CN110246962A - 磁存储装置及其制造方法 - Google Patents
磁存储装置及其制造方法 Download PDFInfo
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- CN110246962A CN110246962A CN201810945668.1A CN201810945668A CN110246962A CN 110246962 A CN110246962 A CN 110246962A CN 201810945668 A CN201810945668 A CN 201810945668A CN 110246962 A CN110246962 A CN 110246962A
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- Prior art keywords
- side wall
- layer
- insulating layer
- magnetic memory
- stepped construction
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
- H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Magnetic active materials
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018043467A JP2019160938A (ja) | 2018-03-09 | 2018-03-09 | 磁気記憶装置及びその製造方法 |
JP2018-043467 | 2018-03-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110246962A true CN110246962A (zh) | 2019-09-17 |
CN110246962B CN110246962B (zh) | 2023-07-21 |
Family
ID=67843507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810945668.1A Active CN110246962B (zh) | 2018-03-09 | 2018-08-20 | 磁存储装置及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10790442B2 (zh) |
JP (1) | JP2019160938A (zh) |
CN (1) | CN110246962B (zh) |
TW (1) | TWI681576B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018147916A (ja) * | 2017-03-01 | 2018-09-20 | ソニーセミコンダクタソリューションズ株式会社 | 磁気記憶素子、磁気記憶装置、電子機器、および磁気記憶素子の製造方法 |
JP2019161180A (ja) * | 2018-03-16 | 2019-09-19 | 東芝メモリ株式会社 | 磁気記憶装置 |
US10522751B2 (en) | 2018-05-22 | 2019-12-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | MTJ CD variation by HM trimming |
CN116583165A (zh) * | 2018-10-08 | 2023-08-11 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
CN111106235B (zh) | 2018-10-29 | 2023-07-11 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
US11469369B2 (en) * | 2019-05-14 | 2022-10-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | MRAM structure with high TMR and high PMA |
JP2021145025A (ja) * | 2020-03-11 | 2021-09-24 | キオクシア株式会社 | 磁気記憶装置及び磁気記憶装置の製造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050174876A1 (en) * | 2002-05-13 | 2005-08-11 | Nec Corporation | Semiconductor storage device and production method therefor |
JP2006165030A (ja) * | 2004-12-02 | 2006-06-22 | Ulvac Japan Ltd | トンネル接合素子のエッチング加工方法および装置 |
US20140170776A1 (en) * | 2012-12-07 | 2014-06-19 | Avalanche Technology Inc. | Mtj stack and bottom electrode patterning process with ion beam etching using a single mask |
CN103985672A (zh) * | 2013-02-08 | 2014-08-13 | 台湾积体电路制造股份有限公司 | 从半导体器件去除膜的方法 |
US20160072050A1 (en) * | 2014-09-08 | 2016-03-10 | Masatoshi Yoshikawa | Magnetic memory device and method of manufacturing the same |
US20170263858A1 (en) * | 2016-03-11 | 2017-09-14 | Kabushiki Kaisha Toshiba | Magnetic memory device and manufacturing method of magnetic memory device |
CN107527994A (zh) * | 2016-06-20 | 2017-12-29 | 上海磁宇信息科技有限公司 | 一种磁性隧道结双层侧墙及其形成方法 |
US9871195B1 (en) * | 2017-03-22 | 2018-01-16 | Headway Technologies, Inc. | Spacer assisted ion beam etching of spin torque magnetic random access memory |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013243307A (ja) | 2012-05-22 | 2013-12-05 | Toshiba Corp | 半導体製造装置および半導体装置の製造方法 |
US9105572B2 (en) * | 2013-09-09 | 2015-08-11 | Hiroyuki Kanaya | Magnetic memory and manufacturing method thereof |
US9070869B2 (en) | 2013-10-10 | 2015-06-30 | Avalanche Technology, Inc. | Fabrication method for high-density MRAM using thin hard mask |
CN106062945B (zh) | 2014-03-11 | 2019-07-26 | 东芝存储器株式会社 | 磁存储器和制造磁存储器的方法 |
US10355198B2 (en) * | 2017-11-13 | 2019-07-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory device and fabrication method thereof |
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2018
- 2018-03-09 JP JP2018043467A patent/JP2019160938A/ja active Pending
- 2018-08-03 TW TW107127003A patent/TWI681576B/zh active
- 2018-08-20 CN CN201810945668.1A patent/CN110246962B/zh active Active
- 2018-08-30 US US16/117,954 patent/US10790442B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050174876A1 (en) * | 2002-05-13 | 2005-08-11 | Nec Corporation | Semiconductor storage device and production method therefor |
JP2006165030A (ja) * | 2004-12-02 | 2006-06-22 | Ulvac Japan Ltd | トンネル接合素子のエッチング加工方法および装置 |
US20140170776A1 (en) * | 2012-12-07 | 2014-06-19 | Avalanche Technology Inc. | Mtj stack and bottom electrode patterning process with ion beam etching using a single mask |
CN103985672A (zh) * | 2013-02-08 | 2014-08-13 | 台湾积体电路制造股份有限公司 | 从半导体器件去除膜的方法 |
US20160072050A1 (en) * | 2014-09-08 | 2016-03-10 | Masatoshi Yoshikawa | Magnetic memory device and method of manufacturing the same |
US20170263858A1 (en) * | 2016-03-11 | 2017-09-14 | Kabushiki Kaisha Toshiba | Magnetic memory device and manufacturing method of magnetic memory device |
CN107527994A (zh) * | 2016-06-20 | 2017-12-29 | 上海磁宇信息科技有限公司 | 一种磁性隧道结双层侧墙及其形成方法 |
US9871195B1 (en) * | 2017-03-22 | 2018-01-16 | Headway Technologies, Inc. | Spacer assisted ion beam etching of spin torque magnetic random access memory |
Also Published As
Publication number | Publication date |
---|---|
CN110246962B (zh) | 2023-07-21 |
TW201939777A (zh) | 2019-10-01 |
JP2019160938A (ja) | 2019-09-19 |
US20190280195A1 (en) | 2019-09-12 |
TWI681576B (zh) | 2020-01-01 |
US10790442B2 (en) | 2020-09-29 |
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PB01 | Publication | ||
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CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Tokyo, Japan Applicant after: Kaixia Co.,Ltd. Address before: Tokyo, Japan Applicant before: TOSHIBA MEMORY Corp. Address after: Tokyo, Japan Applicant after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Applicant before: Japanese businessman Panjaya Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220110 Address after: Tokyo, Japan Applicant after: Japanese businessman Panjaya Co.,Ltd. Address before: Tokyo, Japan Applicant before: TOSHIBA MEMORY Corp. |
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