CN110213958B - Automatic chip mounter for camera - Google Patents
Automatic chip mounter for camera Download PDFInfo
- Publication number
- CN110213958B CN110213958B CN201910500916.6A CN201910500916A CN110213958B CN 110213958 B CN110213958 B CN 110213958B CN 201910500916 A CN201910500916 A CN 201910500916A CN 110213958 B CN110213958 B CN 110213958B
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- sliding rail
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- camera
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- 230000007246 mechanism Effects 0.000 claims abstract description 307
- 239000000463 material Substances 0.000 claims abstract description 75
- 238000010030 laminating Methods 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims description 9
- 239000002390 adhesive tape Substances 0.000 claims 1
- 238000003475 lamination Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Specific Conveyance Elements (AREA)
Abstract
The invention relates to the technical field of chip mounters, in particular to an automatic chip mounter for a camera, which comprises a bonding head mechanism, a first rotating mechanism, a second rotating mechanism, a material bearing mechanism, a first supporting mechanism, a second supporting mechanism, a first sliding mechanism, a second sliding mechanism, a third sliding mechanism, a fourth sliding mechanism, a fifth sliding mechanism, a chassis and a material conveying mechanism. The automatic laminating of the double cameras can be realized during the surface mounting of the surface mounting machine, and the working efficiency and the surface mounting precision are high.
Description
Technical Field
The invention relates to the technical field of chip mounters, in particular to an automatic chip mounter for a camera.
Background
At present, in the process of assembling the double-camera lenses of the mobile phone, the manufacturing factories of the smart phones mostly adopt manual lamination, so that a great deal of manpower is consumed, and the efficiency is low. Meanwhile, as the lenses of the mobile phone with the double cameras are small and thin, defects such as off-tracking of the attaching position, crushing of the lenses and the like easily occur in the manual attaching process. In the operation process of the known chip mounter, the suction nozzle is arranged at the lower end of the suction nozzle rod, the suction nozzle sucks components and the image recognition system recognizes the components, and then the suction nozzle downwards mounts the components meeting the requirements on a circuit board or other workpieces, but the current chip mounter cannot realize synchronous and continuous multiple chip mounting, so that the efficiency is lower; in addition, in the case of a chip mounter, it is necessary to determine whether or not the angle of the component is accurate by an image recognition mechanism, but this prevents the chip mounting from being performed, and thus improvement is required.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention aims to provide the automatic pick-up head chip mounter, which can realize automatic bonding of two cameras of a mobile phone, can effectively control bonding positions and strength, avoid generating faults or scrapping, can maintain good production efficiency for a long time, and has high stability, reliability and mounting precision in working.
The aim of the invention is achieved by the following technical scheme: the utility model provides an automatic chip mounter of camera, includes laminating head mechanism, first rotary mechanism, second rotary mechanism, material bears the weight of the mechanism, first supporting mechanism, second supporting mechanism, first sliding mechanism, second sliding mechanism, third sliding mechanism, fourth sliding mechanism, fifth sliding mechanism, chassis, material conveying mechanism and frame, material conveying mechanism set up in the front wall of frame and be used for the input binder, material bears the weight of the binder that material conveying mechanism inputed, the chassis set up in the up end of frame, first sliding mechanism sets up in the left front end of chassis up end, second sliding mechanism sets up in the chassis up end and be located one side of first sliding mechanism, third sliding mechanism sets up in the chassis up end and be located the opposite side of first sliding mechanism, fifth sliding mechanism sets up in the chassis up end and be located one side of second sliding mechanism, fourth sliding mechanism sets up in the chassis up end and be located between third sliding mechanism and the fifth sliding mechanism, first supporting mechanism set up in the second rotary mechanism sets up in second rotary mechanism is born in first rotary mechanism and is born to the weight of the mechanism.
Preferably, the material conveying mechanism comprises a material tray frame, a first fixing frame, a first driving device, a first nut piece, a first sliding block, a first Z-axis sliding rail and a Z-axis screw rod, wherein the first Z-axis sliding rail is fixedly arranged in the first fixing frame, the first sliding block is slidably sleeved on the first Z-axis sliding rail, the Z-axis screw rod is rotationally arranged in the first fixing frame and is positioned on the inner side of the first Z-axis sliding rail, the material tray frame is fixedly arranged on the first sliding block, and the first nut piece is in threaded connection with the Z-axis screw rod and is fixedly connected with the material tray frame.
Preferably, the first rotating mechanism and the second rotating mechanism comprise a mounting plate, a second fixing frame, a second driving device, a rotating disc and a driving belt, the mounting plate is fixed on the second fixing frame, the second driving device penetrates through the mounting plate and is fixed on the mounting plate, the rotating disc is rotatably arranged at one end of the mounting plate, the second driving device drives the rotating disc to rotate through the driving belt, and the second fixing frame is slidably arranged on the third sliding mechanism and the fifth sliding mechanism.
The first supporting mechanism and the second supporting mechanism preferably comprise a first fixing plate, a third driving device, a supporting rod, a supporting head, a first through center fixing block, a second sliding block and a second Z axial sliding rail, wherein the second Z axial sliding rail is fixed on the first fixing plate, the second sliding block is fixedly sleeved on the second Z axial sliding rail in a sliding manner with the first through center fixing block, the supporting rod is connected with the supporting head and is fixedly arranged on the first through center fixing block, and the third driving device is arranged at the lower end of the first fixing plate and drives the supporting rod to drive the second sliding block to slide on the second Z axial sliding rail.
Preferably, the material bearing mechanism comprises a bearing frame, a material bearing disc, a driving block, a fourth driving device, a second nut piece, a Y-axis screw rod and a Y-axis sliding rail, wherein the material bearing disc is arranged on the upper end face of the bearing frame in a sliding manner, the fourth driving device is fixed at one end of the bearing frame, one end of the Y-axis screw rod is connected with the fourth driving device, the other end of the Y-axis screw rod is rotatably arranged at the other end of the bearing frame, the Y-axis sliding rail is fixed on the lower end face of the inside of the bearing frame, the driving block is slidably sleeved on the Y-axis sliding rail and is connected with the material bearing disc, the second nut piece is in threaded connection with the Y-axis screw rod and is fixedly arranged with the driving block, and the fourth driving device drives the driving block to move relative to the Y-axis sliding rail through driving the Y-axis screw rod.
Preferably, the attaching head mechanism comprises a base frame, a driving mechanism, a camera unit, an X-axis sliding rail, a first suction mechanism, a second suction mechanism and a sixth sliding mechanism, wherein the base frame is arranged on the chassis, the driving mechanism is arranged on the upper end face of the base frame, the sixth sliding mechanism is arranged in the base frame, the X-axis sliding rail is arranged at the front end of the upper end face of the base frame, the camera unit is slidably sleeved on the X-axis sliding rail and then connected with the driving mechanism, the driving mechanism can drive the camera unit to move back and forth relative to the X-axis sliding rail, and the first suction mechanism and the second suction mechanism are slidably arranged at two ends of the sixth sliding mechanism.
Preferably, the driving mechanism comprises a first driving mechanism, a second driving mechanism and a third driving mechanism, and the first driving mechanism is arranged on the upper end surface of the base frame and is positioned at one axial side edge of the upper end surface X of the base frame; the second driving mechanism is arranged on the upper end surface of the base frame and is positioned in front of the left side of the first driving mechanism; the third driving mechanism is arranged on the upper end surface of the base frame and is positioned in front of the right of the first driving mechanism; the camera set comprises a first camera, a second camera and a third camera, wherein the first camera, the second camera and the third camera are all sleeved on the X-axis sliding rail in a sliding mode, the first driving mechanism can drive the first camera to slide relative to the X-axis sliding rail, the second driving mechanism can drive the second camera to slide relative to the X-axis sliding rail, and the third driving mechanism can drive the third camera to slide relative to the X-axis sliding rail. More preferably, the first camera may move in synchronization with the first suction means, and the third camera may move in synchronization with the second suction means.
Preferably, the first suction mechanism and the second suction mechanism are both provided with a fifth driving device, a second fixing plate, an eccentric rotating shaft, a transmission part, a third sliding block, a third Z axial sliding rail, a second through center fixing block, a suction nozzle rod and a suction nozzle head, the fifth driving device is fixed on the side surface of the upper end of one side of the second fixing plate, the eccentric rotating shaft penetrates through the second fixing plate and is rotationally connected with the fifth driving device, the third Z axial sliding rail is fixed on the side surface of the lower end of the other side of the second fixing plate, the third sliding block is slidably sleeved on the third Z axial sliding rail, one end of the transmission part is rotationally arranged on the eccentric rotating shaft, the other end of the transmission part is rotationally arranged with the third sliding block, the suction nozzle head is fixedly arranged on the third sliding block through the second through center fixing block after being screwed with the suction nozzle rod, and the fifth driving device drives the eccentric rotating shaft to rotate to drive the third sliding block to vertically slide relative to the third Z axial sliding rail so as to drive the suction nozzle head to move up and down in the Z axial direction. More preferably, the first supporting mechanism may cooperate with the first sucking mechanism to suck the patch placed on the first rotating mechanism, and the second supporting mechanism may cooperate with the second sucking mechanism to suck the patch placed on the second rotating mechanism.
Preferably, the chip mounter further comprises an image display screen, wherein the image display screen is fixed on the upper end face in the frame and is positioned at the upper end of the attaching head mechanism.
Preferably, the chip mounter further comprises a housing, wherein the housing wraps the frame and each mechanism.
The invention has the beneficial effects that: according to the automatic chip mounter with the cameras, automatic lamination of two cameras of a mobile phone can be achieved when the chip mounter is subjected to chip mounting, the chip mounting can be efficiently sucked from a material bearing mechanism through the arranged camera set matched with the suction mechanism, lamination positions and forces can be effectively controlled, bad or scrapping is avoided, continuous lamination can be achieved through the arranged material conveying mechanism matched with the first rotating mechanism and the second rotating mechanism, and meanwhile good production efficiency, working stability, reliability and lamination accuracy can be maintained for a long time.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a partial perspective view of the present invention;
FIG. 3 is a first exploded view of the present invention;
FIG. 4 is a schematic view of a second exploded construction of the present invention;
FIG. 5 is a third exploded view of the present invention;
FIG. 6 is a schematic view of a material carrying mechanism according to the present invention;
FIG. 7 is a schematic view of a material carrying mechanism according to another aspect of the present invention;
FIG. 8 is a top view of the material carrying mechanism of the present invention;
FIG. 9 is a schematic view of the first drive mechanism of the present invention;
FIG. 10 is a schematic view of the first support mechanism and first slide mechanism combination of the present invention;
FIG. 11 is a perspective view of the bonding head mechanism of the present invention;
FIG. 12 is a partially exploded view of the bond head mechanism of the present invention;
fig. 13 is a schematic structural view of a sixth sliding mechanism of the present invention;
fig. 14 is a perspective view of the first suction means of the present invention;
FIG. 15 is a perspective view of the material handling mechanism of the present invention;
fig. 16 is a schematic view of a material conveying mechanism according to another view of the present invention.
The reference numerals are: 1-attaching head mechanism, 111-base frame, 121-first driving mechanism, 122-second driving mechanism, 123-third driving mechanism, 1311-first camera, 1312-second camera, 1313-third camera, 141-X axial slide rail, 151-first suction mechanism, 1511-fifth driving device, 1512-second fixing plate, 1513-eccentric rotation shaft, 1514-transmission member, 1515-third slider, 1516-third Z axial slide rail, 1517-second center fixing block, 1518-suction nozzle bar, 1519-suction nozzle head, 161-second suction mechanism, 17-sixth sliding mechanism, 2-first rotation mechanism, 21-mounting plate, 22-second fixing frame, 23-second driving device 24-rotating disk, 25-driving belt, 3-second rotating mechanism, 4-material carrying mechanism, 41-carrying frame, 42-material carrying disk, 43-driving block, 44-fourth driving device, 45-second nut piece, 46-Y axial screw rod, 47-Y axial slide rail, 5-first supporting mechanism, 51-first fixing plate, 52-third driving device, 53-supporting rod, 54-supporting head, 55-first through center fixing block, 56-second sliding block, 57-second Z axial slide rail, 6-second supporting mechanism, 7-first sliding mechanism, 8-second sliding mechanism, 9-third sliding mechanism, 10-fourth sliding mechanism, 11-fifth sliding mechanism, 12-chassis, 13-material conveying mechanism, 131-material tray rack, 132-first mount, 133-first drive arrangement, 134-first nut piece, 135-first slider, 136-first Z axial slide rail, 137-Z axial lead screw, 14-frame, 15-image display screen and 16-shell.
Detailed Description
The present invention is further illustrated below with reference to examples and figures 1-16 for the purpose of facilitating understanding of those skilled in the art, and the description of the embodiments is not intended to limit the invention.
Referring to fig. 1-16, an automatic pick-up head chip mounter comprises a bonding head mechanism 1, a first rotary mechanism 2, a second rotary mechanism 3, a material bearing mechanism 4, a first supporting mechanism 5, a second supporting mechanism 6, a first sliding mechanism 7, a second sliding mechanism 8, a third sliding mechanism 9, a fourth sliding mechanism 10, a fifth sliding mechanism 11, a chassis 12, a material conveying mechanism 13 and a rack 14, wherein the material conveying mechanism 13 is arranged on the front side wall of the rack 14 and is used for inputting a base material, the material bearing mechanism 4 bears the base material input by the material conveying mechanism 13, the chassis 12 is arranged on the upper end surface of the rack 14, the first sliding mechanism 7 is arranged at the left front end of the upper end surface of the chassis 12, the second sliding mechanism 8 is arranged on one side of the first sliding mechanism 7, the third sliding mechanism 9 is arranged on the upper end surface of the chassis 12 and is positioned on the other side of the first sliding mechanism 7, the fifth sliding mechanism 11 is arranged on the upper end surface of the chassis 12 and is positioned on one side of the second sliding mechanism 8, the fourth sliding mechanism 8 is arranged on the fourth sliding mechanism 8, the third sliding mechanism 8 is arranged on the upper end surface of the fourth sliding mechanism 8, the fourth sliding mechanism 8 is arranged on the fourth sliding mechanism 4, the fourth sliding mechanism 8 is arranged on the upper end of the fourth sliding mechanism 7, and can be rotated, the attaching head mechanism 1 is erected on the chassis 12 along the X-axis direction. The material conveying mechanism 13 is used for automatically inputting an external base material (such as a printed circuit board, etc.), the material bearing mechanism 4 is used for bearing the base material input by the material conveying mechanism 13, the first rotating mechanism 2 and the second rotating mechanism 3 are used for bearing external patches, and the attaching head mechanism 1 is used for attaching the patches borne by the rotating mechanism to the base material borne by the material bearing mechanism 4.
In this embodiment, the automatic laminating of cell-phone two cameras can be realized to the paster, through the camera group that sets up cooperation first suction means 151 and second suction means 161 not only can carry out the paster operation to material bearing mechanism 4 by the efficient, but also can effectively control laminating position and dynamics, avoided producing badly or scrapping, and the first supporting mechanism 5 that sets up, second supporting mechanism 6 can cooperate first suction means 151 and second suction means 161 accurate to the paster of placing on first rotary mechanism 2 and second rotary mechanism 3 absorb, absorb components and parts, image recognition system discernment back suction nozzle 1519 downward will meet the requirements on circuit board or other work pieces through suction nozzle 1519, and the setting of material conveying mechanism 13 can make the paster provide continuous paster and need not frequently to change the machined part in addition, and this paster can keep good production efficiency, job stabilization nature, reliability and subsides dress precision for a long time simultaneously.
In this embodiment, the material conveying mechanism 13 includes a material tray frame 131, a first fixing frame 132, a first driving device 133, a first nut member 134, a first slider 135, a first Z-axis sliding rail 136 and a Z-axis screw rod 137, where the first Z-axis sliding rail 136 is fixedly disposed in the first fixing frame 132, the first slider 135 is slidably sleeved on the first Z-axis sliding rail 136, the Z-axis screw rod 137 is rotatably disposed in the first fixing frame 132 and is located inside the first Z-axis sliding rail 136, the material tray frame 131 is fixedly disposed on the first slider 135, and the first nut member 134 is screwed to the Z-axis screw rod 137 and is fixedly connected with the material tray frame 131.
In this embodiment, the first driving device 133 of the material conveying mechanism 13 disposed by the first driving device may drive the first nut 134 to move and further drive the tray rack 131 to move up and down relative to the first Z-axis sliding rail 136, so as to realize continuous conveying and replacement between the plurality of material bearing trays 42 disposed on the material tray rack 131 and the material bearing tray 42 disposed on the material bearing mechanism 4, further realize continuous and automatic chip mounting of the chip mounter, and improve working efficiency of the chip mounter.
In this embodiment, the first rotating mechanism 2 and the second rotating mechanism 3 each include a mounting plate 21, a second fixing frame 22, a second driving device 23, a rotating disc 24 and a driving belt 25, the mounting plate 21 is fixed on the second fixing frame 22, the second driving device 23 penetrates through the mounting plate 21 and is fixed on the mounting plate 21, the rotating disc 24 is rotatably disposed at one end of the mounting plate 21, the second driving device 23 drives the rotating disc 24 to rotate via the driving belt 25, and the second fixing frame 22 is slidably disposed on the third sliding mechanism 9 and the fifth sliding mechanism 11.
In this embodiment, the first rotating mechanism 2 and the second rotating mechanism 3 may drive the rotating disc 24 to rotate through the second driving device 23, so that the first suction mechanism 151 and the second suction mechanism 161 further improve the suction efficiency and accuracy of the first suction mechanism 151 and the second suction mechanism 161 when the first support mechanism 5 and the second support mechanism 6 cooperate to suck the patch placed on the rotating disc 24.
In this embodiment, the first supporting mechanism 5 and the second supporting mechanism 6 each include a first fixing plate 51, a third driving device 52, a supporting rod 53, a supporting head 54, a first through center fixing block 55, a second sliding block 56 and a second Z axial sliding rail 57, the second Z axial sliding rail 57 is fixed on the first fixing plate 51, the second sliding block 56 is fixed with the first through center fixing block 55 and is slidably sleeved on the second Z axial sliding rail 57, the supporting rod 53 is connected with the supporting head 54 and then fixed on the first through center fixing block 55, and the third driving device 52 is arranged at the lower end of the first fixing plate 51 and can drive the supporting rod 53 to drive the second sliding block 56 to slide on the second Z axial sliding rail 57.
In this embodiment, the supporting head 54 fixed on the first through center fixing block 55 and arranged on the second supporting mechanism 5 is driven by the third driving device 52 to move up and down along the second Z axis sliding rail 57, when the first sucking mechanism 151 and the second sucking mechanism 161 suck the patches, the supporting mechanism supports the lower part of the patches borne by the rotating mechanism, and can cooperate with the first sucking mechanism 151 and the second sucking mechanism 161 to prevent the patches sucked by the sucking mechanism from sinking downwards, so that the first sucking mechanism 151 and the second sucking mechanism 161 are prevented from falling off due to unstable suction of the patches when sucking the patches.
In this embodiment, the material bearing mechanism 4 includes a bearing frame 41, a material bearing disc 42, a driving block 43, a fourth driving device 44, a second nut member 45, a Y axial screw rod 46 and a Y axial sliding rail 47, where the material bearing disc 42 is slidably disposed on an upper end surface of the bearing frame 41, the fourth driving device 44 is fixed at one end of the bearing frame 41, one end of the Y axial screw rod 46 is rotationally connected with the fourth driving device 44, the other end of the Y axial screw rod 46 is rotationally disposed at the other end of the bearing frame 41, the Y axial sliding rail 47 is fixed at a lower end surface of the inside of the bearing frame 41, the driving block 43 is slidably sleeved on the Y axial sliding rail 47 and connected with the material bearing disc 42, the second nut member 45 is screwed to the Y axial screw rod 46 and fixedly disposed with the driving block 43, and the fourth driving device 44 drives the Y axial screw rod 46 to rotate so that the second nut member 45 moves along with the driving block 43 relative to the Y axial sliding rail 47.
The fourth driving device 44 in this embodiment may drive the second nut member 45 to screw on the Y-axis screw rod 46, so as to drive the driving block 43 fixed with the second nut member 45 to move along with the second nut member 45, so as to push the material carrying tray 42 mounted on the carrying frame 41 to move, and cooperate with the information transmitted by the image recognition system, so that the chip mounter is guaranteed to continuously and accurately mount a plurality of processed workpieces placed on the material carrying tray 42, and the working efficiency of the chip mounter is improved.
In this embodiment, the attaching head mechanism 1 includes a base frame 111, a driving mechanism, a camera unit, an X-axis sliding rail 141, a first suction mechanism 151, a second suction mechanism 161 and a sixth sliding mechanism 17, where the base frame 111 is erected on the chassis 12, the driving mechanism is set up on an upper end surface of the base frame 111, the sixth sliding mechanism 17 is set up in the base frame 111, the X-axis sliding rail 141 is set up at a front end of the upper end surface of the base frame 111, the camera unit is slidably sleeved on the X-axis sliding rail 141 and then connected with the driving mechanism, the driving mechanism can drive the camera unit to move back and forth relative to the X-axis sliding rail 141, and the first suction mechanism 151 and the second suction mechanism 161 are slidably set up at two ends of the sixth sliding mechanism 17.
The laminating head mechanism 1 of chip mounter can realize the automatic laminating of cell-phone two cameras when being used for the chip mounter in this embodiment, cooperates first suction means 151 and second suction means 161 along first X axial slide rail 141 back and forth movement effective control laminating position and dynamics under actuating mechanism's drive through the camera group that sets up, avoids producing bad or scrapping, can also keep good production efficiency for a long time, and stability, reliability and the mounting precision of during operation are high.
In this embodiment, the driving mechanism includes a first driving mechanism 121, a second driving mechanism 122 and a third driving mechanism 123, where the first driving mechanism 121 is disposed on an upper end surface of the base frame 111 and is located at an edge of an upper end surface X of the base frame 111 in an axial direction, the second driving mechanism 122 is disposed on an upper end surface of the base frame 111 and is located at a left front side of the first driving mechanism 121, and the third driving mechanism 123 is disposed on an upper end surface of the base frame 111 and is located at a right front side of the first driving mechanism 121; the camera set includes a first camera 1311, a second camera 1312, and a third camera 1313, where the first camera 1311, the second camera 1312, and the third camera 1313 are all slidably sleeved on the X-axis slide rail 141, the first driving mechanism 121 may drive the first camera 1311 to slide relative to the X-axis slide rail 141, the second driving mechanism 122 may drive the second camera 1312 to slide relative to the X-axis slide rail 141, and the third driving mechanism 123 may drive the third camera 1313 to slide relative to the X-axis slide rail 141. More preferably, the first camera 1311 may move in synchronization with the first suction mechanism 151, and the third camera 1313 may move in synchronization with the second suction mechanism 161.
In this embodiment, the first driving mechanism 121 may effectively drive the first camera 1311 to slide along the X-axis sliding rail 141, and cooperate with the material carrying mechanism 4 to determine the position of the workpiece to be processed for bonding, the second driving mechanism 122 may drive the second camera 1312 to slide along the X-axis sliding rail 141, cooperate with the first sucking mechanism 151 to effectively suck the bonding pad placed on the rotating disc 24, and transfer the bonding pad to the material carrying mechanism 4 for bonding the workpiece to be processed, and the third driving mechanism 123 may drive the third camera 1313 to slide along the X-axis sliding rail 141, cooperate with the second sucking mechanism 161 to effectively suck the bonding pad placed on the rotating disc 24, and transfer the bonding pad to the material carrying mechanism 4 for bonding the workpiece to be processed, so that the first sucking mechanism 115 and the second sucking mechanism 161 implement synchronous bonding during the process of assembling the dual-camera lens of the mobile phone.
In this embodiment, the first suction mechanism 151 and the second suction mechanism 161 are respectively provided with a fifth driving device 1511, a second fixing plate 1512, an eccentric rotation shaft 1513, a transmission member 1514, a third slider 1515, a third Z-axis sliding rail 1516, a second through-center fixing block 1517, a suction nozzle rod 1518 and a suction nozzle head 1519, the fifth driving device 1511 is fixed on the upper end side surface of one side of the second fixing plate 1512, the eccentric rotation shaft 1513 penetrates through the second fixing plate 1512 and is connected with the output end of the fifth driving device 1511, the third Z-axis sliding rail 1516 is fixed on the lower end side surface of the other side of the second fixing plate 1512, the third slider 1515 is slidably sleeved on the third Z-axis sliding rail 1516, one end of the transmission member 1514 is rotatably arranged on the eccentric rotation shaft 1513, the other end of the transmission member 1514 and the third slider 1515 are rotatably arranged, the head 1519 is screwed on the upper end surface of the second through-center fixing block 1518, and the third slider 1515 is rotatably driven by the third through-center fixing block 1517 under the third axial sliding rail 1515, and the third slider 1515 is rotatably driven by the third axial sliding rail 1515. More preferably, the first supporting mechanism 5 may cooperate with the first sucking mechanism 151 to suck the patch placed on the first rotating mechanism 2, and the second supporting mechanism 6 may cooperate with the second sucking mechanism 161 to suck the patch placed on the second rotating mechanism 3.
In this embodiment, the first suction mechanism 151 and the second suction mechanism 161 drive the eccentric rotation shaft 1513 through the fifth driving device 1511, so as to drive the driving piece 1514 rotationally connected with the third slider 1515, and further drive the third slider 1515 to move up and down along the third Z axial sliding rail 1516, and further drive the suction nozzle rod 1518 and the suction nozzle head 1519 mounted on the third slider 1515 to move up and down, so that automatic lamination of the lamination head of the chip mounter with the dual cameras of the mobile phone in the lamination process is realized, and the lamination position and force are precisely controlled.
In this embodiment, the chip mounter further includes an image display screen 15, where the image display screen 15 is fixed on an upper end surface of the frame 14 and is located at an upper end of the attaching head mechanism 1. More preferably, the chip mounter further includes a housing 16, and the housing 16 encloses the rack 14 and the respective mechanisms.
The image display screen 15 provided in this embodiment can assist the camera set to collect image information, and provides convenience for numerical control operation, is favorable for full-automatic operation, control and work of the chip mounter, and the provided housing 16 can well isolate the chip mounter from the external environment, so that dust and some tiny impurities are prevented from falling into the chip, and the chip mounter is well protected and commonly used when in work.
The above embodiments are preferred embodiments of the present invention, and besides, the present invention may be implemented in other ways, and any obvious substitution is within the scope of the present invention without departing from the concept of the present invention.
Claims (7)
1. The utility model provides an automatic chip mounter of camera which characterized in that: the adhesive tape comprises an attaching head mechanism, a first rotating mechanism, a second rotating mechanism, a material bearing mechanism, a first supporting mechanism, a second supporting mechanism, a first sliding mechanism, a second sliding mechanism, a third sliding mechanism, a fourth sliding mechanism, a fifth sliding mechanism, a chassis, a material conveying mechanism and a frame, wherein the material conveying mechanism is arranged on the front side wall of the frame and is used for inputting base materials, the material bearing mechanism bears the base materials input by the material conveying mechanism, the chassis is arranged on the upper end surface of the frame, the first sliding mechanism is arranged at the left front end of the upper end surface of the chassis, the second sliding mechanism is arranged on the upper end surface of the chassis and is positioned on one side of the first sliding mechanism, the third sliding mechanism is arranged on the upper end surface of the chassis and is positioned on one side of the second sliding mechanism, the fourth sliding mechanism is arranged on the upper end surface of the chassis and is positioned between the third sliding mechanism and the fifth sliding mechanism, the first supporting mechanism can be arranged on the upper end surface of the chassis and is arranged on the second sliding mechanism, the second supporting mechanism can be rotatably attached to the rotating mechanism, the first rotating mechanism can be arranged on the attaching head, and the second rotating mechanism can be attached to the rotating mechanism;
the material conveying mechanism comprises a material disc frame, a first fixing frame, a first driving device, a first nut piece, a first sliding block, a first Z-axis sliding rail and a Z-axis screw rod, wherein the first Z-axis sliding rail is fixedly arranged in the first fixing frame, the first sliding block is slidably sleeved on the first Z-axis sliding rail, the Z-axis screw rod is rotationally arranged in the first fixing frame and positioned at the inner side of the first Z-axis sliding rail, the material disc frame is fixedly arranged on the first sliding block, and the first nut piece is in threaded connection with the Z-axis screw rod and is fixedly connected with the material disc frame;
the first rotating mechanism and the second rotating mechanism comprise a mounting plate, a second fixing frame, a second driving device, a rotating disc and a driving belt, the mounting plate is fixed on the second fixing frame, the second driving device penetrates through the mounting plate and is fixed on the mounting plate, the rotating disc is rotatably arranged at one end of the mounting plate, the second driving device drives the rotating disc to rotate through the driving belt, and the second fixing frames are slidably arranged on the third sliding mechanism and the fifth sliding mechanism;
the laminating head mechanism comprises a base frame, a driving mechanism, a camera unit, an X-axis sliding rail, a first sucking mechanism, a second sucking mechanism and a sixth sliding mechanism, wherein the base frame is arranged on the chassis, the driving mechanism is arranged on the upper end face of the base frame, the sixth sliding mechanism is arranged in the base frame, the X-axis sliding rail is arranged at the front end of the upper end face of the base frame, the camera unit is slidably sleeved on the X-axis sliding rail and is connected with the driving mechanism, the driving mechanism can drive the camera unit to move back and forth relative to the X-axis sliding rail, and the first sucking mechanism and the second sucking mechanism are slidably arranged at two ends of the sixth sliding mechanism.
2. The automatic pick-up head mounting machine according to claim 1, wherein: the first supporting mechanism and the second supporting mechanism comprise a first fixing plate, a third driving device, a supporting rod, a supporting head, a first through center fixing block, a second sliding block and a second Z axial sliding rail, the second Z axial sliding rail is fixed on the first fixing plate, the second sliding block is fixed with the first through center fixing block and is sleeved on the second Z axial sliding rail in a sliding manner, the supporting rod is connected with the supporting head and is fixed on the first through center fixing block, and the third driving device is arranged at the lower end of the first fixing plate and drives the supporting rod to drive the second sliding block to slide on the second Z axial sliding rail.
3. The automatic pick-up head mounting machine according to claim 1, wherein: the material bearing mechanism comprises a bearing frame, a material bearing disc, a driving block, a fourth driving device, a second nut piece, a Y-axis screw rod and a Y-axis sliding rail, wherein the material bearing disc is arranged on the upper end face of the bearing frame in a sliding mode, the fourth driving device is fixed at one end of the bearing frame, one end of the Y-axis screw rod is connected with the fourth driving device, the other end of the Y-axis screw rod is rotatably arranged at the other end of the bearing frame, the Y-axis sliding rail is fixed on the lower end face of the inside of the bearing frame, the driving block is slidably sleeved on the Y-axis sliding rail and connected with the material bearing disc, the second nut piece is in threaded connection with the Y-axis screw rod and is fixedly arranged with the driving block, and the fourth driving device drives the second nut piece to drive the driving block to move relative to the Y-axis sliding rail through driving the Y-axis screw rod.
4. The automatic pick-up head mounting machine according to claim 1, wherein: the driving mechanism comprises a first driving mechanism, a second driving mechanism and a third driving mechanism, and the first driving mechanism is arranged on the upper end face of the base frame and is positioned at one axial side edge of the upper end face X of the base frame; the second driving mechanism is arranged on the upper end surface of the base frame and is positioned in front of the left side of the first driving mechanism; the third driving mechanism is arranged on the upper end surface of the base frame and is positioned in front of the right of the first driving mechanism; the camera set comprises a first camera, a second camera and a third camera, wherein the first camera, the second camera and the third camera are all sleeved on the X-axis sliding rail in a sliding mode, the first driving mechanism can drive the first camera to slide relative to the X-axis sliding rail, the second driving mechanism can drive the second camera to slide relative to the X-axis sliding rail, and the third driving mechanism can drive the third camera to slide relative to the X-axis sliding rail.
5. The automatic pick-up head mounting machine according to claim 1, wherein: the first suction mechanism and the second suction mechanism are respectively provided with a fifth driving device, a second fixing plate, an eccentric rotating shaft, a transmission piece, a third sliding block, a third Z axial sliding rail, a second through center fixing block, a suction nozzle rod and a suction nozzle head, wherein the fifth driving device is fixed on the side face of the upper end of one side of the second fixing plate, the eccentric rotating shaft penetrates through the second fixing plate and is connected with the fifth driving device, the third Z axial sliding rail is fixed on the side face of the lower end of the other side of the second fixing plate, the third sliding block is slidably sleeved on the third Z axial sliding rail, one end of the transmission piece is rotatably arranged on the eccentric rotating shaft, the other end of the transmission piece is rotatably arranged with the third sliding block, the suction nozzle head is fixedly connected with the suction nozzle rod through the second through center fixing block in a threaded mode, and the fifth driving device drives the eccentric rotating shaft to rotate so as to drive the third sliding block to slide up and down relative to the third Z axial sliding rail, and further drive the suction nozzle head to move up and down in the Z axial sliding rail.
6. The automatic pick-up head mounting machine according to claim 1, wherein: the chip mounter further comprises an image display screen, wherein the image display screen is fixed on the upper end face in the frame and is positioned at the upper end of the laminating head mechanism.
7. The automatic pick-up head mounting machine according to claim 1, wherein: the chip mounter further comprises a shell, wherein the shell wraps the frame and each mechanism.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910500916.6A CN110213958B (en) | 2019-06-11 | 2019-06-11 | Automatic chip mounter for camera |
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| CN201910500916.6A CN110213958B (en) | 2019-06-11 | 2019-06-11 | Automatic chip mounter for camera |
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| CN110213958A CN110213958A (en) | 2019-09-06 |
| CN110213958B true CN110213958B (en) | 2024-04-09 |
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| CN113068394A (en) * | 2021-04-16 | 2021-07-02 | 福建省泉州市培元中学 | Self-service intelligent part paster assistant |
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