CN209895065U - Laminating head of chip mounter - Google Patents
Laminating head of chip mounter Download PDFInfo
- Publication number
- CN209895065U CN209895065U CN201920877073.7U CN201920877073U CN209895065U CN 209895065 U CN209895065 U CN 209895065U CN 201920877073 U CN201920877073 U CN 201920877073U CN 209895065 U CN209895065 U CN 209895065U
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- sliding block
- driving mechanism
- axis
- connecting piece
- base frame
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- 238000010030 laminating Methods 0.000 title abstract description 17
- 230000005540 biological transmission Effects 0.000 claims description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000002699 waste material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Abstract
The utility model relates to a chip mounter technical field, concretely relates to laminating head of chip mounter, including the base frame, suction means, sliding mechanism, first X axial slide rail, actuating mechanism group, sliding block set and connecting piece group, actuating mechanism set up in the up end of base frame, first X axial slide rail sets up in one side that the up end of base frame is located actuating mechanism group, first X axial slide rail is located to sliding block set sliding sleeve, the one end and the actuating mechanism fixed connection of connecting piece group, the other end and the sliding block set fixed connection of connecting piece group, sliding mechanism sets up in the base frame, suction means slides and sets up in sliding mechanism and is located the base frame outside. The utility model discloses a laminating head can realize the automatic laminating of two cameras of cell-phone when being used for the chip mounter, through camera unit cooperation suction means effective control laminating position and dynamics that sets up, avoids producing the newspaper waste product, can also keep good production efficiency for a long time, and during operation stable performance, subsides dress precision are high.
Description
Technical Field
The utility model relates to a chip mounter technical field, concretely relates to laminating head of chip mounter.
Background
At present, a manufacturing factory of the smart phone mostly adopts manual lamination in the process of assembling the double-camera lens of the mobile phone, so that a large amount of manpower is consumed, and the efficiency is low. Meanwhile, because the lenses of the two cameras of the mobile phone are small and thin, the defects of deviation of the attaching position, crushing of the lenses and the like are easy to occur in the manual attaching process. In the operation process of the known chip mounter, the suction nozzle is arranged at the lower end of the suction nozzle rod, components meeting requirements are mounted on a circuit board or other workpieces by the suction nozzle after being sucked by the suction nozzle and identified by the image identification system, but the conventional bonding head cannot realize synchronous continuous multiple bonding, so that the efficiency is low; in addition, when the chip mounter performs chip mounting, an image recognition mechanism is required to determine whether the angle of the component is accurate, but this may hinder the chip mounting process, which also needs to be improved.
Disclosure of Invention
In order to overcome the shortcoming and the deficiency that exist among the prior art, the utility model aims to provide a laminating head of chip mounter can realize the automatic laminating of two cameras of cell-phone, can not only effective control laminating position and dynamics, avoids producing badly or scrapping, can also keep good production efficiency for a long time, and stability, reliability and the subsides dress precision of during operation are high.
The purpose of the utility model is realized through the following technical scheme: the utility model provides a laminating head of chip mounter, includes base frame, suction means, sliding mechanism, first X axial slide rail, actuating mechanism group, sliding block group and connecting piece group, actuating mechanism group sets up in the up end of base frame, first X axial slide rail set up in the up end of base frame and lie in one side of actuating mechanism group, sliding block group sliding sleeve is located first X axial slide rail, the one end of connecting piece group with actuating mechanism group fixed connection, the other end of connecting piece group with sliding block group fixed connection, actuating mechanism group drives via connecting piece group sliding block group first X axial slide rail relatively makes a round trip to slide, sliding mechanism set up in the base frame and with sliding block group connected, suction means slide set up in sliding mechanism and lie in the base frame outside.
Furthermore, the suction mechanism comprises a first suction mechanism and a second suction mechanism, the first suction mechanism and the second suction mechanism are respectively provided with a first driving device, a first fixing plate, an eccentric rotating shaft, a transmission member, a first sliding block, a Z-axis sliding rail, a through-center fixing block, a suction nozzle rod and a suction nozzle head, the first driving device is fixed on the upper end side surface of one side of the first fixing plate, the eccentric rotating shaft penetrates through the first fixing plate and is connected with the first driving device, the Z-axis sliding rail is fixed on the lower end side surface of the other side of the first fixing plate, the first sliding block is slidably sleeved on the Z-axis sliding rail, one end of the transmission member is rotatably arranged on the eccentric rotating shaft, the other end of the transmission member is rotatably arranged with the first sliding block, and the suction nozzle head is screwed on the suction nozzle rod and then fixed on the first sliding block through the through-center fixing block, the first driving device drives the eccentric rotating shaft to rotate so as to drive the first sliding block to slide up and down relative to the Z-axis sliding rail, and further drive the suction nozzle head to move up and down in the Z-axis direction.
Furthermore, the driving mechanism set comprises a first driving mechanism, a second driving mechanism and a third driving mechanism, wherein the first driving mechanism is arranged on the upper end surface of the pedestal frame and is positioned on one axial side edge of the upper end surface X of the pedestal frame; the second driving mechanism is arranged on the upper end surface of the base frame and is positioned in front of the first driving mechanism; the third driving mechanism is arranged on the upper end face of the base frame and is positioned at the front right of the first driving mechanism.
Further, the first driving mechanism comprises a second driving device, a first X-axis lead screw and a first nut member, the second driving device is fixed on the upper end surface of the base frame, the first X-axis lead screw is connected with the second driving device, and the first nut member is screwed on the first X-axis lead screw; the second driving mechanism comprises a third driving device, a second X-axis screw rod and a second nut piece, the third driving device is fixed on the upper end surface of the base frame, the second X-axis screw rod is connected with the third driving device, and the second nut piece is in threaded connection with the second X-axis screw rod; the third driving mechanism comprises a fourth driving device, a third X-axis screw rod and a third nut piece, the fourth driving device is fixed on the upper end face of the base frame, the third X-axis screw rod is connected with the fourth driving device, and the third nut piece is in threaded connection with the third X-axis screw rod.
Furthermore, the connecting piece group comprises a first connecting piece, a second connecting piece and a third connecting piece, the sliding block group comprises a second sliding block, a third sliding block and a fourth sliding block, one end of the first connecting piece is connected with the first nut piece, the other end of the first connecting piece is connected with the second sliding block, and the first driving mechanism can drive the first connecting piece to drive the second sliding block to slide back and forth relative to the first X-axis sliding rail; one end of the second connecting piece is connected with the second nut piece, the other end of the second connecting piece is connected with the third sliding block, and the second driving mechanism can drive the second connecting piece to drive the third sliding block to slide back and forth relative to the first X-axis sliding rail; one end of the third connecting piece is connected with the third nut piece, the other end of the third connecting piece is connected with the fourth sliding block, and the third driving mechanism can drive the third connecting piece to drive the fourth sliding block to slide back and forth relative to the first X-axis sliding rail.
Furthermore, the bonding head of the chip mounter further comprises a first camera, a second camera and a third camera, wherein the first camera is fixed on the second slide block, and the first driving mechanism can drive the first camera to slide back and forth along the first X-axis slide rail along with the second slide block; the second camera is fixed on the third sliding block, and the second driving mechanism can drive the second camera to slide back and forth along the first X-axis sliding rail along with the third sliding block; the third camera is fixed on the fourth sliding block, and the third driving mechanism can drive the third camera to slide back and forth along the first X-axis sliding rail along with the fourth sliding block.
Further, the first camera may be moved in synchronization with the first suction mechanism, and the third camera may be moved in synchronization with the second suction mechanism.
Furthermore, the attaching head of the chip mounter further comprises a second fixing plate group, and the second fixing plate group is arranged on the lower end face of the base frame.
The beneficial effects of the utility model reside in that: the utility model relates to a laminating head of chip mounter for can realize the automatic laminating of two cameras of cell-phone during chip mounter, can not only effective control laminating position and dynamics through the camera unit cooperation suction means that sets up, avoid producing badly or scrap, can also keep good production efficiency for a long time, stability, reliability and the subsides dress precision of during operation are high.
Drawings
Fig. 1 is a perspective view of the present invention;
fig. 2 is an exploded schematic view of the present invention;
fig. 3 is a top view of the present invention;
FIG. 4 is a schematic structural view of the sliding mechanism and the sucking mechanism combination of the present invention;
fig. 5 is a structural schematic diagram of another view angle of the sliding mechanism and the suction mechanism combination of the present invention;
fig. 6 is a schematic structural view of the first suction mechanism of the present invention.
The reference signs are: 1-base frame, 21-first suction mechanism, 211-first driving device, 212-first fixing plate, 213-eccentric rotating shaft, 214-transmission piece, 215-first slide block, 216-Z axial slide rail, 217-center fixing block, 218 suction nozzle rod, 219-suction nozzle head, 22-second suction mechanism, 3-sliding mechanism, 4-first X axial slide rail, 51-first driving mechanism, 511-second driving device, 512-first X axis screw rod, 513-first nut piece, 52-second driving mechanism, 521-third driving device, 522-second X axis screw rod, 523-second nut piece, 53-third driving mechanism, 531-fourth driving device, 532-third X axis screw rod, 533-third nut piece, 61-second slide, 62-third slide, 63-fourth slide, 71-first connector, 72-second connector, 73-third connector, 81-first camera, 82-second camera, 83-third camera, 9-second fixed plate group.
Detailed Description
In order to facilitate the understanding of those skilled in the art, the present invention will be further described with reference to the following examples and accompanying fig. 1 to 6, which are not intended to limit the present invention.
Referring to fig. 1-6, a bonding head of a chip mounter comprises a base frame 1, a suction mechanism, a sliding mechanism 3, a first X-axis slide rail 4, a driving mechanism group, a slide block group and a connecting group, the driving mechanism set is arranged on the upper end surface of the base frame 1, the first X-axis slide rail 4 is arranged on the upper end surface of the base frame 1 and is positioned at one side of the driving mechanism set, the sliding block group is sleeved on the first X-axis sliding rail 4 in a sliding manner, one end of the connecting group is fixedly connected with the driving mechanism group, the other end of the connecting piece group is fixedly connected with the sliding block group, the driving mechanism group can drive the sliding block group to slide back and forth relative to the first X-axis sliding rail 4 through the connecting piece group, the sliding mechanism 3 is arranged in the base frame 1 and connected with the sliding block set, and the suction mechanism is arranged in the sliding mechanism 3 in a sliding mode and located on the outer side of the base frame 1.
In this embodiment the automatic laminating of two cameras of cell-phone can be realized to the laminating head of chip mounter when being used for the chip mounter, through camera unit cooperation suction mechanism that sets up under the drive of actuating mechanism group along first X axial slide rail 4 back and forth movement effective control laminating position and dynamics, avoid producing badly or scrap, can also keep good production efficiency for a long time, stability, reliability and the subsides dress precision of during operation are high.
In this embodiment, the suction mechanism includes a first suction mechanism 21 and a second suction mechanism 22, the first suction mechanism 21 and the second suction mechanism 22 are respectively provided with a first driving device 211, a first fixing plate 212, an eccentric rotating shaft 213, a transmission member 214, a first slider 215, a Z-axis sliding rail 216, a through-center fixing block 217, a suction nozzle rod 218 and a suction nozzle head 219, the first driving device 211 is fixed on an upper end side surface of one side of the first fixing plate 212, the eccentric rotating shaft 213 penetrates through the first fixing plate 212 and is rotatably connected with the first driving device 211, the Z-axis sliding rail 216 is fixed on a lower end side surface of the other side of the first fixing plate 212, the first slider 215 is slidably sleeved on the Z-axis sliding rail 216, one end of the transmission member 214 is rotatably disposed on the eccentric rotating shaft 213, and the other end of the transmission member 214 is rotatably disposed with the first slider 215, the suction nozzle 219 is screwed on the suction nozzle rod 218 and then fixed to the first sliding block 215 through the through fixing block 217, and the first driving device 211 drives the eccentric rotating shaft 213 to rotate so as to drive the first sliding block 215 to slide up and down relative to the Z-axis sliding rail 216, thereby driving the suction nozzle 219 to move up and down in the Z-axis direction.
In this embodiment, the suction mechanism drives the eccentric rotating shaft 213 to drive the transmission member 214 rotatably connected with the first slider 215 through the first driving device 211, so as to drive the first slider 215 to move up and down along the Z-axis sliding rail 216, and further drive the suction nozzle rod 218 and the suction nozzle 219 mounted on the first slider 215 to move up and down, thereby realizing the automatic attachment of the attachment head of the chip mounter to the two cameras of the mobile phone in the attachment process, and accurately controlling the attachment position and force.
In this embodiment, the driving mechanism set includes a first driving mechanism 51, a second driving mechanism 52 and a third driving mechanism 53, the first driving mechanism 51 is disposed on the upper end surface of the base frame 1 and is located on one side edge of the upper end surface X of the base frame 1 in the axial direction; the second driving mechanism 52 is arranged on the upper end surface of the base frame 1 and positioned in front of the first driving mechanism 51; the third drive mechanism 53 is provided on the upper end surface of the base frame 1 and positioned right in front of the first drive mechanism 51. Further, the first driving mechanism 51 includes a second driving device 511, a first X-axis screw 512 and a first nut member 513, the second driving device 511 is fixed on the upper end surface of the base frame 1, the first X-axis screw 512 is connected with the output end of the second driving device 511, and the first nut member 513 is screwed on the first X-axis screw 512; the second driving mechanism 52 comprises a third driving device 521, a second X-axis screw 522 and a second nut member 523, the third driving device 521 is fixed on the upper end surface of the base frame 1, the second X-axis screw 522 is connected with the output end of the third driving device 521, and the second nut member 523 is screwed on the second X-axis screw 522; the third driving mechanism 53 includes a fourth driving device 531, a third X-axis lead screw 532 and a third nut member 533, the fourth driving device 531 is fixed to the upper end surface of the base frame 1, the third X-axis lead screw 532 is connected to the output end of the fourth driving device 531, and the third nut member 533 is screwed to the third X-axis lead screw 532. Furthermore, the connecting member group comprises a first connecting member 71, a second connecting member 72 and a third connecting member 73, the sliding block group comprises a second sliding block 61, a third sliding block 62 and a fourth sliding block 63, one end of the first connecting member 71 is connected with the first nut member 513, the other end of the first connecting member 71 is connected with the second sliding block 61, and the first driving mechanism 51 can drive the first connecting member 71 to drive the second sliding block 61 to slide back and forth relative to the first X-axis sliding rail 4; one end of the second connecting member 72 is connected to the second nut member 523, the other end of the second connecting member 72 is connected to the third sliding block 62, and the second driving mechanism 52 can drive the second connecting member 72 to drive the third sliding block 62 to slide back and forth relative to the first X-axis sliding rail 4; one end of the third connecting member 73 is connected to the third nut member 533, the other end of the third connecting member 73 is connected to the fourth sliding block 63, and the third driving mechanism 53 can drive the third connecting member 73 to drive the fourth sliding block 63 to slide back and forth relative to the first X-axis 4.
The bonding head of the chip mounter further comprises a camera set, wherein the camera set comprises a first camera 81, a second camera 82 and a third camera 83, the first camera 81 is fixed on the second sliding block 61, and the first driving mechanism 51 can drive the first camera 81 to slide back and forth along the first X-axis sliding rail 4 along with the second sliding block 61; the second camera 82 is fixed on the third slide block 62, and the second driving mechanism 52 can drive the second camera 82 to slide back and forth along the first X-axis slide rail 4 along with the third slide block 62; the third camera 83 is fixed on the fourth slide block 63, and the third driving mechanism 53 can drive the third camera 83 to slide back and forth along the first X-axis slide rail 4 along with the fourth slide block 63; the first camera 81 may move in synchronization with the first suction mechanism 21, and the third camera 81 may move in synchronization with the second suction mechanism 22. Furthermore, the bonding head of the chip mounter further comprises a second fixed plate group 9, and the second fixed plate group 9 is arranged on the lower end surface of the base frame 1.
The second driving device 511 disposed in the first driving mechanism 51 of this embodiment drives the first X-axis lead screw 512 to rotate, so that the first nut 513 drives the first connecting member 71 to drive the second slider 61 to slide back and forth relative to the first X-axis slide rail 4, thereby implementing automatic bonding of two cameras of a mobile phone when the bonding head is used in a chip mounter, the second driving mechanism 52 and the third driving mechanism 53 can respectively drive the first camera and the third camera to respectively cooperate with the first suction mechanism 21 and the second suction mechanism 21 to slide back and forth along the first X-axis slide rail 4 under the driving of the driving mechanism group so as to effectively control the attaching position and the force, the second fixing plate group 9 is convenient for mounting and fixing the bonding head on the chip mounter, so that the stability of the bonding head in the working process is ensured, and the bonding precision and efficiency are improved.
The above-mentioned embodiment is the utility model discloses the implementation of preferred, in addition, the utility model discloses can also realize by other modes, not deviating from the utility model discloses any obvious replacement is all within the protection scope under the prerequisite of design.
Claims (7)
1. The utility model provides a bonding head of chip mounter which characterized in that: the sliding block assembly is driven by the connecting piece group to slide back and forth relative to the first X axial sliding rail, the sliding mechanism is arranged in the base frame and connected with the sliding block assembly, and the suction mechanism is arranged in the sliding mechanism in a sliding mode and located outside the base frame.
2. The bonding head of a placement machine as claimed in claim 1, wherein: the suction mechanism comprises a first suction mechanism and a second suction mechanism, the first suction mechanism and the second suction mechanism are respectively provided with a first driving device, a first fixing plate, an eccentric rotating shaft, a transmission part, a first sliding block, a Z-axis sliding rail, a through-center fixing block, a suction nozzle rod and a suction nozzle head, the first driving device is fixed on the upper end side surface of one side of the first fixing plate, the eccentric rotating shaft penetrates through the first fixing plate and is connected with the first driving device, the Z-axis sliding rail is fixed on the lower end side surface of the other side of the first fixing plate, the first sliding block is slidably sleeved on the Z-axis sliding rail, one end of the transmission part is rotatably arranged on the eccentric rotating shaft, the other end of the transmission part is rotatably arranged with the first sliding block, and the suction nozzle head is screwed on the suction nozzle rod and then fixed on the first sliding block through the through-center, the first driving device drives the eccentric rotating shaft to rotate so as to drive the first sliding block to slide up and down relative to the Z-axis sliding rail, and further drive the suction nozzle head to move up and down in the Z-axis direction.
3. The bonding head of a placement machine as claimed in claim 1, wherein: the driving mechanism set comprises a first driving mechanism, a second driving mechanism and a third driving mechanism, wherein the first driving mechanism is arranged on the upper end surface of the pedestal frame and is positioned on one side edge of the upper end surface of the pedestal frame in the X-axis direction; the second driving mechanism is arranged on the upper end surface of the base frame and is positioned in front of the first driving mechanism; the third driving mechanism is arranged on the upper end face of the base frame and is positioned at the front right of the first driving mechanism.
4. The bonding head of a mounter according to claim 3, wherein: the first driving mechanism comprises a second driving device, a first X-axis screw rod and a first nut piece, the second driving device is fixed on the upper end face of the base frame, the first X-axis screw rod is connected with the second driving device, and the first nut piece is in threaded connection with the first X-axis screw rod; the second driving mechanism comprises a third driving device, a second X-axis screw rod and a second nut piece, the third driving device is fixed on the upper end surface of the base frame, the second X-axis screw rod is connected with the third driving device, and the second nut piece is in threaded connection with the second X-axis screw rod; the third driving mechanism comprises a fourth driving device, a third X-axis screw rod and a third nut piece, the fourth driving device is fixed on the upper end face of the base frame, the third X-axis screw rod is connected with the fourth driving device, and the third nut piece is in threaded connection with the third X-axis screw rod.
5. The bonding head of a placement machine as claimed in claim 4, wherein: the connecting piece group comprises a first connecting piece, a second connecting piece and a third connecting piece, the sliding block group comprises a second sliding block, a third sliding block and a fourth sliding block, one end of the first connecting piece is connected with the first nut piece, the other end of the first connecting piece is connected with the second sliding block, and the first driving mechanism can drive the first connecting piece to drive the second sliding block to slide back and forth relative to the first X-axis sliding rail; one end of the second connecting piece is connected with the second nut piece, the other end of the second connecting piece is connected with the third sliding block, and the second driving mechanism can drive the second connecting piece to drive the third sliding block to slide back and forth relative to the first X-axis sliding rail; one end of the third connecting piece is connected with the third nut piece, the other end of the third connecting piece is connected with the fourth sliding block, and the third driving mechanism can drive the third connecting piece to drive the fourth sliding block to slide back and forth relative to the first X-axis sliding rail.
6. The bonding head of a placement machine as claimed in claim 5, wherein: the bonding head of the chip mounter further comprises a first camera, a second camera and a third camera, wherein the first camera is fixed on the second slide block, and the first driving mechanism can drive the first camera to slide back and forth along the first X-axis slide rail along the second slide block; the second camera is fixed on the third sliding block, and the second driving mechanism can drive the second camera to slide back and forth along the first X-axis sliding rail along with the third sliding block; the third camera is fixed on the fourth sliding block, and the third driving mechanism can drive the third camera to slide back and forth along the first X-axis sliding rail along with the fourth sliding block.
7. The bonding head of a placement machine as claimed in claim 1, wherein: the attaching head of the chip mounter further comprises a second fixing plate group, and the second fixing plate group is arranged on the lower end face of the base frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920877073.7U CN209895065U (en) | 2019-06-11 | 2019-06-11 | Laminating head of chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920877073.7U CN209895065U (en) | 2019-06-11 | 2019-06-11 | Laminating head of chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209895065U true CN209895065U (en) | 2020-01-03 |
Family
ID=69001527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920877073.7U Expired - Fee Related CN209895065U (en) | 2019-06-11 | 2019-06-11 | Laminating head of chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209895065U (en) |
-
2019
- 2019-06-11 CN CN201920877073.7U patent/CN209895065U/en not_active Expired - Fee Related
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200103 |
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| CF01 | Termination of patent right due to non-payment of annual fee |