CN110326280A - 阵列摄像模组及其应用 - Google Patents

阵列摄像模组及其应用 Download PDF

Info

Publication number
CN110326280A
CN110326280A CN201780069711.6A CN201780069711A CN110326280A CN 110326280 A CN110326280 A CN 110326280A CN 201780069711 A CN201780069711 A CN 201780069711A CN 110326280 A CN110326280 A CN 110326280A
Authority
CN
China
Prior art keywords
circuit board
sensitive chip
camera module
molded base
array camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201780069711.6A
Other languages
English (en)
Other versions
CN110326280B (zh
Inventor
王明珠
赵波杰
陈振宇
郭楠
田中武彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority claimed from PCT/CN2017/118337 external-priority patent/WO2018113795A1/zh
Publication of CN110326280A publication Critical patent/CN110326280A/zh
Application granted granted Critical
Publication of CN110326280B publication Critical patent/CN110326280B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
    • G01N15/06Investigating concentration of particle suspensions
    • G01N15/0656Investigating concentration of particle suspensions using electric, e.g. electrostatic methods or magnetic methods
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/28Locating light-sensitive material within camera
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Lens Barrels (AREA)
  • Blocking Light For Cameras (AREA)

Abstract

本发明公开了一阵列摄像模组及其应用,其中所述摄像模组包括至少一光学镜头至少一电路板组件。所述电路板组件进一步包括至少一感光芯片,至少一电路板以及至少一电子元器件,其中所述感光芯片和所述电路板被导通地连接,其中至少一个所述电子元器件被贴装于所述电路板的背面,所述光学镜头被保持在所述感光芯片的感光路径,通过这样的方式,能够减小所述阵列摄像模组的长度尺寸和宽度尺寸中的至少一个尺寸,以有利于所述阵列摄像模组的小型化,从而便于所述阵列摄像模组被应用于轻薄化的电子设备。

Description

PCT国内申请,说明书已公开。

Claims (99)

  1. PCT国内申请,权利要求书已公开。
CN201780069711.6A 2016-12-23 2017-12-25 阵列摄像模组及其应用 Active CN110326280B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201611207393 2016-12-23
CN2016112073939 2016-12-23
PCT/CN2017/118337 WO2018113795A1 (zh) 2016-12-23 2017-12-25 阵列摄像模组及其应用

Publications (2)

Publication Number Publication Date
CN110326280A true CN110326280A (zh) 2019-10-11
CN110326280B CN110326280B (zh) 2022-02-22

Family

ID=61875223

Family Applications (12)

Application Number Title Priority Date Filing Date
CN201720344605.1U Active CN207251755U (zh) 2016-12-23 2017-04-01 电路板组件和摄像模组以及带有摄像模组的电子设备
CN201720344964.7U Active CN207251756U (zh) 2016-12-23 2017-04-01 摄像模组及其电路板组件以及带有摄像模组的电子设备
CN201710214886.3A Pending CN108243297A (zh) 2016-12-23 2017-04-01 摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备
CN201710214811.5A Pending CN108243296A (zh) 2016-12-23 2017-04-01 电路板组件和摄像模组及其制造方法以及带有摄像模组的电子设备
CN201720346336.2U Active CN208353433U (zh) 2016-12-23 2017-04-01 摄像模组及其模塑电路板组件及带有摄像模组的电子设备
CN201710214887.8A Active CN108243298B (zh) 2016-12-23 2017-04-01 摄像模组及其模塑电路板组件和制造方法以及带有摄像模组的电子设备
CN201721839803.1U Active CN208210099U (zh) 2016-12-23 2017-12-25 电路板组件、阵列摄像模组及其电子设备
CN201780069732.8A Pending CN110383804A (zh) 2016-12-23 2017-12-25 摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备
CN201711424165.1A Active CN108243301B (zh) 2016-12-23 2017-12-25 电路板组件和阵列摄像模组及其制造方法以及带有阵列摄像模组的电子设备
CN201780069711.6A Active CN110326280B (zh) 2016-12-23 2017-12-25 阵列摄像模组及其应用
CN201721837587.7U Active CN207897033U (zh) 2016-12-23 2017-12-25 电路板组件、阵列摄像模组和电子设备
CN201711422922.1A Pending CN108243300A (zh) 2016-12-23 2017-12-25 阵列摄像模组及其应用

Family Applications Before (9)

Application Number Title Priority Date Filing Date
CN201720344605.1U Active CN207251755U (zh) 2016-12-23 2017-04-01 电路板组件和摄像模组以及带有摄像模组的电子设备
CN201720344964.7U Active CN207251756U (zh) 2016-12-23 2017-04-01 摄像模组及其电路板组件以及带有摄像模组的电子设备
CN201710214886.3A Pending CN108243297A (zh) 2016-12-23 2017-04-01 摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备
CN201710214811.5A Pending CN108243296A (zh) 2016-12-23 2017-04-01 电路板组件和摄像模组及其制造方法以及带有摄像模组的电子设备
CN201720346336.2U Active CN208353433U (zh) 2016-12-23 2017-04-01 摄像模组及其模塑电路板组件及带有摄像模组的电子设备
CN201710214887.8A Active CN108243298B (zh) 2016-12-23 2017-04-01 摄像模组及其模塑电路板组件和制造方法以及带有摄像模组的电子设备
CN201721839803.1U Active CN208210099U (zh) 2016-12-23 2017-12-25 电路板组件、阵列摄像模组及其电子设备
CN201780069732.8A Pending CN110383804A (zh) 2016-12-23 2017-12-25 摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备
CN201711424165.1A Active CN108243301B (zh) 2016-12-23 2017-12-25 电路板组件和阵列摄像模组及其制造方法以及带有阵列摄像模组的电子设备

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201721837587.7U Active CN207897033U (zh) 2016-12-23 2017-12-25 电路板组件、阵列摄像模组和电子设备
CN201711422922.1A Pending CN108243300A (zh) 2016-12-23 2017-12-25 阵列摄像模组及其应用

Country Status (3)

Country Link
US (4) US11165941B2 (zh)
JP (2) JP6934522B2 (zh)
CN (12) CN207251755U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112751957A (zh) * 2020-12-28 2021-05-04 维沃移动通信有限公司 电子设备

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208143326U (zh) 2016-12-20 2018-11-23 宁波舜宇光电信息有限公司 具有高度差的阵列摄像模组和线路板组件及其电子设备
CN207251755U (zh) * 2016-12-23 2018-04-17 宁波舜宇光电信息有限公司 电路板组件和摄像模组以及带有摄像模组的电子设备
US11049898B2 (en) 2017-04-01 2021-06-29 Ningbo Sunny Opotech Co., Ltd. Systems and methods for manufacturing semiconductor modules
WO2018210337A1 (zh) * 2017-05-18 2018-11-22 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和阵列摄像模组以及电子设备
WO2019242421A1 (zh) * 2018-06-21 2019-12-26 宁波舜宇光电信息有限公司 感光组件、摄像模组及相应的终端设备和制作方法
US10914869B2 (en) 2018-08-14 2021-02-09 Samsung Electro-Mechanics Co., Ltd. Lens assembly and portable electronic device
WO2020063236A1 (zh) * 2018-09-27 2020-04-02 宁波舜宇光电信息有限公司 多群组镜头、摄像模组以及电子设备和组装方法
EP3637466A1 (en) * 2018-10-11 2020-04-15 STMicroelectronics (Research & Development) Limited Electronic device comprising a chip having an optical sensor
CN111277734B (zh) * 2018-12-04 2023-10-27 宁波舜宇光电信息有限公司 摄像模组及其制造方法
CN112073598A (zh) * 2019-06-10 2020-12-11 宁波舜宇光电信息有限公司 一种投射模组以及3d 摄像模组
WO2021017752A1 (zh) * 2019-07-30 2021-02-04 宁波舜宇光电信息有限公司 摄像模组、电子设备、复合基板、感光组件及其制作方法
US20220279094A1 (en) * 2019-07-31 2022-09-01 Ningbo Sunny Opotech Co., Ltd. Molded circuit board and camera module, and manufacturing method thereof and electronic device
CN112399037B (zh) * 2019-08-15 2022-04-05 宁波舜宇光电信息有限公司 感光组件、摄像模组及其制作方法
CN110602363A (zh) * 2019-09-23 2019-12-20 Oppo广东移动通信有限公司 一种摄像头模组以及电子设备
CN112074078A (zh) * 2020-09-14 2020-12-11 福建中科光芯光电科技有限公司 一种用于200g光接收器件的软硬结合电路板
CN114650345B (zh) * 2020-12-17 2024-04-02 宁波舜宇光电信息有限公司 电路板组件、感光组件和摄像模组

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101877944A (zh) * 2009-04-29 2010-11-03 鸿骐新技股份有限公司 印刷电路板的全植板及其接合方法
CN102593116A (zh) * 2011-01-12 2012-07-18 陈淑姿 薄化的影像撷取模组及其制作方法
CN202617250U (zh) * 2012-06-04 2012-12-19 美细耐斯(上海)电子有限公司 照相机模块
CN105681637A (zh) * 2016-03-15 2016-06-15 宁波舜宇光电信息有限公司 阵列摄像模组及其感光组件和制造方法
CN106131386A (zh) * 2016-08-10 2016-11-16 北京小米移动软件有限公司 摄像头模组和电子设备

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6795120B2 (en) * 1996-05-17 2004-09-21 Sony Corporation Solid-state imaging apparatus and camera using the same
FR2800911B1 (fr) 1999-11-04 2003-08-22 St Microelectronics Sa Boitier semi-conducteur optique et procede de fabrication d'un tel boitier
WO2001065839A1 (fr) * 2000-03-02 2001-09-07 Olympus Optical Co., Ltd. Petit module de prise d'images
JP3651580B2 (ja) * 2000-04-07 2005-05-25 三菱電機株式会社 撮像装置及びその製造方法
JP4143304B2 (ja) 2002-01-24 2008-09-03 富士通株式会社 カメラモジュールの製造方法
JP2005072978A (ja) * 2003-08-25 2005-03-17 Renesas Technology Corp 固体撮像装置およびその製造方法
US7005310B2 (en) * 2002-08-14 2006-02-28 Renesas Technology Corporation Manufacturing method of solid-state image sensing device
US6680525B1 (en) 2003-01-09 2004-01-20 Kingpak Technology Inc. Stacked structure of an image sensor
EP1471730A1 (en) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniature camera module
KR100539234B1 (ko) 2003-06-11 2005-12-27 삼성전자주식회사 투명 고분자 소재를 적용한 씨모스형 이미지 센서 모듈 및그 제조방법
JP2005101711A (ja) 2003-09-22 2005-04-14 Renesas Technology Corp 固体撮像装置およびその製造方法
JP2005223716A (ja) * 2004-02-06 2005-08-18 Rohm Co Ltd イメージセンサモジュールおよびイメージセンサモジュール用レンズユニット
JP2005317745A (ja) * 2004-04-28 2005-11-10 Renesas Technology Corp 固体撮像装置およびその製造方法
TWI240556B (en) * 2004-06-29 2005-09-21 Creative Sensor Inc Contact image scanner with multiple focal distances and multiple resolutions
US7045888B2 (en) * 2004-06-29 2006-05-16 Macronix International Co., Ltd. Ultra thin dual chip image sensor package structure and method for fabrication
JP2006018473A (ja) * 2004-06-30 2006-01-19 Toshiba Corp 携帯可能電子装置
CN2725916Y (zh) 2004-09-15 2005-09-14 华泰电子股份有限公司 镜头模块改良结构
JP2006148473A (ja) 2004-11-18 2006-06-08 Shinko Electric Ind Co Ltd カメラモジュール及びその製造方法
JP2007214441A (ja) * 2006-02-10 2007-08-23 Dainippon Printing Co Ltd 複合センサーパッケージ
JP2007306282A (ja) * 2006-05-11 2007-11-22 Citizen Electronics Co Ltd カメラモジュール
CN101075603A (zh) * 2006-05-17 2007-11-21 大瀚光电股份有限公司 取像模组封装结构及其封装方法
JP2009188828A (ja) 2008-02-07 2009-08-20 Panasonic Corp 固体撮像装置とその製造方法
JP2010050771A (ja) * 2008-08-22 2010-03-04 Kyocera Corp 撮像装置モジュール
KR101488831B1 (ko) 2009-02-23 2015-02-04 게리 에드윈 서튼 곡면 센서 카메라를 갖는 이동통신장치, 이동형 광학부를 갖는 곡면 센서 카메라, 및 실리콘 섬유로 제작되는 곡면 센서
US8248499B2 (en) 2009-02-23 2012-08-21 Gary Edwin Sutton Curvilinear sensor system
WO2011078350A1 (ja) * 2009-12-24 2011-06-30 京セラ株式会社 撮像装置
JP2011204797A (ja) * 2010-03-24 2011-10-13 Sony Corp 固体撮像装置とその製造方法、及び電子機器
JP2013017125A (ja) * 2011-07-06 2013-01-24 Ricoh Co Ltd 撮像装置及び撮像装置のモニタリング画像の表示方法
JP5982380B2 (ja) * 2011-08-19 2016-08-31 富士フイルム株式会社 撮像素子モジュール及びその製造方法
JP6077952B2 (ja) * 2013-07-01 2017-02-08 富士フイルム株式会社 近赤外線吸収性組成物、近赤外線カットフィルタおよびその製造方法、並びに、カメラモジュールおよびその製造方法
US9313389B2 (en) * 2013-11-08 2016-04-12 Htc Corporation Camera assembly and electronic device
WO2015126328A1 (en) * 2014-02-18 2015-08-27 Heptagon Micro Optics Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
US9896039B2 (en) * 2014-05-09 2018-02-20 Magna Electronics Inc. Vehicle vision system with forward viewing camera
CN104486465A (zh) 2014-12-08 2015-04-01 上海斐讯数据通信技术有限公司 一种移动终端
US9794522B2 (en) * 2015-02-06 2017-10-17 Google Inc. Systems, methods, and devices for managing coexistence of multiple transceiver devices by optimizing component layout
US9681032B1 (en) * 2015-03-17 2017-06-13 Amazon Technologies, Inc. Imager module with molded packaging
CN205017678U (zh) * 2015-06-23 2016-02-03 深圳市汇联时代科技有限公司 移动电子设备的印刷电路板及移动电子设备
US10523854B2 (en) * 2015-06-25 2019-12-31 Intel Corporation Array imaging system having discrete camera modules and method for manufacturing the same
CN105187697B (zh) 2015-08-04 2019-12-31 宁波舜宇光电信息有限公司 多镜头摄像模组连体支架和多镜头摄像模组及其应用
US10475830B2 (en) * 2015-08-06 2019-11-12 Ams Sensors Singapore Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
CN109547680A (zh) * 2016-02-18 2019-03-29 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组及其模塑线路板组件及制造方法
CN105744131B (zh) * 2016-03-15 2019-07-05 宁波舜宇光电信息有限公司 阵列摄像模组及其线路板组件和制造方法
CN206294240U (zh) * 2016-03-15 2017-06-30 宁波舜宇光电信息有限公司 阵列摄像模组和双摄像模组及其线路板组件和电子设备
CN112217969B (zh) * 2016-04-07 2022-10-21 宁波舜宇光电信息有限公司 具有补强线路板的感光装置和阵列摄像模组及其制造方法
TWI611248B (zh) * 2016-07-18 2018-01-11 實盈光電股份有限公司 360度全景相機模組及裝置
CN207251755U (zh) * 2016-12-23 2018-04-17 宁波舜宇光电信息有限公司 电路板组件和摄像模组以及带有摄像模组的电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101877944A (zh) * 2009-04-29 2010-11-03 鸿骐新技股份有限公司 印刷电路板的全植板及其接合方法
CN102593116A (zh) * 2011-01-12 2012-07-18 陈淑姿 薄化的影像撷取模组及其制作方法
CN202617250U (zh) * 2012-06-04 2012-12-19 美细耐斯(上海)电子有限公司 照相机模块
CN105681637A (zh) * 2016-03-15 2016-06-15 宁波舜宇光电信息有限公司 阵列摄像模组及其感光组件和制造方法
CN106131386A (zh) * 2016-08-10 2016-11-16 北京小米移动软件有限公司 摄像头模组和电子设备

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112751957A (zh) * 2020-12-28 2021-05-04 维沃移动通信有限公司 电子设备
CN112751957B (zh) * 2020-12-28 2023-08-08 维沃移动通信有限公司 电子设备

Also Published As

Publication number Publication date
CN207251756U (zh) 2018-04-17
US20220021792A1 (en) 2022-01-20
CN108243301B (zh) 2023-04-25
CN108243296A (zh) 2018-07-03
US20230083133A1 (en) 2023-03-16
CN207251755U (zh) 2018-04-17
CN110326280B (zh) 2022-02-22
CN108243301A (zh) 2018-07-03
JP2020502951A (ja) 2020-01-23
CN110383804A (zh) 2019-10-25
CN108243298A (zh) 2018-07-03
US11653079B2 (en) 2023-05-16
JP6934522B2 (ja) 2021-09-15
US11165941B2 (en) 2021-11-02
CN208353433U (zh) 2019-01-08
US20200382683A1 (en) 2020-12-03
US20190364184A1 (en) 2019-11-28
CN108243298B (zh) 2022-10-14
JP2020502586A (ja) 2020-01-23
CN208210099U (zh) 2018-12-07
CN108243297A (zh) 2018-07-03
CN108243300A (zh) 2018-07-03
CN207897033U (zh) 2018-09-21

Similar Documents

Publication Publication Date Title
CN110326280A (zh) 阵列摄像模组及其应用
CN111913269B (zh) 透镜驱动装置、相机模块及移动设备
CN211206918U (zh) 光学组件驱动模块
TWI643496B (zh) 相機模組
US11204480B2 (en) Optical member driving mechanism
CN105739218A (zh) 透镜移动装置
EP3562138A1 (en) Array camera module and use thereof
CN104469105A (zh) 相机模块
CN110089100A (zh) 摄像模组及其模制电路板组件和制造方法以及带有摄像模组的电子设备
KR20230174203A (ko) 렌즈 구동장치 및 이를 포함하는 카메라 모듈
KR102291747B1 (ko) 회로판, 조형 감광성 어셈블리 및 그의 제조 방법, 촬상 모듈 및 전자기기
KR100992271B1 (ko) 카메라 모듈
JP7335261B2 (ja) 面取りを有する撮像モジュール、感光モジュールおよび電子機器
CN205407985U (zh) 摄像模组
KR102066430B1 (ko) 카메라 모듈
KR101754737B1 (ko) 칩 온 보드 센서 부착용 렌즈 스탠드 오프를 구비한 카메라 모듈
CN108965649A (zh) 阵列摄像模组及其模塑电路板组件以及制造方法和电子设备

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant