CN109912908A - 基板组合物及由其所制备的基板 - Google Patents
基板组合物及由其所制备的基板 Download PDFInfo
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- CN109912908A CN109912908A CN201810825043.1A CN201810825043A CN109912908A CN 109912908 A CN109912908 A CN 109912908A CN 201810825043 A CN201810825043 A CN 201810825043A CN 109912908 A CN109912908 A CN 109912908A
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- 239000000758 substrate Substances 0.000 title claims abstract description 83
- 239000000203 mixture Substances 0.000 title claims abstract description 54
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 30
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 30
- -1 polytetrafluoroethylene Polymers 0.000 claims abstract description 29
- 150000001875 compounds Chemical class 0.000 claims abstract description 23
- 229920000642 polymer Polymers 0.000 claims abstract description 16
- 125000005469 ethylenyl group Chemical group 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims abstract description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 11
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 claims abstract description 11
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 11
- 239000004813 Perfluoroalkoxy alkane Substances 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000011888 foil Substances 0.000 claims description 12
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000654 additive Substances 0.000 claims description 9
- 230000000996 additive effect Effects 0.000 claims description 9
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- RSNQKPMXXVDJFG-UHFFFAOYSA-N tetrasiloxane Chemical compound [SiH3]O[SiH2]O[SiH2]O[SiH3] RSNQKPMXXVDJFG-UHFFFAOYSA-N 0.000 claims description 8
- 229920002554 vinyl polymer Polymers 0.000 claims description 8
- 229920000734 polysilsesquioxane polymer Polymers 0.000 claims description 7
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- MPJPKEMZYOAIRN-UHFFFAOYSA-N 1,3,5-tris(2-methylprop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound CC(=C)CN1C(=O)N(CC(C)=C)C(=O)N(CC(C)=C)C1=O MPJPKEMZYOAIRN-UHFFFAOYSA-N 0.000 claims description 5
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
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- POPVULPQMGGUMJ-UHFFFAOYSA-N octasilsesquioxane cage Chemical compound O1[SiH](O[SiH](O2)O[SiH](O3)O4)O[SiH]4O[SiH]4O[SiH]1O[SiH]2O[SiH]3O4 POPVULPQMGGUMJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003999 initiator Substances 0.000 claims description 3
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- 229910052799 carbon Inorganic materials 0.000 claims description 2
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- 239000010439 graphite Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 2
- 239000001095 magnesium carbonate Substances 0.000 claims description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
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- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 claims 1
- 239000011575 calcium Substances 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 21
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- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 5
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- 239000011889 copper foil Substances 0.000 description 5
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- 239000004202 carbamide Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 2
- 125000002009 alkene group Chemical group 0.000 description 2
- 239000005030 aluminium foil Substances 0.000 description 2
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- 238000000280 densification Methods 0.000 description 2
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- 238000010586 diagram Methods 0.000 description 2
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- 238000005530 etching Methods 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- RWNXWFYNDNHUJA-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1.CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 RWNXWFYNDNHUJA-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- JVJCWAOBAKYZSY-UHFFFAOYSA-N C(C)(C)(C)OOC1(CCC(C#C1)(C)OOC(C)(C)C)C.C(C)(C)(C)OOC1(CCC(C#C1)(C)OOC(C)(C)C)C Chemical compound C(C)(C)(C)OOC1(CCC(C#C1)(C)OOC(C)(C)C)C.C(C)(C)(C)OOC1(CCC(C#C1)(C)OOC(C)(C)C)C JVJCWAOBAKYZSY-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- CGZZMOTZOONQIA-UHFFFAOYSA-N cycloheptanone Chemical group O=C1CCCCCC1 CGZZMOTZOONQIA-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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- 230000000750 progressive effect Effects 0.000 description 1
- FKRCODPIKNYEAC-UHFFFAOYSA-N propionic acid ethyl ester Natural products CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- OIQNWJHRBIPDFR-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate 2-tert-butylbenzenecarboperoxoic acid Chemical compound C(C)(C)(C)C1=C(C(=O)OO)C=CC=C1.C(C1=CC=CC=C1)(=O)OOC(C)(C)C OIQNWJHRBIPDFR-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- QVTVDJWJGGEOGX-UHFFFAOYSA-N urea;cyanide Chemical compound N#[C-].NC(N)=O QVTVDJWJGGEOGX-UHFFFAOYSA-N 0.000 description 1
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/18—Homopolymers or copolymers or tetrafluoroethene
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/549—Silicon-containing compounds containing silicon in a ring
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09D127/18—Homopolymers or copolymers of tetrafluoroethene
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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Abstract
本公开提供一种基板组合物及由该基板组合物所制备的基板。该基板组合物包含:25‑80重量份的聚合物,其中该聚合物选自聚四氟乙烯(polytetrafluoroethylene、PTFE)和全氟烷氧基烷烃(perfluoroalkoxy alkane、PFA);20‑75重量份的无机填充剂,其中该聚合物及该无机填充剂的总和为100重量份;以及,0.015‑0.7重量份的化合物,其中该化合物具有至少三个末端乙烯基(terminal vinyl group)。
Description
【技术领域】
本公开涉及一种基板组合物、及由该基板组合物所制备的基板。
【背景技术】
新世纪的电子产品趋向轻、薄、短、小,且以高频传输,使得印刷电路板的配线必须高密度化,来提升传输速度,同时保持信号完整性。电子产品采用了多层化的半导体组件与精密的封装技术,藉由进步的接合安装技术达到多层电路板的高密度化。
在电子构件领域中,对能高频率的通讯器材已有急迫的需求,因此最近已需要相关的电子构件材料,诸如具有低介电常数的半导体密封材料及具有低介电损失因子的材料,从而能够快速传送数据,并且不会在传送的过程造成数据的损失或被干扰。
聚四氟乙烯(PTFE)由于其较低的介电常数及介电损失因子,已普遍使用作为高频基板材料。然而,聚四氟乙烯(PTFE)其材料本身刚性不足,除了较不易进行后续加工外,所得的基板的机械强度也较差。
基于上述,业界需要一种具有低介电常数、低损失因子、耐热性佳及高机械强度的基板材料,以解决现有技术所遭遇到的问题。
【发明内容】
根据本公开实施例,本公开提供一种基板组合物,该基板组合物可包含25-80重量份的聚合物,其中该聚合物可选自聚四氟乙烯(polytetrafluoroethylene、PTFE)和全氟烷氧基烷烃(perfluoroalkoxy alkane、PFA);20-75重量份的无机填充剂,其中该聚合物及该无机填充剂的总和可为100重量份;以及,0.015-0.7重量份的化合物,其中该化合物为可具有至少三个末端乙烯基(terminal vinyl group)。
根据本公开实施例,本公开亦提供一种基板。该基板包含膜层,其中该膜层为本公开上述基板组合物所形成的固化物。
【附图说明】
图1为本公开一实施例所述基板的示意图。
图2为本公开另一实施例所述基板的示意图。
【符号说明】
110 膜层;
120 第一金属箔;
100 基板。
【具体实施方式】
本公开实施例提供一种基板组合物及由该基板组合物所制备的基板。本公开所述的接着组合物同时包含特定的聚合物、无机填充物及具有至少三个末端乙烯基的化合物,且上述成份以特定比例构成该基板组合物。藉由该具有至少三个末端乙烯基的化合物的添加,可在不影响介电特性(例如介电常数及损耗因子)的前提下,提升该基板组合物的可加工性,并增加由该基板组合物所制备而得的基板的机械强度。
根据本公开实施例,本公开提供一种基板组合物,该基板组合物可包含25-80重量份(例如30-75重量份、或35-70重量份)的聚合物;20-75重量份(例如25-70重量份、或30-65重量份)的无机填充剂,其中该聚合物及该无机填充剂的总和可为100重量份;以及,0.015-0.7重量份的化合物,其中该化合物为可具有至少三个末端乙烯基(terminal vinylgroup)。
根据本公开实施例,该聚合物可选自聚四氟乙烯(polytetrafluoroethylene、PTFE)和全氟烷氧基烷烃(perfluoroalkoxy alkane、PFA)。此外,该聚合物的数均分子量(number average molecular weight)可为约数十万至数百万。
根据本公开实施例,该无机填充剂可例如为二氧化硅、氧化铝、氧化镁、碳酸钙、碳化硅、碳酸钠、二氧化钛、氧化锌、氧化锆、石墨、碳酸镁、硫酸钡、或上述的组合。该无机填充剂的平均粒径可为约500nm至3000nm。
根据本公开实施例,该具有至少三个末端乙烯基的化合物的添加量对于本公开所述基板组合物(以及由该基板组合物所制备而得的基板)的性质具有很大的影响。根据本公开实施例,该具有至少三个末端乙烯基的化合物的添加量被控制在0.015-0.7重量份的范围内(例如0.018-0.65重量份、0.018-0.6重量份、或0.015-0.6重量份)。若具有至少三个末端乙烯基的化合物的添加量过低或过高,则无法提升基板组合物的加工性以及所得基板的机械强度。此外,若具有至少三个末端乙烯基的化合物的添加量超过0.7重量份,易造成所得的基板组合物介电常数及损耗因子增加。
根据本公开实施例,该具有至少三个末端乙烯基的化合物可包含三烯丙基异氰脲酸酯(triallyl isocyanurate、TAIC)、三甲基烯丙基异氰脲酸酯(trimethallylisocyanurate、TMAIC)、三烯丙基氰脲酸酯(triallyl cyanurate、TAC)、四乙烯基四甲基环四硅氧烷(tetravinyltetramethylcyclotetrasiloxane)、八乙烯基八聚倍半硅氧烷(octavinyl octasilsesquioxane)、或上述的组合。此外,根据本公开实施例,该具有至少三个末端乙烯基的化合物可选自三烯丙基异氰脲酸酯(triallyl isocyanurate、TAIC)、三甲基烯丙基异氰脲酸酯(trimethallyl isocyanurate、TMAIC)、三烯丙基氰脲酸酯(triallyl cyanurate、TAC)、四乙烯基四甲基环四硅氧烷(tetravinyltetramethylcyclotetrasiloxane)及八乙烯基八聚倍半硅氧烷(Octavinyloctasilsesquioxane)。
根据本公开实施例,本公开所述的基板组合物可还包含0.01-10重量份添加剂,其中该添加剂可为起始剂、平坦剂、色料、消泡剂、耐燃剂、或上述的组合。
根据本公开实施例,本公开所述的基板组合物可还包含溶剂,以使上述聚合物、无机填充剂、化合物及/或添加剂均匀分散于该溶剂中。该溶剂可例如为甲乙酮、乙酸丙二醇甲酯(PGMEA)、乙基-2-乙氧基乙醇乙酸酯、3-乙氧基丙酸乙酯、乙酸异戊酯、苯、甲苯、二甲苯、环己烷、或上述的组合。
根据本公开实施例,该起始剂可为过氧化物起始剂,例如苯甲酰基过氧化物(benzoyl peroxide)、1,1-双(叔丁基过氧基)环己烷(1,1-bis(tert-butylperoxy)cyclohexane)、2,5-双(叔丁基过氧基)-2,5-二甲基环己烷(2,5-bis(tert-butylperoxy)-2,5-dimethylcyclohexane)、2,5-双(叔丁基过氧基)-2,5-二甲基-3-环己炔(2,5-bis(tert-butylperoxy)-2,5-dimethyl-3-cyclohexyne)、双(1-(叔丁基过氧基)-1-甲基乙基)苯(bis(1-(tert-butylpeorxy)-1-methy-ethyl)benzene)、叔丁基氢过氧化物(tert-butyl hydroperoxide)、叔丁基过氧化物(tert-butyl peroxide)、叔丁基过氧基苯甲酸酯(tert-butyl peroxybenzoate)、茴香基氢过氧化物(cumene hydroperoxide)、环己酮基过氧化物(cyclohexanone peroxide)、二茴香基过氧化物(二枯基过氧化物,dicumylperoxide)、月桂酰基过氧化物(lauroyl peroxide)、或上述的组合。
根据本公开实施例,本公开亦提供一种基板。该基板包含膜层,其中该膜层为本公开所述基板组合物所形成的固化物。根据本公开实施例,该基板的制备方式可包含以下步骤:将上述基板组合物在80至120℃下烘干(移除溶剂),在以滚轮辗压的制程中形成薄片。接着,将该薄片在150至300℃下烘烤,得到该膜层。根据本公开实施例,本公开所述基板100可还包含配置于该膜层110上的第一金属箔120,请参照图1。根据本公开实施例,该第一金属箔可为铜箔或铝箔。
根据本公开实施例,除了该第一金属箔120及该膜层110之外,本公开所述基板100可还包含第二金属箔130。其中,该膜层110置于该第一金属箔120及该第二金属箔130之间,请参照图2。根据本公开实施例,该第二金属箔可为铜箔或铝箔。
根据本公开实施例,本公开所述基板具有低介电常数、低损失因子、及高机械强度,可作为印刷电路板、集成电路载板、或高频基板。
为了让本公开的上述和其他目的、特征、和优点能更明显易懂,下文特举数实施例及比较实施例,作详细说明如下:
基板组合物
实施例1:
首先,将4克三甲基烯丙基异氰脲酸酯(trimethallyl isocyanurate、TMAIC)(购自于Hunan Farida Technology Co.,Ltd.)及1.2克二茴香基过氧化物(dicumylperoxide)溶于36克甲乙酮(methyl ethyl ketone)中,得到含三甲基烯丙基异氰脲酸酯的溶液(TMAIC溶液)。接着,将27.5克二氧化硅(平均粒径为25nm、购自于US Silica)、37.5克聚四氟乙烯分散液(PTFE dispersion)(购自于杜邦,其中PTFE含量为60%(22.5克))、以及0.1克上述含三甲基烯丙基异氰脲酸酯的溶液(其中三甲基烯丙基异氰脲酸酯含量为0.0097克)进行混合。经过烘干去除部分溶剂后,得到基板组合物(1)。
实施例2:
依照实施例1所述基板组合物(1)的制备方式进行,除了将含三甲基烯丙基异氰脲酸酯溶液由0.1克增加至0.25克,得到基板组合物(2)。
实施例3:
依照实施例1所述基板组合物(1)的制备方式进行,除了将含三甲基烯丙基异氰脲酸酯溶液由0.1克增加至0.5克,得到基板组合物(3)。
实施例4:
依实施例1所述基板组合物(1)的制备方式进行,除了将含三甲基烯丙基异氰脲酸酯溶液由0.1克增加至1克,得到基板组合物(4)。
实施例5:
依实施例1所述基板组合物(1)的制备方式进行,除了将含三甲基烯丙基异氰脲酸酯溶液由0.1克增加至3克,得到基板组合物(5)。
比较例1:
依照实施例1所述基板组合物(1)的制备方式进行,除了不添加三甲基烯丙基异氰脲酸酯溶液,得到基板组合物(6)。
比较例2:
依照实施例1所述基板组合物(1)的制备方式进行,除了将含三甲基烯丙基异氰脲酸酯溶液由0.1克增加至5克,得到基板组合物(7)。
实施例6:
首先,将4克四乙烯基四甲基环四硅氧烷(tetravinyltetramethylcyclotetrasiloxane)(购自于公隆化学代理进口Gelest Inc.)及1.2克二茴香基过氧化物(dicumylperoxide)溶于36克甲乙酮(methyl ethyl ketone)中,得到含四乙烯基四甲基环四硅氧烷的溶液。接着,将27.5克二氧化硅(平均粒径为25μm、购自于US Silica)、37.5克聚四氟乙烯分散液(PTFE dispersion)(购自于杜邦,其中PTFE含量为60%(22.5克))、以及1克上述四乙烯基四甲基环四硅氧烷溶液(其中四乙烯基四甲基环四硅氧烷含量为0.097克)进行混合。经过烘干去除部分溶剂后,得到基板组合物(8)。
实施例7:
首先,将4克八乙烯基八聚倍半硅氧烷(octavinyl octasilsesquioxane)(购自于Gelest Inc.)及1.2克二茴香基过氧化物(dicumyl peroxide)溶于36克甲乙酮(methylethyl ketone)中,得到含八乙烯基八聚倍半硅氧烷的溶液。接着,将27.5克二氧化硅(平均粒径为25μm、购自于US Silica)、37.5克聚四氟乙烯分散液(PTFE dispersion)(购自于杜邦,其中PTFE含量为60%(22.5克))、以及1克上述八乙烯基八聚倍半硅氧烷溶液(其中八乙烯基八聚倍半硅氧烷含量为0.097克)进行混合。经过烘干去除部分溶剂后,得到基板组合物(9)。
基板的制备及性质测量
实施例8
分别将实施例1-5及比较例1-2所述基板组合物在120℃下烘烤以去除溶剂。接着,将烘烤后的产物使用滚轮辗压形成薄片。接着,将该薄片在150至300℃下烘烤固化,形成膜层(1)-(7)(厚度约为300μm)。最后,将所得膜层(1)-(7)分别与铜箔(购自于福田,厚度为18μm)压合后,得到基板(1)-(7)。
接着,将铜箔蚀刻移除后,测量膜层(1)-(7)的介电常数(dielectriccoefficient、Dk)、介电损失因子(dielectric loss factor、Df)、弹性模量(elasticmodulus)、粘度模量(viscosity modulus)、以及复合模量(complex modulus),结果如表1所示。其中,介电常数(dielectric coefficient、Dk)及介电损失因子(dielectric lossfactor、Df)使用微波诱电分析仪(microwave dielectrometer,微波电介质测试器,购自AET公司)于10GHz频率下测量;而弹性模量(elastic modulus)、粘度模量(viscositymodulus)、以及复合模量(complex modulus)的测量方式为在50℃使用粘度分析仪参照ASTM D 5992-96进行。
表1
实施例9
将实施例6所述基板组合物在120℃下烘烤以去除溶剂。接着,将烘烤后的产物使用滚轮辗压形成薄片。接着,将该薄片在150至300℃下烘烤固化,形成膜层(8)(厚度约为300μm)。将所得膜层(8)与铜箔(购自于福田,厚度为18μm)压合后,得到基板(8)。接着,将铜箔蚀刻移除后,测量膜层(8)的介电常数(dielectric coefficient、Dk)、介电损失因子(dielectric loss factor、Df)、弹性模量(elastic modulus)、粘度模量(viscositymodulus)、以及复合模量(complex modulus),结果如表2所示。
表2
由表1-2可得知,由于实施例1-6所述基板组合物添加了约0.0194重量份至0.582重量份的具有至少三个末端烯基化合物(例如三甲基烯丙基异氰脲酸酯(TMAIC)、或四乙烯基四甲基环四硅氧烷)(相对于100重量份的无机填充剂及聚合物),因此以本公开所述基板组合物所形成的膜层,除了仍具有低介电常数及低介电损失因子之外,其弹性模量、粘度模量、以及复合模量与比较例1(不添加具有至少三个末端烯基的化合物)所述膜层相比亦大幅提升。此外,当添加过量三甲基烯丙基异氰脲酸酯时(即比较例2),其所得膜层的杨氏模量反而较比较例1(不添加三甲基烯丙基异氰脲酸酯)所述膜层来得低。
虽然本公开已以数个实施例揭露如上,然其并非用以限定本公开,任何本技术领域技术人员在不脱离本公开的精神和范围内,应可作任意的更动与润饰,因此本公开的保护范围应以所附权利要求书所界定的范围为准。
Claims (13)
1.一种基板组合物,包含:
25-80重量份的聚合物,其中该聚合物选自聚四氟乙烯(polytetrafluoroethylene、PTFE)和全氟烷氧基烷烃(perfluoroalkoxy alkane、PFA);
20-75重量份的无机填充剂,其中该聚合物及该无机填充剂的总和为100重量份;以及
0.015-0.7重量份的化合物,其中该化合物具有至少三个末端乙烯基(terminal vinylgroup)。
2.如权利要求1所述的基板组合物,其中该无机填充剂为二氧化硅、氧化铝、氧化镁、碳酸钙、碳化硅、碳酸钠、二氧化钛、氧化锌、氧化锆、石墨、碳酸镁、硫酸钡、或上述的组合。
3.如权利要求1所述的基板组合物,其中该化合物为三烯丙基异氰脲酸酯(triallylisocyanurate、TAIC)。
4.如权利要求1所述的基板组合物,其中该化合物为三甲基烯丙基异氰脲酸酯(trimethallylisocyanurate、TMAIC)。
5.如权利要求1所述的基板组合物,其中该化合物为三烯丙基氰脲酸酯(triallylcyanurate、TAC)。
6.如权利要求1所述的基板组合物,其中该化合物为四乙烯基四甲基环四硅氧烷(tetravinyltetramethylcyclotetrasiloxane)。
7.如权利要求1所述的基板组合物,其中该化合物为八乙烯基八聚倍半硅氧烷(octavinyl octasilsesquioxane)。
8.如权利要求1所述的基板组合物,还包含0.01-10重量份的添加剂。
9.如权利要求8所述的基板组合物,其中该添加剂为起始剂、平坦剂、色料、消泡剂、耐燃剂、或上述的组合。
10.一种基板,包含:
膜层,其中该膜层为权利要求1所述的基板组合物所形成的固化物。
11.如权利要求10所述的基板,还包含:
第一金属箔,其配置于该膜层上。
12.如权利要求11所述的基板,还包含:
第二金属箔,其中该膜层置于该第一金属箔及该第二金属箔之间。
13.如权利要求10所述的基板,其中该基板为印刷电路板、集成电路载板、或高频基板。
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