CN110334045B - Extensible multi-interface industrial personal computer mainboard - Google Patents
Extensible multi-interface industrial personal computer mainboard Download PDFInfo
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- CN110334045B CN110334045B CN201910507636.8A CN201910507636A CN110334045B CN 110334045 B CN110334045 B CN 110334045B CN 201910507636 A CN201910507636 A CN 201910507636A CN 110334045 B CN110334045 B CN 110334045B
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4204—Bus transfer protocol, e.g. handshake; Synchronisation on a parallel bus
- G06F13/4221—Bus transfer protocol, e.g. handshake; Synchronisation on a parallel bus being an input/output bus, e.g. ISA bus, EISA bus, PCI bus, SCSI bus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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Abstract
The invention discloses an extensible multi-interface industrial personal computer mainboard, wherein a central data processor is connected with a fifth VPX connector, one end of a PCIE/SRIO protocol conversion module is connected to a first VPX connector through an SRIO bus, an SPI flash memory is bidirectionally connected with a platform management control module through an SPI bus, the SPI flash memory is used for storing a BIOS instruction for initializing a peripheral component, and the other end of a gigabit network processing chip is connected with an RJ45 socket and a fourth VPX connector; a switch is arranged between the CRT display and the platform management control module, a total port of the PCIE splitter is in bidirectional connection with the central data processor through a PCIE bus, and a first branch port and a second branch port of the PCIE splitter are connected to the second VPX connector through the PCIE bus. The invention overcomes the defects of single function and limited interfaces of the existing mainboard, realizes multiple functions and multiple interfaces, is convenient to expand the functions of the product, and realizes the compatibility with products of various standards in the industry.
Description
Technical Field
The invention relates to an extensible multi-interface industrial personal computer mainboard, and belongs to the technical field of digital signal processing systems.
Background
The industrial control computer is a general name of tools for detecting and controlling production process, electromechanical equipment and technological equipment by adopting a bus structure, has important computer attributes and characteristics, and the main component in the industrial computer is a multifunctional industrial controller mainboard. The interfaces of the industrial control mainboard are rich and various. An industrial main board is divided into two parts, namely a high-speed core board part and a peripheral interface extension part. However, to develop a multifunctional industrial controller motherboard, the development cycle is very long and the risk is very high because the design of the core board is involved.
Disclosure of Invention
The invention aims to provide an extensible multi-interface industrial personal computer mainboard, which overcomes the defects of single function and limited interfaces of the traditional mainboard, realizes multifunction, multi-interface and extensibility, is convenient for expanding the functions of products, realizes compatibility with products of various standards in the industry, and has rich industrial standard interfaces.
In order to achieve the purpose, the invention adopts the technical scheme that: an extensible multi-interface industrial personal computer mainboard comprises a central data processor, a platform management control module, an EC embedded controller, a PCIE/SRIO protocol conversion module, a PCI/PCIE protocol conversion module, a gigabit network processing chip, an onboard hard disk, a CRT display, a PCIE splitter, an onboard memory and a DDI memory expansion interface which are connected with the central data processor in a bidirectional way, wherein the central data processor is used for data processing, the platform management control module is used for controlling input and output operations of peripheral components, the EC embedded controller is used for controlling a power supply and on-off time sequence on the mainboard, the PCIE/SRIO protocol conversion module is used for conversion of PCIE protocol data and SRIO protocol data, the PCI/PCIE protocol conversion module is used for conversion of PCI protocol data and PCIE protocol data, the gigabit network processing chip is used for improving data transmission bandwidth and network speed, the on-board memory is used for storing intermediate data in the CPU processing process, and the DDI memory expansion interface unit is used for plugging memory strips so as to expand the memory capacity;
the central data processor and the platform management control module are connected in a bidirectional mode through DMI buses, one end of the central data processor and one end of the PCIE/SRIO protocol conversion module are connected in a bidirectional mode through PCIE buses, one end of the platform management control module and one end of the PCI/PCIE protocol conversion module are connected in a bidirectional mode through PCIE buses, the platform management control module and one end of the gigabit network processing chip are connected in a bidirectional mode through PCIE buses, the EC embedded controller and the platform management control module are connected in a bidirectional mode through LPC buses, and the onboard hard disk is connected to the platform management control module;
the central data processor is connected with a fifth VPX connector, one end of the PCIE/SRIO protocol conversion module is connected to the first VPX connector through an SRIO bus, an SPI flash memory is bidirectionally connected with the platform management control module through an SPI bus and used for storing a BIOS instruction for initializing a peripheral component, the other end of the gigabit network processing chip is connected with an RJ45 socket and a fourth VPX connector, and the other end of the PCI/PCIE protocol conversion module is connected with a PMC connector;
a switch is arranged between the CRT display and the platform management control module, a total port of the PCIE splitter is bidirectionally connected with the central data processor through a PCIE bus, a first branch port and a second branch port of the PCIE splitter are both connected to a second VPX connector through the PCIE bus, a third branch port of the PCIE splitter is bidirectionally connected with an XMC connector through the PCIE bus, and the platform management control module is connected to a sixth VPX connector through an HDA protocol bus;
the circuit board further comprises an insulating curing plate, an upper copper foil pattern layer and a lower copper foil pattern layer, wherein an upper insulating adhesive layer is arranged between the insulating curing plate and the upper copper foil pattern layer, a lower insulating adhesive layer is arranged between the insulating curing plate and the lower copper foil pattern layer, a plurality of metal long blocks which are arranged at intervals are arranged in the insulating curing plate, two ends of each metal long block are exposed out of the side end face of the insulating curing plate, at least 1 long through hole penetrating through the metal long blocks is formed in each metal long block, a plurality of vertical through holes are formed in the insulating curing plate, a conductive column is arranged in each vertical through hole, the upper end of each conductive column is electrically communicated with the upper copper foil pattern layer, the lower end of each conductive column is electrically communicated with the lower copper foil pattern layer, and the conductive columns are located in an insulating curing plate area between every two adjacent metal long blocks.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, one end of a preposed USB joint is connected to the platform management control module, and the other end of the preposed USB joint is connected with a USB socket.
2. In the above scheme, a keyboard and mouse interface is connected to the EC embedded controller.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages and effects:
1. the extensible multi-interface industrial control computer mainboard overcomes the defects of single function and limited interfaces of the traditional mainboard, realizes multiple functions and multiple interfaces, is convenient for expanding the functions of products, realizes compatibility with products with various standards in the industry, has rich industrial standard interfaces, basically meets various requirements of users, reduces design risks and shortens the research and development period.
2. The invention can expand the industrial computer mainboard with multiple interfaces, wherein a plurality of metal long blocks which are arranged at intervals are arranged in an insulating curing plate, the two ends of each metal long block are exposed out of the side end surface of the insulating curing plate, at least 1 long through hole which penetrates through the metal long blocks is arranged in each metal long block, a conductive post is positioned in the insulating curing plate area between every two adjacent metal long blocks, the metal long blocks can quickly absorb heat generated by the mainboard, at least 1 long through hole which penetrates through the metal long blocks is arranged in each metal long block, the heat from the communication mainboard can be quickly transferred, the airflow in the insulating curing plates can quickly flow, more heat can be taken out, the service life of a device can be prolonged, the reliability of a product can be improved, a plurality of vertical through holes are arranged in each insulating curing plate, a conductive post is arranged in each vertical through hole, the upper end of each conductive post is electrically communicated with an upper copper foil pattern layer, the lower end of the conductive column is electrically communicated with the lower copper foil pattern layer, so that the density of the layout of the device is improved, the control panel is favorable for further reducing the volume, the short circuit of a circuit is avoided, and the reliability of the electrical property is improved.
Drawings
FIG. 1 is a schematic diagram of a mainboard structure of an extensible multi-interface industrial personal computer;
FIG. 2 is a schematic partial structure view of FIG. 1;
FIG. 3 is a schematic diagram of a circuit board structure of the motherboard according to the present invention;
fig. 4 is a partial schematic view of fig. 1.
In the above drawings: 1. a central data processor; 2. a platform management control module; 3. an EC embedded controller; 4. a PCIE/SRIO protocol conversion module; 5. a PCI/PCIE protocol conversion module; 6. a gigabit network processing chip; 7. an onboard hard disk; 8. onboard memory; 9. DDI memory expansion interface unit; 101. a first VPX connector; 102. a second VPX connector; 104. a fourth VPX connector; 105. a fifth VPX connector; 106. a sixth VPX connector; 11. an SPI flash memory; 12. an RJ45 jack; 13. a PMC connector; 14. a SATA interface device; 15. a front USB connector; 16. a USB socket; 17. EC flash memory; 18. a keyboard and mouse interface; 19. a CRT display; 20. a PCIE splitter; 21. a switch; 22. an XMC connector; 23. an HDA protocol bus; 24. a hardware detection module; 30. a circuit board; 31. an insulating curing plate; 32. a copper foil pattern layer is arranged; 33. a lower copper foil pattern layer; 34. an insulating adhesive layer is arranged; 35. a lower insulating adhesive layer; 36. a metal long block; 37. a long through hole; 38. a vertical through hole; 39. and a conductive post.
Detailed Description
The invention is further described below with reference to the following examples:
example (b): an extensible multi-interface industrial personal computer mainboard comprises a central data processor 1, a platform management control module 2, an EC embedded controller 3, a PCIE/SRIO protocol conversion module 4, a PCI/PCIE protocol conversion module 5, a gigabit network processing chip 6, an onboard hard disk 7, a CRT display 19, a PCIE splitter 20, an onboard memory 8 and a DDI memory expansion interface 9 which are connected with the central data processor 1 in a bidirectional mode, wherein the central data processor 1 is used for data processing, the platform management control module 2 is used for controlling input and output operations of peripheral components, the EC embedded controller 3 is used for controlling power supply and on-off time sequence on the mainboard, the PCIE/SRIO protocol conversion module 4 is used for conversion of PCIE protocol data and SRIO protocol data, the PCI/PCIE protocol conversion module 5 is used for conversion of PCI protocol data and PCIE protocol data, the gigabit network processing chip 6 is used for improving data transmission bandwidth and network speed, the onboard memory 8 is used for storing intermediate data in the CPU processing process, and the DDI memory expansion interface unit 9 is used for plugging memory strips so as to expand the memory capacity;
the central data processor 1 and the platform management control module 2 are connected in a bidirectional mode through a DMI bus, one ends of the central data processor 1 and the PCIE/SRIO protocol conversion module 4 are connected in a bidirectional mode through a PCIE bus, one ends of the platform management control module 2 and the PCI/PCIE protocol conversion module 5 are connected in a bidirectional mode through a PCIE bus, one ends of the platform management control module 2 and the gigabit network processing chip 6 are connected in a bidirectional mode through a PCIE bus, the EC embedded controller 3 and the platform management control module 2 are connected in a bidirectional mode through an LPC bus, and the onboard hard disk 7 is connected to the platform management control module 2;
the central data processor 1 is connected with a fifth VPX connector 105, the other end of the PCIE/SRIO protocol conversion module 4 is connected to the first VPX connector 101 through an SRIO bus, an SPI flash memory 11 is bidirectionally connected to the platform management control module 2 through an SPI bus, the SPI flash memory 11 is used for storing a BIOS instruction for initializing a peripheral component, the other end of the gigabit network processing chip 6 is connected with an RJ45 socket 12 and a fourth VPX connector 104, and the other end of the PCI/PCIE protocol conversion module 5 is connected with a PMC connector 13;
a switch 21 is arranged between the CRT display 19 and the platform management control module 2, a total port of the PCIE splitter 20 is bidirectionally connected to the central data processor 1 through a PCIE bus, a first branch port and a second branch port of the PCIE splitter 20 are both connected to the second VPX connector 102 through a PCIE bus, a third branch port of the PCIE splitter 20 is bidirectionally connected to an XMC connector 22 through a PCIE bus, and the platform management control module 2 is connected to the sixth VPX connector 106 through an HDA protocol bus 23;
the circuit board 30 further includes an insulating curing plate 31, an upper copper foil pattern layer 32 and a lower copper foil pattern layer 33, an upper insulating adhesive layer 34 is provided between the insulating curing sheet 31 and the upper copper foil pattern layer 32, a lower insulating adhesive layer 35 is arranged between the insulating curing plate 31 and the lower copper foil pattern layer 33, a plurality of metal long blocks 36 arranged at intervals are arranged in the insulating and curing plate 31, both ends of the metal long blocks 36 are exposed out of the side end surface of the insulating and curing plate 31, the metal long block 36 is provided with at least 1 long through hole 37 penetrating the metal long block 36, the insulating curing plate 31 is provided with a plurality of vertical through holes 38, the vertical through holes 38 are internally provided with conductive columns 39, the upper ends of the conductive columns 29 are electrically communicated with the upper copper foil pattern layer 32, the lower ends of the conductive columns 39 are electrically communicated with the lower copper foil pattern layer 33, the conductive posts 39 are located between the adjacent 2 metal bars 36 to insulate the cured plate 31 area.
The thickness ratio of the thickness of the insulating and curing plate 31 to the thickness of the metal long block 36 is 10: 6.5.
a fourth VPX connector 104 is connected to the gigabit network processing chip 6.
An EC flash memory 17 is connected to the EC embedded controller 3, this EC flash memory 17 is used to store the firmware of the EC and is responsible for the information timing management of power-up.
A keyboard and mouse interface 18 is connected to the EC embedded controller 3.
The number of the PCIE/SRIO protocol conversion modules 4 is 2, and the 2 PCIE/SRIO protocol conversion modules 4 are all connected to the first VPX connector 101.
The number of the PCIE/SRIO protocol conversion modules 4 is 2, and the 2 PCIE/SRIO protocol conversion modules 4 are all connected to the first VPX connector 101; an EC flash memory 17 is connected to the EC embedded controller 3, and the EC flash memory 17 is used for storing EC firmware and is responsible for power-on information timing management; the thickness ratio of the thickness of the insulating curing plate 31 to the thickness of the metal long block 36 is 10: 6.5.
one end of a front USB connector 15 is connected to the platform management control module 2, and the other end of the front USB connector 15 is connected with a USB socket 16.
When the extensible multi-interface industrial personal computer mainboard is adopted, the defects of single function and limited interfaces of the existing mainboard are overcome, multiple functions and multiple interfaces are realized, the functions of products are conveniently expanded, the compatibility with products with various standards in the industry is realized, the extensible multi-interface industrial personal computer mainboard has rich industrial standard interfaces, the requirements of users are basically met, the design risk is reduced, and the research and development period is shortened; secondly, the heat that its metal long piece can absorb the mainboard production fast, it has 1 at least long through-hole that link up the metal long piece to open in the metal long piece, also be favorable to coming from the heat quick transmission of communication mainboard, be favorable to the air current in the metal substrate to flow fast, thereby take more heat out, thereby be favorable to improving the life of device, the reliability of product has been improved, and again, it has both improved the density of device overall arrangement, be favorable to the control panel further to reduce the volume, the short circuit etc. of circuit has also been avoided, the reliability of electrical property has been improved.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (3)
1. The utility model provides an extensible multi-interface industrial computer mainboard which characterized in that: the integrated intelligent power supply comprises a circuit board (30), a central data processor (1) arranged on the circuit board (30), a platform management control module (2), an EC embedded controller (3), a PCIE/SRIO protocol conversion module (4), a PCI/PCIE protocol conversion module (5), a gigabit network processing chip (6), an onboard hard disk (7), a CRT display (19), a PCIE splitter (20), an onboard memory (8) and a DDI memory expansion interface (9) which are bidirectionally connected with the central data processor (1), wherein the central data processor (1) is used for processing data, the platform management control module (2) is used for controlling the input and output operations of peripheral components, the EC embedded controller (3) is responsible for controlling the power supply and the on-off time sequence on a mainboard, and the PCIE/SRIO protocol conversion module (4) is used for the conversion of PCIE protocol data and SRIO protocol data, the PCI/PCIE protocol conversion module (5) is used for converting PCI protocol data and PCIE protocol data, the gigabit network processing chip (6) is used for improving data transmission bandwidth and network speed, the onboard memory (8) is used for storing intermediate data in the CPU processing process, and the DDI memory expansion interface unit (9) is used for plugging memory strips so as to expand the memory capacity;
the central data processor (1) and the platform management control module (2) are connected in a bidirectional mode through a DMI bus, one ends of the central data processor (1) and the PCIE/SRIO protocol conversion module (4) are connected in a bidirectional mode through a PCIE bus, one ends of the platform management control module (2) and the PCI/PCIE protocol conversion module (5) are connected in a bidirectional mode through a PCIE bus, one ends of the platform management control module (2) and one end of a gigabit network processing chip (6) are connected in a bidirectional mode through a PCIE bus, the EC embedded controller (3) and the platform management control module (2) are connected in a bidirectional mode through an LPC bus, and the onboard hard disk (7) is connected to the platform management control module (2);
the central data processor (1) is connected with a fifth VPX connector (105), the other end of the PCIE/SRIO protocol conversion module (4) is connected to the first VPX connector (101) through an SRIO bus, an SPI flash memory (11) is bidirectionally connected with the platform management control module (2) through an SPI bus, the SPI flash memory (11) is used for storing a BIOS instruction for initializing peripheral components, the other end of the gigabit network processing chip (6) is connected with an RJ45 socket (12) and a fourth VPX connector (104), and the other end of the PCI/PCIE protocol conversion module (5) is connected with a PMC connector (13);
a switch (21) is arranged between the CRT display (19) and the platform management control module (2), a total port of the PCIE splitter (20) is bidirectionally connected with the central data processor (1) through a PCIE bus, a first branch port and a second branch port of the PCIE splitter (20) are both connected to the second VPX connector (102) through the PCIE bus, a third branch port of the PCIE splitter (20) is bidirectionally connected with an XMC connector (22) through the PCIE bus, and the platform management control module (2) is connected to the sixth VPX connector (106) through an HDA protocol bus (23);
the circuit board (30) further comprises an insulating curing plate (31), an upper copper foil pattern layer (32) and a lower copper foil pattern layer (33), an upper insulating adhesive layer (34) is arranged between the insulating curing plate (31) and the upper copper foil pattern layer (32), a lower insulating adhesive layer (35) is arranged between the insulating curing plate (31) and the lower copper foil pattern layer (33), a plurality of metal long blocks (36) which are arranged at intervals are arranged in the insulating curing plate (31), two ends of each metal long block (36) are exposed out of the side end surface of the insulating curing plate (31), at least 1 long through hole (37) penetrating through each metal long block (36) is formed in each metal long block (36), a plurality of vertical through holes (38) are formed in the insulating curing plate (31), a conductive column (39) is arranged in each vertical through hole (38), and the upper end of each conductive column (29) is electrically conducted with the upper copper foil pattern layer (32), the lower end of the conductive column (39) is electrically communicated with the lower copper foil pattern layer (33), and the conductive column (39) is positioned in the area of the insulating curing plate (31) between the adjacent 2 metal long blocks (36);
the number of the PCIE/SRIO protocol conversion modules (4) is 2, and the 2 PCIE/SRIO protocol conversion modules (4) are all connected to the first VPX connector (101); an EC flash memory (17) is connected to the EC embedded controller (3), the EC flash memory (17) is used for storing EC firmware and is responsible for the timing management of power-on information; the thickness ratio of the thickness of the insulating curing plate (31) to the thickness of the metal long block (36) is 10: 6.5.
2. the extensible multi-interface industrial personal computer motherboard of claim 1, wherein: one end of a preposed USB joint (15) is connected to the platform management control module (2), and the other end of the preposed USB joint (15) is connected with a USB socket (16).
3. The extensible multi-interface industrial personal computer motherboard of claim 1, wherein: a keyboard and mouse interface (18) is connected to the EC embedded controller (3).
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| CN201910507636.8A CN110334045B (en) | 2017-09-10 | 2017-09-10 | Extensible multi-interface industrial personal computer mainboard |
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| CN201910507636.8A CN110334045B (en) | 2017-09-10 | 2017-09-10 | Extensible multi-interface industrial personal computer mainboard |
| CN201710809123.3A CN107632955B (en) | 2017-09-10 | 2017-09-10 | Multi-interface industrial control board |
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| CN201710809123.3A Division CN107632955B (en) | 2017-09-10 | 2017-09-10 | Multi-interface industrial control board |
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| CN110334045B true CN110334045B (en) | 2021-01-01 |
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| CN201910507636.8A Active CN110334045B (en) | 2017-09-10 | 2017-09-10 | Extensible multi-interface industrial personal computer mainboard |
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| CN206348789U (en) * | 2016-10-20 | 2017-07-21 | 中船重工（武汉）凌久电子有限责任公司 | A kind of embedded signal processing system based on CPCIE and OpenVPX frameworks |
| CN206363303U (en) * | 2016-12-27 | 2017-07-28 | 北京盛博协同科技有限责任公司 | A kind of CPU module based on VPX structures |
| CN106909525A (en) * | 2017-01-13 | 2017-06-30 | 电子科技大学 | A kind of control Switching Module based on VPX buses |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107632955A (en) | 2018-01-26 |
| CN110309095B (en) | 2021-08-06 |
| CN110309095A (en) | 2019-10-08 |
| CN107632955B (en) | 2019-05-14 |
| CN110334045A (en) | 2019-10-15 |
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