CN110098316B - 层叠压电陶瓷部件和压电器件 - Google Patents
层叠压电陶瓷部件和压电器件 Download PDFInfo
- Publication number
- CN110098316B CN110098316B CN201910090497.3A CN201910090497A CN110098316B CN 110098316 B CN110098316 B CN 110098316B CN 201910090497 A CN201910090497 A CN 201910090497A CN 110098316 B CN110098316 B CN 110098316B
- Authority
- CN
- China
- Prior art keywords
- piezoelectric ceramic
- internal electrode
- electrode
- ceramic body
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 134
- 239000012212 insulator Substances 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000000452 restraining effect Effects 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018013962A JP7036604B2 (ja) | 2018-01-30 | 2018-01-30 | 積層圧電セラミック部品及び圧電デバイス |
| JP2018-013962 | 2018-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110098316A CN110098316A (zh) | 2019-08-06 |
| CN110098316B true CN110098316B (zh) | 2023-12-29 |
Family
ID=67392402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910090497.3A Active CN110098316B (zh) | 2018-01-30 | 2019-01-30 | 层叠压电陶瓷部件和压电器件 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11362261B2 (https=) |
| JP (1) | JP7036604B2 (https=) |
| CN (1) | CN110098316B (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7128628B2 (ja) * | 2018-01-30 | 2022-08-31 | 太陽誘電株式会社 | 積層圧電セラミック部品及び圧電デバイス |
| EP4177976B1 (en) * | 2020-07-03 | 2025-09-10 | Kyocera Corporation | Piezoelectric element |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085753A (ja) * | 1999-09-16 | 2001-03-30 | Murata Mfg Co Ltd | 圧電アクチュエータ |
| JP2002094134A (ja) * | 2000-09-14 | 2002-03-29 | Ngk Insulators Ltd | 薄型積層圧電／電歪素子および同積層圧電／電歪素子の製造方法 |
| JP2007335485A (ja) * | 2006-06-13 | 2007-12-27 | Funai Electric Co Ltd | 積層型圧電アクチュエータおよびその製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61239682A (ja) * | 1985-04-16 | 1986-10-24 | Tohoku Metal Ind Ltd | 積層型圧電バイモルフ素子の製造方法 |
| JP3185226B2 (ja) * | 1991-01-30 | 2001-07-09 | 株式会社村田製作所 | 圧電バイモルフ素子の駆動方法及び圧電バイモルフ素子 |
| DE10206115A1 (de) * | 2001-03-06 | 2002-09-19 | Ceramtec Ag | Piezokeramische Vielschichtaktoren sowie ein Verfahren zu ihrer Herstellung |
| DE602004029076D1 (de) * | 2003-10-27 | 2010-10-21 | Kyocera Corp | Mehrschichtiges piezoelektrisches bauelement |
| WO2006087871A1 (ja) * | 2005-02-15 | 2006-08-24 | Murata Manufacturing Co., Ltd. | 積層型圧電素子 |
| JP5135679B2 (ja) * | 2005-11-30 | 2013-02-06 | 株式会社村田製作所 | 積層型圧電素子の製造方法 |
| JP4992946B2 (ja) * | 2009-09-18 | 2012-08-08 | Ｔｄｋ株式会社 | セラミック電子部品およびその製造方法 |
| US9583692B2 (en) | 2011-10-03 | 2017-02-28 | Kyocera Corporation | Piezoelectric vibration device and portable terminal using the same |
-
2018
- 2018-01-30 JP JP2018013962A patent/JP7036604B2/ja active Active
-
2019
- 2019-01-25 US US16/258,376 patent/US11362261B2/en active Active
- 2019-01-30 CN CN201910090497.3A patent/CN110098316B/zh active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085753A (ja) * | 1999-09-16 | 2001-03-30 | Murata Mfg Co Ltd | 圧電アクチュエータ |
| JP2002094134A (ja) * | 2000-09-14 | 2002-03-29 | Ngk Insulators Ltd | 薄型積層圧電／電歪素子および同積層圧電／電歪素子の製造方法 |
| JP2007335485A (ja) * | 2006-06-13 | 2007-12-27 | Funai Electric Co Ltd | 積層型圧電アクチュエータおよびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20190237656A1 (en) | 2019-08-01 |
| JP2019134035A (ja) | 2019-08-08 |
| CN110098316A (zh) | 2019-08-06 |
| JP7036604B2 (ja) | 2022-03-15 |
| US11362261B2 (en) | 2022-06-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |