CN110265319B - 注入装置及注入方法 - Google Patents

注入装置及注入方法 Download PDF

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CN110265319B
CN110265319B CN201910171841.1A CN201910171841A CN110265319B CN 110265319 B CN110265319 B CN 110265319B CN 201910171841 A CN201910171841 A CN 201910171841A CN 110265319 B CN110265319 B CN 110265319B
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前田浩明
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Mitsubishi Electric Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0623—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers coupled with a vibrating horn
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/16—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening having selectively- effective outlets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/14—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
    • B05B7/1404—Arrangements for supplying particulate material
    • B05B7/1413—Apparatus to be carried on or by a person, e.g. by hand; Apparatus comprising a container fixed to the discharge device
    • B05B7/1418—Apparatus to be carried on or by a person, e.g. by hand; Apparatus comprising a container fixed to the discharge device comprising means for supplying an additional liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/28—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for shielding the discharged liquid or other fluent material, e.g. to limit area of spray; with integral means for catching drips or collecting surplus liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
    • B05B17/0646—Vibrating plates, i.e. plates being directly subjected to the vibrations, e.g. having a piezoelectric transducer attached thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B3/04—Methods of, or means for, filling the material into the containers or receptacles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B3/18—Controlling escape of air from containers or receptacles during filling

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)

Abstract

本发明得到一种能够缩短注入时间、抑制气泡的吸入的注入装置及注入方法。注入喷嘴(1)将注入剂(4)注入至对象器(2)。在将该注入剂(4)注入时，振动发生装置(5)使注入喷嘴(1)在多个方向振动。

Description

注入装置及注入方法
技术领域
本发明涉及将注入剂注入至对象器的注入装置及注入方法。
背景技术
在将多量的液体的注入剂注入至对象器时，在对象器内为了使注入材料扩展而花费时间，因此注入时间变长。另外，根据对象器的内部构造，在注入后在对象器内会残留有大的气泡。特别是高粘度的注入剂的流动性差，因此扩展慢，经常发生气泡的吸入。对此，提出了在将注入剂注入时使注入喷嘴在一个方向振动的技术(例如，参照专利文献1)。
专利文献1：日本特开平1－284364号公报
但是，在使注入喷嘴仅在一个方向振动时，注入剂难以进入至对象器的角部或箱形的对象器的四角等，存在下述问题，即，在注入后的对象器吸入气泡。
发明内容
本发明就是为了解决上述这样的课题而提出的，其目的在于，得到能够缩短注入时间、抑制气泡的吸入的注入装置及注入方法。
本发明所涉及的注入装置，其特征在于，具有：注入喷嘴，其将注入剂注入至对象器；振动发生装置，其在注入所述注入剂时使所述注入喷嘴在多个方向振动。
发明的效果
在本发明中，振动发生装置在将注入剂注入时使注入喷嘴在多个方向振动。由此，使注入剂振动而产生波，由此即使是高粘度的注入剂，流动性也变好。因此，注入剂的扩展提前，因此能够缩短高粘度的注入剂的注入时间。另外，注入剂也容易进入至对象器的角部及箱形的对象器的四角，因此能够抑制气泡向对象器内的吸入。
附图说明
图1是表示实施方式1所涉及的注入装置的剖视图。
图2是表示实施方式1所涉及的注入喷嘴的仰视图。
图3是表示实施方式1所涉及的注入装置的斜视图。
图4是表示对象器的一个例子的俯视图。
图5是表示实施方式2所涉及的注入装置的斜视图。
标号的说明
1注入喷嘴，2对象器，4注入剂，5振动发生装置，5a、5b振动发生器
具体实施方式
参照附图，对实施方式所涉及的注入装置及注入方法进行说明。对相同或对应的结构要素标注相同标号，有时省略说明的重复。
实施方式1.
图1是表示实施方式1所涉及的注入装置的剖视图。注入喷嘴1配置于对象器2的上方，将从喷嘴头3排出的注入剂4注入至对象器2。在将该注入剂4注入时，振动发生装置5使注入喷嘴1在多个方向振动。例如注入喷嘴1的振动的频率小于或等于1000Hz，振幅小于或等于1mm。
图2是表示实施方式1所涉及的注入喷嘴的仰视图。振动发生装置5具有：多个振动发生器5a、5b，它们分别设置于注入喷嘴1的侧面的多个部位；以及放大器5c，其对振动发生器5a、5b进行驱动。在这里，2个振动发生器5a、5b设置于注入喷嘴1的侧面，注入喷嘴1在横向的2个方向进行振动。并不限定于此，振动发生器也可以大于或等于3个，注入喷嘴1也可以在纵向进行振动。
图3是表示实施方式1所涉及的注入装置的斜视图。注入喷嘴1安装于正交轴6，能够一边将注入剂4注入、一边向上下左右移动。例如，一边将注入喷嘴1在对象器2的上方以描绘圆的方式移动，一边将注入剂4注入至对象器2。由此，能够将注入剂4均匀地注入至对象器2内。
如以上说明所述，在本实施方式中，振动发生装置5在将注入剂4注入时使注入喷嘴1在多个方向振动。由此，使注入剂4振动而产生波，由此即使是高粘度的注入剂4，流动性也变好。因此，注入剂4的扩展提前，因此能够缩短高粘度的注入剂的注入时间。
图4是表示对象器的一个例子的俯视图。例如，一边相对于箱形的对象器2的各边在45°的方向使注入喷嘴1振动，一边将注入剂4注入。如上所述，使注入剂4振动，由此注入剂4也容易进入至箱形的对象器2的四角。此外，即使在对象器2为圆型的情况下，通过使注入喷嘴1振动，从而注入剂4也容易进入至对象器2的角部。如上所述，注入剂4也容易进入至对象器2的角部及箱形的对象器2的四角，因此能够抑制气泡向对象器2内的吸入。
此外，本实施方式所涉及的注入装置能够利用于半导体装置的制造。在该情况下，对象器2是半导体装置的壳体，注入剂4是封装树脂。但是，并不限定于此，本实施方式所涉及的注入装置也能够利用于其他装置的制造，能够得到相同的效果。
实施方式2.
图5是表示实施方式2所涉及的注入装置的斜视图。2个注入喷嘴1并排地设置于正交轴6。此外，注入喷嘴的个数也可以大于或等于3个。在多个注入喷嘴1各自设置有多个振动发生器5a、5b。通过从该多个注入喷嘴1同时喷出注入剂4，从而能够将多量的注入剂4一次性地注入。

Claims (10)

1.一种注入装置，其特征在于，具有：
注入喷嘴，其将注入剂注入至对象器；
振动发生装置，其在注入所述注入剂时，使所述注入喷嘴在多个方向振动，
所述注入喷嘴安装于正交轴，可以利用所述正交轴向上下左右移动，一边使所述注入喷嘴和所述振动发生装置在所述对象器的上方以描绘圆的方式移动，一边将所述将注入剂注入至所述对象器。
2.根据权利要求1所述的注入装置，其特征在于，
所述振动发生装置具有多个振动发生器，它们分别设置于所述注入喷嘴的侧面的多个部位。
3.根据权利要求1或2所述的注入装置，其特征在于，
所述注入喷嘴的振动的频率小于或等于1000Hz。
4.根据权利要求1或2所述的注入装置，其特征在于，
所述注入喷嘴能够一边将所述注入剂注入，一边向上下左右移动。
5.根据权利要求3所述的注入装置，其特征在于，
所述注入喷嘴能够一边将所述注入剂注入，一边向上下左右移动。
6.根据权利要求1或2所述的注入装置，其特征在于，
所述注入喷嘴并排设置有多个。
7.根据权利要求3所述的注入装置，其特征在于，
所述注入喷嘴并排设置有多个。
8.根据权利要求4所述的注入装置，其特征在于，
所述注入喷嘴并排设置有多个。
9.根据权利要求5所述的注入装置，其特征在于，
所述注入喷嘴并排设置有多个。
10.一种注入方法，其特征在于，
在注入喷嘴将注入剂向对象器注入时，通过振动发生装置使所述注入喷嘴在多个方向振动，
所述注入喷嘴安装于正交轴，可以利用所述正交轴向上下左右移动，一边使所述注入喷嘴和所述振动发生装置在所述对象器的上方以描绘圆的方式移动，一边将所述将注入剂注入至所述对象器。
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