CN113056096A - Domestic control mainboard based on godson 2K - Google Patents
Domestic control mainboard based on godson 2K Download PDFInfo
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- CN113056096A CN113056096A CN201911386068.7A CN201911386068A CN113056096A CN 113056096 A CN113056096 A CN 113056096A CN 201911386068 A CN201911386068 A CN 201911386068A CN 113056096 A CN113056096 A CN 113056096A
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- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 54
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 54
- 238000006243 chemical reaction Methods 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000004033 plastic Substances 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 230000005236 sound signal Effects 0.000 claims description 8
- 239000004744 fabric Substances 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- HIZCTWCPHWUPFU-UHFFFAOYSA-N Glycerol tribenzoate Chemical compound C=1C=CC=CC=1C(=O)OCC(OC(=O)C=1C=CC=CC=1)COC(=O)C1=CC=CC=C1 HIZCTWCPHWUPFU-UHFFFAOYSA-N 0.000 claims 1
- 230000006870 function Effects 0.000 abstract description 10
- 238000012545 processing Methods 0.000 abstract description 6
- 230000008054 signal transmission Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000007306 functionalization reaction Methods 0.000 description 3
- SXHLTVKPNQVZGL-UHFFFAOYSA-N 1,2-dichloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1 SXHLTVKPNQVZGL-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008571 general function Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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Abstract
The invention discloses a domestic control mainboard based on Loongson 2K, which comprises a Loongson 2K chip, a video bus conversion module, a format conversion module, a CAN transceiver, a level conversion module, an audio conversion module, a network chip and a memory for information storage, wherein the Loongson 2K chip, the video bus conversion module, the format conversion module, the CAN transceiver, the level conversion module, the audio conversion module, the network chip and the memory are arranged on a PCB circuit board; the second dielectric layer is respectively provided with a plurality of blind holes for connecting the first conductive pattern layer and the second conductive pattern layer, a heat dissipation block with clamping blocks at two side ends is embedded into the mounting groove of the aluminum substrate, and the clamping blocks of the heat dissipation block are embedded into the clamping grooves of the mounting groove; the mounting through hole is internally embedded with a plastic sleeve of which the center is provided with a through hole for embedding a bolt, the upper part of the plastic sleeve positioned above the aluminum substrate is provided with a wide-mouth extension part, the lower part of the plastic sleeve positioned below the aluminum substrate is provided with an outer convex part, and the blind hole consists of an arc hole and a conical hole communicated with the bottom of the arc hole. The invention reduces the resistance, improves the reliability, realizes the high-efficiency real-time acquisition, processing and transmission of signals and battery management, and is convenient for expanding the functions of products.
Description
Technical Field
The invention relates to a mainboard, and belongs to the technical field of computers.
Background
With the rapid development of computer technology, embedded development platforms are becoming more and more widespread in industrial automation control. Because the industrial control circuit board integrates the general functions of the core, one industrial control circuit board is matched with different bottom plates, thereby realizing system chips with different functions in different fields.
The chip is a high-integration system chip designed for a safe and applicable computer, and a fixed-point processor, a floating-point processor, streaming media processing and graphic image processing functions, south bridge and north bridge matched chip set functions, I/O functions and the like are integrated in the chip. The user can develop the core board of the product through the Loongson chip.
The circuit board based on the Loongson in the current market has different application modes due to different technical requirements, different types and different quantities of interfaces and the like of application fields, and the interface provided by the core board based on the Loongson cannot meet the requirements of user expansion, cannot adapt to the requirements of more different functional system products, has poor flexibility and poor overall stability, so that the circuit board needs to be improved.
Disclosure of Invention
The invention aims to provide a domestic control mainboard based on a Loongson 2K, which not only realizes high-efficiency real-time acquisition, processing and transmission of signals and battery management, but also is convenient for expanding the functions of products, so that the mainboard can be widely applied to the control field; and the resistance is reduced, the reliability is improved, and the damage to the service life of the circuit board caused by poor heat dissipation of the circuit board is reduced.
In order to achieve the purpose, the invention adopts the technical scheme that: a home-made control mainboard based on Loongson 2K comprises a Loongson 2K chip, a video bus conversion module, a format conversion module, a CAN transceiver, a level conversion module, an audio conversion module, a network chip and a memory for information storage, wherein the Loongson 2K chip is installed on a PCB circuit board; the video bus conversion module is positioned between the Loongson 2K chip and the LVDS interface and is used for converting the DVO format video code into an LVDS format video signal; the format conversion module is positioned between the Loongson 2K chip and the micro HDMI interface and is used for converting the DVO format signals into HDMI format signals; the CAN transceiver is positioned between the Loongson 2K chip and the CAN interface and is used for converting data signals and CAN electric signals; the level conversion module is positioned between the Loongson 2K chip and the serial port interface and is used for converting the UART bus level and the RS232 bus level; the audio conversion module is positioned between the Loongson 2K chip and the audio interface and is used for converting the HAD format audio signal and the analog audio signal; the network chip is positioned between the Loongson 2K chip and the network interface and is used for receiving and transmitting Ethernet signals;
the PCB circuit board further comprises an aluminum substrate, a first conductive graph layer, a second conductive graph layer and a bolt, wherein a first dielectric layer is arranged between the aluminum substrate and the first conductive graph layer, a second dielectric layer is arranged between the first conductive graph layer and the second conductive graph layer, a solder mask layer is arranged on the surface, opposite to the second dielectric layer, of the second conductive graph layer, the second dielectric layer is respectively provided with a plurality of blind holes for connecting the first conductive graph layer and the second conductive graph layer, and the blind holes are filled with conductive columns;
the aluminum base plate is characterized in that the four corners of the aluminum base plate are respectively provided with an installation through hole, a plastic sleeve with a through hole for embedding a bolt is embedded in the installation through hole, the upper part of the plastic sleeve above the aluminum base plate is provided with a wide-mouth extending part, the lower part of the plastic sleeve below the aluminum base plate is provided with an outer convex part, the diameter of the outer side wall of the wide-mouth extending part is larger than that of the installation through hole, the diameter of the outer convex part is smaller than that of the installation through hole, a rubber gasket sleeved on the upper part of the plastic sleeve is positioned between the wide-mouth extending part and the aluminum base plate, and an O-shaped ring sleeved on the lower part of the;
the blind hole consists of an arc hole and a conical hole communicated with the bottom of the arc hole, and the arc hole and the conical hole of the blind hole are respectively connected with the first conductive pattern layer and the second conductive pattern layer; the surface of the aluminum substrate, which is back to the first medium layer, is provided with a mounting groove, two side walls of the mounting groove are respectively provided with a clamping groove, a radiating block with clamping blocks at two side ends is embedded into the mounting groove of the aluminum substrate, and the clamping blocks of the radiating block are embedded into the clamping grooves of the mounting groove.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, the thickness of the first conductive pattern layer and the second conductive pattern layer is 10-60 micrometers.
2. In the scheme, the thickness of the first dielectric layer and the second dielectric layer is 80-200 microns.
3. In the above scheme, the first dielectric layer and the second dielectric layer are both composed of an epoxy resin cured layer and glass fiber cloth located in the epoxy resin cured layer.
4. In the above solution, the firmware is further connected to the Loongson 2K chip, and the firmware is used for storing the boot initialization command of the peripheral component.
5. In the above scheme, the USB hub further comprises a USB hub, one end of the USB hub is connected to the Loongson 2K chip, and the other end of the USB hub is connected with at least 2 USB interfaces.
6. In the scheme, the device further comprises a TF card connected to the Loongson 2K chip and used for storing data.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages and effects:
1. the domestic control mainboard based on the Loongson 2K is beneficial to the promotion of miniaturization, high integration and circuit board multi-functionalization of a circuit board, overcomes the defects of single function and limited interfaces of the existing mainboard, leaves an interface for connecting and connecting multi-path data acquisition and transmission equipment, realizes high-efficiency real-time acquisition, processing and transmission and battery management of signals, is convenient to expand the functions of products, can be widely applied to the control field, basically meets various requirements of users, reduces design risks and shortens the research and development period; in addition, the aluminum base plate is beneficial to the improvement of miniaturization, high integration and multi-functionalization of the circuit board, and avoids the influence on the electrical property of the circuit board, such as circuit breaking and the like, caused by metal scraps generated by friction when the aluminum base plate is fixed by the bolts, and also can buffer the vibration from the outside to the electric heating plate, thereby improving the protection performance of the circuit board.
2. According to the domestic control mainboard based on the Loongson 2K, heat generated by operation of the circuit board can be transferred to the aluminum substrate and the heat dissipation block positioned in the aluminum substrate, and then the heat is exchanged with outside express through the heat dissipation block, so that the heat in the circuit board cannot be accumulated in the circuit board, and damage to the service life of the circuit board due to poor heat dissipation of the circuit board is reduced; in addition, the arrangement of the clamping block and the clamping groove is convenient for workers to disassemble and assemble the heat dissipation block; in addition, the lower part of the plastic sleeve below the aluminum substrate is provided with an external convex part, and an O-shaped ring sleeved at the lower part of the plastic sleeve is positioned between the external convex part and the aluminum substrate, so that the plastic sleeve is effectively prevented from sliding off the substrate, the mounting efficiency is improved, and the operation of personnel is facilitated; in addition, the blind hole in the medium layer consists of the arc hole and the tapered hole communicated with the bottom of the arc hole, so that the bonding force between the conductive column and the side surface of the blind hole is enhanced, and the probability of generating a gap in the conductive column is reduced, thereby reducing the resistance and improving the reliability.
Drawings
FIG. 1 is a schematic structural diagram of a domestic control mainboard based on Loongson 2K;
FIG. 2 is a schematic view of a portion of the structure of FIG. 1;
FIG. 3 is a schematic diagram of a PCB circuit board structure in the domestic control mainboard of the invention;
fig. 4 is a schematic view of a portion of the structure shown in fig. 3 at a.
In the above drawings: 1. an aluminum substrate; 2. a first conductive pattern layer; 3. a second conductive pattern layer; 4. a first dielectric layer; 5. a second dielectric layer; 51. blind holes; 52. a conductive post; 6. a solder resist layer; 7. curing the epoxy resin layer; 8. glass fiber cloth; 9. a bolt; 10. mounting a through hole; 11. a plastic sheath; 111. a through hole; 12. a wide-mouth extension portion; 13. an outer convex portion; 14. a rubber gasket; 15. an O-shaped ring; 16. a recessed groove; 17. a circular arc hole; 18. a tapered hole; 20. a PCB circuit board; 21. 2K Loongson chips; 22. a video bus conversion module; 221. an LVDS interface; 23. a format conversion module; 231. a micro HDMI interface; 24. a CAN transceiver; 241. a CAN interface; 25. a level conversion module; 251. a serial port interface; 26. an audio conversion module; 261. an audio interface; 27. a network chip; 271. a network interface; 28. a memory; 29. firmware; 30. a USB hub; 301. a USB interface; 31. a power management control chip; 32. an RTC battery; 33. TF card; 34. mounting grooves; 341. a card slot; 35. a heat dissipating block; 351. and (7) clamping blocks.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a home-made control mainboard based on Loongson 2K comprises a Loongson 2K chip 21, a video bus conversion module 22, a format conversion module 23, a CAN transceiver 24, a level conversion module 25, an audio conversion module 26, a network chip 27 and a memory 28 for information storage, wherein the Loongson 2K chip 21, the video bus conversion module 22, the format conversion module 23, the CAN transceiver 24, the level conversion module 25, the audio conversion module 26 and the network chip 27 are arranged on a PCB; the video bus conversion module 22 is located between the Loongson 2K chip 21 and the LVDS interface 221, and is used for converting the DVO format video code into an LVDS format video signal; the format conversion module 23 is located between the loongson 2K chip 21 and the micro HDMI interface 231, and is configured to convert the DVO format signal into an HDMI format signal; the CAN transceiver 24 is positioned between the Loongson 2K chip 21 and the CAN interface 241 and is used for converting data signals and CAN electric signals; the level conversion module 25 is positioned between the Loongson 2K chip 21 and the serial port interface 251 and is used for converting the UART bus level and the RS232 bus level; the audio conversion module 26 is located between the loongson 2K chip 21 and the audio interface 261, and is used for converting the HAD format audio signal and the analog audio signal; the network chip 27 is located between the Loongson 2K chip 21 and the network interface 271, and is responsible for receiving and transmitting Ethernet signals;
the PCB 20 further comprises an aluminum substrate 1, a first conductive pattern layer 2, a second conductive pattern layer 3 and a bolt 9, wherein a first dielectric layer 4 is arranged between the aluminum substrate 1 and the first conductive pattern layer 2, a second dielectric layer 5 is arranged between the first conductive pattern layer 2 and the second conductive pattern layer 3, a solder resist layer 6 is arranged on the surface of the second conductive pattern layer 3 opposite to the second dielectric layer 5, the second dielectric layer 5 is respectively provided with a plurality of blind holes 51 for connecting the first conductive pattern layer 2 and the second conductive pattern layer 3, and the blind holes 51 are filled with conductive columns 52;
the aluminum base plate comprises an aluminum base plate 1, and is characterized in that four corners of the aluminum base plate 1 are respectively provided with an installation through hole 10, a plastic sleeve 11 with a through hole 111 for a bolt 9 to be embedded in is embedded in the installation through hole 10, the upper part of the plastic sleeve 11 above the aluminum base plate 1 is provided with a wide-mouth extending part 12, the lower part of the plastic sleeve below the aluminum base plate 1 is provided with an outer convex part 13, the diameter of the outer side wall of the wide-mouth extending part 12 is larger than that of the installation through hole 10, the diameter of the outer convex part 13 is smaller than that of the installation through hole 10, a rubber gasket 14 sleeved on the upper part of the plastic sleeve 11 is positioned between the wide-mouth extending part 12 and the aluminum base plate 1, and an O-shaped ring;
the blind hole 51 consists of an arc hole 17 and a tapered hole 18 communicated with the bottom of the arc hole 17, and the arc hole 17 and the tapered hole 18 of the blind hole 51 are respectively connected with the first conductive pattern layer 2 and the second conductive pattern layer 3; the surface of the aluminum substrate 1 opposite to the first dielectric layer 4 has a mounting groove 34, two side walls of the mounting groove 34 are respectively provided with a clamping groove 341, a heat dissipation block 35 having clamping blocks 351 at two side ends is embedded in the mounting groove 34 of the aluminum substrate 1, and the clamping blocks 351 of the heat dissipation block 35 are embedded in the clamping grooves 341 of the mounting groove 34.
The thickness of the above-described first conductive pattern layer 2 and second conductive pattern layer 3 was 15 μm.
The thickness of the first dielectric layer 4 and the second dielectric layer 5 is 120 micrometers.
The first medium layer 4 and the second medium layer 5 are both composed of an epoxy resin cured layer 7 and a glass fiber cloth 8 positioned in the epoxy resin cured layer 7.
The USB hub device further comprises a USB hub 30 with one end connected to the Loongson 2K chip 21, and the other end of the USB hub 30 is connected with at least 2 USB interfaces 301.
A TF card 33 for storing data is also included, connected to the Loongson 2K chip 21.
Example 2: a home-made control mainboard based on Loongson 2K comprises a Loongson 2K chip 21, a video bus conversion module 22, a format conversion module 23, a CAN transceiver 24, a level conversion module 25, an audio conversion module 26, a network chip 27 and a memory 28 for information storage, wherein the Loongson 2K chip 21, the video bus conversion module 22, the format conversion module 23, the CAN transceiver 24, the level conversion module 25, the audio conversion module 26 and the network chip 27 are arranged on a PCB; the video bus conversion module 22 is located between the Loongson 2K chip 21 and the LVDS interface 221, and is used for converting the DVO format video code into an LVDS format video signal; the format conversion module 23 is located between the loongson 2K chip 21 and the micro HDMI interface 231, and is configured to convert the DVO format signal into an HDMI format signal; the CAN transceiver 24 is positioned between the Loongson 2K chip 21 and the CAN interface 241 and is used for converting data signals and CAN electric signals; the level conversion module 25 is positioned between the Loongson 2K chip 21 and the serial port interface 251 and is used for converting the UART bus level and the RS232 bus level; the audio conversion module 26 is located between the loongson 2K chip 21 and the audio interface 261, and is used for converting the HAD format audio signal and the analog audio signal; the network chip 27 is located between the Loongson 2K chip 21 and the network interface 271, and is responsible for receiving and transmitting Ethernet signals;
the PCB 20 further comprises an aluminum substrate 1, a first conductive pattern layer 2, a second conductive pattern layer 3 and a bolt 9, wherein a first dielectric layer 4 is arranged between the aluminum substrate 1 and the first conductive pattern layer 2, a second dielectric layer 5 is arranged between the first conductive pattern layer 2 and the second conductive pattern layer 3, a solder resist layer 6 is arranged on the surface of the second conductive pattern layer 3 opposite to the second dielectric layer 5, the second dielectric layer 5 is respectively provided with a plurality of blind holes 51 for connecting the first conductive pattern layer 2 and the second conductive pattern layer 3, and the blind holes 51 are filled with conductive columns 52;
the aluminum base plate comprises an aluminum base plate 1, and is characterized in that four corners of the aluminum base plate 1 are respectively provided with an installation through hole 10, a plastic sleeve 11 with a through hole 111 for a bolt 9 to be embedded in is embedded in the installation through hole 10, the upper part of the plastic sleeve 11 above the aluminum base plate 1 is provided with a wide-mouth extending part 12, the lower part of the plastic sleeve below the aluminum base plate 1 is provided with an outer convex part 13, the diameter of the outer side wall of the wide-mouth extending part 12 is larger than that of the installation through hole 10, the diameter of the outer convex part 13 is smaller than that of the installation through hole 10, a rubber gasket 14 sleeved on the upper part of the plastic sleeve 11 is positioned between the wide-mouth extending part 12 and the aluminum base plate 1, and an O-shaped ring;
the blind hole 51 consists of an arc hole 17 and a tapered hole 18 communicated with the bottom of the arc hole 17, and the arc hole 17 and the tapered hole 18 of the blind hole 51 are respectively connected with the first conductive pattern layer 2 and the second conductive pattern layer 3; the surface of the aluminum substrate 1 opposite to the first dielectric layer 4 has a mounting groove 34, two side walls of the mounting groove 34 are respectively provided with a clamping groove 341, a heat dissipation block 35 having clamping blocks 351 at two side ends is embedded in the mounting groove 34 of the aluminum substrate 1, and the clamping blocks 351 of the heat dissipation block 35 are embedded in the clamping grooves 341 of the mounting groove 34.
The thickness of the above-described first conductive pattern layer 2 and second conductive pattern layer 3 was 40 μm.
The thickness of the first dielectric layer 4 and the second dielectric layer 5 is 100 μm.
The first medium layer 4 and the second medium layer 5 are both composed of an epoxy resin cured layer 7 and a glass fiber cloth 8 positioned in the epoxy resin cured layer 7.
Also included is firmware 29 coupled to the Loongson 2K chip 21, the firmware 29 being used to store boot initialization instructions for the peripheral components.
The USB hub device further comprises a USB hub 30 with one end connected to the Loongson 2K chip 21, and the other end of the USB hub 30 is connected with at least 2 USB interfaces 301.
When the domestic control mainboard based on the Loongson 2K is adopted, the promotion of miniaturization, high integration and circuit board multifunction of the circuit board is facilitated, the defects of single function and limited interfaces of the existing mainboard are overcome, the interface of the matched and connected multi-path data acquisition and transmission equipment is reserved, the high-efficiency real-time acquisition, processing and transmission and battery management of signals are realized, and the functions of products are conveniently expanded, so that the mainboard can be widely applied to the control field, the requirements of users on various kinds are basically met, the design risk is reduced, and the research and development period is shortened; in addition, the aluminum base plate is beneficial to the improvement of miniaturization, high integration and multi-functionalization of the circuit board, avoids the influence on the electrical property of the circuit board, such as open circuit and the like, caused by metal scraps generated by friction when the aluminum base plate is fixed by the bolts, and also can buffer the vibration of the electric heating plate from the outside, thereby improving the protection performance of the circuit board; in addition, the lower part of the plastic sleeve below the aluminum substrate is provided with an external convex part, and an O-shaped ring sleeved at the lower part of the plastic sleeve is positioned between the external convex part and the aluminum substrate, so that the plastic sleeve is effectively prevented from sliding off the substrate, the mounting efficiency is improved, and the operation of personnel is facilitated; in addition, the bonding force between the conductive column and the side surface of the blind hole is enhanced, and the probability of generating a gap in the conductive column is reduced, so that the resistance is reduced, and the reliability is improved; in addition, the heat generated by the operation of the circuit board can be transferred to the aluminum substrate and the heat dissipation block positioned in the aluminum substrate, and then the heat is exchanged with the outside by the heat dissipation block, so that the heat in the circuit board cannot be accumulated in the circuit board, and the damage to the service life of the circuit board caused by poor heat dissipation of the circuit board is reduced; in addition, due to the arrangement of the clamping blocks and the clamping grooves, workers can conveniently detach and install the radiating block.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (7)
1. The utility model provides a homemade control mainboard based on godson 2K which characterized in that: the intelligent control system comprises a Loongson 2K chip (21), a video bus conversion module (22), a format conversion module (23), a CAN transceiver (24), a level conversion module (25), an audio conversion module (26), a network chip (27) and a memory (28) for information storage, wherein the Loongson 2K chip is installed on a PCB (20); the video bus conversion module (22) is positioned between the Loongson 2K chip (21) and the LVDS interface (221) and is used for converting the DVO format video code into an LVDS format video signal; the format conversion module (23) is positioned between the Loongson 2K chip (21) and the micro HDMI (high-definition multimedia interface) and is used for converting the DVO format signals into HDMI format signals; the CAN transceiver (24) is positioned between the Loongson 2K chip (21) and the CAN interface (241) and is used for converting data signals and CAN electric signals; the level conversion module (25) is positioned between the Loongson 2K chip (21) and the serial port interface (251) and is used for converting the UART bus level and the RS232 bus level; the audio conversion module (26) is positioned between the Loongson 2K chip (21) and the audio interface (261) and is used for converting the HAD format audio signal and the analog audio signal; the network chip (27) is positioned between the Loongson 2K chip (21) and the network interface (271) and is used for receiving and transmitting Ethernet signals;
the PCB (20) further comprises an aluminum substrate (1), a first conductive pattern layer (2), a second conductive pattern layer (3) and a bolt (9), wherein a first dielectric layer (4) is arranged between the aluminum substrate (1) and the first conductive pattern layer (2), a second dielectric layer (5) is arranged between the first conductive pattern layer (2) and the second conductive pattern layer (3), a solder mask layer (6) is arranged on the surface of the second conductive pattern layer (3) opposite to the second dielectric layer (5), the second dielectric layer (5) is respectively provided with a plurality of blind holes (51) for connecting the first conductive pattern layer (2) and the second conductive pattern layer (3), and conductive columns (52) are filled in the blind holes (51);
the aluminum substrate is characterized in that recessed grooves (16) are formed in the surfaces of four corners of the aluminum substrate (1) opposite to the first medium layer (4), mounting through holes (10) are formed in the bottoms of the recessed grooves (16), a plastic sleeve (11) with a through hole (111) in the center for embedding a bolt (9) is embedded into the mounting through holes (10), a wide-mouth extending portion (12) is arranged on the upper portion, located above the aluminum substrate (1), of the plastic sleeve (11), an outer convex portion (13) is arranged on the lower portion, located in the recessed groove (16) of the aluminum substrate (1), of the plastic sleeve, the diameter of the outer side wall of the wide-mouth extending portion (12) is larger than that of the mounting through holes (10), the diameter of the outer convex portion (13) is smaller than that of the mounting through holes (10), a rubber gasket (14) sleeved on the upper portion of the plastic sleeve (11) is located between the wide-mouth extending portion (12) and the aluminum substrate (1), and an O-shaped ring (15) on the lower portion of the plastic A (c) is added;
the blind hole (51) consists of an arc hole (17) and a conical hole (18) communicated with the bottom of the arc hole (17), and the arc hole (17) and the conical hole (18) of the blind hole (51) are respectively connected with the first conductive pattern layer (2) and the second conductive pattern layer (3); the surface of the aluminum substrate (1) opposite to the first medium layer (4) is provided with a mounting groove (34), two side walls of the mounting groove (34) are respectively provided with a clamping groove (341), a heat dissipation block (35) with clamping blocks (351) at two side ends is embedded into the mounting groove (34) of the aluminum substrate (1), and the clamping blocks (351) of the heat dissipation block (35) are embedded into the clamping grooves (341) of the mounting groove (34).
2. A domestic control mainboard based on loongson 2K according to claim 1, characterized in that: the thickness of the first conductive pattern layer (2) and the second conductive pattern layer (3) is 10-60 micrometers.
3. A domestic control mainboard based on loongson 2K according to claim 1, characterized in that: the thickness of the first dielectric layer (4) and the second dielectric layer (5) is 80-200 microns.
4. A domestic control mainboard based on loongson 2K according to claim 1, characterized in that: the first medium layer (4) and the second medium layer (5) are both composed of an epoxy resin curing layer (7) and glass fiber cloth (8) located in the epoxy resin curing layer (7).
5. A domestic control mainboard based on loongson 2K according to claim 1, characterized in that: and a firmware (29) connected to the Loongson 2K chip (21), wherein the firmware (29) is used for storing a starting initialization instruction of the peripheral component.
6. A domestic control mainboard based on loongson 2K according to claim 1, characterized in that: also included is a TF card (33) connected to the Loongson 2K chip (21) for storing data.
7. A domestic control mainboard based on loongson 2K according to claim 1, characterized in that: the USB hub device further comprises a USB hub (30) with one end connected to the Loongson 2K chip (21), and the other end of the USB hub (30) is connected with at least 2 USB interfaces (301).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911386068.7A CN113056096A (en) | 2019-12-29 | 2019-12-29 | Domestic control mainboard based on godson 2K |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911386068.7A CN113056096A (en) | 2019-12-29 | 2019-12-29 | Domestic control mainboard based on godson 2K |
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Cited By (1)
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| CN115118553A (en) * | 2022-06-22 | 2022-09-27 | 北京航天发射技术研究所 | Multi-protocol gateway based on domestic CPU and real-time operating system |
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| CN115118553B (en) * | 2022-06-22 | 2024-04-09 | 北京航天发射技术研究所 | Multiprotocol gateway based on domestic CPU and real-time operation system |
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Application publication date: 20210629 |