CN110277339B - Efem以及efem的气体置换方法 - Google Patents

Efem以及efem的气体置换方法 Download PDF

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Publication number
CN110277339B
CN110277339B CN201910164786.3A CN201910164786A CN110277339B CN 110277339 B CN110277339 B CN 110277339B CN 201910164786 A CN201910164786 A CN 201910164786A CN 110277339 B CN110277339 B CN 110277339B
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CN
China
Prior art keywords
efem
inert gas
case member
nitrogen
robot
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CN201910164786.3A
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English (en)
Chinese (zh)
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CN110277339A (zh
Inventor
河合俊宏
小仓源五郎
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Sinfonia Technology Co Ltd
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Sinfonia Technology Co Ltd
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Priority to CN202311500242.2A priority Critical patent/CN117457556A/zh
Priority to CN202311500243.7A priority patent/CN117438355A/zh
Publication of CN110277339A publication Critical patent/CN110277339A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pens And Brushes (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
CN201910164786.3A 2018-03-15 2019-03-05 Efem以及efem的气体置换方法 Active CN110277339B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202311500242.2A CN117457556A (zh) 2018-03-15 2019-03-05 Efem以及efem的气体置换方法
CN202311500243.7A CN117438355A (zh) 2018-03-15 2019-03-05 输送机器人以及efem

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-048437 2018-03-15
JP2018048437A JP7137047B2 (ja) 2018-03-15 2018-03-15 Ｅｆｅｍ、及び、ｅｆｅｍにおけるガス置換方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN202311500242.2A Division CN117457556A (zh) 2018-03-15 2019-03-05 Efem以及efem的气体置换方法
CN202311500243.7A Division CN117438355A (zh) 2018-03-15 2019-03-05 输送机器人以及efem

Publications (2)

Publication Number Publication Date
CN110277339A CN110277339A (zh) 2019-09-24
CN110277339B true CN110277339B (zh) 2023-11-28

Family

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Family Applications (3)

Application Number Title Priority Date Filing Date
CN202311500243.7A Pending CN117438355A (zh) 2018-03-15 2019-03-05 输送机器人以及efem
CN201910164786.3A Active CN110277339B (zh) 2018-03-15 2019-03-05 Efem以及efem的气体置换方法
CN202311500242.2A Pending CN117457556A (zh) 2018-03-15 2019-03-05 Efem以及efem的气体置换方法

Family Applications Before (1)

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CN202311500243.7A Pending CN117438355A (zh) 2018-03-15 2019-03-05 输送机器人以及efem

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202311500242.2A Pending CN117457556A (zh) 2018-03-15 2019-03-05 Efem以及efem的气体置换方法

Country Status (4)

Country Link
JP (3) JP7137047B2 (ja)
KR (2) KR102663054B1 (ja)
CN (3) CN117438355A (ja)
TW (2) TW202314934A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102278078B1 (ko) * 2019-10-17 2021-07-19 세메스 주식회사 기판 반송 장치 및 기판 처리 장치
CN116325108A (zh) * 2020-09-03 2023-06-23 川崎重工业株式会社 基板保持机械手和基板搬运机器人
US12076854B2 (en) 2021-03-18 2024-09-03 Applied Materials, Inc. Increased number of load ports on factory interface with robot that moves on track
JP2022170477A (ja) * 2021-04-28 2022-11-10 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
CN117690857B (zh) * 2024-01-31 2024-05-03 北京锐洁机器人科技有限公司 一种防水型晶圆搬运机械手

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09131680A (ja) * 1995-11-02 1997-05-20 Tokyo Electron Ltd 真空室用搬送装置
KR20050069777A (ko) * 2003-12-31 2005-07-05 동부아남반도체 주식회사 반도체용 파티클 제거장치
KR20060081523A (ko) * 2005-01-10 2006-07-13 삼성전자주식회사 웨이퍼 이송 장치
TW200940287A (en) * 2007-11-21 2009-10-01 Yaskawa Denki Seisakusho Kk Conveyance robot, locally cleaned housing with the conveyance robot, and semiconductor manufacturing device with the housing
JP2011517134A (ja) * 2008-04-15 2011-05-26 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー クリーン移送ロボット
CN102768977A (zh) * 2011-05-06 2012-11-07 北京北方微电子基地设备工艺研究中心有限责任公司 机械手、大气传输单元和晶片传输方法
JP2014116440A (ja) * 2012-12-10 2014-06-26 Hitachi High-Tech Manufacturing & Service Corp ミニエンシステム
TW201530680A (zh) * 2013-12-13 2015-08-01 Sinfonia Technology Co Ltd 設備前端模組（ｅｆｅｍ）
JP2015146348A (ja) * 2014-01-31 2015-08-13 シンフォニアテクノロジー株式会社 Ｅｆｅｍシステム
JP2015146349A (ja) * 2014-01-31 2015-08-13 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
JP2016039250A (ja) * 2014-08-07 2016-03-22 東京エレクトロン株式会社 基板処理装置、クリーニング用治具、基板処理装置のパーティクルの除去方法及び記憶媒体
JP2016162818A (ja) * 2015-02-27 2016-09-05 シンフォニアテクノロジー株式会社 搬送室
CN106876309A (zh) * 2015-12-11 2017-06-20 Tdk株式会社 设备前端模块

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5054988A (en) * 1988-07-13 1991-10-08 Tel Sagami Limited Apparatus for transferring semiconductor wafers
JP3671983B2 (ja) * 1993-10-22 2005-07-13 東京エレクトロン株式会社 真空処理装置
JP3376678B2 (ja) * 1994-03-11 2003-02-10 株式会社安川電機 多関節形産業用ロボットの冷却構造
JP2001135702A (ja) * 1999-11-04 2001-05-18 Canon Inc 基板搬送装置および基板処理装置ならびにデバイス製造方法
JP4344593B2 (ja) * 2002-12-02 2009-10-14 ローツェ株式会社 ミニエンバイロメント装置、薄板状物製造システム及び清浄容器の雰囲気置換方法
JP5155848B2 (ja) * 2008-12-18 2013-03-06 日本ケンブリッジフィルター株式会社 Ｆｏｕｐ用ｎ２パージ装置
JP2012056034A (ja) * 2010-09-09 2012-03-22 Sinfonia Technology Co Ltd ロボットアーム装置
KR20150061103A (ko) * 2013-11-25 2015-06-04 세메스 주식회사 반송 로봇, 기판 처리 장치, 그리고 파티클 배출 방법
JP2015109355A (ja) * 2013-12-05 2015-06-11 株式会社日立ハイテクマニファクチャ＆サービス 局所クリーン化搬送装置
US20150311100A1 (en) * 2014-04-23 2015-10-29 Tdk Corporation Load port unit and efem system
JP6459462B2 (ja) * 2014-12-11 2019-01-30 東京エレクトロン株式会社 リーク判定方法、基板処理装置及び記憶媒体
JP6604890B2 (ja) * 2016-04-04 2019-11-13 株式会社荏原製作所 基板搬送装置および基板処理装置ならびに結露抑制方法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09131680A (ja) * 1995-11-02 1997-05-20 Tokyo Electron Ltd 真空室用搬送装置
KR20050069777A (ko) * 2003-12-31 2005-07-05 동부아남반도체 주식회사 반도체용 파티클 제거장치
KR20060081523A (ko) * 2005-01-10 2006-07-13 삼성전자주식회사 웨이퍼 이송 장치
TW200940287A (en) * 2007-11-21 2009-10-01 Yaskawa Denki Seisakusho Kk Conveyance robot, locally cleaned housing with the conveyance robot, and semiconductor manufacturing device with the housing
JP2011517134A (ja) * 2008-04-15 2011-05-26 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー クリーン移送ロボット
CN102768977A (zh) * 2011-05-06 2012-11-07 北京北方微电子基地设备工艺研究中心有限责任公司 机械手、大气传输单元和晶片传输方法
JP2014116440A (ja) * 2012-12-10 2014-06-26 Hitachi High-Tech Manufacturing & Service Corp ミニエンシステム
TW201530680A (zh) * 2013-12-13 2015-08-01 Sinfonia Technology Co Ltd 設備前端模組（ｅｆｅｍ）
JP2015146348A (ja) * 2014-01-31 2015-08-13 シンフォニアテクノロジー株式会社 Ｅｆｅｍシステム
JP2015146349A (ja) * 2014-01-31 2015-08-13 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
JP2016039250A (ja) * 2014-08-07 2016-03-22 東京エレクトロン株式会社 基板処理装置、クリーニング用治具、基板処理装置のパーティクルの除去方法及び記憶媒体
JP2016162818A (ja) * 2015-02-27 2016-09-05 シンフォニアテクノロジー株式会社 搬送室
CN106876309A (zh) * 2015-12-11 2017-06-20 Tdk株式会社 设备前端模块

Also Published As

Publication number Publication date
JP7137047B2 (ja) 2022-09-14
JP2024109740A (ja) 2024-08-14
JP2019161117A (ja) 2019-09-19
JP2022162002A (ja) 2022-10-21
TWI788422B (zh) 2023-01-01
KR20240060774A (ko) 2024-05-08
TW202314934A (zh) 2023-04-01
KR20190109245A (ko) 2019-09-25
KR102663054B1 (ko) 2024-05-07
JP7496493B2 (ja) 2024-06-07
CN110277339A (zh) 2019-09-24
CN117457556A (zh) 2024-01-26
TW201939653A (zh) 2019-10-01
CN117438355A (zh) 2024-01-23

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