral components, the EC embedded controllers are responsible for power supply and switching on and shutting down sequential in control mainboard, and the PCIE/SRIO protocol translations module is used for PCIE protocol datas and changed with SRIO protocol datas；It is bi-directionally connected between central data processor, platform management control module by DMI buses, central data processor, PCIE/SRIO protocol translation modules are bi-directionally connected between one end by PCIE buses；Central data processor is connected with the 5th VPX connectors, and the PCIE/SRIO protocol translations module other end is connected to the first VPX connectors by SRIO buses.The utility model industrial computer main board realizes multi-functional, multiplex roles, expansible, facilitates the function of extended products, realizes and the product of numerous standards of industry is compatible.
Description
Technical field
A kind of communication mainboard is the utility model is related to, belongs to digital information processing system technical field.
Background technology
Industrial control computer, it is that one kind uses bus structures, production process and its electromechanical equipment, technological equipment is carried out
The instrument general name of Detection ＆ Controling, it has important computer attribute and a feature, and the critical piece inside industrial computer is just
It is industrial control computer mainboard.The rich interface of industrial control mainboard, species are various.A industrial master board is divided into two parts, first, high speed core
Core part, second, peripheral interface expansion.But a kind of industrial control computer mainboard is developed, because involving setting for core board
Meter, it is necessary to R＆D cycle it is very long, risk is very high.
The content of the invention
The utility model purpose is to provide a kind of industrial computer main board, and the industrial computer main board overcomes existing mainboard
The defects of function is single, interface is limited, multi-functional, multiplex roles, expansible are realized, facilitates the function of extended products, realizes
It is compatible with the product of numerous standards of industry, there is abundant industry standard interface.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of industrial computer main board, including circuit
Plate, the central data processor being installed on circuit board, platform management control module, EC embedded controllers, PCIE/SRIO associations
It is double to discuss conversion module, PCI/PCIE protocol translations module, gigabit networking process chip, on-board hard disk and central data processor
Memory on board and DDI memory expansion interface units to connection, the central data processor are used for data processing, the platform pipe
Reason control module is used for the input-output operation for controlling peripheral components, and the EC embedded controllers are responsible for the electricity in control mainboard
Source and switching on and shutting down sequential, the PCIE/SRIO protocol translations module are used for PCIE protocol datas and changed with SRIO protocol datas, institute
State PCI/PCIE protocol translations module and be used for PCI protocol datas and the conversion of PCIE protocol datas, the gigabit networking process chip
For improving data transfer bandwidth and network speed, the memory on board is used to store the intermediate data in CPU processing procedures, described
DDI memory expansions interface unit is used to patch memory bar so as to exented memory capacity；
It is bi-directionally connected between the central data processor, platform management control module by DMI buses, the central number
It is bi-directionally connected according between processor, PCIE/SRIO protocol translation modules one end by PCIE buses, the platform management controls mould
Block, PCI/ PCIE protocol translation modules are bi-directionally connected between one end by PCIE buses, the platform management control module, thousand
It is bi-directionally connected between million network processes chip one end by PCIE buses, the EC embedded controllers, platform management control mould
It is bi-directionally connected between block by lpc bus, the on-board hard disk is connected to platform management control module；
The central data processor is connected with the 5th VPX connectors, the PCIE/SRIO protocol translations module other end
First VPX connectors are connected to by SRIO buses, a SPI Flash passes through spi bus and the two-way company of platform management control module
Connect, the BIOS that this SPI Flash is used for storing initial peripheral components is instructed, and the gigabit networking process chip other end is connected with
RJ45 sockets and the 4th VPX connectors, the PCI/PCIE protocol translations module other end are connected with PMC connectors；
The circuit board further comprises insulate cured plate, upper copper foil pattern layer and lower copper foil pattern layer, and the insulation is admittedly
Changing has upper insulation adhesive layer between plate and upper copper foil pattern layer, under having between the insulation cured plate and lower copper foil pattern layer
Insulate adhesive layer, and the insulation cured plate is built-in with several spaced metal long blocks, and this metal long block both ends is exposed
Go out the side end face of cured plate of insulating, the long through-hole of at least one insertion metal long block is provided with the metal long block, the insulation is solid
Change plate and be provided with several vertical through hole, there is conductive pole in this vertical through hole, this conductive pole upper end and upper copper foil pattern layer conductance
Logical, this conductive pole lower end conducts with lower copper foil pattern layer, and the conductive pole insulate solidification between adjacent 2 metal long blocks
Plate region.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, a SATA interface device is connected to the platform management control module, this SATA interface device is used for
Connect the hard disk of extension.
2. in such scheme, a preposition USB joint one end is connected to the platform management control module, and this preposition USB connects
The other end of head is connected with USB.
3. in such scheme, one the 4th VPX connectors are connected to the gigabit networking process chip.
4. in such scheme, the long through-hole quantity in the metal long block is 2.
5. in such scheme, the thickness ratio of the insulation solidification plate thickness and metal long block thickness is 10：（5~8）.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
1. the utility model industrial computer main board, the defects of existing main board function is single, interface is limited is which overcomed,
Multi-functional, multiplex roles are realized, facilitate the function of extended products, realize compatible with the product of numerous standards of industry, are had
Abundant industry standard interface, a variety of demand of user is substantially met, reduces design risk, shorten research and development week
Phase.
2. the utility model industrial computer main board, its cured plate that insulate is built-in with several spaced metal length
Block, this metal long block both ends expose the side end face of insulation cured plate, and at least one insertion metal is provided with the metal long block
The long through-hole of long block, the conductive pole insulate cured plate region between adjacent 2 metal long blocks, and metal long block can quickly inhale
Heat caused by mainboard is received, the long through-hole of at least one insertion metal long block is provided with metal long block, is also beneficial to from communication
The heat of mainboard quickly transmits, and the air-flow be advantageous in metal substrate quickly flows, so as to which more heats be taken out of, so as to have
Beneficial to the service life for improving device, the reliability of product is improved, secondly, it is vertical logical that its cured plate that insulate is provided with several
Hole, this vertical through hole is interior to have conductive pole, and this conductive pole upper end conducts with upper copper foil pattern layer, this conductive pole lower end and lower copper
Paper tinsel patterned layer conducts, and has both improved the density of device layout, is advantageous to control panel and further reduces volume, it also avoid circuit
Short circuit etc., improve electrical reliability.
Brief description of the drawings
Accompanying drawing 1 is the utility model industrial computer main board structural representation；
Accompanying drawing 2 is the partial structural diagram of accompanying drawing 1；
Accompanying drawing 3 is board structure of circuit schematic diagram in the utility model industrial computer main board.
In the figures above：1st, central data processor；2nd, platform management control module；3rd, EC embedded controllers；4、
PCIE/SRIO protocol translation modules；5th, PCI/PCIE protocol translations module；6th, gigabit networking process chip；7th, on-board hard disk；8、
Memory on board；9th, DDI memory expansions interface unit；101st, the first VPX connectors；104th, the 4th VPX connectors；105th, the 5th VPX
Connector；11st, SPI Flash；12nd, RJ45 sockets；13rd, PMC connectors；14th, SATA interface device；15th, preposition USB joint；16、
USB；17th, EC flash memories；18th, keyboard and mouse interface；20th, circuit board；21st, insulate cured plate；22nd, upper copper foil pattern layer；
23rd, lower copper foil pattern layer；24th, upper insulation adhesive layer；25th, lower insulation adhesive layer；26th, metal long block；27th, long through-hole；28th, it is vertical
Through hole；29th, conductive pole.
Embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：At a kind of industrial computer main board, including circuit board 20, the central data that is installed on circuit board 20
Device 1, platform management control module 2, EC embedded controllers 3, PCIE/SRIO protocol translations module 4, PCI/PCIE agreements is managed to turn
Change module 5, gigabit networking process chip 6, on-board hard disk 7, the memory on board 8 being bi-directionally connected with central data processor 1 and DDI
Memory expansion interface unit 9, the central data processor 1 are used for data processing, and the platform management control module 2 is used to control
The input-output operation of peripheral components, the EC embedded controllers 3 are responsible for power supply and switching on and shutting down sequential in control mainboard, institute
State PCIE/SRIO protocol translations module 4 and be used for PCIE protocol datas and the conversion of SRIO protocol datas, the PCI/PCIE agreements turn
Change module 5 and be used for PCI protocol datas and the conversion of PCIE protocol datas, the gigabit networking process chip 6 is used to improve data biography
Defeated bandwidth and network speed, the memory on board 8 are used to store the intermediate data in CPU processing procedures, the DDI memory expansions interface
Device 9 is used to patch memory bar so as to exented memory capacity；
It is bi-directionally connected between the central data processor 1, platform management control module 2 by DMI buses, the center
Data processor 1, PCIE/SRIO protocol translations module 4 are bi-directionally connected between one end by PCIE buses, the platform management control
Molding block 2, PCI/ PCIE protocol translations module 5 are bi-directionally connected between one end by PCIE buses, and the platform management controls mould
Block 2, gigabit networking process chip 6 are bi-directionally connected between one end by PCIE buses, the EC embedded controllers 3, platform pipe
It is bi-directionally connected between reason control module 2 by lpc bus, the on-board hard disk 7 is connected to platform management control module 2；
The central data processor 1 is connected with the 5th VPX connectors 105, the PCIE/SRIO protocol translations module 4
The other end is connected to the first VPX connectors 101 by SRIO buses, and a SPI Flash 11 is controlled by spi bus and platform management
Module 2 is bi-directionally connected, and the BIOS that this SPI Flash 11 is used for storing initial peripheral components is instructed, and the gigabit networking handles core
The other end of piece 6 is connected with the VPX connectors 104 of RJ45 sockets 12 and the 4th, and the other end of PCI/PCIE protocol translations module 5 connects
It is connected to PMC connectors 13；
The circuit board 20 further comprises insulate cured plate 21, upper copper foil pattern layer 22 and lower copper foil pattern layer 23, institute
Stating between insulation cured plate 21 and upper copper foil pattern layer 22 has upper insulation adhesive layer 24, the insulation cured plate 21 and lower copper foil
There is lower insulation adhesive layer 25, the insulation cured plate 21 is built-in with several spaced metal long blocks between patterned layer 23
26, this both ends of metal long block 26 exposes the side end face of insulation cured plate 21, and being provided with least one in the metal long block 26 passes through
The long through-hole 27 of logical metal long block 26, the insulation cured plate 21 are provided with several vertical through hole 28, had in this vertical through hole 28
There is conductive pole 29, this upper end of conductive pole 29 conducts with upper copper foil pattern layer 22, this lower end of conductive pole 29 and lower copper foil pattern layer
23 conduct, and the conductive pole 29 insulate the region of cured plate 21 between adjacent 2 metal long blocks 26.
One SATA interface device 14 is connected to the platform management control module 2, and this SATA interface device 14, which is used to connect, to be extended
Hard disk.
One preposition one end of USB joint 15 is connected to the platform management control module 2, this preposition USB joint 15 it is another
End is connected with USB 16.
One the 4th VPX connectors 104 are connected to the gigabit networking process chip 6.
The thickness ratio of the above-mentioned thickness of insulation cured plate 21 and the thickness of metal long block 26 is 10：7.
Embodiment 2：At a kind of industrial computer main board, including circuit board 20, the central data that is installed on circuit board 20
Device 1, platform management control module 2, EC embedded controllers 3, PCIE/SRIO protocol translations module 4, PCI/PCIE agreements is managed to turn
Change module 5, gigabit networking process chip 6, on-board hard disk 7, the memory on board 8 being bi-directionally connected with central data processor 1 and DDI
Memory expansion interface unit 9, the central data processor 1 are used for data processing, and the platform management control module 2 is used to control
The input-output operation of peripheral components, the EC embedded controllers 3 are responsible for power supply and switching on and shutting down sequential in control mainboard, institute
State PCIE/SRIO protocol translations module 4 and be used for PCIE protocol datas and the conversion of SRIO protocol datas, the PCI/PCIE agreements turn
Change module 5 and be used for PCI protocol datas and the conversion of PCIE protocol datas, the gigabit networking process chip 6 is used to improve data biography
Defeated bandwidth and network speed, the memory on board 8 are used to store the intermediate data in CPU processing procedures, the DDI memory expansions interface
Device 9 is used to patch memory bar so as to exented memory capacity；
It is bi-directionally connected between the central data processor 1, platform management control module 2 by DMI buses, the center
Data processor 1, PCIE/SRIO protocol translations module 4 are bi-directionally connected between one end by PCIE buses, the platform management control
Molding block 2, PCI/ PCIE protocol translations module 5 are bi-directionally connected between one end by PCIE buses, and the platform management controls mould
Block 2, gigabit networking process chip 6 are bi-directionally connected between one end by PCIE buses, the EC embedded controllers 3, platform pipe
It is bi-directionally connected between reason control module 2 by lpc bus, the on-board hard disk 7 is connected to platform management control module 2；
The central data processor 1 is connected with the 5th VPX connectors 105, the PCIE/SRIO protocol translations module 4
The other end is connected to the first VPX connectors 101 by SRIO buses, and a SPI Flash 11 is controlled by spi bus and platform management
Module 2 is bi-directionally connected, and the BIOS that this SPI Flash 11 is used for storing initial peripheral components is instructed, and the gigabit networking handles core
The other end of piece 6 is connected with the VPX connectors 104 of RJ45 sockets 12 and the 4th, and the other end of PCI/PCIE protocol translations module 5 connects
It is connected to PMC connectors 13；
The circuit board 20 further comprises insulate cured plate 21, upper copper foil pattern layer 22 and lower copper foil pattern layer 23, institute
Stating between insulation cured plate 21 and upper copper foil pattern layer 22 has upper insulation adhesive layer 24, the insulation cured plate 21 and lower copper foil
There is lower insulation adhesive layer 25, the insulation cured plate 21 is built-in with several spaced metal long blocks between patterned layer 23
26, this both ends of metal long block 26 exposes the side end face of insulation cured plate 21, and being provided with least one in the metal long block 26 passes through
The long through-hole 27 of logical metal long block 26, the insulation cured plate 21 are provided with several vertical through hole 28, had in this vertical through hole 28
There is conductive pole 29, this upper end of conductive pole 29 conducts with upper copper foil pattern layer 22, this lower end of conductive pole 29 and lower copper foil pattern layer
23 conduct, and the conductive pole 29 insulate the region of cured plate 21 between adjacent 2 metal long blocks 26.
One the 4th VPX connectors 104 are connected to the gigabit networking process chip 6.
The quantity of long through-hole 27 in above-mentioned metal long block 26 is 2.
One EC flash memories 17 are connected to the EC embedded controllers 3, and this EC flash memory 17 is used for the firmware for storing EC and is responsible for
Upper electric information timing management.
One keyboard and mouse interface 18 are connected to the EC embedded controllers 3.
The thickness ratio of the above-mentioned thickness of insulation cured plate 21 and the thickness of metal long block 26 is 10：6.
During using above-mentioned industrial computer main board, the defects of existing main board function is single, interface is limited is which overcomed, is realized
Multi-functional, multiplex roles, facilitate the function of extended products, realize compatible with the products of numerous standards of industry, have abundant
Industry standard interface, substantially meet a variety of demand of user, reduce design risk, shorten the R＆D cycle；Its
Secondary, its metal long block can quickly absorb heat caused by mainboard, and the length that at least one insertion metal long block is provided with metal long block is led to
Hole, it is also beneficial to quickly transmit the heat from communication mainboard, the air-flow be advantageous in metal substrate quickly flows, so that will
More heats are taken out of, so as to be advantageous to improve the service life of device, improve the reliability of product, again, it was both improved
The density of device layout, is advantageous to control panel and further reduces volume, it also avoid short circuit of circuit etc., improve electrical
Reliability.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (6)
- A kind of 1. industrial computer main board, it is characterised in that：Including circuit board（20）, be installed on circuit board（20）On central number According to processor（1）, platform management control module（2）, EC embedded controllers（3）, PCIE/SRIO protocol translation modules（4）、 PCI/PCIE protocol translation modules（5）, gigabit networking process chip（6）, on-board hard disk（7）With central data processor（1）It is double To the memory on board of connection（8）With DDI memory expansion interface units（9）, the central data processor（1）For data processing, The platform management control module（2）For controlling the input-output operation of peripheral components, the EC embedded controllers（3）It is negative Blame the power supply and switching on and shutting down sequential in control mainboard, the PCIE/SRIO protocol translations module（4）For PCIE protocol datas with SRIO protocol datas are changed, the PCI/PCIE protocol translations module（5）Turn for PCI protocol datas and PCIE protocol datas Change, the gigabit networking process chip（6）For improving data transfer bandwidth and network speed, the memory on board（8）For storing Intermediate data in CPU processing procedures, the DDI memory expansions interface unit（9）For patching memory bar so as to which exented memory holds Amount；The central data processor（1）, platform management control module（2）Between be bi-directionally connected by DMI buses, the center Data processor（1）, PCIE/SRIO protocol translation modules（4）It is bi-directionally connected between one end by PCIE buses, the platform pipe Manage control module（2）, PCI/ PCIE protocol translation modules（5）It is bi-directionally connected between one end by PCIE buses, the platform pipe Manage control module（2）, gigabit networking process chip（6）It is bi-directionally connected between one end by PCIE buses, the embedded controls of EC Device processed（3）, platform management control module（2）Between be bi-directionally connected by lpc bus, the on-board hard disk（7）It is connected to platform Management control module（2）；The central data processor（1）It is connected with the 5th VPX connectors（105）, the PCIE/SRIO protocol translations module （4）The other end is connected to the first VPX connectors by SRIO buses（101）, a SPI Flash（11）Pass through spi bus and platform Management control module（2）It is bi-directionally connected, this SPI Flash（11）BIOS for storing initial peripheral components is instructed, and described thousand Million network processes chips（6）The other end is connected with RJ45 sockets（12）With the 4th VPX connectors（104）, the PCI/PCIE associations Discuss conversion module（5）The other end is connected with PMC connectors（13）；The circuit board（20）Further comprise the cured plate that insulate（21）, upper copper foil pattern layer（22）With lower copper foil pattern layer （23）, the insulation cured plate（21）With upper copper foil pattern layer（22）Between there is upper insulation adhesive layer（24）, the insulation is admittedly Change plate（21）With lower copper foil pattern layer（23）Between there is lower insulation adhesive layer（25）, the insulation cured plate（21）If it is built-in with Dry spaced metal long block（26）, this metal long block（26）Both ends expose insulation cured plate（21）Side end face, The metal long block（26）Inside it is provided with least one insertion metal long block（26）Long through-hole（27）, the insulation cured plate（21） It is provided with several vertical through hole（28）, this vertical through hole（28）It is interior that there is conductive pole（29）, this conductive pole（29）Upper end and upper copper Paper tinsel patterned layer（22）Conduct, this conductive pole（29）Lower end and lower copper foil pattern layer（23）Conduct, the conductive pole（29）Position In adjacent 2 metal long blocks（26）Between insulate cured plate（21）Region.
- 2. industrial computer main board according to claim 1, it is characterised in that：One SATA interface device（14）It is connected to described Platform management control module（2）, this SATA interface device（14）For connecting the hard disk of extension.
- 3. industrial computer main board according to claim 1, it is characterised in that：One preposition USB joint（15）One end connects To the platform management control module（2）, this preposition USB joint（15）The other end be connected with USB（16）.
- 4. industrial computer main board according to claim 1, it is characterised in that：One the 4th VPX connectors（104）It is connected to The gigabit networking process chip（6）.
- 5. industrial computer main board according to claim 1, it is characterised in that：The metal long block（26）Interior long through-hole （27）Quantity is 2.
- 6. industrial computer main board according to claim 1, it is characterised in that：The insulation cured plate（21）Thickness and gold Belong to long block（26）The thickness ratio of thickness is 10：（5~8）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721158847.8U CN207216499U (en) | 2017-09-10 | 2017-09-10 | Industrial computer main board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721158847.8U CN207216499U (en) | 2017-09-10 | 2017-09-10 | Industrial computer main board |
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| Publication Number | Publication Date |
|---|---|
| CN207216499U true CN207216499U (en) | 2018-04-10 |
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ID=61824140
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| CN201721158847.8U Expired - Fee Related CN207216499U (en) | 2017-09-10 | 2017-09-10 | Industrial computer main board |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109283981A (en) * | 2018-09-29 | 2019-01-29 | 重庆秦嵩科技有限公司 | A kind of blade apparatus having both high-performance and low-power consumption |
| CN113056096A (en) * | 2019-12-29 | 2021-06-29 | 苏州匠致电子科技有限公司 | Domestic control mainboard based on godson 2K |
-
2017
- 2017-09-10 CN CN201721158847.8U patent/CN207216499U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109283981A (en) * | 2018-09-29 | 2019-01-29 | 重庆秦嵩科技有限公司 | A kind of blade apparatus having both high-performance and low-power consumption |
| CN109283981B (en) * | 2018-09-29 | 2021-11-30 | 重庆秦嵩科技有限公司 | Blade device with high performance and low power consumption |
| CN113056096A (en) * | 2019-12-29 | 2021-06-29 | 苏州匠致电子科技有限公司 | Domestic control mainboard based on godson 2K |
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