JP2019155255A - 注入装置及び注入方法 - Google Patents
注入装置及び注入方法 Download PDFInfo
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- JP2019155255A JP2019155255A JP2018044294A JP2018044294A JP2019155255A JP 2019155255 A JP2019155255 A JP 2019155255A JP 2018044294 A JP2018044294 A JP 2018044294A JP 2018044294 A JP2018044294 A JP 2018044294A JP 2019155255 A JP2019155255 A JP 2019155255A
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- injection
- target device
- nozzle
- injection nozzle
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- 238000002347 injection Methods 0.000 title claims abstract description 103
- 239000007924 injection Substances 0.000 title claims abstract description 103
- 238000000034 method Methods 0.000 title claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 239000000243 solution Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0623—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers coupled with a vibrating horn
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
- B05B1/16—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening having selectively- effective outlets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/14—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
- B05B7/1404—Arrangements for supplying particulate material
- B05B7/1413—Apparatus to be carried on or by a person, e.g. by hand; Apparatus comprising a container fixed to the discharge device
- B05B7/1418—Apparatus to be carried on or by a person, e.g. by hand; Apparatus comprising a container fixed to the discharge device comprising means for supplying an additional liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/28—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for shielding the discharged liquid or other fluent material, e.g. to limit area of spray; with integral means for catching drips or collecting surplus liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
- B05B17/0646—Vibrating plates, i.e. plates being directly subjected to the vibrations, e.g. having a piezoelectric transducer attached thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
- B65B3/04—Methods of, or means for, filling the material into the containers or receptacles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
- B65B3/18—Controlling escape of air from containers or receptacles during filling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
Description
図1は、実施の形態1に係る注入装置を示す断面図である。注入ノズル1が対象器2の上方に配置され、ノズルヘッド3から排出した注入剤4を対象器2に注入する。この注入剤4の注入時に振動発生装置5が注入ノズル1を複数の方向に振動させる。例えば注入ノズル1の振動の周波数は1000Hz以下、振幅は1mm以下である。
図5は、実施の形態2に係る注入装置を示す斜視図である。2個の注入ノズル1が直交軸6に並べて設けられている。なお、注入ノズルの個数は3個以上でもよい。複数の注入ノズル1の各々に複数の振動発生器5a,5bが設けられている。この複数の注入ノズル1から注入剤4を同時に出すことで、多量の注入剤4を一度に注入できる。
Claims (6)
- 対象器に注入剤を注入する注入ノズルと、
前記注入剤の注入時に前記注入ノズルを複数の方向に振動させる振動発生装置とを備えることを特徴とする注入装置。 - 前記振動発生装置は、前記注入ノズルの側面の複数の箇所にそれぞれ設けられた複数の振動発生器を有することを特徴とする請求項1に記載の注入装置。
- 前記注入ノズルの振動の周波数は1000Hz以下であることを特徴とする請求項1又は2に記載の注入装置。
- 前記注入ノズルは前記注入剤を注入しながら上下左右に移動可能であることを特徴とする請求項1〜3の何れか1項に記載の注入装置。
- 前記注入ノズルが複数個、並べて設けられていることを特徴とする請求項1〜4の何れか1項に記載の注入装置。
- 注入ノズルが対象器に注入剤を注入する際に振動発生装置により前記注入ノズルを複数の方向に振動させることを特徴とする注入方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018044294A JP6939657B2 (ja) | 2018-03-12 | 2018-03-12 | 注入装置及び注入方法 |
US16/159,744 US20190275552A1 (en) | 2018-03-12 | 2018-10-15 | Injection device and injection method |
DE102018221001.2A DE102018221001A1 (de) | 2018-03-12 | 2018-12-05 | Einspritzvorrichtung und Einspritzverfahren |
CN201910171841.1A CN110265319B (zh) | 2018-03-12 | 2019-03-07 | 注入装置及注入方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018044294A JP6939657B2 (ja) | 2018-03-12 | 2018-03-12 | 注入装置及び注入方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019155255A true JP2019155255A (ja) | 2019-09-19 |
JP6939657B2 JP6939657B2 (ja) | 2021-09-22 |
Family
ID=67701776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018044294A Active JP6939657B2 (ja) | 2018-03-12 | 2018-03-12 | 注入装置及び注入方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20190275552A1 (ja) |
JP (1) | JP6939657B2 (ja) |
CN (1) | CN110265319B (ja) |
DE (1) | DE102018221001A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110374639B (zh) * | 2019-08-02 | 2021-06-01 | 中煤第三建设(集团)有限责任公司 | 谷物注入装置及谷物注入方法 |
KR20220029906A (ko) * | 2020-09-02 | 2022-03-10 | 에스케이하이닉스 주식회사 | 기판의 평탄화 장치 및 방법 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01284364A (ja) * | 1988-05-11 | 1989-11-15 | Seiwa Denki Kk | ディスペンサー |
JPH04285840A (ja) * | 1991-03-14 | 1992-10-09 | Meidensha Corp | 薬液分注コントロール方法 |
JPH11245006A (ja) * | 1998-03-04 | 1999-09-14 | Nippon Steel Corp | 浸漬ノズルの詰り防止方法及び装置 |
JP2000120983A (ja) * | 1998-10-19 | 2000-04-28 | Seiko Instruments Inc | 液体注入器 |
JP2002320894A (ja) * | 2001-04-27 | 2002-11-05 | Kyocera Corp | 吐出装置 |
JP2007167791A (ja) * | 2005-12-22 | 2007-07-05 | Shibaura Mechatronics Corp | ペースト塗布装置、これを用いた表示パネルの製造装置、及び、ペースト塗布方法 |
US20100055299A1 (en) * | 2008-09-02 | 2010-03-04 | Nscrypt, Inc. | Dispensing patterns including lines and dots at high speeds |
JP2010524492A (ja) * | 2007-04-30 | 2010-07-22 | ザ プロクター アンド ギャンブル カンパニー | 基材を被覆するための超音波噴霧装置 |
JP2011161366A (ja) * | 2010-02-09 | 2011-08-25 | Denso Corp | シート材の製造方法およびシート材の製造装置 |
CN108722798A (zh) * | 2018-07-17 | 2018-11-02 | 深圳市曼恩斯特科技有限公司 | 一种涂布模头机构 |
Family Cites Families (6)
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JPH0668150B2 (ja) * | 1988-03-26 | 1994-08-31 | 神奈川県 | 弗水素化非晶質炭化珪素薄膜及び弗素化非晶質珪素薄膜の気相合成法 |
JP3800211B2 (ja) * | 2002-10-17 | 2006-07-26 | セイコーエプソン株式会社 | 液状体の吐出装置と液状体の吐出方法、電気光学装置とその製造方法、及び電子機器 |
CN1822932A (zh) * | 2003-07-16 | 2006-08-23 | 出光兴产株式会社 | 针对树脂材料的超声波振动施加装置,使用此超声波施加装置的树脂材料的熔化成型方法及树脂组成物 |
US7688583B1 (en) * | 2008-09-30 | 2010-03-30 | General Electric Company | Synthetic jet and method of making same |
FR2937884A1 (fr) * | 2008-11-05 | 2010-05-07 | Osmooze | Procede de formation d'une emulsion a partir de liquides non miscibles en eux et application a l'alimentation en liquide d'un dispositif de nebulisation |
JP2018044294A (ja) | 2016-09-12 | 2018-03-22 | Toto株式会社 | アダプタ |
-
2018
- 2018-03-12 JP JP2018044294A patent/JP6939657B2/ja active Active
- 2018-10-15 US US16/159,744 patent/US20190275552A1/en active Pending
- 2018-12-05 DE DE102018221001.2A patent/DE102018221001A1/de active Pending
-
2019
- 2019-03-07 CN CN201910171841.1A patent/CN110265319B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01284364A (ja) * | 1988-05-11 | 1989-11-15 | Seiwa Denki Kk | ディスペンサー |
JPH04285840A (ja) * | 1991-03-14 | 1992-10-09 | Meidensha Corp | 薬液分注コントロール方法 |
JPH11245006A (ja) * | 1998-03-04 | 1999-09-14 | Nippon Steel Corp | 浸漬ノズルの詰り防止方法及び装置 |
JP2000120983A (ja) * | 1998-10-19 | 2000-04-28 | Seiko Instruments Inc | 液体注入器 |
JP2002320894A (ja) * | 2001-04-27 | 2002-11-05 | Kyocera Corp | 吐出装置 |
JP2007167791A (ja) * | 2005-12-22 | 2007-07-05 | Shibaura Mechatronics Corp | ペースト塗布装置、これを用いた表示パネルの製造装置、及び、ペースト塗布方法 |
JP2010524492A (ja) * | 2007-04-30 | 2010-07-22 | ザ プロクター アンド ギャンブル カンパニー | 基材を被覆するための超音波噴霧装置 |
US20100055299A1 (en) * | 2008-09-02 | 2010-03-04 | Nscrypt, Inc. | Dispensing patterns including lines and dots at high speeds |
JP2011161366A (ja) * | 2010-02-09 | 2011-08-25 | Denso Corp | シート材の製造方法およびシート材の製造装置 |
CN108722798A (zh) * | 2018-07-17 | 2018-11-02 | 深圳市曼恩斯特科技有限公司 | 一种涂布模头机构 |
Also Published As
Publication number | Publication date |
---|---|
US20190275552A1 (en) | 2019-09-12 |
CN110265319A (zh) | 2019-09-20 |
CN110265319B (zh) | 2023-09-29 |
JP6939657B2 (ja) | 2021-09-22 |
DE102018221001A1 (de) | 2019-09-12 |
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