CN106800733A - 一种复合微波介质材料、用其制作的印刷电路板基材及其制造方法 - Google Patents
一种复合微波介质材料、用其制作的印刷电路板基材及其制造方法 Download PDFInfo
- Publication number
- CN106800733A CN106800733A CN201710042374.3A CN201710042374A CN106800733A CN 106800733 A CN106800733 A CN 106800733A CN 201710042374 A CN201710042374 A CN 201710042374A CN 106800733 A CN106800733 A CN 106800733A
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- Prior art keywords
- microwave medium
- composite microwave
- printed circuit
- circuit board
- sheet material
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- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 88
- 239000002131 composite material Substances 0.000 title claims abstract description 44
- 239000000758 substrate Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title description 16
- 238000004519 manufacturing process Methods 0.000 title description 5
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- 238000004132 cross linking Methods 0.000 claims abstract description 17
- 229920002313 fluoropolymer Polymers 0.000 claims abstract description 15
- 239000004811 fluoropolymer Substances 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 15
- 230000005855 radiation Effects 0.000 claims abstract description 13
- 239000007787 solid Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000011888 foil Substances 0.000 claims description 20
- 238000001035 drying Methods 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 9
- 239000000314 lubricant Substances 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000839 emulsion Substances 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000004062 sedimentation Methods 0.000 claims description 5
- 239000004812 Fluorinated ethylene propylene Substances 0.000 claims description 4
- 229920009441 perflouroethylene propylene Polymers 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 3
- 229920001774 Perfluoroether Polymers 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 claims description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 238000009736 wetting Methods 0.000 claims description 2
- 150000001336 alkenes Chemical class 0.000 claims 1
- 125000000468 ketone group Chemical group 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 21
- 238000005516 engineering process Methods 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 239000012876 carrier material Substances 0.000 abstract description 2
- 238000009725 powder blending Methods 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 description 18
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 11
- 239000004810 polytetrafluoroethylene Substances 0.000 description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 238000003486 chemical etching Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 239000012752 auxiliary agent Substances 0.000 description 3
- 238000003490 calendering Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- DUFKCOQISQKSAV-UHFFFAOYSA-N Polypropylene glycol (m w 1,200-3,000) Chemical class CC(O)COC(C)CO DUFKCOQISQKSAV-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920006361 Polyflon Polymers 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- MTZOKGSUOABQEO-UHFFFAOYSA-L barium(2+);phthalate Chemical compound [Ba+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O MTZOKGSUOABQEO-UHFFFAOYSA-L 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical group FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/18—Homopolymers or copolymers or tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
Description
100 | 金属箔层 |
200 | 复合微波介质材料 |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710042374.3A CN106800733B (zh) | 2017-01-20 | 2017-01-20 | 一种复合微波介质材料、用其制作的印刷电路板基材及其制造方法 |
Applications Claiming Priority (1)
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CN201710042374.3A CN106800733B (zh) | 2017-01-20 | 2017-01-20 | 一种复合微波介质材料、用其制作的印刷电路板基材及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN106800733A true CN106800733A (zh) | 2017-06-06 |
CN106800733B CN106800733B (zh) | 2019-04-02 |
Family
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Family Applications (1)
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CN201710042374.3A Expired - Fee Related CN106800733B (zh) | 2017-01-20 | 2017-01-20 | 一种复合微波介质材料、用其制作的印刷电路板基材及其制造方法 |
Country Status (1)
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CN (1) | CN106800733B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109912908A (zh) * | 2017-12-13 | 2019-06-21 | 财团法人工业技术研究院 | 基板组合物及由其所制备的基板 |
CN110982202A (zh) * | 2019-11-25 | 2020-04-10 | 江苏富仕德科技发展有限公司 | 一种热固性树脂组合物及由其制备的半固化片、覆铜板 |
CN112143145A (zh) * | 2020-09-28 | 2020-12-29 | 深圳市德诚旺科技有限公司 | 一种低介电损耗型聚四氟乙烯微波板材及其制备方法 |
CN112310629A (zh) * | 2020-09-30 | 2021-02-02 | 江西安缔诺科技有限公司 | 一种基于高分子复合微波介质的片式天线及其制备方法 |
CN112677617A (zh) * | 2020-12-18 | 2021-04-20 | 浙江巨化新材料研究院有限公司 | 一种新型挠性覆铜板的制备方法 |
CN114536923A (zh) * | 2022-03-30 | 2022-05-27 | 常州中英科技股份有限公司 | 一种高介电常数的含氟树脂基高导热高频覆铜板 |
CN114854152A (zh) * | 2021-02-03 | 2022-08-05 | 台光电子材料股份有限公司 | 树脂组合物及其制品 |
US11549035B2 (en) | 2020-12-16 | 2023-01-10 | Saint-Gobain Performance Plastics Corporation | Dielectric substrate and method of forming the same |
US11596064B2 (en) | 2020-07-28 | 2023-02-28 | Saint-Gobain Performance Plastics Corporation | Dielectric substrate and method of forming the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101235200A (zh) * | 2007-01-30 | 2008-08-06 | 长春人造树脂厂股份有限公司 | 热固性树脂改质的聚酰亚胺树脂组成物 |
CN103289158A (zh) * | 2012-02-29 | 2013-09-11 | 深圳光启创新技术有限公司 | 一种基板及其制备方法 |
-
2017
- 2017-01-20 CN CN201710042374.3A patent/CN106800733B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101235200A (zh) * | 2007-01-30 | 2008-08-06 | 长春人造树脂厂股份有限公司 | 热固性树脂改质的聚酰亚胺树脂组成物 |
CN103289158A (zh) * | 2012-02-29 | 2013-09-11 | 深圳光启创新技术有限公司 | 一种基板及其制备方法 |
Non-Patent Citations (1)
Title |
---|
黄达斐等: ""陶瓷/PTFE复合介质基板新成型工艺的研究"", 《电子元件与材料》 * |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109912908A (zh) * | 2017-12-13 | 2019-06-21 | 财团法人工业技术研究院 | 基板组合物及由其所制备的基板 |
CN110982202A (zh) * | 2019-11-25 | 2020-04-10 | 江苏富仕德科技发展有限公司 | 一种热固性树脂组合物及由其制备的半固化片、覆铜板 |
US11596064B2 (en) | 2020-07-28 | 2023-02-28 | Saint-Gobain Performance Plastics Corporation | Dielectric substrate and method of forming the same |
CN112143145A (zh) * | 2020-09-28 | 2020-12-29 | 深圳市德诚旺科技有限公司 | 一种低介电损耗型聚四氟乙烯微波板材及其制备方法 |
CN112310629A (zh) * | 2020-09-30 | 2021-02-02 | 江西安缔诺科技有限公司 | 一种基于高分子复合微波介质的片式天线及其制备方法 |
US11549035B2 (en) | 2020-12-16 | 2023-01-10 | Saint-Gobain Performance Plastics Corporation | Dielectric substrate and method of forming the same |
CN112677617A (zh) * | 2020-12-18 | 2021-04-20 | 浙江巨化新材料研究院有限公司 | 一种新型挠性覆铜板的制备方法 |
CN112677617B (zh) * | 2020-12-18 | 2022-04-01 | 浙江巨化新材料研究院有限公司 | 一种挠性覆铜板的制备方法 |
CN114854152A (zh) * | 2021-02-03 | 2022-08-05 | 台光电子材料股份有限公司 | 树脂组合物及其制品 |
CN114854152B (zh) * | 2021-02-03 | 2023-05-23 | 台光电子材料股份有限公司 | 树脂组合物及其制品 |
CN114536923A (zh) * | 2022-03-30 | 2022-05-27 | 常州中英科技股份有限公司 | 一种高介电常数的含氟树脂基高导热高频覆铜板 |
CN114536923B (zh) * | 2022-03-30 | 2024-04-26 | 常州中英科技股份有限公司 | 一种高介电常数的含氟树脂基高导热高频覆铜板 |
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