CN110114502B - 溅射装置 - Google Patents
溅射装置 Download PDFInfo
- Publication number
- CN110114502B CN110114502B CN201880005318.5A CN201880005318A CN110114502B CN 110114502 B CN110114502 B CN 110114502B CN 201880005318 A CN201880005318 A CN 201880005318A CN 110114502 B CN110114502 B CN 110114502B
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- 238000004544 sputter deposition Methods 0.000 title claims abstract description 173
- 230000007246 mechanism Effects 0.000 claims abstract description 108
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 238000003860 storage Methods 0.000 claims abstract description 32
- 230000015572 biosynthetic process Effects 0.000 claims description 81
- 238000007789 sealing Methods 0.000 claims description 20
- 239000010408 film Substances 0.000 description 202
- 230000001105 regulatory effect Effects 0.000 description 57
- 230000032258 transport Effects 0.000 description 39
- 238000000034 method Methods 0.000 description 22
- 238000000605 extraction Methods 0.000 description 21
- 239000011521 glass Substances 0.000 description 21
- 238000011049 filling Methods 0.000 description 18
- 230000008569 process Effects 0.000 description 17
- 238000011068 loading method Methods 0.000 description 15
- 238000012546 transfer Methods 0.000 description 13
- 230000002829 reductive effect Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- 239000000428 dust Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 8
- 230000001360 synchronised effect Effects 0.000 description 8
- 230000000670 limiting effect Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000002411 adverse Effects 0.000 description 5
- 238000013459 approach Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000007480 spreading Effects 0.000 description 5
- 238000003892 spreading Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005401 electroluminescence Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 239000012636 effector Substances 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 3
- 238000001449 potential sputter etching Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000036544 posture Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005478 sputtering type Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017195211 | 2017-10-05 | ||
| JP2017-195211 | 2017-10-05 | ||
| PCT/JP2018/037229 WO2019070031A1 (ja) | 2017-10-05 | 2018-10-04 | スパッタリング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110114502A CN110114502A (zh) | 2019-08-09 |
| CN110114502B true CN110114502B (zh) | 2021-11-19 |
Family
ID=65994706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880005318.5A Active CN110114502B (zh) | 2017-10-05 | 2018-10-04 | 溅射装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6742513B2 (ja) |
| KR (1) | KR102223849B1 (ja) |
| CN (1) | CN110114502B (ja) |
| TW (1) | TWI712700B (ja) |
| WO (1) | WO2019070031A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI130006B (fi) * | 2020-12-02 | 2022-12-15 | Volframi Oy Ltd | Laite kuvioiden muodostamiseksi substraattilevyn pinnalle |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012043150A1 (ja) * | 2010-09-30 | 2012-04-05 | トッキ株式会社 | 成膜装置 |
| CN102686764A (zh) * | 2009-12-28 | 2012-09-19 | 株式会社爱发科 | 成膜装置以及成膜方法 |
| CN205595318U (zh) * | 2013-07-26 | 2016-09-21 | 瓦里安半导体设备公司 | 用于工件处理的系统 |
| JP2017057485A (ja) * | 2015-09-18 | 2017-03-23 | 株式会社アルバック | 真空処理装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS539150B1 (ja) | 1970-12-30 | 1978-04-04 | ||
| JPS5347683A (en) | 1976-10-12 | 1978-04-28 | Nippon Steel Corp | Cargo forwarding and receiving system |
| JP3811943B2 (ja) | 2001-07-06 | 2006-08-23 | 日本精機株式会社 | 有機ｅｌパネルの製造方法。 |
| JP4417019B2 (ja) * | 2003-03-26 | 2010-02-17 | 株式会社アルバック | マスク装置及び真空成膜装置 |
| JP2007265707A (ja) * | 2006-03-28 | 2007-10-11 | Toppan Printing Co Ltd | 有機電界発光素子とその製造方法並びにマスクフレーム |
| JP5074368B2 (ja) | 2008-12-15 | 2012-11-14 | 株式会社日立ハイテクノロジーズ | 成膜装置 |
| JP5877955B2 (ja) | 2011-03-18 | 2016-03-08 | キヤノントッキ株式会社 | 蒸着装置並びに蒸着方法 |
| JP2013237914A (ja) * | 2012-05-17 | 2013-11-28 | Hitachi High-Technologies Corp | 成膜装置及び成膜方法 |
| JP6050104B2 (ja) * | 2012-11-30 | 2016-12-21 | 株式会社アルバック | 無機酸化物膜の形成装置、及び、ｉｇｚｏ膜の形成方法 |
-
2018
- 2018-10-04 WO PCT/JP2018/037229 patent/WO2019070031A1/ja active Application Filing
- 2018-10-04 KR KR1020197022549A patent/KR102223849B1/ko active IP Right Grant
- 2018-10-04 CN CN201880005318.5A patent/CN110114502B/zh active Active
- 2018-10-04 JP JP2019516003A patent/JP6742513B2/ja active Active
- 2018-10-05 TW TW107135202A patent/TWI712700B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686764A (zh) * | 2009-12-28 | 2012-09-19 | 株式会社爱发科 | 成膜装置以及成膜方法 |
| WO2012043150A1 (ja) * | 2010-09-30 | 2012-04-05 | トッキ株式会社 | 成膜装置 |
| CN205595318U (zh) * | 2013-07-26 | 2016-09-21 | 瓦里安半导体设备公司 | 用于工件处理的系统 |
| JP2017057485A (ja) * | 2015-09-18 | 2017-03-23 | 株式会社アルバック | 真空処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102223849B1 (ko) | 2021-03-05 |
| WO2019070031A1 (ja) | 2019-04-11 |
| TW201923129A (zh) | 2019-06-16 |
| JPWO2019070031A1 (ja) | 2019-11-14 |
| CN110114502A (zh) | 2019-08-09 |
| JP6742513B2 (ja) | 2020-08-19 |
| KR20190101440A (ko) | 2019-08-30 |
| TWI712700B (zh) | 2020-12-11 |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |