CN210298419U - Chip mounting mechanism of chip mounter - Google Patents

Abstract

The utility model relates to a chip mounter technical field, concretely relates to chip mounter's paster mechanism, including first mechanism of laminating, first rotary mechanism, second rotary mechanism, the material bears the mechanism, first supporting mechanism, second supporting mechanism, first slide mechanism, second slide mechanism, third slide mechanism, fourth slide mechanism, fifth slide mechanism and chassis, first slide mechanism, second slide mechanism, third slide mechanism, fourth slide mechanism and fifth slide mechanism all put on the chassis, first support mechanism slides and sets up in first slide mechanism, second supporting mechanism slides and sets up in second slide mechanism, first rotary mechanism slides and sets up in third slide mechanism, second rotary mechanism slides and sets up in fifth slide mechanism, the material bears the mechanism and slides and set up in fourth slide mechanism, first mechanism of laminating erects on the chassis. The utility model discloses a paster mechanism can realize the automatic laminating of two cameras during the paster, and work efficiency, reliability, subsides dress precision are high.

Description

Chip mounting mechanism of chip mounter

Technical Field

The utility model relates to a chip mounter technical field, concretely relates to chip mounter's paster mechanism.

Background

At present, a manufacturing factory of the smart phone mostly adopts manual lamination in the process of assembling the double-camera lens of the mobile phone, so that a large amount of manpower is consumed, and the efficiency is low. Meanwhile, because the lenses of the two cameras of the mobile phone are small and thin, the defects of deviation of the attaching position, crushing of the lenses and the like are easy to occur in the manual attaching process. In the operation process of the known chip mounter, the suction nozzle is arranged at the lower end of the suction nozzle rod, components meeting requirements are downwards mounted on a circuit board or other workpieces through the suction nozzle after the components are sucked by the suction nozzle and identified by the image identification system, but the conventional chip mounting mechanism cannot realize synchronous continuous multiple chips, so that the efficiency is low; in addition, when the chip mounter performs chip mounting, it is necessary to determine whether the angle of the component is accurate by using an image recognition mechanism, but improvement is required because the accuracy of the angle of the component is hindered.

Disclosure of Invention

In order to overcome the shortcoming and the not enough that exist among the prior art, the utility model aims to provide a paster mechanism of chip mounter can realize the automatic laminating of two cameras of cell-phone, can not only effective control laminating position and dynamics, avoids producing harmfully or scrapping moreover, can also keep good production efficiency for a long time, and stability, reliability and the subsides dress precision of during operation are high.

The purpose of the utility model is realized through the following technical scheme: a chip mounting mechanism of a chip mounter comprises a chassis, and a fitting head mechanism, a first rotating mechanism, a second rotating mechanism, a material bearing mechanism, a first supporting mechanism, a second supporting mechanism, a first sliding mechanism, a second sliding mechanism, a third sliding mechanism, a fourth sliding mechanism and a fifth sliding mechanism which are arranged on the chassis, wherein the first sliding mechanism is arranged at the left front end of the upper end surface of the chassis, the second sliding mechanism is arranged at one side of the upper end surface of the chassis, the third sliding mechanism is arranged at the other side of the upper end surface of the chassis, the fifth sliding mechanism is arranged at one side of the upper end surface of the chassis, the fourth sliding mechanism is arranged at the upper end surface of the chassis, the fourth sliding mechanism is arranged between the third sliding mechanism and the fifth sliding mechanism, and the first supporting mechanism is arranged on the first sliding mechanism in a sliding manner, the second supporting mechanism is slidably arranged on the second sliding mechanism, the first rotating mechanism is slidably arranged on the third sliding mechanism, the second rotating mechanism is slidably arranged on the fifth sliding mechanism, the material bearing mechanism is slidably arranged on the fourth sliding mechanism, and the fitting head mechanism is erected on the chassis along the X-axis direction.

Further, first rotary mechanism and second rotary mechanism all include mounting panel, mount, first drive arrangement, rotary disk and drive belt, the mounting panel is fixed on the mount, first drive arrangement runs through the mounting panel is fixed on the mounting panel, the rotary disk rotates and sets up the one end of mounting panel, first drive arrangement can via the drive belt drives the rotary disk is rotatory, the mount all can slide set up in on third slide mechanism and the fifth slide mechanism.

Furthermore, the first supporting mechanism and the second supporting mechanism both comprise a first fixing plate, a second driving device, a supporting rod, a supporting head, a first through center fixing block, a first sliding block and a first Z axial sliding rail, the first Z axial sliding rail is fixed on the first fixing plate, the first sliding block and the first through center fixing block are fixed and then slidably sleeved on the first Z axial sliding rail, the supporting rod is connected with the supporting head and then fixed on the first through center fixing block, and the second driving device is arranged at the lower end of the first fixing plate and used for driving the supporting rod to drive the first sliding block to slide on the first Z axial sliding rail.

Further, the material bearing mechanism comprises a bearing frame, a material bearing disc, a driving block, a third driving device, a nut piece, a Y-axis screw rod and a Y-axis slide rail, the material bearing plate is arranged on the upper end surface of the bearing frame in a sliding manner, the third driving device is fixed at one end of the bearing frame, the third driving device is used for driving the Y-axis screw rod to rotate, the other end of the Y-axis screw rod is rotatably arranged at the other end of the bearing frame, the Y-axis slide rail is fixed on the lower end surface in the bearing frame, the driving block is connected with the material bearing disc after being sleeved on the Y-axis slide rail in a sliding way, the nut piece is in threaded connection with the Y-axis screw rod and then is fixedly arranged with the driving block, and the third driving device drives the Y-axis screw rod to rotate so that the nut piece drives the driving block to move relative to the Y-axis sliding rail.

Furthermore, the laminating head mechanism comprises a base frame, a driving mechanism, a camera set, an X axial sliding rail, a first suction mechanism, a second suction mechanism and a sixth sliding mechanism, the base frame is arranged on the chassis, the driving mechanism is arranged on the upper end face of the base frame, the sixth sliding mechanism is arranged in the base frame, the X axial sliding rail is arranged at the front end of the upper end face of the base frame, the camera set is slidably sleeved behind the X axial sliding rail and is connected with the driving mechanism, the driving mechanism can drive the camera set to move back and forth relative to the X axial sliding rail, and the first suction mechanism and the second suction mechanism are slidably arranged at two ends of the sixth sliding mechanism.

Furthermore, the driving mechanism comprises a first driving mechanism, a second driving mechanism and a third driving mechanism, wherein the first driving mechanism is arranged on the upper end surface of the pedestal frame and is positioned on one axial side edge of the upper end surface X of the pedestal frame; the second driving mechanism is arranged on the upper end surface of the base frame and is positioned in front of the first driving mechanism; the third driving mechanism is arranged on the upper end face of the base frame and is positioned at the front right of the first driving mechanism.

Furthermore, the camera set comprises a first camera, a second camera and a third camera, the first camera, the second camera and the third camera are all slidably sleeved on the X-axis slide rail, the first driving mechanism can drive the first camera to slide relative to the X-axis slide rail, the second driving mechanism can drive the second camera to slide relative to the X-axis slide rail, and the third driving mechanism can drive the third camera to slide relative to the X-axis slide rail. Further, the first camera, the second camera and the third camera may constitute a full-azimuth stereoscopic image recognition system.

Furthermore, the first suction mechanism and the second suction mechanism are respectively provided with a fourth driving device, a second fixing plate, an eccentric rotating shaft, a transmission member, a second sliding block, a second Z-axis sliding rail, a second through-center fixing block, a suction nozzle rod and a suction nozzle head, the fourth driving device is fixed on the upper end side face of one side of the second fixing plate, the eccentric rotating shaft penetrates through the second fixing plate and is connected with the fourth driving device in a rotating manner, the second Z-axis sliding rail is fixed on the lower end side face of the other side of the second fixing plate, the second sliding block is sleeved on the second Z-axis sliding rail in a sliding manner, one end of the transmission member is rotatably arranged on the eccentric rotating shaft, the other end of the transmission member is rotatably arranged with the second sliding block, the suction nozzle head is screwed on the suction nozzle rod and then fixed on the second sliding block through the second through-center fixing block, the fourth driving device drives the rotating shaft to eccentrically rotate so as to drive the second sliding block to rotate relative And the suction nozzle head is driven to move up and down along the Z-axis direction by sliding up and down.

Further, the first camera moves in synchronization with the first suction mechanism, and the third camera moves in synchronization with the second suction mechanism. Furthermore, the first supporting mechanism can cooperate with the first suction mechanism to suck the patches placed on the first rotating mechanism, and the second supporting mechanism can cooperate with the second suction mechanism to suck the patches placed on the second rotating mechanism.

The beneficial effects of the utility model reside in that: the utility model relates to a chip mounter's paster mechanism for can realize the automatic laminating of two cameras of cell-phone during chip mounter, not only can bear the mechanism from the material and absorb the paster by the efficient through the camera unit cooperation suction means that sets up, but also can effective control laminating position and dynamics, avoided producing badly or scrap, can keep good production efficiency, job stabilization nature, reliability and subsides dress precision for a long time simultaneously.

Drawings

Fig. 1 is a perspective view of the present invention;

fig. 2 is a first exploded schematic view of the present invention;

fig. 3 is a second exploded schematic view of the present invention;

fig. 4 is a perspective view of the material carrying mechanism of the present invention;

fig. 5 is a perspective view of the material carrying mechanism of the present invention from another perspective;

FIG. 6 is a top view of the material support mechanism of the present invention;

fig. 7 is a schematic structural diagram of a first driving mechanism of the present invention;

fig. 8 is a schematic structural view of the combination of the first support mechanism and the first sliding mechanism of the present invention;

fig. 9 is a perspective view of the head attaching mechanism of the present invention;

fig. 10 is a partially exploded view of the bonding head mechanism of the present invention;

fig. 11 is a schematic structural view of a sixth sliding mechanism according to the present invention;

fig. 12 is a perspective view of the first suction mechanism of the present invention.

The reference signs are: 1-attaching head mechanism, 111-base frame, 121-driving mechanism, 1211-first driving mechanism, 1212-second driving mechanism, 1213-third driving mechanism, 131-first camera, 132-second camera, 133-third camera, 14-X axial slide rail, 15-first suction mechanism, 151-fourth driving device, 152-second fixing plate, 153-eccentric rotating shaft, 154-transmission piece, 155-second sliding block, 156-second Z axial slide rail, 157-second central fixing block, 158-suction nozzle rod, 159-suction nozzle head, 16-second suction mechanism, 17-sixth sliding mechanism, 2-first rotating mechanism 21-mounting plate, 22-fixing frame, 23-first driving device, 24-rotating disc, 25-driving belt, 3-second rotating mechanism, 4-material bearing mechanism, 41-bearing frame, 42-material bearing disc, 43-driving block, 44-third driving device, 45-nut component, 46-Y axial screw rod, 47-Y axial slide rail, 5-first supporting mechanism and 51-first fixing plate, 52-a second driving device, 53-a supporting rod, 54-a supporting head, 55-a first through fixed block, 56-a first sliding block, 57-a first Z-axis sliding rail, 6-a second supporting mechanism, 7-a first sliding mechanism, 8-a second sliding mechanism, 9-a third sliding mechanism, 10-a fourth sliding mechanism, 11-a fifth sliding mechanism and 12-a chassis.

Detailed Description

In order to facilitate the understanding of those skilled in the art, the present invention will be further described with reference to the following examples and accompanying fig. 1-12, which are not intended to limit the present invention.

Referring to fig. 1-12, a chip mounting mechanism of a chip mounter includes a chassis 12, and a bonding head mechanism 1, a first rotating mechanism 2, a second rotating mechanism 3, a material bearing mechanism 4, a first supporting mechanism 5, a second supporting mechanism 6, a first sliding mechanism 7, a second sliding mechanism 8, a third sliding mechanism 9, a fourth sliding mechanism 10, and a fifth sliding mechanism 11 mounted on the chassis 12, where the first sliding mechanism 7 is disposed at a left front end of an upper end surface of the chassis 12, the second sliding mechanism 8 is disposed at an upper end surface of the chassis 12 and is located at one side of the first sliding mechanism 7, the third sliding mechanism 9 is disposed at an upper end surface of the chassis 12 and is located at the other side of the first sliding mechanism 7, the fifth sliding mechanism 11 is disposed at an upper end surface of the chassis 12 and is located at one side of the second sliding mechanism 8, and the fourth sliding mechanism 10 is disposed at an upper end surface of the chassis 12 and is located at the third sliding mechanism 9 and the fifth sliding mechanism 11 Between, first supporting mechanism 5 slidable set up in first slide mechanism 7, second supporting mechanism 5 slidable set up in second slide mechanism 8, first rotary mechanism 2 slidable set up in third slide mechanism 9, second rotary mechanism 3 slidable set up in fifth slide mechanism 11, material bears mechanism 4 slidable set up in fourth slide mechanism 10, first mechanism 1 of laminating erects on chassis 12 along the X axial.

The automatic bonding of the two cameras of the mobile phone can be realized when the chip mounting mechanism is used for the chip mounter in the embodiment, the camera set is matched with the first suction mechanism 15 and the second suction mechanism 16, so that the patch can be efficiently sucked from the material bearing mechanism 4, but also can effectively control the attaching position and force, avoids generating badness or scrapping, the arranged first supporting mechanism 5 and the second supporting mechanism 6 can be matched with the first suction mechanism 15 and the second suction mechanism 16 to accurately suck the patches placed on the first rotating mechanism 2 and the second rotating mechanism 3, the suction nozzle 159 sucks the components, and the components meeting the requirements are downwards attached to a circuit board or other workpieces through the suction nozzle 159 after being identified by the image identification system, so that good production efficiency, working stability, reliability and attachment precision can be kept for a long time.

In this embodiment, each of the first rotating mechanism 2 and the second rotating mechanism 3 includes a mounting plate 21, a fixing frame 22, a first driving device 23, a rotating disc 24 and a transmission belt 25, the mounting plate 21 is fixed on the fixing frame 22, the first driving device 23 penetrates through the mounting plate 21 and is fixed on the mounting plate 21, the rotating disc 24 is rotatably disposed at one end of the mounting plate 21, the first driving device 23 can drive the rotating disc 24 to rotate via the transmission belt 25, and the fixing frame 22 can be slidably disposed on the third sliding mechanism 9 and the fifth sliding mechanism 12.

In this embodiment, the first rotating mechanism 2 and the second rotating mechanism 3 can drive the rotating disc 24 to rotate through the first driving device 23, and the suction of the patches placed on the rotating disc 24 by the first suction mechanism 15 and the second suction mechanism 16 is further improved under the cooperation of the first supporting mechanism 5 and the second supporting mechanism 6, so that the suction efficiency and precision of the first suction mechanism 15 and the second suction mechanism 16 are further improved.

In this embodiment, each of the first supporting mechanism 5 and the second supporting mechanism 6 includes a first fixing plate 51, a second driving device 52, a supporting rod 53, a supporting head 54, a first through fixing block 55, a first slider 56 and a first Z-axis sliding rail 57, the first Z-axis sliding rail 57 is fixed on the first fixing plate 51, the first slider 56 and the first through fixing block 55 are fixed and then slidably sleeved on the first Z-axis sliding rail 57, the supporting rod 53 and the supporting head 54 are connected and then fixed on the first through fixing block 55, the second driving device 52 is disposed at the lower end of the first fixing plate 51, and the supporting rod 53 can be driven to drive the first slider 56 to slide on the first Z-axis sliding rail 57.

In this embodiment, the supporting head 54 fixed on the first through-center fixing block 55 and disposed on the second supporting mechanism 6 of the first supporting mechanism 5 moves up and down along the first Z-axis sliding rail 57 under the driving of the second driving device 52, and when the first absorbing mechanism 15 and the second absorbing mechanism 16 absorb patches, the supporting head can cooperate with the first absorbing mechanism 15 and the second absorbing mechanism 16 to support the patch paper, so as to prevent the patch paper for bearing the patches from sinking when the first absorbing mechanism 15 and the second absorbing mechanism 16 absorb patches, and prevent the first absorbing mechanism 15 and the second absorbing mechanism 16 from falling off due to instability of patch absorption when absorbing patches.

In this embodiment, the material bearing mechanism 4 includes a bearing frame 41, a material bearing plate 42, a driving block 43, a third driving device 44, a nut member 45, a Y-axis lead screw 46 and a Y-axis slide rail 47, the material bearing plate 42 is slidably disposed on an upper end surface of the bearing frame 41, the third driving device 44 is fixed to one end of the bearing frame 41, one end of the Y-axis lead screw 46 is connected to an output end of the third driving device 44, the other end of the Y-axis lead screw 46 is rotatably disposed on the other end of the bearing frame 41, the Y-axis slide rail 47 is fixed to a lower end surface inside the bearing frame 41, the driving block 43 is slidably sleeved on the Y-axis slide rail 47 and then connected to the material bearing plate 42, the nut member 45 is screwed to the Y-axis lead screw 46 and then fixed to the driving block 43, and the third driving device 44 can drive the Y-axis lead screw 46 to screw 45 to screw the nut member 45 to drive the driving block 43 to rotate relative Moving towards the slide rail 47.

The third driving device 44 of this embodiment can drive the nut member 45 to move along the Y-axis to the lead screw 46, and further drive the driving block 43 fixed with the nut member 45 to move along with the nut member 45, and further push the material bearing disc 42 mounted on the bearing frame 41 to move, so as to cooperate with information transmitted by the image recognition system, ensure continuous and accurate pasting of the pasting mechanism on a plurality of processed workpieces placed on the material bearing disc 42, and improve the working efficiency of the pasting mechanism.

In this embodiment, the fitting head mechanism 1 includes a base frame 111, a driving mechanism 121, a camera set, an X-axis sliding rail 14, a first suction mechanism 15, a second suction mechanism 16, and a sixth sliding mechanism 17, the base frame 111 is erected on the chassis 12, the driving mechanism 12 is disposed on the upper end surface of the base frame 111, the sixth sliding mechanism 17 is disposed in the base frame 111, the X-axis sliding rail 14 is disposed at the front end of the upper end surface of the base frame 111, the camera set is slidably sleeved on the X-axis sliding rail 14 and then connected to the driving mechanism 12, the driving mechanism 12 can drive the camera set to move back and forth relative to the X-axis sliding rail 14, and the first suction mechanism 15 and the second suction mechanism 16 are slidably disposed at two ends of the sixth sliding mechanism 17.

In this embodiment, the automatic attachment of the two cameras of the mobile phone can be realized when the attachment head mechanism 1 of the chip mounter is used for mounting, the attachment position and force can be effectively controlled by the back-and-forth movement of the camera set matched with the first suction mechanism 15 and the second suction mechanism 16 along the first X-axis slide rail 14 under the driving of the driving mechanism 12, the generation of defects or scrapping can be avoided, the good production efficiency can be kept for a long time, and the stability, reliability and mounting precision during working are high.

In this embodiment, the driving mechanism 121 includes a first driving mechanism 1211, a second driving mechanism 1212, and a third driving mechanism 1213, where the first driving mechanism 1211 is disposed on the upper end surface of the base frame 111 and is located at one axial side edge of the upper end surface X of the base frame 111; the second driving mechanism 1212 is disposed on the upper end surface of the base frame 111 and positioned in front of the first driving mechanism 1211 on the left side; the third driving mechanism 1213 is provided on the upper end surface of the base frame 111 and is positioned right in front of the first driving mechanism 1211. The camera set includes a first camera 131, a second camera 132 and a third camera 133, the first camera 131, the second camera 132 and the third camera 133 are all slidably sleeved on the X-axis slide rail 14, the first driving mechanism 1211 can drive the first camera 131 to slide relative to the X-axis slide rail 14, the second driving mechanism 1212 can drive the second camera 132 to slide relative to the X-axis slide rail 14, and the third driving mechanism 1213 can drive the third camera 133 to slide relative to the X-axis slide rail 14. Still further, the first camera 131, the second camera 132, and the third camera 133 may constitute a full-azimuth stereoscopic image recognition system; further, the first camera 131 may be moved in synchronization with the first suction mechanism 15, and the third camera 133 may be moved in synchronization with the second suction mechanism 16.

The first driving mechanism 1211 of this embodiment can effectively drive the first camera 131 to slide along the X-axis sliding rail 14, and cooperate with the material carrying mechanism 4 to determine the position of the workpiece to be processed for mounting, the second driving mechanism 1212 can drive the second camera 132 to slide relative to the X-axis sliding rail 14, cooperate with the first sucking mechanism 15 to effectively suck the patches placed on the rotating disc 24, transfer the patches sucked to the material carrying mechanism 4 to patch the workpiece to be processed (such as a flexible circuit board, etc.), the third driving mechanism 1213 can drive the third camera 133 to slide relative to the X-axis slide rail 14, cooperate with the second suction mechanism 16 to effectively suck the patches placed on the rotating disc 24, transfer the patches to the material carrying mechanism 4 for the patches of the workpiece to be processed, and the arranged first suction mechanism 15 and the second suction mechanism 16 realize synchronous chip mounting in the process of assembling the double-camera lens of the mobile phone.

In this embodiment, each of the first suction mechanism 15 and the second suction mechanism 16 is provided with a fourth driving device 151, a second fixing plate 152, an eccentric rotating shaft 153, a transmission member 154, a second sliding block 155, a second Z-axis sliding rail 156, a second through-center fixing block 157, a suction nozzle rod 158 and a suction nozzle head 159, the fourth driving device 151 is fixed to an upper end side surface of one side of the second fixing plate 152, the eccentric rotating shaft 153 penetrates through the second fixing plate 152 and is rotatably connected to the fourth driving device 151, the second Z-axis sliding rail 156 is fixed to a lower end side surface of the other side of the second fixing plate 152, the second sliding block 155 is slidably sleeved on the second Z-axis sliding rail 156, one end of the transmission member 154 is rotatably disposed on the eccentric rotating shaft 153, the other end of the transmission member 154 is rotatably disposed on the second sliding block 155, the suction nozzle head 159 is screwed on the suction nozzle rod 158 and is fixed to the second sliding block 155 through the second through-center fixing block 157, the fourth driving device 151 drives the eccentric rotating shaft 153 to rotate, so as to drive the second slider 155 to slide up and down relative to the second Z-axis sliding rail 156, and further drive the nozzle head 159 to move up and down in the Z-axis direction. Further, the first supporting mechanism 5 may cooperate with the first suction mechanism 15 to suck the patch placed on the first rotating mechanism 2, and the second supporting mechanism 6 may cooperate with the second suction mechanism 16 to suck the patch placed on the second rotating mechanism 3.

In this embodiment, the first suction mechanism 15 and the second suction mechanism 16 drive the eccentric rotating shaft 153 to drive the transmission member 154 rotatably connected to the second slider 155 through the fourth driving device 151, so as to drive the second slider 155 to move up and down along the second Z-axis slide rail 156, and further drive the suction nozzle rod 158 and the suction nozzle 159 mounted on the second slider 155 to move up and down, thereby implementing automatic bonding of the bonding head mechanism 1 of the chip mounter to the two cameras of the mobile phone in the bonding process, and accurately controlling the bonding position and force.

The above-mentioned embodiment is the utility model discloses the implementation of preferred, in addition, the utility model discloses can also realize by other modes, not deviating from the utility model discloses any obvious replacement is all within the protection scope under the prerequisite of design.

Claims (10)

1. A chip mounting mechanism of a chip mounter is characterized in that: comprises a chassis, a fitting head mechanism, a first rotating mechanism, a second rotating mechanism, a material bearing mechanism, a first supporting mechanism, a second supporting mechanism, a first sliding mechanism, a second sliding mechanism, a third sliding mechanism, a fourth sliding mechanism and a fifth sliding mechanism, wherein the fitting head mechanism, the first rotating mechanism, the second rotating mechanism, the material bearing mechanism, the first supporting mechanism, the second supporting mechanism, the first sliding mechanism, the second sliding mechanism, the third sliding mechanism, the fourth sliding mechanism and the fifth sliding mechanism are arranged on the chassis, the first sliding mechanism is arranged at the left front end of the upper end face of the chassis, the second sliding mechanism is arranged at one side of the first sliding mechanism, the third sliding mechanism is arranged at the other side of the first sliding mechanism, the fifth sliding mechanism is arranged at one side of the second sliding mechanism, the fourth sliding mechanism is arranged at the upper end face of the chassis between the third sliding mechanism and the fifth sliding mechanism, the first supporting mechanism is arranged at the first sliding mechanism, the second supporting mechanism is slidably arranged on the second sliding mechanism, the first rotating mechanism is slidably arranged on the third sliding mechanism, the second rotating mechanism is slidably arranged on the fifth sliding mechanism, the material bearing mechanism is slidably arranged on the fourth sliding mechanism, and the fitting head mechanism is erected on the chassis along the X-axis direction.

2. The bonding mechanism of the bonding machine according to claim 1, wherein: first rotary mechanism and second rotary mechanism all include mounting panel, mount, first drive arrangement, rotary disk and drive belt, the mounting panel is fixed on the mount, first drive arrangement runs through the mounting panel is fixed on the mounting panel, the rotary disk rotates and sets up the one end of mounting panel, first drive arrangement can via the drive belt drives the rotary disk is rotatory, the mount all slidable set up in on third slide mechanism and the fifth slide mechanism.

3. The bonding mechanism of the bonding machine according to claim 1, wherein: the first supporting mechanism and the second supporting mechanism respectively comprise a first fixing plate, a second driving device, a supporting rod, a supporting head, a first through center fixing block, a first sliding block and a first Z axial sliding rail, the first Z axial sliding rail is fixed on the first fixing plate, the first sliding block is sleeved with the first through center fixing block in a sliding mode after being fixed, the supporting rod is fixed on the first through center fixing block after being connected with the supporting head, the second driving device is arranged at the lower end of the first fixing plate and used for driving the supporting rod to drive the first sliding block to slide on the first Z axial sliding rail.

4. The bonding mechanism of the bonding machine according to claim 1, wherein: the material bearing mechanism comprises a bearing frame, a material bearing disc, a driving block, a third driving device, a nut piece, a Y-axis screw rod and a Y-axis slide rail, the material bearing plate is arranged on the upper end surface of the bearing frame in a sliding manner, the third driving device is fixed at one end of the bearing frame, the third driving device is used for driving the Y-axis screw rod to rotate, the other end of the Y-axis screw rod is rotatably arranged at the other end of the bearing frame, the Y-axis slide rail is fixed on the lower end surface in the bearing frame, the driving block is connected with the material bearing disc after being sleeved on the Y-axis slide rail in a sliding way, the nut piece is in threaded connection with the Y-axis screw rod and then is fixedly arranged with the driving block, and the third driving device drives the Y-axis screw rod to rotate so that the nut piece drives the driving block to move relative to the Y-axis sliding rail.

5. The bonding mechanism of the bonding machine according to claim 1, wherein: the laminating head mechanism comprises a base frame, a driving mechanism, a camera set, an X axial sliding rail, a first suction mechanism, a second suction mechanism and a sixth sliding mechanism, the base frame is erected on the chassis, the driving mechanism is arranged on the upper end face of the base frame, the sixth sliding mechanism is arranged in the base frame, the X axial sliding rail is arranged at the front end of the upper end face of the base frame, the camera set is slidably sleeved behind the X axial sliding rail and is connected with the driving mechanism, the driving mechanism can drive the camera set to move back and forth relative to the X axial sliding rail, and the first suction mechanism and the second suction mechanism are slidably arranged at two ends of the sixth sliding mechanism.

6. The bonding mechanism of the bonding machine according to claim 5, wherein: the driving mechanism comprises a first driving mechanism, a second driving mechanism and a third driving mechanism, and the first driving mechanism is arranged on the upper end surface of the pedestal frame and is positioned on one axial side edge of the upper end surface X of the pedestal frame; the second driving mechanism is arranged on the upper end surface of the base frame and positioned in front of the first driving mechanism; the third driving mechanism is arranged on the upper end surface of the base frame and is positioned at the front right of the first driving mechanism.

7. The bonding mechanism of the bonding machine according to claim 6, wherein: the camera set comprises a first camera, a second camera and a third camera, the first camera, the second camera and the third camera are all slidably sleeved on the X-axis slide rail, the first driving mechanism can drive the first camera to slide relative to the X-axis slide rail, the second driving mechanism can drive the second camera to slide relative to the X-axis slide rail, and the third driving mechanism can drive the third camera to slide relative to the X-axis slide rail.

8. The bonding mechanism of the bonding machine according to claim 5, wherein: the first suction mechanism and the second suction mechanism are respectively provided with a fourth driving device, a second fixing plate, an eccentric rotating shaft, a transmission part, a second sliding block, a second Z-axis sliding rail, a second through-center fixing block, a suction nozzle rod and a suction nozzle head, the fourth driving device is fixed on the upper end side surface of one side of the second fixing plate, the eccentric rotating shaft penetrates through the second fixing plate and is connected with the fourth driving device, the second Z-axis sliding rail is fixed on the lower end side surface of the other side of the second fixing plate, the second sliding block is sleeved on the second Z-axis sliding rail in a sliding manner, one end of the transmission part is rotatably arranged on the eccentric rotating shaft, the other end of the transmission part is rotatably arranged with the second sliding block, the suction nozzle head is screwed on the suction nozzle rod and then fixed on the second sliding block through the second through-center fixing block, the fourth driving device drives the eccentric rotating shaft to rotate so as to drive the second sliding block to slide up and down relative to, and then the suction nozzle head is driven to move up and down in the Z-axis direction.

9. The bonding mechanism of the bonding machine according to claim 7, wherein: the first camera moves in synchronization with the first suction mechanism, and the third camera moves in synchronization with the second suction mechanism.

10. The bonding mechanism of the bonding machine according to claim 5, wherein: the first supporting mechanism can be matched with the first sucking mechanism to suck the patches on the first rotating mechanism, and the second supporting mechanism can be matched with the second sucking mechanism to suck the patches on the second rotating mechanism.

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