CN109817546A - Flat panel display manufacturing device - Google Patents
Flat panel display manufacturing device Download PDFInfo
- Publication number
- CN109817546A CN109817546A CN201711372925.9A CN201711372925A CN109817546A CN 109817546 A CN109817546 A CN 109817546A CN 201711372925 A CN201711372925 A CN 201711372925A CN 109817546 A CN109817546 A CN 109817546A
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- Prior art keywords
- plasma
- cabin
- glass substrate
- flat panel
- panel display
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Optics & Photonics (AREA)
- Physical Vapour Deposition (AREA)
- Elimination Of Static Electricity (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Plasma Technology (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The flat panel display manufacturing device with static eraser that the present invention relates to a kind of, the static eraser are suitable for the static elimination of glass substrate under a high vacuum.Flat panel display manufacturing device (ID) has: processing cabin (1) bestows working process to glass substrate (S)；And transport path (3), form the carrying-in/carrying-out path that glass substrate (S) is moved in or moved out processing cabin (1)；Wherein, it handles cabin (1) and transport path (3) is under vacuum environment, and static eraser (O) be connected to constitute transport path (3) vacuum tank outside wall surface, the static eraser (O) towards vacuum tank inside releasing such glass substrate (S) static elimination electronics.
Description
Technical field
The present invention relates to the flat panel display manufacturing devices for bestowing set processing to glass substrate under vacuum, and
With the device for eliminating the electrostatic eliminating function of charged particles on glass substrate.
Background technique
The flat panel of liquid crystal display or plasma display (plasma display), organic el display etc. is shown
The manufacturing step of device is to implement under vacuum.
For the concrete example of manufacturing step, the ion merging step or circuit pattern structure for importing impurity can be enumerated
Step of exposure, film formation step of forming thin film of figure etc..
When implementing each step, Yao Jinhang: glass substrate carrying-in/carrying-out is handled into cabin using transfer robot etc. or is made
With the positioning of the processing position of the glass substrate of substrate support mechanism.
In the carrying or positioning of glass substrate to be carried out, because by the friction and/or removing between object, and in glass base
Charged particles are had on plate.If remain the state of charged particles, can generate glass substrate stick or static discharge.Moreover,
Since the particle attracted by electrification glass substrate is main cause, the undesirable doubt of processing substrate is caused.
It therefore, was all the static elimination for using plasma to carry out the charge of glass substrate in the past.
Disappeared described in patent document 1 or patent document 2 using the electrostatic of ion generator (ionizer) specifically, having
Except method.It is the inert gas that nitrogen or argon gas etc. are filled in cabin after vacuum exhaustion in the static elimination method.So
Afterwards, ultraviolet light is irradiated to the gas or lights plasma in inert gas environment, ionize the plasma that inert gas makes whereby
Change.Finally, in a manner of making glass substrate be exposed to the plasma through the inert gas generated, to be charged to glass substrate
Charge static elimination.
(existing technical literature)
(patent document)
Patent document 1: Japanese Unexamined Patent Publication 2004-241420
Patent document 2: Japanese Unexamined Patent Publication 9-324260.
Summary of the invention
(the invention project to be solved)
In the method described in patent document 1 or patent document 2, it must be filled in cabin in advance in static elimination lazy
Property gas, so more improper use under a high vacuum.
A kind of flat panel display manufacturing device is provided in the present invention, there is the glass substrate being suitble under a high vacuum
Static elimination static eraser.
(method to project to be solved)
Flat panel display manufacturing device of the invention, has:
Cabin is handled, working process is bestowed to glass substrate；And
Transport path, the carrying-in/carrying-out path in cabin will be handled by being formed described in glass substrate carrying-in/carrying-out；
The processing cabin and the transport path be under vacuum environment,
In the outside wall surface for the vacuum tank for constituting the transport path, it is connected with towards the release of the inside of the vacuum tank
The static eraser of the electronics of the static elimination of the glass substrate.
When electronegative glass substrate is also set as static elimination object, most preferably:
The static eraser has:
By the ionization of imported gas, the plasma cabin of plasma is generated in cabin；And it is released out of same cabin
Put the plasma of the static elimination of the glass substrate.
In order to improve the utilization efficiency for being fed to the indoor gas in plasma cabin, most preferably:
The static eraser has:
To transmit the plasma transmission path of plasma to the transport path from the plasma cabin；
At in vertical severing section, the severing section of the plasma transmission path is with the transmission direction of plasma
The severing section in the plasma cabin is also small.
In order to be easily guided into generated plasma to transport path side, preferably:
The magnetic field of the transmission direction along plasma is formed in the plasma transmission path.
In order to prevent in the disappearance of the plasma of the inner wall of plasma transmission path:
It can also be provided in the periphery of the plasma transmission path to generation point magnetic field (cusp in transmission path
Magnetic field) permanent magnet.
In order to which in the static eraser of flat panel display manufacturing device, to keep transport path side is the shape of vacuum
The maintenance of static eraser is carried out under state, preferably:
The plasma transmission path is provided with the valve body of transmission path opening and closing.
In order to which plasma is supplied on two surfaces efficiently to glass substrate, preferably:
In the transport path, progress is supplied from the side of the glass substrate by the plasma transmission path
To give the plasma of the glass substrate.
(The effect of invention)
It is connected with static eraser in the outside wall surface for the vacuum tank for constituting transport path, and is based on filling from static elimination
Supplied electronics is set to carry out the static elimination of glass substrate, so being not necessary to the filling gas in transport path.Thereby, it is possible to
Formation will remain high vacuum in transport path.
Detailed description of the invention
Fig. 1 is the schematic plan of an example of display plane panel display manufacturing device.
Fig. 2 is the schematic plan for showing an example of static eraser.
Fig. 3 (A), Fig. 3 (B) and Fig. 3 (C) are the explanatory diagram for the plasma direction of illumination for glass substrate.
Description of symbols
1 processing cabin
2 vacuum preparation cabins
3 intermediate cabins
4 substrate reception cabins
5 potentiometers
6 substrate support mechanisms
11 insulation boards
12 plasma transmission paths
13 plasma cabins
14 permanent electric magnet
15 coils
16 filaments
The magnetic field B
G gas sprays port
ID ion doping apparatus (flat panel display manufacturing device)
O static eraser
P plasma
S glass substrate
R1 vacuum environment robot
R2 atmospheric robots
V valve body
Va electric arc
Ve draws power supply
Vf A-power supply
X1 transport path
X2 transport path.
Specific embodiment
Fig. 1 is the schematic plan of ion doping apparatus ID.Ion doping apparatus ID is flat panel display manufacture
Device, and it is used in the manufacture of TFT component.Fig. 1 omits the configuration with the static eraser O for belonging to characteristic of the invention
The diagram of the unrelated ratio processing more upstream side in cabin 1 (being related to the position of the transmission of ion beams).
Glass substrate S is accommodated in the substrate reception cabin 4 of atmospheric environment side.Carry out processing substrate when, glass substrate S along
Transport path shown in arrow dotted line X1 is carried.
Specifically, glass substrate S is carried to vacuum preparation cabin from substrate reception cabin 4 using atmospheric robots R2
Room 2.Later, glass substrate S is carried to processing cabin from vacuum preparation cabin 2 using the vacuum environment robot R1 in intermediate cabin 3
The substrate support mechanism 6 of room 1.
After processing substrate, glass substrate S transport path shown in the arrow dotted line X2 is carried to storage cabin 4.
Carrying, glass base in the glass substrate S carried out from vacuum environment robot R1 or atmospheric robots R2
Plate S be placed on substrate support mechanism 6 and/or from substrate support mechanism 6 remove glass substrate S in, glass substrate S have because by
Charged particles caused by friction and/or removing, and accumulate charged particles.
It in the present invention, is that the glass substrate S charge charged is given into static elimination using static eraser O,
Static eraser O is connected to the outside wall surface for constituting the vacuum tank in intermediate cabin 3.
In noting technology, the cabin for setting the static elimination for carrying out glass substrate will be filled before inert gas before static elimination
After interior, the indoor inert gas in cabin will be fills up to and give plasma, and using the plasma given glass substrate quiet
Electricity is eliminated.
In contrast, in static eraser O of the invention, according to the plasma supplied from static eraser O
The static elimination of glass substrate S is carried out, so be not necessary to be pre-charged with inert gas in intermediate cabin 3.So of the invention
Static eraser O can be under a high vacuum (for example, 10-4Pa platform) it uses.
It can also from the timing of static eraser O supply plasma are as follows: to be installed on the current potential of the ceiling in intermediate cabin 3
Meter 5 measure glass substrates current potentials, and its measurement be more than a reference value when carry out.But not necessarily such as above-mentioned measurement,
Also it may be configured as supplying plasma constantly.
Furthermore the position that potentiometer 5 is installed also is mountable to floor or the vacuum environment robot R1 in intermediate cabin 3
Mechanical hand.Moreover, it is also contemplated that the cabin being installed on other than intermediate cabin 3 or the multiple potentiometers 5 of installation etc., miscellaneous
It constitutes.
In Fig. 1, although depicting the composition that static eraser O is connected to intermediate cabin 3, static eraser O
Junction be not limited to intermediate cabin 3.For example, static eraser O is also connected to vacuum preparation cabin 2, the vacuum is pre-
Atmospheric environment and vacuum environment can be switched in standby cabin 2, as long as and carrying out the place of moving glass substrate under vacuum (using being
Form the place of the transport path of the carrying-in/carrying-out of glass substrate), it can also be any place.
In addition, measuring the current potential of glass substrate S from the place of static eraser O supply plasma and using potentiometer 5
Place be not necessary to unanimously.As long as carrying out the supply of plasma according to the measurement using potentiometer 5, in glass substrate S
On the route of carrying, as long as will be set as by the place of the progress electrostatic measurement of potentiometer 5 and be supplied from static eraser O etc.
Identical place is in the place of ion or is placed in the place also leading portion compared with plasma supply, so that it may fit in response to measurement
Locality supply plasma.
The configuration example for having static eraser O is drawn in Fig. 2.
Static eraser O is installed on the outside wall surface for constituting the vacuum tank in intermediate cabin 3 via insulation board 11.This is quiet
The major part of electricity removal apparatus O is constituted with plasma cabin 13 and plasma transmission path 12, which is
The plasma P being made of electronics and ion is generated, which discharges towards intermediate cabin 3 with plasma cabin
The plasma P that room 13 generates.
In plasma cabin 13, port will be sprayed by gas using the thermoelectron discharged from filament (filament) 16
(gas port) G is simultaneously directed into the inert gases such as the indoor xenon in cabin (xenon) or argon (argon) and is ionized, generate whereby etc.
Ion P.
Releasing from the plasma P of static eraser is easy or made in order to make to generate in the indoor plasma in plasma cabin
It is easy to put, and static eraser O has A-power supply Vf (not shown), electric arc (arc) power supply Va (applies the tens of volts of voltage
It is special) and draw power supply Ve (applying voltage some tens of volts).
Permanent electric magnetic configured with sharp magnetic field (cusp magnetic field) generation around plasma cabin 13
Iron 14, the permanent electric magnet 14 is to prevent electronics or ion in the inner wall in plasma cabin 13 from disappearing.
The periphery of plasma transmission path 12 is wound with a pair of of coil 15, and a pair of coil 15 is to generate along transmission road
The magnetic field B of diameter.The plasma P of plasma transmission path 12 is to be captured by magnetic field B to avoid because of the collision with transmission path wall surface
Caused disappearance, and towards discharging in intermediate cabin 3.
The composition of coil 15 is not limited to a pair, for example, the quantity of coil 15 can also when plasma transmission path 12 is shorter
It is one, coil 15 can also omit.In addition, the quantity of coil can also increase up to three when plasma transmission path 12 is longer
More than.Further, the coil of coherent length can also be formed in a manner of being not provided with gap between a pair of of coil 15.Another party
Face can also configure in the periphery of plasma transmission path 12 and replace the permanent magnet of coil 15, and the permanent magnet is in order to keep away
Exempt from the plasma extinguishment in the wall surface of plasma transmission path 12, and generates point near the inner wall of plasma transmission path 15
Magnetic field.
If with the transmission direction of plasma at vertical plane, to compare severing plasma transmission path 12 and severing
The severing section of severing section when plasma cabin 13, plasma transmission path 12 can be than the severing section in plasma cabin 13
It is also small.Therefore relationship, has mitigated inert gas the passing through toward 12 side of plasma transmission path for being fed to plasma cabin 13.
Whereby, the utilization efficiency that related gas is generated with plasma being lifted in plasma cabin 13.In addition, sanction described herein
Section refers not only to the wall surface in plasma cabin 13 or plasma transmission path 12, also refers to the inner space comprising each cabin
Surface.
For in above-mentioned severing section, in the severing section in plasma transmission path 12 and plasma cabin 13 etc.
The transmission direction of ion has the situation for belonging to constant situation, but also having non-constant.For example, plasma transmission path 12 with
When diameter is constituted along the cylindric vacuum tank that the transmission direction of plasma changes, above-mentioned severing section does not just become
It is constant.It is related to plasma cabin 13 and also has identical situation.
In the transmission direction of plasma, when the diameter change of one or two component, the ratio of above-mentioned severing section
It is carried out compared with meeting at the smallest position of each component severing section.
The valve body V for carrying out the opening and closing of transmission path is provided in plasma transmission path 12.By the way that valve body V is arranged,
Intermediate 3 side of cabin can be maintained at vacuum state, and 3 side of plasma cabin is set as atmosphere opening, just can be carried out static elimination
The maintenance of device O.
The plasma P of plasma transmission path 12 is released the end of side, and mode as shown may be alternatively located at intermediate cabin 3
Vacuum tank wall surface can also but as long as promoting static elimination efficiency discharging plasma P close to the position of glass substrate S
It is prominent in towards intermediate cabin 3.
In addition, the setting of above-mentioned plasma transmission path 12 is not necessarily, it can also be omitted, and plasma cabin 13 is straight
It is connected to intermediate cabin 3 in succession.
In general, glass substrate S, which belongs to, is easy positively charged property, but also have electronegative situation.Furthermore, it is also possible to send out
The surface back side two sides of raw glass substrate S is the situation of different current potential electrification.The electrification of which kind of current potential is depended in flat panel
The process content for the glass substrate S that display manufacturing apparatus is implemented.
For example, when bestowing into mould to glass substrate S and handling, if the property of mould be easy it is negatively charged, by 5 institute of potentiometer
It is negative potential that the current potential of the glass substrate S measured, which measures,.
Fig. 3 (A), Fig. 3 (B) and Fig. 3 (C) are to draw the example having from all directions to glass substrate S irradiation plasma P.
It is to irradiate plasma P from the side of glass substrate S in Fig. 3 (A).According to such composition, plasma P can be wrapped
Enclose two surfaces of glass substrate S and entrance upper surface and lower surface, it is possible to once just eliminate to two surface electrostatics.
When the size of glass substrate S is larger, in the composition of Fig. 3 (A), be only from the side of glass substrate S irradiation etc. from
The composition of sub- P, so having the doubt not carried out sufficiently in the static elimination that plasma P irradiates the opposite side of side.
This point can also irradiate plasma P from the two sides of glass substrate S such as Fig. 3 (B).
Moreover, as shown in Fig. 3 (C) plasma P can also be irradiated to the upper and lower surface of glass substrate S.At this point, compared to Fig. 3
(A) or past lower face side of the composition of Fig. 3 (B) compared with the plasma P for the upper surface that can not expect to be irradiated onto glass substrate S into
Enter, so it is better also to irradiate plasma P from the lower face side of glass substrate S.
But if complete static elimination object surface be only glass substrate S any one side, from be set as quiet
The opposite seated position that electricity eliminates the surface of object irradiates plasma P.
On the other hand, whens solving the problems, such as static discharge etc. really, electrostatic preferably is carried out to two surfaces of glass substrate S
It eliminates.
Glass substrate S still has after static elimination due to the ion in plasma with positive charge or with negative electrical charge
Ion and the doubt for charging glass substrate S.
But ten volts of the coefficient of potential of the extraction voltage Ve shown in the composition of Fig. 2, even if so glass substrate S has
Ion or electronics in the plasma of electrification, the current potential of glass substrate S are some tens of volts at most.Such electrified voltage and because
The current potential of glass substrate S caused by by stripping charge up to current potential several thousand volts compared to be it is very little, the reason and cause quiet
A possibility that discharge of electricity problem etc., are low, can't have to the yield of glass substrate processing and draw sound.
In Fig. 1, for flat panel display manufacturing device, hereby for act ion doping apparatus.But it is of the invention
Object be not limited to flat panel display manufacturing device.
For example, can also such as film formation device multitask cabin mode device.In addition, can also be by each device with series connection
The device for the production line mode that continuous mode combines.
In composition of the invention, as long as static eraser O is connected to the carrying for the glass substrate S to be formed under vacuum
The composition of the outside wall surface of the vacuum tank in path then can be applicable to any flat panel display manufacturing device.
In above-mentioned embodiment, it has been directed to from the composition of static eraser O release plasma P and has been illustrated, still
Plasma P can also be replaced to only discharge the composition of electronics.For example, stopping spraying the lazy of port G by gas with being constituted for Fig. 2
The supply of property gas, does not generate plasma, and electronics is only released to intermediate cabin 3 from static eraser O can also whereby.
When the situation for only supplying electronics, it is not necessary to that gas ejection port G is arranged in plasma cabin 13.Only supply electronics or
Plasma P is supplied, such as may be based on suitably selecting in the measurement of potentiometer 5.
In above-mentioned embodiment, with regard to the method that the method that plasma generates is using electronic impact, but can also be by height
Frequency electric discharge is to generate plasma.
In addition, for discharging thermionic composition, the combined plate-like cathodes and filament of replacement filament can also be used
Indirect heating type cathode or hollow type cathode.
In Fig. 3 (B), Fig. 3 (C), multiple static erasers are configured in the portions different up and down of glass substrate S
The composition of position, but multiple static eraser O can also be configured in the same side up and down of glass substrate S.
For example, static eraser O can also be arranged in immediately ahead of paper up and down direction or paper in the composition of Fig. 3 (A)
Direction.In addition, can also using multiple static erasers as a unit come using.
In addition, than that described above, can have various improvement in the range of without departing from purport of the invention and/or deformation is not
Speech can be explained.
Claims (7)
1. a kind of flat panel display manufacturing device, has:
Cabin is handled, working process is bestowed to glass substrate；And
Transport path, the carrying-in/carrying-out path in cabin will be handled by being formed described in glass substrate carrying-in/carrying-out；Wherein
The processing cabin and the transport path are under vacuum environment,
In the outside wall surface for the vacuum tank for constituting the transport path, it is connected with towards described in the release of the inside of the vacuum tank
The static eraser of the electronics of the static elimination of glass substrate.
2. flat panel display manufacturing device according to claim 1, wherein
The static eraser has:
By the ionization of imported gas, the plasma cabin of plasma is generated in cabin；And institute is discharged out of same cabin
State the plasma of the static elimination of glass substrate.
3. flat panel display manufacturing device according to claim 2, wherein
The static eraser includes
To transmit the plasma transmission path of plasma to the transport path from the plasma cabin；
At in vertical severing section, the severing section of the plasma transmission path is relatively described with the transmission direction of plasma
The severing section in plasma cabin is also small.
4. flat panel display manufacturing device according to claim 3, wherein formed in the plasma transmission path
There is the magnetic field of the transmission direction along plasma.
5. flat panel display manufacturing device according to claim 3, wherein in the outer of the plasma transmission path
It is provided in week to the permanent magnet for generating sharp magnetic field in transmission path.
6. according to the flat panel display manufacturing device any in claim 3 to 5, wherein passed in the plasma
Defeated path is provided with the valve body of transmission path opening and closing.
7. according to the flat panel display manufacturing device any in claim 3 to 6, wherein in the transport path
In, supplied from the side of the glass substrate by the plasma transmission path will to the glass substrate it is equal from
Son.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-224395 | 2017-11-22 | ||
| JP2017224395A JP7209318B2 (en) | 2017-11-22 | 2017-11-22 | Flat panel display manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109817546A true CN109817546A (en) | 2019-05-28 |
Family
ID=66600242
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711372925.9A Pending CN109817546A (en) | 2017-11-22 | 2017-12-19 | Flat panel display manufacturing device |
| CN201810825295.4A Active CN109819570B (en) | 2017-11-22 | 2018-07-25 | Flat panel display manufacturing apparatus |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810825295.4A Active CN109819570B (en) | 2017-11-22 | 2018-07-25 | Flat panel display manufacturing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7209318B2 (en) |
| KR (1) | KR102089130B1 (en) |
| CN (2) | CN109817546A (en) |
| TW (2) | TW201926457A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7378700B2 (en) * | 2019-09-20 | 2023-11-14 | 日新イオン機器株式会社 | Substrate processing equipment |
| JP7332985B2 (en) * | 2020-06-09 | 2023-08-24 | 日新イオン機器株式会社 | Static eliminator and flat panel display manufacturing equipment |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3169993B2 (en) * | 1991-08-19 | 2001-05-28 | 忠弘 大見 | Electrostatic suction device |
| JPH0551749A (en) * | 1991-08-20 | 1993-03-02 | Tadahiro Omi | Vacuum treating device |
| JPH06216060A (en) * | 1993-01-12 | 1994-08-05 | Tokyo Electron Ltd | Vacuum processing method |
| JP3815580B2 (en) | 1996-03-31 | 2006-08-30 | アルプス電気株式会社 | Plasma processing equipment |
| JP2001028342A (en) * | 1999-07-15 | 2001-01-30 | Hitachi Ltd | Thin-film forming method and liquid crystalline display |
| JP4060507B2 (en) | 2000-02-07 | 2008-03-12 | 株式会社東芝 | Substrate transfer apparatus and substrate processing method |
| JP4841035B2 (en) * | 2000-11-27 | 2011-12-21 | 東京エレクトロン株式会社 | Vacuum processing equipment |
| JP2004241420A (en) | 2003-02-03 | 2004-08-26 | Toshiba Matsushita Display Technology Co Ltd | Processing system |
| TWI252507B (en) * | 2004-05-27 | 2006-04-01 | Chunghwa Picture Tubes Ltd | A vacuum process for neutralizing electrostatic charges |
| KR20060082987A (en) * | 2005-01-14 | 2006-07-20 | 엘지전자 주식회사 | Display device and method for controlling power thereof |
| KR100726665B1 (en) * | 2005-09-22 | 2007-06-12 | 엘지전자 주식회사 | Plasma Display Apparatus |
| KR20070056498A (en) * | 2005-11-30 | 2007-06-04 | 삼성전자주식회사 | Apparatus and method for fabricating flat panel display |
| KR100829748B1 (en) * | 2006-11-01 | 2008-05-15 | 삼성에스디아이 주식회사 | Gas excitation display apparatus performing reset operation |
| JP4001185B1 (en) | 2007-03-06 | 2007-10-31 | 日新イオン機器株式会社 | Plasma generator |
| JP4784599B2 (en) * | 2007-12-28 | 2011-10-05 | 東京エレクトロン株式会社 | Vacuum processing apparatus, vacuum processing method, and storage medium |
| JP5234019B2 (en) * | 2010-01-29 | 2013-07-10 | 株式会社島津製作所 | Mass spectrometer |
| CN102833933B (en) * | 2012-08-30 | 2016-08-10 | 深圳南玻显示器件科技有限公司 | Neutralizing method and Destaticizing device |
| CN202773163U (en) * | 2012-08-30 | 2013-03-06 | 深圳南玻显示器件科技有限公司 | Static electricity eliminating device |
| US8673753B1 (en) * | 2012-12-03 | 2014-03-18 | Advanced Ion Beam Technology, Inc. | Multi-energy ion implantation |
| CN104483770B (en) * | 2015-01-05 | 2019-01-22 | 合肥京东方光电科技有限公司 | Anti-static device and FPD manufacturing equipment |
-
2017
- 2017-11-22 JP JP2017224395A patent/JP7209318B2/en active Active
- 2017-12-19 TW TW106144594A patent/TW201926457A/en unknown
- 2017-12-19 CN CN201711372925.9A patent/CN109817546A/en active Pending
- 2017-12-22 KR KR1020170178153A patent/KR102089130B1/en active IP Right Grant
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2018
- 2018-07-25 CN CN201810825295.4A patent/CN109819570B/en active Active
- 2018-07-25 TW TW107125709A patent/TWI724316B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190059179A (en) | 2019-05-30 |
| JP2019096459A (en) | 2019-06-20 |
| TWI724316B (en) | 2021-04-11 |
| TW201925862A (en) | 2019-07-01 |
| KR102089130B1 (en) | 2020-03-13 |
| CN109819570B (en) | 2022-06-03 |
| JP7209318B2 (en) | 2023-01-20 |
| TW201926457A (en) | 2019-07-01 |
| CN109819570A (en) | 2019-05-28 |
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