CN110226366B - 电磁波屏蔽膜、屏蔽印制线路板及电子设备 - Google Patents
电磁波屏蔽膜、屏蔽印制线路板及电子设备 Download PDFInfo
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- CN110226366B CN110226366B CN201880010126.3A CN201880010126A CN110226366B CN 110226366 B CN110226366 B CN 110226366B CN 201880010126 A CN201880010126 A CN 201880010126A CN 110226366 B CN110226366 B CN 110226366B
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- electromagnetic wave
- wave shielding
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-021648 | 2017-02-08 | ||
| JP2017021648 | 2017-02-08 | ||
| PCT/JP2018/004107 WO2018147298A1 (ja) | 2017-02-08 | 2018-02-07 | 電磁波シールドフィルム、シールドプリント配線板及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110226366A CN110226366A (zh) | 2019-09-10 |
| CN110226366B true CN110226366B (zh) | 2021-02-12 |
Family
ID=63107537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880010126.3A Active CN110226366B (zh) | 2017-02-08 | 2018-02-07 | 电磁波屏蔽膜、屏蔽印制线路板及电子设备 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6564534B2 (ja) |
| KR (1) | KR102267570B1 (ja) |
| CN (1) | CN110226366B (ja) |
| TW (1) | TWI760431B (ja) |
| WO (1) | WO2018147298A1 (ja) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113170603A (zh) | 2018-12-03 | 2021-07-23 | 拓自达电线株式会社 | 接地构件及屏蔽印制线路板 |
| JP7363103B2 (ja) * | 2019-05-30 | 2023-10-18 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
| JP6597927B1 (ja) * | 2019-06-18 | 2019-10-30 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
| JP6624331B1 (ja) * | 2019-08-01 | 2019-12-25 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
| JP6645610B1 (ja) * | 2019-08-01 | 2020-02-14 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
| JP6690773B1 (ja) * | 2019-12-18 | 2020-04-28 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
| KR102472342B1 (ko) * | 2020-02-10 | 2022-11-30 | 진테크 주식회사 | 열반응성 점착제층을 구비한 전자파 차폐용 캐리어 금속극박 및 이의 제조방법 |
| TWI812913B (zh) * | 2020-03-02 | 2023-08-21 | 日商拓自達電線股份有限公司 | 金屬箔及電磁波屏蔽膜 |
| TW202202337A (zh) * | 2020-03-02 | 2022-01-16 | 日商拓自達電線股份有限公司 | 接地連接引出膜 |
| KR102433774B1 (ko) * | 2020-11-18 | 2022-08-19 | 율촌화학 주식회사 | 열 안정성이 향상된 고주파 전자파 차폐 필름 및 그 제조방법 |
| KR102437292B1 (ko) * | 2020-12-28 | 2022-08-29 | 와이엠티 주식회사 | 전자파 차폐소재 및 이의 제조방법 |
| JP7001187B1 (ja) | 2021-03-19 | 2022-01-19 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシートおよびその製造方法、シールド性配線基板、並びに電子機器 |
| WO2022210631A1 (ja) | 2021-03-29 | 2022-10-06 | タツタ電線株式会社 | 電磁波シールドフィルム及びシールドプリント配線板 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000196285A (ja) * | 1998-12-25 | 2000-07-14 | Sumitomo Rubber Ind Ltd | 透光性電磁波シ―ルド部材およびその製造方法 |
| CN1697589A (zh) * | 2004-03-23 | 2005-11-16 | 大自达系统电子株式会社 | 印刷线路板用屏蔽薄膜及其制造方法 |
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| TWI488280B (zh) * | 2012-11-21 | 2015-06-11 | Ind Tech Res Inst | 電磁波屏蔽結構及其製造方法 |
| JP6202177B1 (ja) * | 2016-01-21 | 2017-09-27 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
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| JP2000196285A (ja) * | 1998-12-25 | 2000-07-14 | Sumitomo Rubber Ind Ltd | 透光性電磁波シ―ルド部材およびその製造方法 |
| CN1697589A (zh) * | 2004-03-23 | 2005-11-16 | 大自达系统电子株式会社 | 印刷线路板用屏蔽薄膜及其制造方法 |
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| KR20190117494A (ko) | 2019-10-16 |
| CN110226366A (zh) | 2019-09-10 |
| KR102267570B1 (ko) | 2021-06-18 |
| JP6564534B2 (ja) | 2019-08-21 |
| WO2018147298A1 (ja) | 2018-08-16 |
| JPWO2018147298A1 (ja) | 2019-02-14 |
| TW201836464A (zh) | 2018-10-01 |
| TWI760431B (zh) | 2022-04-11 |
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