KR102223849B1 - 스퍼터링 장치 - Google Patents
스퍼터링 장치 Download PDFInfo
- Publication number
- KR102223849B1 KR102223849B1 KR1020197022549A KR20197022549A KR102223849B1 KR 102223849 B1 KR102223849 B1 KR 102223849B1 KR 1020197022549 A KR1020197022549 A KR 1020197022549A KR 20197022549 A KR20197022549 A KR 20197022549A KR 102223849 B1 KR102223849 B1 KR 102223849B1
- Authority
- KR
- South Korea
- Prior art keywords
- mask frame
- mask
- stock
- support
- chamber
- Prior art date
Links
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 165
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 230000015572 biosynthetic process Effects 0.000 claims description 88
- 238000000034 method Methods 0.000 claims description 39
- 238000007789 sealing Methods 0.000 claims description 17
- 238000004891 communication Methods 0.000 claims description 3
- 230000001174 ascending effect Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 173
- 230000001105 regulatory effect Effects 0.000 description 99
- 230000033001 locomotion Effects 0.000 description 55
- 230000032258 transport Effects 0.000 description 21
- 239000011521 glass Substances 0.000 description 20
- 238000011049 filling Methods 0.000 description 17
- 230000008859 change Effects 0.000 description 16
- 239000002245 particle Substances 0.000 description 14
- 239000000428 dust Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000012546 transfer Methods 0.000 description 12
- 210000003141 lower extremity Anatomy 0.000 description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 230000001360 synchronised effect Effects 0.000 description 7
- 230000005484 gravity Effects 0.000 description 6
- 230000002411 adverse Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000010355 oscillation Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000007480 spreading Effects 0.000 description 5
- 238000003892 spreading Methods 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 239000012636 effector Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 210000001364 upper extremity Anatomy 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000036544 posture Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005478 sputtering type Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017195211 | 2017-10-05 | ||
| JPJP-P-2017-195211 | 2017-10-05 | ||
| PCT/JP2018/037229 WO2019070031A1 (ja) | 2017-10-05 | 2018-10-04 | スパッタリング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190101440A KR20190101440A (ko) | 2019-08-30 |
| KR102223849B1 true KR102223849B1 (ko) | 2021-03-05 |
Family
ID=65994706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197022549A KR102223849B1 (ko) | 2017-10-05 | 2018-10-04 | 스퍼터링 장치 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6742513B2 (ja) |
| KR (1) | KR102223849B1 (ja) |
| CN (1) | CN110114502B (ja) |
| TW (1) | TWI712700B (ja) |
| WO (1) | WO2019070031A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI130006B (fi) * | 2020-12-02 | 2022-12-15 | Volframi Oy Ltd | Laite kuvioiden muodostamiseksi substraattilevyn pinnalle |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003027213A (ja) | 2001-07-06 | 2003-01-29 | Nippon Seiki Co Ltd | 有機ｅｌパネルの製造方法。 |
| JP2007265707A (ja) * | 2006-03-28 | 2007-10-11 | Toppan Printing Co Ltd | 有機電界発光素子とその製造方法並びにマスクフレーム |
| JP2012197468A (ja) | 2011-03-18 | 2012-10-18 | Canon Tokki Corp | 蒸着装置並びに蒸着方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS539150B1 (ja) | 1970-12-30 | 1978-04-04 | ||
| JPS5347683A (en) | 1976-10-12 | 1978-04-28 | Nippon Steel Corp | Cargo forwarding and receiving system |
| JP4417019B2 (ja) * | 2003-03-26 | 2010-02-17 | 株式会社アルバック | マスク装置及び真空成膜装置 |
| JP5074368B2 (ja) | 2008-12-15 | 2012-11-14 | 株式会社日立ハイテクノロジーズ | 成膜装置 |
| KR101488668B1 (ko) * | 2009-12-28 | 2015-02-02 | 울박, 인크 | 성막 장치 및 성막 방법 |
| JP5639431B2 (ja) * | 2010-09-30 | 2014-12-10 | キヤノントッキ株式会社 | 成膜装置 |
| JP2013237914A (ja) * | 2012-05-17 | 2013-11-28 | Hitachi High-Technologies Corp | 成膜装置及び成膜方法 |
| JP6050104B2 (ja) * | 2012-11-30 | 2016-12-21 | 株式会社アルバック | 無機酸化物膜の形成装置、及び、ｉｇｚｏ膜の形成方法 |
| US9490153B2 (en) * | 2013-07-26 | 2016-11-08 | Varian Semiconductor Equipment Associates, Inc. | Mechanical alignment of substrates to a mask |
| JP6509696B2 (ja) * | 2015-09-18 | 2019-05-08 | 株式会社アルバック | 真空処理装置 |
-
2018
- 2018-10-04 WO PCT/JP2018/037229 patent/WO2019070031A1/ja active Application Filing
- 2018-10-04 KR KR1020197022549A patent/KR102223849B1/ko active IP Right Grant
- 2018-10-04 CN CN201880005318.5A patent/CN110114502B/zh active Active
- 2018-10-04 JP JP2019516003A patent/JP6742513B2/ja active Active
- 2018-10-05 TW TW107135202A patent/TWI712700B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003027213A (ja) | 2001-07-06 | 2003-01-29 | Nippon Seiki Co Ltd | 有機ｅｌパネルの製造方法。 |
| JP2007265707A (ja) * | 2006-03-28 | 2007-10-11 | Toppan Printing Co Ltd | 有機電界発光素子とその製造方法並びにマスクフレーム |
| JP2012197468A (ja) | 2011-03-18 | 2012-10-18 | Canon Tokki Corp | 蒸着装置並びに蒸着方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110114502B (zh) | 2021-11-19 |
| WO2019070031A1 (ja) | 2019-04-11 |
| TW201923129A (zh) | 2019-06-16 |
| JPWO2019070031A1 (ja) | 2019-11-14 |
| CN110114502A (zh) | 2019-08-09 |
| JP6742513B2 (ja) | 2020-08-19 |
| KR20190101440A (ko) | 2019-08-30 |
| TWI712700B (zh) | 2020-12-11 |
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| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right |