CN109791352A - 感光性树脂组合物、导电性图案的制造方法、基板、触摸面板及显示器 - Google Patents
感光性树脂组合物、导电性图案的制造方法、基板、触摸面板及显示器 Download PDFInfo
- Publication number
- CN109791352A CN109791352A CN201780060041.1A CN201780060041A CN109791352A CN 109791352 A CN109791352 A CN 109791352A CN 201780060041 A CN201780060041 A CN 201780060041A CN 109791352 A CN109791352 A CN 109791352A
- Authority
- CN
- China
- Prior art keywords
- methyl
- substrate
- resin
- acid
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 67
- 239000000758 substrate Substances 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 239000002253 acid Substances 0.000 claims abstract description 102
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 76
- 239000002245 particle Substances 0.000 claims abstract description 71
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 56
- 239000011347 resin Substances 0.000 claims abstract description 56
- 229920005989 resin Polymers 0.000 claims abstract description 56
- 239000000126 substance Substances 0.000 claims abstract description 53
- 238000010494 dissociation reaction Methods 0.000 claims abstract description 41
- 230000005593 dissociations Effects 0.000 claims abstract description 41
- 239000003513 alkali Substances 0.000 claims abstract description 40
- 150000001722 carbon compounds Chemical class 0.000 claims abstract description 38
- 239000011248 coating agent Substances 0.000 claims description 51
- 238000000576 coating method Methods 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 43
- 229910052782 aluminium Inorganic materials 0.000 claims description 25
- 239000002738 chelating agent Substances 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 21
- 229910052719 titanium Inorganic materials 0.000 claims description 16
- 229910052726 zirconium Inorganic materials 0.000 claims description 14
- 238000011161 development Methods 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 11
- 230000036961 partial effect Effects 0.000 claims description 10
- 229920000178 Acrylic resin Polymers 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000011342 resin composition Substances 0.000 claims description 5
- 150000001336 alkenes Chemical class 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000003446 ligand Substances 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 3
- 238000007591 painting process Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 239000004695 Polyether sulfone Substances 0.000 claims description 2
- 238000003384 imaging method Methods 0.000 claims description 2
- 239000004760 aramid Substances 0.000 claims 2
- 229920003235 aromatic polyamide Polymers 0.000 claims 2
- 229920002577 polybenzoxazole Polymers 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 150000002466 imines Chemical class 0.000 claims 1
- 229910052745 lead Inorganic materials 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920006393 polyether sulfone Polymers 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- NVBFHJWHLNUMCV-UHFFFAOYSA-N sulfamide Chemical compound NS(N)(=O)=O NVBFHJWHLNUMCV-UHFFFAOYSA-N 0.000 claims 1
- 239000013522 chelant Substances 0.000 abstract description 8
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 144
- -1 (methyl) ethyl Chemical group 0.000 description 113
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 62
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 54
- 150000001875 compounds Chemical class 0.000 description 44
- 239000002585 base Substances 0.000 description 33
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 25
- 239000004411 aluminium Substances 0.000 description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 23
- 150000001721 carbon Chemical group 0.000 description 22
- 239000006185 dispersion Substances 0.000 description 21
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 21
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 20
- 229920001577 copolymer Polymers 0.000 description 19
- 238000005259 measurement Methods 0.000 description 19
- 239000000049 pigment Substances 0.000 description 19
- 239000000243 solution Substances 0.000 description 19
- 150000002148 esters Chemical class 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 18
- 239000010936 titanium Substances 0.000 description 17
- 239000000975 dye Substances 0.000 description 16
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 15
- 239000011777 magnesium Substances 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 14
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 13
- 229910052797 bismuth Inorganic materials 0.000 description 13
- 229910052749 magnesium Inorganic materials 0.000 description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 12
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 12
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 12
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 12
- 239000002270 dispersing agent Substances 0.000 description 12
- 238000003756 stirring Methods 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 11
- 230000018109 developmental process Effects 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 11
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 11
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 10
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 10
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 239000007787 solid Substances 0.000 description 10
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 9
- 125000003545 alkoxy group Chemical group 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 239000003112 inhibitor Substances 0.000 description 9
- 239000011133 lead Substances 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 9
- 239000011135 tin Substances 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 239000006229 carbon black Substances 0.000 description 8
- 235000019241 carbon black Nutrition 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 239000007983 Tris buffer Substances 0.000 description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 7
- 239000012847 fine chemical Substances 0.000 description 7
- 239000004615 ingredient Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- 239000011164 primary particle Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 229910052718 tin Inorganic materials 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 125000002887 hydroxy group Chemical class [H]O* 0.000 description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 125000000962 organic group Chemical group 0.000 description 6
- 239000004094 surface-active agent Substances 0.000 description 6
- 239000011701 zinc Substances 0.000 description 6
- ZDQWESQEGGJUCH-UHFFFAOYSA-N Diisopropyl adipate Chemical compound CC(C)OC(=O)CCCCC(=O)OC(C)C ZDQWESQEGGJUCH-UHFFFAOYSA-N 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 150000002431 hydrogen Chemical class 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 235000016768 molybdenum Nutrition 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Natural products CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 125000002252 acyl group Chemical group 0.000 description 4
- 125000005907 alkyl ester group Chemical group 0.000 description 4
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 150000003949 imides Chemical class 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- CWERGRDVMFNCDR-UHFFFAOYSA-M thioglycolate(1-) Chemical compound [O-]C(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-M 0.000 description 4
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 3
- OQOGEOLRYAOSKO-UHFFFAOYSA-N 1,1-dichloro-1-nitroethane Chemical compound CC(Cl)(Cl)[N+]([O-])=O OQOGEOLRYAOSKO-UHFFFAOYSA-N 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 3
- 238000005160 1H NMR spectroscopy Methods 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 235000003283 Pachira macrocarpa Nutrition 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 3
- 240000001085 Trapa natans Species 0.000 description 3
- 235000014364 Trapa natans Nutrition 0.000 description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 150000002118 epoxides Chemical class 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 238000002309 gasification Methods 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 208000009322 hypertrophic pyloric stenosis Diseases 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 150000003951 lactams Chemical class 0.000 description 3
- 235000014655 lactic acid Nutrition 0.000 description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 235000009165 saligot Nutrition 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
- QAEDNLDMOUKNMI-UHFFFAOYSA-O (4-hydroxyphenyl)-dimethylsulfanium Chemical compound C[S+](C)C1=CC=C(O)C=C1 QAEDNLDMOUKNMI-UHFFFAOYSA-O 0.000 description 2
- APQSQLNWAIULLK-UHFFFAOYSA-N 1,4-dimethylnaphthalene Chemical compound C1=CC=C2C(C)=CC=C(C)C2=C1 APQSQLNWAIULLK-UHFFFAOYSA-N 0.000 description 2
- FVRDHGXQGXTIGF-UHFFFAOYSA-N 1-[4-[(2-methylphenyl)methyl]phenyl]ethanone Chemical compound C1=CC(C(=O)C)=CC=C1CC1=CC=CC=C1C FVRDHGXQGXTIGF-UHFFFAOYSA-N 0.000 description 2
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 2
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 2
- OJVAMHKKJGICOG-UHFFFAOYSA-N 2,5-hexanedione Chemical compound CC(=O)CCC(C)=O OJVAMHKKJGICOG-UHFFFAOYSA-N 0.000 description 2
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 2
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 2
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 2
- NTPLXRHDUXRPNE-UHFFFAOYSA-N 4-methoxyacetophenone Chemical compound COC1=CC=C(C(C)=O)C=C1 NTPLXRHDUXRPNE-UHFFFAOYSA-N 0.000 description 2
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Natural products CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- CYRRYHPFWXNRRH-UHFFFAOYSA-N C(CCCCCCCCCCCCCCCCC)(=O)OOCCCC Chemical compound C(CCCCCCCCCCCCCCCCC)(=O)OOCCCC CYRRYHPFWXNRRH-UHFFFAOYSA-N 0.000 description 2
- VNBSQLNGVSZDCT-UHFFFAOYSA-N CC1=C(C[S+](C)C2=CC=C(C=C2)C(C2=CC=CC=C2)=O)C=CC=C1 Chemical compound CC1=C(C[S+](C)C2=CC=C(C=C2)C(C2=CC=CC=C2)=O)C=CC=C1 VNBSQLNGVSZDCT-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- ZWNZGTHTOBNSDL-UHFFFAOYSA-N N.[Ti+4] Chemical class N.[Ti+4] ZWNZGTHTOBNSDL-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229940022663 acetate Drugs 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- 150000001260 acyclic compounds Chemical class 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 239000000908 ammonium hydroxide Substances 0.000 description 2
- 150000008064 anhydrides Chemical group 0.000 description 2
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical group CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229950005953 camsilate Drugs 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 150000007942 carboxylates Chemical class 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- 229960005082 etohexadiol Drugs 0.000 description 2
- 238000005562 fading Methods 0.000 description 2
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000006232 furnace black Substances 0.000 description 2
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 2
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
- GJRQTCIYDGXPES-UHFFFAOYSA-N isobutyl acetate Chemical compound CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 2
- 238000011907 photodimerization Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 235000019795 sodium metasilicate Nutrition 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical class CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- BKQXXLVXLSREHB-UHFFFAOYSA-N (1,3-dioxobenzo[de]isoquinolin-2-yl) 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)ON(C1=O)C(=O)C2=C3C1=CC=CC3=CC=C2 BKQXXLVXLSREHB-UHFFFAOYSA-N 0.000 description 1
- LWHOMMCIJIJIGV-UHFFFAOYSA-N (1,3-dioxobenzo[de]isoquinolin-2-yl) trifluoromethanesulfonate Chemical compound C1=CC(C(N(OS(=O)(=O)C(F)(F)F)C2=O)=O)=C3C2=CC=CC3=C1 LWHOMMCIJIJIGV-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- GZVCZUMFOVHOOB-UHFFFAOYSA-N (4-methoxycyclohexyl) 2-methylprop-2-enoate Chemical compound COC1CCC(OC(=O)C(C)=C)CC1 GZVCZUMFOVHOOB-UHFFFAOYSA-N 0.000 description 1
- YKSSSKBJDZDZTD-XVNBXDOJSA-N (E)-isoeugenyl benzyl ether Chemical compound COC1=CC(\C=C\C)=CC=C1OCC1=CC=CC=C1 YKSSSKBJDZDZTD-XVNBXDOJSA-N 0.000 description 1
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- SKYXLDSRLNRAPS-UHFFFAOYSA-N 1,2,4-trifluoro-5-methoxybenzene Chemical compound COC1=CC(F)=C(F)C=C1F SKYXLDSRLNRAPS-UHFFFAOYSA-N 0.000 description 1
- VYMPLPIFKRHAAC-UHFFFAOYSA-N 1,2-ethanedithiol Chemical compound SCCS VYMPLPIFKRHAAC-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- VNQNXQYZMPJLQX-UHFFFAOYSA-N 1,3,5-tris[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CN2C(N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C(=O)N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C2=O)=O)=C1 VNQNXQYZMPJLQX-UHFFFAOYSA-N 0.000 description 1
- 239000005967 1,4-Dimethylnaphthalene Substances 0.000 description 1
- 150000004057 1,4-benzoquinones Chemical class 0.000 description 1
- MCQBNNIXDVYWGW-UHFFFAOYSA-N 1-(2,4-dimethylcyclohexyl)pyrrole-2,5-dione Chemical compound CC1CC(C)CCC1N1C(=O)C=CC1=O MCQBNNIXDVYWGW-UHFFFAOYSA-N 0.000 description 1
- LNOKVKHZEYOLIQ-UHFFFAOYSA-N 1-(2,6-diethylphenyl)pyrrole-2,5-dione Chemical compound CCC1=CC=CC(CC)=C1N1C(=O)C=CC1=O LNOKVKHZEYOLIQ-UHFFFAOYSA-N 0.000 description 1
- SSMSBSWKLKKXGG-UHFFFAOYSA-N 1-(2-chlorophenyl)-2-isopropylaminoethanol Chemical compound CC(C)NCC(O)C1=CC=CC=C1Cl SSMSBSWKLKKXGG-UHFFFAOYSA-N 0.000 description 1
- AXTADRUCVAUCRS-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrole-2,5-dione Chemical compound OCCN1C(=O)C=CC1=O AXTADRUCVAUCRS-UHFFFAOYSA-N 0.000 description 1
- YWODHBPFOGXUFX-UHFFFAOYSA-N 1-(3-hydroxyphenyl)pyrrole-2,5-dione Chemical compound OC1=CC=CC(N2C(C=CC2=O)=O)=C1 YWODHBPFOGXUFX-UHFFFAOYSA-N 0.000 description 1
- UNCUTNPWBZKJHD-UHFFFAOYSA-N 1-(3-methoxyphenyl)pyrrole-2,5-dione Chemical compound COC1=CC=CC(N2C(C=CC2=O)=O)=C1 UNCUTNPWBZKJHD-UHFFFAOYSA-N 0.000 description 1
- NHJYOIVBSCPZMO-UHFFFAOYSA-N 1-(4-hydroxybutyl)pyrrole-2,5-dione Chemical compound OCCCCN1C(=O)C=CC1=O NHJYOIVBSCPZMO-UHFFFAOYSA-N 0.000 description 1
- BLLFPKZTBLMEFG-UHFFFAOYSA-N 1-(4-hydroxyphenyl)pyrrole-2,5-dione Chemical compound C1=CC(O)=CC=C1N1C(=O)C=CC1=O BLLFPKZTBLMEFG-UHFFFAOYSA-N 0.000 description 1
- XAHCEMQKWSQGLQ-UHFFFAOYSA-N 1-(4-methoxyphenyl)pyrrole-2,5-dione Chemical compound C1=CC(OC)=CC=C1N1C(=O)C=CC1=O XAHCEMQKWSQGLQ-UHFFFAOYSA-N 0.000 description 1
- XGIKILRODBEJIL-UHFFFAOYSA-N 1-(ethylamino)ethanol Chemical compound CCNC(C)O XGIKILRODBEJIL-UHFFFAOYSA-N 0.000 description 1
- VPTHKCDQSIYZFV-UHFFFAOYSA-N 1-[2-(aminomethyl)phenyl]pyrrole-2,5-dione Chemical compound NCC1=CC=CC=C1N1C(=O)C=CC1=O VPTHKCDQSIYZFV-UHFFFAOYSA-N 0.000 description 1
- BXLDBSSCKMVRGO-UHFFFAOYSA-N 1-[3-(aminomethyl)phenyl]pyrrole-2,5-dione Chemical compound NCC1=CC=CC(N2C(C=CC2=O)=O)=C1 BXLDBSSCKMVRGO-UHFFFAOYSA-N 0.000 description 1
- JMCBZDIRMCFJLZ-UHFFFAOYSA-N 1-[4-(aminomethyl)phenyl]pyrrole-2,5-dione Chemical compound C1=CC(CN)=CC=C1N1C(=O)C=CC1=O JMCBZDIRMCFJLZ-UHFFFAOYSA-N 0.000 description 1
- MKRBAPNEJMFMHU-UHFFFAOYSA-N 1-benzylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CC1=CC=CC=C1 MKRBAPNEJMFMHU-UHFFFAOYSA-N 0.000 description 1
- QLCFJROVGLBZQE-UHFFFAOYSA-N 1-butoxyanthracene Chemical compound C1=CC=C2C=C3C(OCCCC)=CC=CC3=CC2=C1 QLCFJROVGLBZQE-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- CMCBDXRRFKYBDG-UHFFFAOYSA-N 1-dodecoxydodecane Chemical compound CCCCCCCCCCCCOCCCCCCCCCCCC CMCBDXRRFKYBDG-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- OZFIGURLAJSLIR-UHFFFAOYSA-N 1-ethenyl-2h-pyridine Chemical compound C=CN1CC=CC=C1 OZFIGURLAJSLIR-UHFFFAOYSA-N 0.000 description 1
- KZCSJWFLPQFDNW-UHFFFAOYSA-N 1-ethenylpyrrole-2,5-dione Chemical compound C=CN1C(=O)C=CC1=O KZCSJWFLPQFDNW-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- BPIUIOXAFBGMNB-UHFFFAOYSA-N 1-hexoxyhexane Chemical compound CCCCCCOCCCCCC BPIUIOXAFBGMNB-UHFFFAOYSA-N 0.000 description 1
- FBPVUBVZRPURIU-UHFFFAOYSA-N 1-hexylpyrrole-2,5-dione Chemical compound CCCCCCN1C(=O)C=CC1=O FBPVUBVZRPURIU-UHFFFAOYSA-N 0.000 description 1
- SVFBPYWZNHLAGQ-UHFFFAOYSA-N 1-isocyanatopropan-2-yl prop-2-enoate Chemical compound O=C=NCC(C)OC(=O)C=C SVFBPYWZNHLAGQ-UHFFFAOYSA-N 0.000 description 1
- JPCJFTLKASDBBA-UHFFFAOYSA-N 1-methoxypyrrole-2,5-dione Chemical compound CON1C(=O)C=CC1=O JPCJFTLKASDBBA-UHFFFAOYSA-N 0.000 description 1
- UZUCFTVAWGRMTQ-UHFFFAOYSA-N 1-methyladamantane Chemical compound C1C(C2)CC3CC2CC1(C)C3 UZUCFTVAWGRMTQ-UHFFFAOYSA-N 0.000 description 1
- CVBUKMMMRLOKQR-UHFFFAOYSA-N 1-phenylbutane-1,3-dione Chemical compound CC(=O)CC(=O)C1=CC=CC=C1 CVBUKMMMRLOKQR-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- DABFKTHTXOELJF-UHFFFAOYSA-N 1-propylpyrrole-2,5-dione Chemical compound CCCN1C(=O)C=CC1=O DABFKTHTXOELJF-UHFFFAOYSA-N 0.000 description 1
- YEKDUBMGZZTUDY-UHFFFAOYSA-N 1-tert-butylpyrrole-2,5-dione Chemical compound CC(C)(C)N1C(=O)C=CC1=O YEKDUBMGZZTUDY-UHFFFAOYSA-N 0.000 description 1
- QTKPMCIBUROOGY-UHFFFAOYSA-N 2,2,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)F QTKPMCIBUROOGY-UHFFFAOYSA-N 0.000 description 1
- XPGYKKWRLTVUTQ-UHFFFAOYSA-N 2,2,3-trihydroxypropanoic acid Chemical compound OCC(O)(O)C(O)=O XPGYKKWRLTVUTQ-UHFFFAOYSA-N 0.000 description 1
- LTMRRSWNXVJMBA-UHFFFAOYSA-L 2,2-diethylpropanedioate Chemical compound CCC(CC)(C([O-])=O)C([O-])=O LTMRRSWNXVJMBA-UHFFFAOYSA-L 0.000 description 1
- WNJSKZBEWNVKGU-UHFFFAOYSA-N 2,2-dimethoxyethylbenzene Chemical compound COC(OC)CC1=CC=CC=C1 WNJSKZBEWNVKGU-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- VTFXHGBOGGGYDO-UHFFFAOYSA-N 2,4-bis(dodecylsulfanylmethyl)-6-methylphenol Chemical compound CCCCCCCCCCCCSCC1=CC(C)=C(O)C(CSCCCCCCCCCCCC)=C1 VTFXHGBOGGGYDO-UHFFFAOYSA-N 0.000 description 1
- BOSPHQRXWAPYSU-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethanol;methyl prop-2-enoate Chemical compound COC(=O)C=C.OCCOCCO BOSPHQRXWAPYSU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- UHOPWFKONJYLCF-UHFFFAOYSA-N 2-(2-sulfanylethyl)isoindole-1,3-dione Chemical compound C1=CC=C2C(=O)N(CCS)C(=O)C2=C1 UHOPWFKONJYLCF-UHFFFAOYSA-N 0.000 description 1
- GOHZKUSWWGUUNR-UHFFFAOYSA-N 2-(4,5-dihydroimidazol-1-yl)ethanol Chemical compound OCCN1CCN=C1 GOHZKUSWWGUUNR-UHFFFAOYSA-N 0.000 description 1
- JJRUAPNVLBABCN-UHFFFAOYSA-N 2-(ethenoxymethyl)oxirane Chemical compound C=COCC1CO1 JJRUAPNVLBABCN-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- JFWFAUHHNYTWOO-UHFFFAOYSA-N 2-[(2-ethenylphenyl)methoxymethyl]oxirane Chemical compound C=CC1=CC=CC=C1COCC1OC1 JFWFAUHHNYTWOO-UHFFFAOYSA-N 0.000 description 1
- ZADXFVHUPXKZBJ-UHFFFAOYSA-N 2-[(4-ethenylphenyl)methoxymethyl]oxirane Chemical compound C1=CC(C=C)=CC=C1COCC1OC1 ZADXFVHUPXKZBJ-UHFFFAOYSA-N 0.000 description 1
- AJJLBMIIDVIQIA-UHFFFAOYSA-N 2-[1-(2-ethenylphenyl)ethoxymethyl]oxirane Chemical compound C=1C=CC=C(C=C)C=1C(C)OCC1CO1 AJJLBMIIDVIQIA-UHFFFAOYSA-N 0.000 description 1
- WZPIYCSDWSSKRZ-UHFFFAOYSA-N 2-[1-(3-ethenylphenyl)ethoxymethyl]oxirane Chemical compound C=1C=CC(C=C)=CC=1C(C)OCC1CO1 WZPIYCSDWSSKRZ-UHFFFAOYSA-N 0.000 description 1
- GBQNGHNVAOQHBN-UHFFFAOYSA-N 2-[1-(4-ethenylphenyl)ethoxymethyl]oxirane Chemical compound C=1C=C(C=C)C=CC=1C(C)OCC1CO1 GBQNGHNVAOQHBN-UHFFFAOYSA-N 0.000 description 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 1
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 1
- RZRILSWMGXWSJY-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]ethanol;sulfuric acid Chemical compound OS(O)(=O)=O.OCCN(CCO)CCO RZRILSWMGXWSJY-UHFFFAOYSA-N 0.000 description 1
- GOJUJUVQIVIZAV-UHFFFAOYSA-N 2-amino-4,6-dichloropyrimidine-5-carbaldehyde Chemical group NC1=NC(Cl)=C(C=O)C(Cl)=N1 GOJUJUVQIVIZAV-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- 125000000143 2-carboxyethyl group Chemical group [H]OC(=O)C([H])([H])C([H])([H])* 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- WGRZHLPEQDVPET-UHFFFAOYSA-N 2-methoxyethoxysilane Chemical compound COCCO[SiH3] WGRZHLPEQDVPET-UHFFFAOYSA-N 0.000 description 1
- 125000004204 2-methoxyphenyl group Chemical group [H]C1=C([H])C(*)=C(OC([H])([H])[H])C([H])=C1[H] 0.000 description 1
- 125000006179 2-methyl benzyl group Chemical group [H]C1=C([H])C(=C(C([H])=C1[H])C([H])([H])*)C([H])([H])[H] 0.000 description 1
- GAODDBNJCKQQDY-UHFFFAOYSA-N 2-methyl-4,6-bis(octylsulfanylmethyl)phenol Chemical compound CCCCCCCCSCC1=CC(C)=C(O)C(CSCCCCCCCC)=C1 GAODDBNJCKQQDY-UHFFFAOYSA-N 0.000 description 1
- TWAAEIIAGUJMJX-UHFFFAOYSA-N 2-methylprop-2-enoic acid pent-1-ene Chemical group CCCC=C.CC(=C)C(O)=O TWAAEIIAGUJMJX-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- GISWNRNUVGGVOS-UHFFFAOYSA-N 3,4-dihydroxybutan-2-yl prop-2-enoate Chemical compound OCC(O)C(C)OC(=O)C=C GISWNRNUVGGVOS-UHFFFAOYSA-N 0.000 description 1
- ASADJROTZYOPMC-UHFFFAOYSA-N 3-(2,5-dioxopyrrol-1-yl)propyl but-2-enoate Chemical compound CC=CC(=O)OCCCN1C(=O)C=CC1=O ASADJROTZYOPMC-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- MPAGVACEWQNVQO-UHFFFAOYSA-N 3-acetyloxybutyl acetate Chemical class CC(=O)OC(C)CCOC(C)=O MPAGVACEWQNVQO-UHFFFAOYSA-N 0.000 description 1
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical group CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- BDCLDNALSPBWPQ-UHFFFAOYSA-N 3-oxohexanoic acid Chemical compound CCCC(=O)CC(O)=O BDCLDNALSPBWPQ-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- LKUOJDGRNKVVFF-UHFFFAOYSA-N 4-(2,5-dioxopyrrol-1-yl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1N1C(=O)C=CC1=O LKUOJDGRNKVVFF-UHFFFAOYSA-N 0.000 description 1
- NCPQROHLJFARLL-UHFFFAOYSA-N 4-(2,5-dioxopyrrol-1-yl)butanoic acid Chemical compound OC(=O)CCCN1C(=O)C=CC1=O NCPQROHLJFARLL-UHFFFAOYSA-N 0.000 description 1
- IOSONAGXTXMCDY-UHFFFAOYSA-N 4-(benzylsulfanylmethyl)phenol Chemical compound C1=CC(O)=CC=C1CSCC1=CC=CC=C1 IOSONAGXTXMCDY-UHFFFAOYSA-N 0.000 description 1
- STCQADFDVULNEN-UHFFFAOYSA-N 4-[(2-methylphenyl)methylsulfanylmethyl]phenol Chemical compound CC1=CC=CC=C1CSCC1=CC=C(O)C=C1 STCQADFDVULNEN-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 1
- UZDMJPAQQFSMMV-UHFFFAOYSA-N 4-oxo-4-(2-prop-2-enoyloxyethoxy)butanoic acid Chemical compound OC(=O)CCC(=O)OCCOC(=O)C=C UZDMJPAQQFSMMV-UHFFFAOYSA-N 0.000 description 1
- WOJKKJKETHYEAC-UHFFFAOYSA-N 6-Maleimidocaproic acid Chemical compound OC(=O)CCCCCN1C(=O)C=CC1=O WOJKKJKETHYEAC-UHFFFAOYSA-N 0.000 description 1
- ZVVFVKJZNVSANF-UHFFFAOYSA-N 6-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]hexyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCCCCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 ZVVFVKJZNVSANF-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 description 1
- 229940076442 9,10-anthraquinone Drugs 0.000 description 1
- KTYCXBAOXVVIMM-UHFFFAOYSA-N 9,10-bis(4-methoxyphenyl)anthracene Chemical class C1=CC(OC)=CC=C1C(C1=CC=CC=C11)=C(C=CC=C2)C2=C1C1=CC=C(OC)C=C1 KTYCXBAOXVVIMM-UHFFFAOYSA-N 0.000 description 1
- KSMGAOMUPSQGTB-UHFFFAOYSA-N 9,10-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 KSMGAOMUPSQGTB-UHFFFAOYSA-N 0.000 description 1
- GJNKQJAJXSUJBO-UHFFFAOYSA-N 9,10-diethoxyanthracene Chemical compound C1=CC=C2C(OCC)=C(C=CC=C3)C3=C(OCC)C2=C1 GJNKQJAJXSUJBO-UHFFFAOYSA-N 0.000 description 1
- JWJMBKSFTTXMLL-UHFFFAOYSA-N 9,10-dimethoxyanthracene Chemical compound C1=CC=C2C(OC)=C(C=CC=C3)C3=C(OC)C2=C1 JWJMBKSFTTXMLL-UHFFFAOYSA-N 0.000 description 1
- JELGMNFSBVSQRB-UHFFFAOYSA-N 9,10-dipentoxyanthracene Chemical compound C1=CC=C2C(OCCCCC)=C(C=CC=C3)C3=C(OCCCCC)C2=C1 JELGMNFSBVSQRB-UHFFFAOYSA-N 0.000 description 1
- LBQJFQVDEJMUTF-UHFFFAOYSA-N 9,10-dipropoxyanthracene Chemical compound C1=CC=C2C(OCCC)=C(C=CC=C3)C3=C(OCCC)C2=C1 LBQJFQVDEJMUTF-UHFFFAOYSA-N 0.000 description 1
- LUBXLGUQZVKOFP-UHFFFAOYSA-N 9-phenylanthracene Chemical compound C1=CC=CC=C1C1=C(C=CC=C2)C2=CC2=CC=CC=C12 LUBXLGUQZVKOFP-UHFFFAOYSA-N 0.000 description 1
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 1
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 1
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- WKLNPIPUIVGQIY-UHFFFAOYSA-N C1=CC=CC=C1.C(=O)OCC Chemical compound C1=CC=CC=C1.C(=O)OCC WKLNPIPUIVGQIY-UHFFFAOYSA-N 0.000 description 1
- 241000202785 Calyptronoma Species 0.000 description 1
- 241000040710 Chela Species 0.000 description 1
- 229910021555 Chromium Chloride Inorganic materials 0.000 description 1
- 244000168525 Croton tiglium Species 0.000 description 1
- PQMOXTJVIYEOQL-UHFFFAOYSA-N Cumarin Natural products CC(C)=CCC1=C(O)C(C(=O)C(C)CC)=C(O)C2=C1OC(=O)C=C2CCC PQMOXTJVIYEOQL-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- GKKZMYDNDDMXSE-UHFFFAOYSA-N Ethyl 3-oxo-3-phenylpropanoate Chemical compound CCOC(=O)CC(=O)C1=CC=CC=C1 GKKZMYDNDDMXSE-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- HSRJKNPTNIJEKV-UHFFFAOYSA-N Guaifenesin Chemical compound COC1=CC=CC=C1OCC(O)CO HSRJKNPTNIJEKV-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000006237 Intermediate SAF Substances 0.000 description 1
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 1
- DJOWTWWHMWQATC-KYHIUUMWSA-N Karpoxanthin Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1(O)C(C)(C)CC(O)CC1(C)O)C=CC=C(/C)C=CC2=C(C)CC(O)CC2(C)C DJOWTWWHMWQATC-KYHIUUMWSA-N 0.000 description 1
- FSOGIJPGPZWNGO-UHFFFAOYSA-N Meomammein Natural products CCC(C)C(=O)C1=C(O)C(CC=C(C)C)=C(O)C2=C1OC(=O)C=C2CCC FSOGIJPGPZWNGO-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- DUDHRYJQHQPTER-UHFFFAOYSA-N N=NC=NN.N=NC=NN.C(COCCO)O Chemical compound N=NC=NN.N=NC=NN.C(COCCO)O DUDHRYJQHQPTER-UHFFFAOYSA-N 0.000 description 1
- KWNHLNSOMWIHJW-UHFFFAOYSA-N NC1=C(C(C(C=2C(C3=CC=CC=C3C(C1=2)=O)=O)=O)=O)N Chemical compound NC1=C(C(C(C=2C(C3=CC=CC=C3C(C1=2)=O)=O)=O)=O)N KWNHLNSOMWIHJW-UHFFFAOYSA-N 0.000 description 1
- NMJFNVPVICIXBO-UHFFFAOYSA-N OC(O)(O)C(C)(C)C(O)(O)O Chemical compound OC(O)(O)C(C)(C)C(O)(O)O NMJFNVPVICIXBO-UHFFFAOYSA-N 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 206010034960 Photophobia Diseases 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical class CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- LCKIEQZJEYYRIY-UHFFFAOYSA-N Titanium ion Chemical compound [Ti+4] LCKIEQZJEYYRIY-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- SEEVRZDUPHZSOX-WPWMEQJKSA-N [(e)-1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(\C)=N\OC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-WPWMEQJKSA-N 0.000 description 1
- HVUMOYIDDBPOLL-IIZJTUPISA-N [2-[(2r,3s,4r)-3,4-dihydroxyoxolan-2-yl]-2-hydroxyethyl] octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)[C@H]1OC[C@@H](O)[C@@H]1O HVUMOYIDDBPOLL-IIZJTUPISA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- FUECIDVNGAUMGJ-UHFFFAOYSA-N acetic acid;2-(2-butoxyethoxy)ethanol Chemical class CC(O)=O.CCCCOCCOCCO FUECIDVNGAUMGJ-UHFFFAOYSA-N 0.000 description 1
- GTYLEVMOSBBKCQ-UHFFFAOYSA-N acetic acid;2-(2-ethoxyethoxy)ethanol Chemical class CC(O)=O.CCOCCOCCO GTYLEVMOSBBKCQ-UHFFFAOYSA-N 0.000 description 1
- JIMPAYYJPMENLQ-UHFFFAOYSA-N acetic acid;2-(2-methoxypropoxy)propan-1-ol Chemical class CC(O)=O.COC(C)COC(C)CO JIMPAYYJPMENLQ-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004520 agglutination Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- MQQXUGFEQSCYIA-OAWHIZORSA-M aluminum;(z)-4-ethoxy-4-oxobut-2-en-2-olate;propan-2-olate Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CCOC(=O)\C=C(\C)[O-] MQQXUGFEQSCYIA-OAWHIZORSA-M 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- BTBJBAZGXNKLQC-UHFFFAOYSA-N ammonium lauryl sulfate Chemical compound [NH4+].CCCCCCCCCCCCOS([O-])(=O)=O BTBJBAZGXNKLQC-UHFFFAOYSA-N 0.000 description 1
- 229940063953 ammonium lauryl sulfate Drugs 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 150000008365 aromatic ketones Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- DXOGIYKUUNHDSH-UHFFFAOYSA-N benzoic acid;2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCC(CO)(CO)CO.OC(=O)C1=CC=CC=C1 DXOGIYKUUNHDSH-UHFFFAOYSA-N 0.000 description 1
- CHIHQLCVLOXUJW-UHFFFAOYSA-N benzoic anhydride Chemical compound C=1C=CC=CC=1C(=O)OC(=O)C1=CC=CC=C1 CHIHQLCVLOXUJW-UHFFFAOYSA-N 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 229940007550 benzyl acetate Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- VEZXCJBBBCKRPI-UHFFFAOYSA-N beta-propiolactone Chemical compound O=C1CCO1 VEZXCJBBBCKRPI-UHFFFAOYSA-N 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- RFVHVYKVRGKLNK-UHFFFAOYSA-N bis(4-methoxyphenyl)methanone Chemical class C1=CC(OC)=CC=C1C(=O)C1=CC=C(OC)C=C1 RFVHVYKVRGKLNK-UHFFFAOYSA-N 0.000 description 1
- NNFNMTHLSPQNHF-UHFFFAOYSA-N bismuth;2-ethylhexanoic acid Chemical compound [Bi].CCCCC(CC)C(O)=O NNFNMTHLSPQNHF-UHFFFAOYSA-N 0.000 description 1
- 239000001055 blue pigment Substances 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- MQINVZZGCCLXKG-UHFFFAOYSA-N but-1-ene;2-methylprop-2-enoic acid Chemical group CCC=C.CC(=C)C(O)=O MQINVZZGCCLXKG-UHFFFAOYSA-N 0.000 description 1
- RJUIDDKTATZJFE-UHFFFAOYSA-N but-2-enoyl chloride Chemical compound CC=CC(Cl)=O RJUIDDKTATZJFE-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- KQBTUOVABZLXGP-UHFFFAOYSA-N butane-1,4-diol;ethane-1,2-diol Chemical compound OCCO.OCCCCO KQBTUOVABZLXGP-UHFFFAOYSA-N 0.000 description 1
- DDPAAMHROJBRGE-UHFFFAOYSA-N butane-1,4-diol;propane-1,2-diol Chemical compound CC(O)CO.OCCCCO DDPAAMHROJBRGE-UHFFFAOYSA-N 0.000 description 1
- CKAAOCRYHRAMEC-UHFFFAOYSA-N butanoic acid;propane-1,2-diol Chemical class CC(O)CO.CCCC(O)=O CKAAOCRYHRAMEC-UHFFFAOYSA-N 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000019282 butylated hydroxyanisole Nutrition 0.000 description 1
- OOCILPYOPQKPJY-UHFFFAOYSA-N calcium;(3,5-ditert-butyl-4-hydroxyphenyl)methyl-ethoxyphosphinic acid Chemical compound [Ca].CCOP(O)(=O)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 OOCILPYOPQKPJY-UHFFFAOYSA-N 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 description 1
- XEHUIDSUOAGHBW-UHFFFAOYSA-N chromium;pentane-2,4-dione Chemical compound [Cr].CC(=O)CC(C)=O.CC(=O)CC(C)=O.CC(=O)CC(C)=O XEHUIDSUOAGHBW-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 150000004775 coumarins Chemical class 0.000 description 1
- CVSVTCORWBXHQV-UHFFFAOYSA-N creatine Chemical compound NC(=[NH2+])N(C)CC([O-])=O CVSVTCORWBXHQV-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical compound [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- JVGAAIQCXGCLJH-UHFFFAOYSA-N cyclopropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CC1 JVGAAIQCXGCLJH-UHFFFAOYSA-N 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- NZZIMKJIVMHWJC-UHFFFAOYSA-N dibenzoylmethane Chemical compound C=1C=CC=CC=1C(=O)CC(=O)C1=CC=CC=C1 NZZIMKJIVMHWJC-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229940043237 diethanolamine Drugs 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- UZBQIPPOMKBLAS-UHFFFAOYSA-N diethylazanide Chemical compound CC[N-]CC UZBQIPPOMKBLAS-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- UYAAVKFHBMJOJZ-UHFFFAOYSA-N diimidazo[1,3-b:1',3'-e]pyrazine-5,10-dione Chemical compound O=C1C2=CN=CN2C(=O)C2=CN=CN12 UYAAVKFHBMJOJZ-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- PPSZHCXTGRHULJ-UHFFFAOYSA-N dioxazine Chemical compound O1ON=CC=C1 PPSZHCXTGRHULJ-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- LMWPZRGDGZOPLT-UHFFFAOYSA-N ethane-1,1,2-trithiol Chemical compound SCC(S)S LMWPZRGDGZOPLT-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N ethyl butyrate Chemical compound CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 150000002220 fluorenes Chemical class 0.000 description 1
- 235000011194 food seasoning agent Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000005456 glyceride group Chemical group 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 235000013773 glyceryl triacetate Nutrition 0.000 description 1
- 239000001087 glyceryl triacetate Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- GMZRIJPNNCCDRL-UHFFFAOYSA-N hex-1-ene 2-methylprop-2-enoic acid Chemical group CCCCC=C.CC(=C)C(O)=O GMZRIJPNNCCDRL-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 235000019239 indanthrene blue RS Nutrition 0.000 description 1
- UHOKSCJSTAHBSO-UHFFFAOYSA-N indanthrone blue Chemical compound C1=CC=C2C(=O)C3=CC=C4NC5=C6C(=O)C7=CC=CC=C7C(=O)C6=CC=C5NC4=C3C(=O)C2=C1 UHOKSCJSTAHBSO-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000000797 iron chelating agent Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 1
- GWVMLCQWXVFZCN-UHFFFAOYSA-N isoindoline Chemical compound C1=CC=C2CNCC2=C1 GWVMLCQWXVFZCN-UHFFFAOYSA-N 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-M isovalerate Chemical compound CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000000816 matrix-assisted laser desorption--ionisation Methods 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- LLAZQXZGAVBLRX-UHFFFAOYSA-N methyl 2,5-dioxopyrrole-1-carboxylate Chemical compound COC(=O)N1C(=O)C=CC1=O LLAZQXZGAVBLRX-UHFFFAOYSA-N 0.000 description 1
- 229940095102 methyl benzoate Drugs 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- MHNNAWXXUZQSNM-UHFFFAOYSA-N methylethylethylene Natural products CCC(C)=C MHNNAWXXUZQSNM-UHFFFAOYSA-N 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- AUCNMQYOQYTGPE-UHFFFAOYSA-N n-(hydroxymethyl)-n-methylprop-2-enamide Chemical compound OCN(C)C(=O)C=C AUCNMQYOQYTGPE-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical class CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- ONLRKTIYOMZEJM-UHFFFAOYSA-N n-methylmethanamine oxide Chemical compound C[NH+](C)[O-] ONLRKTIYOMZEJM-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- JMXROTHPANUTOJ-UHFFFAOYSA-H naphthol green b Chemical compound [Na+].[Na+].[Na+].[Fe+3].C1=C(S([O-])(=O)=O)C=CC2=C(N=O)C([O-])=CC=C21.C1=C(S([O-])(=O)=O)C=CC2=C(N=O)C([O-])=CC=C21.C1=C(S([O-])(=O)=O)C=CC2=C(N=O)C([O-])=CC=C21 JMXROTHPANUTOJ-UHFFFAOYSA-H 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- BKIMMITUMNQMOS-UHFFFAOYSA-N normal nonane Natural products CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- UPHWVVKYDQHTCF-UHFFFAOYSA-N octadecylazanium;acetate Chemical class CC(O)=O.CCCCCCCCCCCCCCCCCCN UPHWVVKYDQHTCF-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 125000005474 octanoate group Chemical group 0.000 description 1
- MBAUOPQYSQVYJV-UHFFFAOYSA-N octyl 3-[4-hydroxy-3,5-di(propan-2-yl)phenyl]propanoate Chemical compound OC1=C(C=C(C=C1C(C)C)CCC(=O)OCCCCCCCC)C(C)C MBAUOPQYSQVYJV-UHFFFAOYSA-N 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003017 phosphorus Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- YOSXAXYCARLZTR-UHFFFAOYSA-N prop-2-enoyl isocyanate Chemical compound C=CC(=O)N=C=O YOSXAXYCARLZTR-UHFFFAOYSA-N 0.000 description 1
- ARJOQCYCJMAIFR-UHFFFAOYSA-N prop-2-enoyl prop-2-enoate Chemical compound C=CC(=O)OC(=O)C=C ARJOQCYCJMAIFR-UHFFFAOYSA-N 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- ZJLMKPKYJBQJNH-UHFFFAOYSA-N propane-1,3-dithiol Chemical compound SCCCS ZJLMKPKYJBQJNH-UHFFFAOYSA-N 0.000 description 1
- 229960000380 propiolactone Drugs 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 229940116423 propylene glycol diacetate Drugs 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- IZMJMCDDWKSTTK-UHFFFAOYSA-N quinoline yellow Chemical compound C1=CC=CC2=NC(C3C(C4=CC=CC=C4C3=O)=O)=CC=C21 IZMJMCDDWKSTTK-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000001054 red pigment Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000015424 sodium Nutrition 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 239000004250 tert-Butylhydroquinone Substances 0.000 description 1
- 235000019281 tert-butylhydroquinone Nutrition 0.000 description 1
- 125000005931 tert-butyloxycarbonyl group Chemical group [H]C([H])([H])C(OC(*)=O)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 239000006234 thermal black Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- HNKJADCVZUBCPG-UHFFFAOYSA-N thioanisole Chemical compound CSC1=CC=CC=C1 HNKJADCVZUBCPG-UHFFFAOYSA-N 0.000 description 1
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 229950004288 tosilate Drugs 0.000 description 1
- 229960002622 triacetin Drugs 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical compound CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 1
- XJMULQBEYKPFGJ-UHFFFAOYSA-N trimethyl-[2-[10-(2-trimethylsilylethynyl)anthracen-9-yl]ethynyl]silane Chemical class C1=CC=C2C(C#C[Si](C)(C)C)=C(C=CC=C3)C3=C(C#C[Si](C)(C)C)C2=C1 XJMULQBEYKPFGJ-UHFFFAOYSA-N 0.000 description 1
- SLGBZMMZGDRARJ-UHFFFAOYSA-N triphenylene Chemical compound C1=CC=C2C3=CC=CC=C3C3=CC=CC=C3C2=C1 SLGBZMMZGDRARJ-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical class C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- YEIGUXGHHKAURB-UHFFFAOYSA-N viridine Natural products O=C1C2=C3CCC(=O)C3=CC=C2C2(C)C(O)C(OC)C(=O)C3=COC1=C23 YEIGUXGHHKAURB-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
- G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0036—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
Abstract
本发明的目的在于提供能够同时实现微细图案的分辨率和基板上的残渣抑制的感光性树脂组合物。提供含有通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)、具有酸解离性基团的碱溶性树脂(B)以及金属螯合物的感光性树脂组合物。
Description
技术领域
本发明涉及感光性树脂组合物、导电性图案的制造方法、基板、触摸面板及显示器。
背景技术
近年来,伴随着显示器的高精细化、电子部件的小型化或高密度化等,对电子布线的微细化的要求逐渐提高。作为使用含有导电性粒子的树脂组合物来制作电子布线中使用的导电性图案的方法,通常为在基板上形成图案后进行加热、由此使导电性粒子相接触而得到导电性图案的方法。作为在基板上形成图案的方法,例如,可举出丝网印刷法、喷墨法或光刻法。它们中,认为丝网印刷法、喷墨法不适于形成微细图案,而光刻法适于微细图案的形成。
光刻法中,在感光性组合物的涂布及干燥后,隔着描绘有微细布线图案的形状的光掩模照射紫外线等,由此在涂膜上形成曝光部及未曝光部。接着,利用显影液对其进行显影,由此在基板上形成微细图案。进而,通过之后的导电化处理,从而形成微细的导电性图案。该方法中使用的感光性组合物由导电性粒子、感光剂及树脂等构成(专利文献1~4)。
进而,为了形成5μm以下的超微细图案,需要使用具有更微小粒径的粒子作为导电性粒子、以及需要抑制凝集粒子的产生。此时,就前者而言,从图案的表面平滑性及侧面直线性的观点考虑,针对要求的布线宽度,必须使用粒径充分小的微粒。就后者而言,为了获得导电性粒子的分散稳定性,必须使用粒子表面经被覆的粒子。此处,作为使用了粒径充分小且进行了表面被覆的微粒的感光性树脂组合物,已知使用了通过碳单质及/或碳化合物进行了表面被覆的银微粒(专利文献5~6)的感光性树脂组合物。
现有技术文献
专利文献
专利文献1:日本特开2000-199954号公报
专利文献2:日本特开2014-142587号公报
专利文献3:日本特开2002-82428号公报
专利文献4:日本特开2013-101861号公报
专利文献5:日本特开2013-196997号公报
专利文献6:WO2016/158864
发明内容
发明要解决的课题
然而,在使用了通过碳单质及/或碳化合物进行了表面被覆的银微粒的感光性树脂组合物中,在形成图案时容易在基板上、尤其是包含有机成分的膜上产生残渣。因此,将该感光性树脂组合物形成图案而得到的物质存在外观不良或可靠性降低等问题。
本发明是鉴于上述现有技术的缺点而作出的,其目的在于提供一种感光性树脂组合物,其即使在包含有机成分的膜上,也能够同时实现微细图案的分辨率和基板上的残渣抑制。通过使用这样的感光性树脂组合物,能够得到外观极为良好且可靠性高的微细的导电性图案。
用于解决课题的手段
本申请的发明人进行了深入研究,结果发现,含有通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)、具有酸解离性基团的碱溶性树脂(B)以及金属螯合性化合物(C)的感光性树脂组合物对于解决上述课题极其有效。
即,本发明提供含有通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)、具有酸解离性基团的碱溶性树脂(B)以及金属螯合性化合物(C)的感光性树脂组合物。
发明的效果
根据本发明的感光性树脂组合物,能够得到外观良好且可靠性高的微细的导电图案。
具体实施方式
本发明的感光性树脂组合物的特征在于含有通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)、具有酸解离性基团的碱溶性树脂(B)以及金属螯合性化合物(C)。需要说明的是,该感光性树脂组合物的感光性可以为正型感光性也可以为负型感光性,优选为负型感光性。
(通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A))
就通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)而言,通过将表面被覆的层(以下记为“表面被覆层”)的存在,从而能够抑制低温时的导电性粒子彼此的融合。
作为通过碳单质及/或碳化合物将粒子表面被覆的方法,例如,可举出在利用热等离子体法制作导电性粒子时使其与反应性气体接触的方法(日本特开2007-138287号公报)。优选导电性粒子的表面被完全地被覆,但只要能够实现本发明的目的,允许存在一部分被覆不完全的粒子。
作为通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A),例如可举出金(Au)、银(Ag)、铜(Cu)、镍(Ni)、锡(Sn)、铋(Bi)、铅(Pb)、锌(Zn)、钯(Pd)、铂(Pt)、铝(Al)、钨(W)或钼(Mo)等金属微粒。其中,优选为含有选自由金、银、铜、镍、锡、铋、铅、锌、钯、铂、铝及碳组成的组中的至少一种元素的金属微粒,更优选为银的金属微粒。
为了形成具有期望的导电性的微细导电图案,通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)的一次粒径优选为1~700nm。此处,所谓通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)的一次粒径,可以根据使用扫描电子显微镜随机选择的100个一次粒子的粒径的平均值算出。对于各一次粒子的粒径而言,可以测定一次粒子的长径和短径,由其平均值算出。通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)的一次粒径优选为10~200nm,更优选为10~60nm。
表面被覆层的平均厚度优选为0.1~10nm。在该范围内时,抑制导电性微细粒子彼此的融合,由此能够提高微细图案加工性,并且通过于300℃以下的温度进行热处理,从而能够呈现出期望的导电性。
就表面被覆层的平均厚度而言,利用热天平测定通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)的质量减少,假定该值全部来自碳的燃烧,以碳的密度为2.0,根据粒径可算出表面被覆层的平均厚度。设为在粒径(Dp)已知的导电性粒子上以平均厚度A(μm)被覆碳。将经碳被覆的粒子的个数设为n。将热天平测定中最初称取的质量设为W1(g)、将碳完全飞散后的质量设为W2(g)、将导电性粒子的密度设为ρ时,若已知Dp和W2,则可根据下式算出n。
W2=π/6×Dp3ρ×n
进而,可根据下式算出表面被覆层的平均厚度A。
W1-W2={4/3×π(Dp/2+A)3-π/6×Dp3}×2.0×n
作为感光性树脂组合物中的通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)的含量,优选为65~95质量%,更优选为70~95质量%,进一步优选为70~90质量%。通过在该范围内含有导电性粒子(A),能够同时实现图案加工性和导电性的呈现。此处,所谓全部固态成分,是指感光性树脂组合物所含有的成分中除去溶剂之外的全部成分。
就通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)在全部固态成分中所占的比例而言,可以通过对感光性树脂组合物的全部成分进行定量分析而算出。需要说明的是,后述各成分的比例也可利用同样的方法算出。
感光性树脂组合物的全部成分分析方法如下所述。
(i)用有机溶剂稀释感光性树脂组合物,进行1H-NMR测定、GC测定及GC/MS测定,调查其大概情况。
(ii)将感光性树脂组合物用有机溶剂萃取后进行离心分离,分离可溶成分和不溶成分。
(iii)针对上述不溶成分,用高极性有机溶剂萃取后进行离心分离,进一步分离可溶成分和不溶成分。
(iv)针对由上述(ii)及(iii)得到的可溶成分的混合液,进行IR测定、1H-NMR测定及GC/MS测定。进而,对上述混合液进行GPC分级。针对得到的分级物进行IR测定及1H-NMR测定。另外,针对该分级物,根据需要进行GC测定、GC/MS测定、热分解GC/MS测定及MALDI/MS测定。
(v)针对由上述(iii)得到的不溶成分,进行IR测定或TOF-SIMS测定。确认到存在有机物时,进行热分解GC/MS或TPD/MS测定。
(vi)通过对上述(i)、(iv)及(v)的测定结果进行综合判断,从而可求出感光性树脂组合物所含有的各成分的含有率。需要说明的是,作为上述(iii)中使用的高极性有机溶剂,优选氯仿或甲醇等。
(具有酸解离性基团的碱溶性树脂(B))
通过在碱溶性树脂中含有酸解离性基团,从而在形成图案后的热处理中,酸解离性基团脱离分解、气化,图案收缩。由此,能够促进通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)彼此的接触,提高导电性,同时形成微细的图案。
具有酸解离性基团的碱溶性树脂(B)通常可以通过使含有羧基的化合物与具有酸解离性基团的化合物及其他单体进行共聚而得到。具有酸解离性基团的碱溶性树脂(B)优选为(甲基)丙烯酸系共聚物。此处,(甲基)丙烯酸系共聚物是指在共聚成分中至少含有(甲基)丙烯酸系单体的共聚物。此处,作为(甲基)丙烯酸系单体,例如可举出(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸异丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸仲丁酯、(甲基)丙烯酸异丁酯、(甲基)丙烯酸叔丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸烯丙基酯、(甲基)丙烯酸苄基酯、(甲基)丙烯酸丁氧基乙酯、丁氧基三乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸环己基酯、(甲基)丙烯酸二环戊基酯、(甲基)丙烯酸二环戊烯基酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸甘油酯、(甲基)丙烯酸缩水甘油酯、(甲基)丙烯酸十七氟癸基酯、(甲基)丙烯酸2-羟基乙基酯、(甲基)丙烯酸异冰片酯、(甲基)丙烯酸2-羟基丙基酯、(甲基)丙烯酸异癸基酯、(甲基)丙烯酸异辛基酯、(甲基)丙烯酸月桂基酯、(甲基)丙烯酸2-甲氧基乙基酯、甲氧基乙二醇(甲基)丙烯酸酯、甲氧基二乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸八氟戊基酯、(甲基)丙烯酸苯氧基乙基酯、(甲基)丙烯酸硬脂基酯、(甲基)丙烯酸三氟乙基酯、(甲基)丙烯酰胺、(甲基)丙烯酸氨基乙基酯、(甲基)丙烯酸苯基酯、(甲基)丙烯酸1-萘基酯、(甲基)丙烯酸2-萘基酯、(甲基)丙烯酸苯硫酚酯或(甲基)丙烯酸苄硫醇酯。
作为(甲基)丙烯酸系单体以外的共聚成分,可使用具有碳-碳双键的化合物。作为这样的化合物,例如可举出苯乙烯、对甲基苯乙烯、邻甲基苯乙烯、间甲基苯乙烯或α-甲基苯乙烯等芳香族乙烯基化合物、(甲基)丙烯酰胺、N-羟甲基(甲基)丙烯酰胺或N-乙烯基吡咯烷酮等酰胺系不饱和化合物、(甲基)丙烯腈、烯丙醇、乙酸乙烯酯、环己基乙烯基醚、正丙基乙烯基醚、异丙基乙烯基醚、正丁基乙烯基醚、异丁基乙烯基醚、2-羟基乙基乙烯基醚或4-羟基丁基乙烯基醚。
作为含有羧基的化合物(其为对具有酸解离性基团的碱溶性树脂(B)赋予碱溶性的共聚成分),例如可举出(甲基)丙烯酸、衣康酸、巴豆酸、马来酸或富马酸或它们的酸酐。
使用(甲基)丙烯酸系共聚物时,为了增加感光性树脂组合物的由曝光带来的固化反应的速度,优选在侧链或分子末端具有碳-碳双键的(甲基)丙烯酸系共聚物。作为具有碳-碳双键的官能团,例如可举出乙烯基、烯丙基或(甲基)丙烯酸系基团。为了使这样的官能团加成至(甲基)丙烯酸系共聚物上,有下述方法:使具有缩水甘油基(或异氰酸酯基)和碳-碳双键的化合物或者(甲基)丙烯酰氯或烯丙基氯、与(甲基)丙烯酸系共聚物中的巯基、氨基、羟基或羧基进行加成反应。
作为具有缩水甘油基和碳-碳双键的化合物,例如,可举出(甲基)丙烯酸缩水甘油酯、烯丙基缩水甘油醚或丙烯酸缩水甘油基乙基酯、巴豆基缩水甘油醚、巴豆酸缩水甘油酯或异巴豆酸缩水甘油酯。作为具有异氰酸酯基和碳-碳双键的化合物,例如,可举出(甲基)丙烯酰基异氰酸酯或(甲基)丙烯酰氧基乙基异氰酸酯。
作为具有酸解离性基团的化合物,可举出具有酸解离性基团的(甲基)丙烯酸酯。
为了使酸解离性基团在脱离后分解、气化,酸解离性基团优选为碳原子数4~15的有机基团,更优选为碳原子数6~15的有机基团。酸解离性基团的碳原子数小于4时,脱离后于低温发生气化,因此存在下述情况:在膜中产生大的气泡,妨碍通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)彼此的接触,导电性变差。另一方面,酸解离性基团的碳原子数超过15时,存在下述情况:脱离后,解离性基团残留在膜中,妨碍通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)彼此的接触,导电性仍然变差。需要说明的是,酸解离性基团为碳原子数6~15的有机基团时,即使在膜中产生气泡也容易通过后烘烤使其消失,能够形成导电性良好的导电性图案。
作为酸解离性基团,例如可举出叔丁基、叔丁氧基羰基、苄基、甲基金刚烷基或四氢吡喃基。
作为具有酸解离性基团的(甲基)丙烯酸酯,例如可举出(甲基)丙烯酸1-甲基金刚烷基酯、(甲基)丙烯酸叔丁酯、(甲基)丙烯酸苄基酯或(甲基)丙烯酸四氢吡喃基酯。
本发明的感光性树脂组合物中,在考虑感光性呈现的情况下,具有酸解离性基团的碱溶性树脂(B)的含量相对于全部固态成分而言优选在5~30质量%的范围内。
具有酸解离性基团的碱溶性树脂(B)优选为自由基共聚有20~80摩尔%的具有酸解离性基团的化合物的碱溶性树脂。尤其优选在碱溶性树脂中含有20~80摩尔%的具有酸解离性基团的(甲基)丙烯酸酯作为单体成分。通过使用具有酸解离性基团的碱溶性树脂(B),酸解离性基团容易在空气下、于100~300℃发生热氧化分解及脱离,膜大幅收缩,从而能够使全部固态成分中的通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)浓度容易地上升。而且,作为其结果,易于得到比电阻为10~1,000μΩ·cm的期望的导电性。此时并用后述的热产酸剂及/或光产酸剂的话,其效果更加显著。
具有酸解离性基团的碱溶性树脂(B)的羧酸当量优选为200~1,400g/mol,更优选为400~1,000g/mol。丙烯酸树脂的羧酸当量可通过测定酸值而算出。另外,为了能够以高的水平同时实现硬度和耐裂纹性,具有酸解离性基团的碱溶性树脂(B)的双键当量优选为150~10,000g/mol。丙烯酸树脂的双键当量可以通过测定碘值而算出。
就具有酸解离性基团的碱溶性树脂(B)的重均分子量(Mw)而言,通过凝胶渗透色谱法(GPC)测定并以聚苯乙烯换算计优选为1,000~100,000。通过使重均分子量(Mw)为上述范围,可获得良好的涂布特性,形成图案时在显影液中的溶解性也良好。
(金属螯合性化合物(C))
金属螯合性化合物(C)是具有中心金属、和在两个以上的部位与该中心金属配位的配体的化合物,配体容易脱离,能够与碱溶性官能团形成络合物。通过与碱溶性树脂形成络合物,能够控制树脂成分的显影性,抑制图案剥落的效果变得显著。
作为金属螯合性化合物(C)的金属元素,例如,可举出Au(金)、Ag(银)、Cu(铜)、Cr(铬)、Fe(铁)、Co(钴)、Ni(镍)、Bi(铋)、Sn(锡)、Pb(铅)、Zn(锌)、Pd(钯)、In(铟)、Pt(铂)、Mg(镁)、Al(铝)、Ti(钛)、Zr(锆)、W(钨)、Mo(钼)。从配体的易脱离性的观点考虑,优选Mg(镁)、Al(铝)、Ti(钛)、Zr(锆)、Bi(铋),从与碱溶性官能团的络合物稳定性的观点考虑,更优选Al(铝)、Zr(锆)、Bi(铋)。金属螯合性化合物(C)可通过使螯合剂与金属醇盐反应而容易地得到。作为螯合剂,例如,可举出乙酰丙酮、苯甲酰丙酮或二苯甲酰甲烷等β-二酮或者乙酰乙酸乙酯或苯甲酰乙酸乙酯等β-酮酯。
作为金属螯合性化合物(C),例如可举出:双(乙酰丙酮根)合镁、双(乙基乙酰乙酸根)合镁、异丙氧基单(乙酰丙酮根)合镁或异丙氧基单(乙基乙酰乙酸根)合镁等镁螯合物;乙酰乙酸乙基铝二异丙酯、三(乙基乙酰乙酸根)合铝、乙酰乙酸烷基酯二异丙基铝酸酯、单乙酰丙酮根双(乙基乙酰乙酸根)合铝、三(乙酰丙酮根)合铝等铝螯合物;四(乙酰丙酮根)合钛、二异丙氧基双(乙基乙酰乙酸根)合钛、二异丙氧基双(乙酰丙酮根)合钛、二正辛氧基双(辛二醇根)合钛、二异丙氧基双(三乙醇胺根)合钛、二羟基双(2-羟基丙酸根)合钛或二羟基双(2-羟基丙酸根)钛铵盐等钛螯合物;四(乙酰丙酮根)合锆、二丁氧基双(乙基乙酰乙酸根)合锆、三丁氧基单(乙酰丙酮根)锆、三丁氧基单硬脂酸锆等锆螯合物;双(乙酰丙酮根)合金或双(乙基乙酰乙酸根)合金等金螯合物;双(乙酰丙酮根)合银或双(乙基乙酰乙酸根)合银等银螯合物;双(乙酰丙酮根)合铜或双(乙基乙酰乙酸根)合铜等铜螯合物;双(乙酰丙酮根)合铬或双(乙基乙酰乙酸根)合铬等铬螯合物;双(乙酰丙酮根)合铁或双(乙基乙酰乙酸根)合铁等铁螯合物;(乙酰丙酮根)合钴或双(乙基乙酰乙酸根)合钴等钴螯合物;双(乙酰丙酮根)合镍或双(乙基乙酰乙酸根)合镍等镍螯合物;双(乙酰丙酮根)合铋或双(乙基乙酰乙酸根)合铋等铋螯合物;双(乙酰丙酮根)合锡或双(乙基乙酰乙酸根)合锡等锡螯合物;双(乙酰丙酮根)合铅或双(乙基乙酰乙酸根)合铅等铅螯合物;双(乙酰丙酮根)合锌或双(乙基乙酰乙酸根)合锌等锌螯合物;双(乙酰丙酮根)合钯或双(乙基乙酰乙酸根)合钯等钯螯合物;双(乙酰丙酮根)合铟或双(乙基乙酰乙酸根)合铟等铟螯合物;双(乙酰丙酮根)合铂或双(乙基乙酰乙酸根)合铂等铂螯合物;双(乙酰丙酮根)合钨或双(乙基乙酰乙酸根)合钨等钨螯合物;双(乙酰丙酮根)合钼或双(乙基乙酰乙酸根)合钼等钼螯合物。
作为金属螯合性化合物(C),例如,可举出通式(1)表示的化合物。
[化学式1]
(M表示镁、铝、钛、锆或铋,R1表示氢、碳原子数1~10的烷基、碳原子数4~10的环烷基或碳原子数6~15的芳基,R2及R3各自独立地表示氢、碳原子数1~20的烷基、碳原子数4~10的环烷基、碳原子数6~15的芳基、碳原子数1~6的烷氧基或羟基,n及m表示0~4的整数,n+m=2~4。)
R1优选为氢、碳原子数1~6的烷基、碳原子数4~7的环烷基或碳原子数6~10的芳基,R2及R3各自独立地优选为氢、碳原子数1~18的烷基、碳原子数4~7的环烷基、碳原子数6~10的芳基、碳原子数1~4的烷氧基或羟基。上述的烷基、环烷基、芳基及烷氧基可以为未取代体或取代体中的任意。M优选为铝、锆或铋。
作为通式(1)表示的化合物,例如,可举出双(乙酰丙酮根)合镁、双(乙基乙酰乙酸根)合镁、异丙氧基单(乙酰丙酮根)合镁或异丙氧基单(乙基乙酰乙酸根)合镁等镁螯合物、乙酰乙酸乙基铝二异丙酯、三(乙基乙酰乙酸根)合铝、乙酰乙酸烷基酯铝二异丙酯、单(乙酰丙酮根)双(乙基乙酰乙酸根)合铝、三(乙酰丙酮根)合铝等铝螯合物、四(乙酰丙酮根)合钛、二异丙氧基双(乙基乙酰乙酸根)合钛、二异丙氧基双(乙酰丙酮根)合钛、二正辛氧基双(辛二醇根)钛、二异丙氧基双(三乙醇胺根)钛、二羟基双(2-羟基丙酸根)钛或二羟基双(2-羟基丙酸根)钛铵盐等钛螯合物、四(乙酰丙酮根)合锆、二丁氧基双(乙基乙酰乙酸根)合锆、三丁氧基单(乙酰丙酮根)合锆、三丁氧基单硬脂酸锆等锆螯合物、双(乙酰丙酮根)合铋或双(乙基乙酰乙酸根)合铋等铋螯合物。
金属螯合性化合物(C)在全部固态成分中所占的比例优选为0.01~10质量%,更优选为0.05~5质量%,进一步优选为0.1~5质量%。金属螯合性化合物(C)含量为0.01质量%以上时,基板上的残渣抑制的效果进一步显著。另一方面,金属螯合性化合物(C)的含量为10质量%以下时,导电性高,并且能够形成微细的图案。
(分散剂)
本发明的感光性树脂组合物可以含有分散剂。通过含有分散剂,能够使通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)稳定地存在于感光性树脂组合物中。
作为分散剂,优选胺系分散剂。作为市售的胺系分散剂,例如,可举出DISPERBYK(注册商标)106、108、112、116、142、145、166、180、2001、2008、2022、2150、6919或21116(以上均为BYK-Chemie Japan制)或Efka(注册商标)4300、4400、4401、4403、4406、4510、4570、4800、5054、5055或5207(以上均为BASF制)。
为了进一步提高分散性,分散剂优选具有丙烯酸系嵌段共聚物结构。作为具有丙烯酸系嵌段共聚物结构的市售的胺系分散剂,例如,可举出DISPERBYK(注册商标)2001、2008、2022、2150、6919或21116或Efka(注册商标)4300。
作为感光性树脂组合物中的分散剂的含量,相对于通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)与后述其他粒子的合计100质量份,优选为1~7质量份。通过使分散剂的含量在该范围内,通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)的分散良好,能够实现更微细的图案加工,通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)的接触及融合得以进行,能够得到更高的导电性。
(光聚合引发剂)
本发明的感光性树脂组合物可以含有光聚合引发剂。通过含有光聚合引发剂,从而能够对感光性树脂组合物赋予负型感光性。
作为光聚合引发剂,例如,可举出苯乙酮系化合物、二苯甲酮系化合物、苯偶姻醚系化合物、α-氨基烷基苯甲酮系化合物(α-aminoalkyl phenone)、噻吨酮系化合物、有机过氧化物、咪唑系化合物、二茂钛(titanocene)系化合物、三嗪系化合物、酰基氧化膦化合物、醌化合物或肟酯系化合物。优选为即使少量添加其敏感度也高的肟酯系化合物,更优选为具有咔唑骨架的肟酯系化合物。作为不具有咔唑骨架的肟酯系化合物,例如可举出Irgacure(注册商标)OXE01(BASF公司制),作为具有咔唑骨架的肟酯系化合物,例如可举出Irgacure(注册商标)OXE02(BASF公司制)、ADEKA OPTOMER(注册商标)N1919(株式会社ADEKA制)或ADEKA ARKLS(注册商标)NCI-831(株式会社ADEKA制)。
(溶剂)
本发明的感光性树脂组合物可以含有溶剂。
作为溶剂,例如,可举出丙二醇单甲基醚、丙二醇单丁基醚、2-庚醇、环己醇、环戊醇、2-丁醇、2-戊醇、叔丁醇、二丙酮醇、α-松油醇、2-羟基异丁酸甲酯、2-羟基异丁酸乙酯、丙二醇单乙基醚乙酸酯、乙酰乙酸乙酯、乙酰乙酸甲酯、3-甲氧基丙酸甲酯、乙酸3-甲基-3-甲氧基丁酯、环戊酮、环己酮、苄基乙基醚、二己基醚、丙酮基丙酮、异佛尔酮、乙酸苄酯、苯甲酸乙酯、草酸二乙酯、马来酸二乙酯、碳酸亚乙基酯、碳酸亚丙基酯、苯甲酸甲酯、苯甲酸乙酯、丙二酸二乙酯、β-丙内酯、γ-丁内酯、γ-戊内酯、δ-戊内酯、γ-己内酯、ε-己内酯、乙二醇单丁基醚乙酸酯、二乙二醇单乙基醚乙酸酯、二乙二醇单丁基醚乙酸酯、二乙二醇二甲基醚、二乙二醇二乙基醚、二乙二醇甲基乙基醚、二丙二醇甲基醚乙酸酯、二丙二醇二甲基醚、丙二醇二乙酸酯、1,3-丁二醇二乙酸酯、环己醇乙酸酯、二甲基亚砜、甲基乙基酮、乙酸异丁酯、乙酸异丁酯、乙酸丁酯、乙酸丙酯、乙酸异丙酯、乙酰丙酮、三乙酸甘油酯或2-庚酮。
(其他粒子)
为了提高分散性、控制导电性,本发明的感光性树脂组合物可以含有除通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)以外的其他粒子。作为其他粒子,例如,可举出未进行表面被覆的金属微粒或金属氧化物微粒、有机颜料或无机颜料。
这些其他粒子的粒径优选为10~100nm。粒径小于10nm时,用于分散稳定化的分散剂使用增多,有时难以得到期望的导电性。另一方面,粒径大于100nm时,图案的分辨率降低,有时难以形成5μm以下的超微细图案。
作为这些其他粒子,优选有助于控制导电性的碳黑。
作为碳黑,例如,可举出MA77、7、8、11、100、100R、100S、230、220或14(以上均为三菱化学株式会社制)、#52、47、45、45L、44、40、33、32、30、25、20、10、5、95、85或260(以上均为三菱化学株式会社制)、Special Black100、250、350或550(以上均为Evonik Degussa公司制)或者Printex95、90、55、45、40、P、60、L6、L、300、30、ES23、9、ES22、35、25、200、A或G(以上均为Evonik Degussa公司制)。其中,优选pH值为4以下的MA77、7、8、11、100、100R、100S、230、220或14或者Special Black100、250、350或550。需要说明的是,碳黑的pH值可按照JISK5101进行测定。
(热产酸剂及光产酸剂)
本发明的感光性树脂组合物可以含有热产酸剂及/或光产酸剂。通过产生的酸,具有酸解离性基团的碱溶性树脂(B)中的酸解离性基团的分解被促进,能够使空气下的热处理温度降低。
作为通过热而产生酸的化合物即热产酸剂,例如可举出SI-60、SI-80、SI-100、SI-110、SI-145、SI-150、SI-60L、SI-80L、SI-100L、SI-110L、SI-145L、SI-150L、SI-160L、SI-180L或SI-200(以上均为三新化学工业(株)制)、4-羟基苯基二甲基锍、苄基-4-羟基苯基甲基锍、2-甲基苄基-4-羟基苯基甲基锍、2-甲基苄基-4-乙酰基苯基甲基锍或2-甲基苄基-4-苯甲酰基氧基苯基甲基锍或者它们的甲磺酸盐、三氟甲磺酸盐、樟脑磺酸盐或对甲苯磺酸盐。其中,可优选使用4-羟基苯基二甲基锍、苄基-4-羟基苯基甲基锍、2-甲基苄基-4-羟基苯基甲基锍、2-甲基苄基-4-乙酰基苯基甲基锍或2-甲基苄基-4-苯甲酰基氧基苯基甲基锍或者它们的甲磺酸盐、三氟甲磺酸盐、樟脑磺酸盐或对甲苯磺酸盐。
作为感光性树脂组合物中的热产酸剂的含量,相对于具有酸解离性基团的碱溶性树脂(B)100质量份,优选0.01~20质量份。其原因在于,通过使热产酸剂的含量在该范围内,具有酸解离性基团的碱溶性树脂(B)中的酸解离性基团的分解被促进,不妨碍通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)彼此的接触,可获得更高的导电性。
对于由光产酸剂(其是通过光而产生酸的化合物)产生的酸而言,为了促进酸解离性基团的分解,优选全氟烷基磺酸或对甲苯磺酸等强酸。
作为光产酸剂,例如,可举出SI-101、SI-105、SI-106、SI-109、PI-105、PI-106、PI-109、NAI-100、NAI-1002、NAI-1003、NAI-1004、NAI-101、NAI-105、NAI-106、NAI-109、NDI-101、NDI-105、NDI-106、NDI-109、PAI-01、PAI-101、PAI-106或PAI-1001(以上均为MidoriKagaku(株)制)、SP-077或SP-082(以上均为(株)ADEKA制)、TPS-PFBS(东洋合成工业(株)制)、CGI-MDT或CGI-NIT(以上均为Ciba Japan(株)制)或WPAG-281、WPAG-336、WPAG-339、WPAG-342、WPAG-344、WPAG-350、WPAG-370、WPAG-372、WPAG-449、WPAG-469、WPAG-505或WPAG-506(以上均为和光纯药工业(株)制)。
作为感光性树脂组合物中的光产酸剂的含量,相对于具有酸解离性基团的碱溶性树脂(B)100质量份,优选0.01~20质量份。其原因在于,通过使光产酸剂的含量在该范围内,具有酸解离性基团的碱溶性树脂(B)中的酸解离性基团的分解被促进,不妨碍通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)彼此的接触,可获得更高的导电性。另外,为了进一步促进酸解离性基团的分解,可以并用热产酸剂和光产酸剂。
(阻聚剂)
本发明的感光性树脂组合物可以含有阻聚剂。通过含有适量阻聚剂,显影后的分辨率提高。作为阻聚剂,没有特别限定,可使用已知的阻聚剂。例如,可举出二叔丁基羟基甲苯、丁基羟基苯甲醚、氢醌、4-甲氧基苯酚、1,4-苯醌、叔丁基邻苯二酚。另外,作为市售的阻聚剂,可举出“IRGANOX1010”、“IRGANOX 1035”、“IRGANOX 1076”、“IRGANOX 1098”、“IRGANOX 1135”、“IRGANOX 1330”、“IRGANOX1726”、“IRGANOX 1425”、“IRGANOX 1520”、“IRGANOX 245”、“IRGANOX 259”、“IRGANOX 3114”、“IRGANOX565”、“IRGANOX 295”(以上均为BASF制)等。
(敏化剂)
本发明的感光性树脂组合物含有光产酸剂的情况下,感光性树脂组合物可以还含有敏化剂。敏化剂优选为因热处理而气化的敏化剂、或即使残留在固化膜中时也会因光照射而褪色的敏化剂。从图案加工的高分辨率的观点考虑,敏化剂更优选为因光照射而褪色的敏化剂。
作为因热处理而气化、或因光照射而褪色的敏化剂,例如可举出3,3’-羰基双(二乙基氨基香豆素)等香豆素、9,10-蒽醌等蒽醌、二苯甲酮、4,4’-二甲氧基二苯甲酮、苯乙酮、4-甲氧基苯乙酮或苯甲醛等芳香族酮或联苯、1,4-二甲基萘、9-芴酮、芴、菲、苯并菲、芘、蒽、9-苯基蒽、9-甲氧基蒽、9,10-二苯基蒽、9,10-双(4-甲氧基苯基)蒽、9,10-双(三苯基甲硅烷基)蒽、9,10-二甲氧基蒽、9,10-二乙氧基蒽、9,10-二丙氧基蒽(DPA;川崎化成(株)制)、9,10-二丁氧基蒽(DBA;川崎化成(株)制)、9,10-二戊氧基蒽、2-叔丁基-9,10-二丁氧基蒽或9,10-双(三甲基甲硅烷基乙炔基)蒽等稠合芳香族。
作为因热处理而气化的敏化剂,优选因热处理而升华、蒸发的敏化剂或者因热分解而得到的热分解物升华或蒸发的敏化剂。作为敏化剂的气化温度,为了于预烘烤温度不气化而在热固化时分解及气化、使通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)接触及融合,优选150~300℃。
另外,就敏化剂而言,从能够实现高敏感度及高分辨率的方面、以及通过光照射而二聚化并褪色的方面考虑,优选蒽系化合物。尤其优选对热稳定的9,10-二取代蒽系化合物,从敏化剂的溶解性提高和光二聚化反应的反应性的观点考虑,进一步优选通式(2)表示的9,10-二烷氧基蒽系化合物。
[化学式2]
(R4~R11各自独立地表示氢、碳原子数1~20的烷基、烷氧基、链烯基、乙炔基、芳基或酰基或者它们被取代而形成的有机基团,R12及R13各自独立地表示碳原子数1~20的烷氧基或者被其他有机基团取代的烷氧基。)
作为R4~R11中的烷基,例如,可举出甲基、乙基或正丙基。作为烷氧基,例如,可举出甲氧基、乙氧基、丙氧基、丁氧基或戊氧基。作为链烯基,例如,可举出乙烯基、丙烯酰氧基丙基或甲基丙烯酰氧基丙基。作为芳基,例如,可举出苯基、甲苯基或萘基。作为酰基,例如,可举出乙酰基。需要说明的是,从化合物的气化性及光二聚化的反应性的观点考虑,优选R4~R11为氢或碳原子数1~6的有机基团,更优选R4、R7、R8及R11为氢。
作为R12及R13中对烷氧基进行取代的取代基,例如,可举出烷氧基或酰基。作为这种情况下的烷氧基,例如,可举出甲氧基、乙氧基、丙氧基、丁氧基、戊氧基、甲氧基乙氧基、1-甲氧基-2-丙氧基或1-乙酰基-2-丙氧基,从化合物的溶解性及由光二聚化带来的褪色反应的观点考虑,优选丙氧基或丁氧基。
作为感光性树脂组合物中的敏化剂含量,相对于碱溶性树脂(B)100质量份,优选0.001~20质量份,更优选0.005~15质量份。其原因在于,通过使敏化剂的含量在该范围内,用于使光产酸剂感光的敏化效果变得充分,不妨碍通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)彼此的接触,可获得更高的导电性。
(对可见光具有吸收的颜料及/或染料)
本发明的感光性树脂组合物可以在不损害通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)彼此的接触及融合的范围内含有对可见光具有吸收的颜料及/或染料。通过使感光性树脂组合物含有对可见光具有吸收的颜料及/或染料,能够抑制后烘烤后的导电性图案的可见光反射。
作为对可见光具有吸收的颜料,例如,可举出内酰胺系颜料、苝系颜料、酞菁系颜料、异吲哚啉系颜料、二氨基蒽醌系颜料、二噁嗪系颜料、阴丹酮系颜料、碳黑或无机颜料。
作为蓝色颜料,例如可举出C.I.颜料蓝(以下称为“PB”)15、PB15:1、PB15:2、PB15:3、PB15:4、PB15:5、PB15:6、PB16或PB60。作为紫色颜料,例如可举出C.I.颜料紫(以下称为“PV”)19、PV23或PV37。作为红色颜料,例如可举出C.I.颜料红(以下称为“PR”)149、PR166、PR177、PR179、PR209或PR254。作为绿色颜料,例如可举出C.I.颜料绿(以下称为“PG”)7、PG36或PG58。作为黄色颜料,例如可举出C.I.颜料黄(以下称为“PY”)150、PY138、PY139或PY185。作为黑色颜料,例如可举出HCF、MCF、LFF、RCF、SAF、ISAF、HAF、XCF、FEF、GPF或SRF等炉黑(Furnace Black)、FT或MT等热裂黑(Thermal Black)、槽黑(Channel Black)或乙炔黑等碳黑或者内酰胺系颜料(例如,“Irgaphor”(注册商标)Black S0100CF;BASF公司制)。其中,优选耐热性、耐光性及可见光的吸收性优异的碳黑,从导电性及分散性的观点考虑,更优选炉黑或内酰胺系颜料。
作为碳黑,例如可举出MA77、7、8、11、100、100R、100S、230、220或14(以上均为三菱化学株式会社制)、#52、47、45、45L、44、40、33、32、30、25、20、10、5、95、85或260(以上均为三菱化学株式会社制)、Special Black100、250、350或550(以上均为Evonik Degussa公司制)、或Printex95、90、55、45、40、P、60、L6、L、300、30、ES23、9、ES22、35、25、200、A或G。其中,优选pH值为4以下的MA77、7、8、11、100、100R、100S、230、220或14或者Special Black100、250、350或550。碳黑的pH值可以按照JIS K5101进行测定。
作为感光性树脂组合物中的对可见光具有吸收的颜料的添加量,相对于组合物中的全部固态成分,优选为0.1~10质量%。
作为对可见光具有吸收的染料,例如可举出二茂铁系染料、芴酮系染料、苝系染料、三苯基甲烷系染料、香豆素系染料、二苯基胺系染料、喹吖啶酮系染料、喹酞酮系染料、酞菁系染料或呫吨系染料,优选耐热性、耐光性及可见光的吸收性优异的黑色染料,优选VALIFAST(注册商标)Black 1888、VALIFAST(注册商标)Black 3830、NUBIAN(注册商标)Black PA-2802或OIL Black 860。
作为感光性树脂组合物中的对可见光具有吸收的染料的添加量,相对于组合物中的全部固态成分,优选为0.1~10质量%。
(其他成分)
就本发明的感光性树脂组合物而言,从调节感光性能、提高图案加工性的观点考虑,也可以在不损害通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)彼此的接触及融合的范围内含有丙烯酸系单体。
作为丙烯酸系单体,例如可举出三羟甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇五(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯或二季戊四醇五(甲基)丙烯酸酯或它们的烷基改性物、烷基醚改性物或烷基酯改性物。
本发明的感光性树脂组合物也可以根据需要进一步含有密合改良剂、表面活性剂或阻聚剂等。
作为密合改良剂,例如可举出乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、乙烯基三(2-甲氧基乙氧基)硅烷、N-(2-氨基乙基)-3-氨基丙基甲基二甲氧基硅烷、N-(2-氨基乙基)-3-氨基丙基三甲氧基硅烷、3-氨基丙基三乙氧基硅烷、3-环氧丙氧基丙基三甲氧基硅烷、3-环氧丙氧基丙基甲基二甲氧基硅烷、2-(3,4-环氧环己基)乙基三甲氧基硅烷、3-氯丙基甲基二甲氧基硅烷、3-氯丙基三甲氧基硅烷、3-甲基丙烯酰氧基丙基三甲氧基硅烷或3-巯基丙基三甲氧基硅烷等硅烷偶联剂。
作为表面活性剂,例如可举出十二烷基硫酸铵或聚氧乙烯烷基醚硫酸三乙醇胺等阴离子表面活性剂、十八烷基胺乙酸酯或十二烷基三甲基氯化铵等阳离子表面活性剂、十二烷基二甲基氧化胺或十二烷基羧基甲基羟基乙基咪唑鎓甜菜碱等两性表面活性剂、聚氧乙烯十二烷基醚、聚氧乙烯十八烷基醚或失水山梨糖醇单硬脂酸酯等非离子表面活性剂、氟系表面活性剂或硅系表面活性剂。
作为感光性树脂组合物中的表面活性剂的添加量,为了使涂布性及涂膜表面的均匀性良好,相对于组合物整体,优选为0.001~10质量%,更优选为0.01~1质量%。添加量少于0.001质量%时,存在涂布性及涂膜表面的均匀性的效果变得不充分的情况。另一方面,添加量超过10质量%时,存在引起收缩、凹陷等涂膜缺陷、粒子凝集的情况。
作为阻聚剂,例如可举出氢醌系、邻苯二酚系、磷系、硫系、胺系或受阻酚系的化合物。其中,对于氢醌系和邻苯二酚系的阻聚剂,优选不损害在溶剂中的溶解性及颜料的分散稳定性的氢醌系或邻苯二酚系的化合物,更优选氢醌、叔丁基氢醌、2,5-双(1,1,3,3-四甲基丁基)氢醌、2,5-双(1,1-二甲基丁基)氢醌、邻苯二酚或叔丁基邻苯二酚。
(感光性树脂组合物的制造方法)
本发明的感光性树脂组合物可以使用球磨机、砂磨机、三辊磨机、温和(Mild)分散机、无介质分散机(medialess dispersion machine)等分散机进行制造。想要将通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)均匀地分散时,也可以利用下述方法制造:预先使用分散剂制备使通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)分散至有机溶剂中而成的分散液,并将该分散液与含有单体、聚合物、密合改良剂、表面活性剂及阻聚剂等的溶液混合。对于通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)的分散液而言,为了防止表面被覆层受到损害,优选使用温和分散机或无介质分散机使其分散,更优选使用无介质分散机使其分散。通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)的分散液使用例如温和分散机NANO GETTER(注册商标)(AshizawaFinetech(株))或高压湿式无介质微粒化装置NANOMIZER(NANOMIZER(株))等分散机,使通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)分散在有机溶剂中进行制造。
(导电性图案的制造方法)
接下来,针对使用本发明的感光性树脂组合物、利用光刻法来制造导电性图案的方法进行说明。
本发明的导电性图案的制造方法通过具备下述工序的工艺来进行:将本发明的感光性树脂组合物涂布于基板面上的涂布工序;对其进行干燥的预烘烤工序;对其进行曝光及显影而形成图案的工序(曝光工序、显影工序);及对其进行后烘烤的后烘烤工序。
作为涂布工序中使用的基板,例如可举出硅晶片、陶瓷基板或有机系基板。作为陶瓷基板,例如可举出钠玻璃(soda glass)、无碱玻璃、硼硅酸玻璃或石英玻璃等玻璃基板、氧化铝基板、氮化铝基板或碳化硅基板。作为有机系基板,例如可举出环氧基板、聚醚亚酰胺树脂基板、聚醚酮树脂基板、聚砜系树脂基板、聚酰亚胺膜或聚酯膜。
作为将本发明的感光性树脂组合物涂布在基板面上的方法,例如可举出使用旋涂机、棒涂机、刮刀涂布机、辊涂机、模涂机、压延涂布机或液面弯曲式涂布机进行的涂布、丝网印刷、喷涂或浸涂。
作为预烘烤工序中的干燥方法,例如可举出通过加热板、热风干燥机(烘箱)、减压干燥、真空干燥或红外线照射进行的干燥。
预烘烤的温度及时间可以根据感光性树脂组合物的组成、要干燥的涂布膜的膜厚适当地确定,优选在50~150℃的温度范围内加热10秒~30分钟。
其中,将使用加热板或热风干燥机(烘箱)进行的加热与减压干燥并用,能够在抑制涂布膜含有的树脂的热固化的同时将溶剂干燥除去,故而优选。作为减压干燥所达到的压力,优选10~200Pa,更优选为30~100Pa。
作为曝光工序中使用的光源,例如优选汞灯的j线、i线、h线或g线。
作为显影工序中用于碱性显影液的碱性物质,例如可举出氢氧化钠、氢氧化钾、碳酸钠、碳酸钾、硅酸钠、偏硅酸钠或氨水等无机碱类、乙基胺或正丙基胺等伯胺类、二乙基胺或二正丙基胺等仲胺类、三乙基胺或甲基二乙基胺等叔胺类、四甲基氢氧化铵(TMAH)等四烷基氢氧化铵类、胆碱等季铵盐、三乙醇胺、二乙醇胺、单乙醇胺、二甲基氨基乙醇或二乙基氨基乙醇等醇胺类或吡咯、哌啶、1,8-二氮杂双环[5,4,0]十一碳-7-烯、1,5-二氮杂双环[4,3,0]-5-壬烷或吗啉等环状胺类等有机碱类,也可以向这些碱性显影液中适当地加入乙醇、γ-丁内酯、二甲基甲酰胺或N-甲基-2-吡咯烷酮等水溶性有机溶剂。
另外,为了得到更良好的导电性图案,还优选向这些碱性显影液中进一步添加0.01~1质量%的非离子系表面活性剂等表面活性剂。
作为后烘烤工序中的干燥方法,可举出与预烘烤工序同样的方法。后烘烤的气氛、温度及时间可以根据感光性树脂组合物的组成、要干燥的涂布膜的膜厚而适当地确定,优选在空气中、100~300℃的温度范围内加热5~120分钟。
在基板上以网眼状形成导电性图案时,能够作为触摸面板、液晶或有机EL等显示器面板或可穿戴终端等所具备的透明导电布线使用。
上述导电性图案不透明,因此,若图案的宽度大,则布线会被设备的使用者所看到。因此,导电性图案的宽度优选为5μm以下。
(包含有机成分的膜)
对本发明中使用的包含有机成分的膜进行说明。
作为构成本发明中使用的包含有机成分的膜的成分,优选含有碱溶性树脂。通过具有碱溶性基团,能够与本发明的感光性树脂组合物中的金属螯合性化合物(C)形成络合物。由于金属螯合物(C)与本发明的感光性树脂组合物中的具有酸解离性基团的碱溶性树脂(B)也能形成络合物,因此显影密合性提高。由此,能够在严苛的显影条件下处理,能够减少显影残渣。
包含有机成分的膜中的碱溶性树脂优选具有极性基团。作为极性基团,可举出羟基、羰基、羧基、氨基、硝基、氰基等,从碱显影性的观点考虑,优选羧基。
另外,作为包含有机成分的膜中的碱溶性树脂,从可靠性的观点考虑,优选固化后成为高膜密度的Cardo树脂。此外,优选除了Cardo树脂外还含有丙烯酸聚合物、且Cardo系树脂与丙烯酸聚合物的含量以重量比计为1:10~10:1,更优选为1:8~7:1。
作为包含有机成分的膜中的Cardo系树脂,可优选使用市售品,可举出“WR-301(商品名)”((株)ADEKA制)、“V-259ME(商品名)”(新日铁住金化学(株)制)、“OGSOL CR-TR1(商品名)”、“OGSOL CR-TR2(商品名)”、“OGSOL CR-TR3(商品名)”、“OGSOL CR-TR4(商品名)”、“OGSOL CR-TR5(商品名)”、“OGSOL CR-TR6(商品名)”(以上为Osaka Gas Chemicals(株)制)等。
另外,作为丙烯酸聚合物,例如可使用在侧链具有脂环式骨架的丙烯酸聚合物。
丙烯酸聚合物优选为将含有羧基及/或酸酐基的(甲基)丙烯酸化合物、及(甲基)丙烯酸酯、及/或马来酰亚胺或马来酰亚胺衍生物进行自由基共聚后、与具有烯键式不饱和双键基团的环氧化合物进行加成反应而得到的物质。
自由基聚合的催化剂没有特别限制,通常可使用偶氮二异丁腈等偶氮化合物、过氧化苯甲酰等有机过氧化物等。
具有烯键式不饱和双键基团的环氧化合物的加成反应中使用的催化剂没有特别限制,可使用已知的催化剂,例如可使用二甲基苯胺、2,4,6-三(二甲基氨基甲基)苯酚、二甲基苄胺等氨基系催化剂、2-乙基己酸锡(II)、月桂酸二丁基锡等锡系催化剂、2-乙基己酸钛(IV)等钛系催化剂、三苯基膦等磷系催化剂及乙酰丙酮铬、氯化铬等铬系催化剂等。
作为含有羧基及/或酸酐基的(甲基)丙烯酸化合物,可使用(甲基)丙烯酸、(甲基)丙烯酸酐、衣康酸、衣康酸酐、琥珀酸单(2-丙烯酰氧基乙基)酯、邻苯二甲酸单(2-丙烯酰氧基乙基)酯、四氢邻苯二甲酸单(2-丙烯酰氧基乙基)酯等。
作为(甲基)丙烯酸酯,可使用(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸环丙酯、(甲基)丙烯酸环戊酯、(甲基)丙烯酸环己酯、(甲基)丙烯酸环己烯酯、(甲基)丙烯酸4-甲氧基环己酯、(甲基)丙烯酸2-环丙氧基羰基乙酯、(甲基)丙烯酸2-环戊氧基羰基乙酯、(甲基)丙烯酸2-环己氧基羰基乙酯、(甲基)丙烯酸2-环己烯氧基羰基乙酯、(甲基)丙烯酸2-(4-甲氧基环己基)氧基羰基乙酯、(甲基)丙烯酸降冰片酯、(甲基)丙烯酸异冰片酯、(甲基)丙烯酸三环癸酯、(甲基)丙烯酸四环癸酯、(甲基)丙烯酸二环戊烯酯、(甲基)丙烯酸金刚烷酯、(甲基)丙烯酸金刚烷基甲酯、(甲基)丙烯酸1-甲基金刚烷酯等。另外,可以将苯乙烯、对甲基苯乙烯、邻甲基苯乙烯、间甲基苯乙烯、α-甲基苯乙烯等芳香族乙烯基化合物与上述(甲基)丙烯酸、(甲基)丙烯酸酯进行共聚。
作为马来酰亚胺或马来酰亚胺衍生物,例如,可举出马来酰亚胺、N-甲基马来酰亚胺、N-乙基马来酰亚胺、N-正丙基马来酰亚胺、N-异丁基马来酰亚胺、N-正丁基马来酰亚胺、N-叔丁基马来酰亚胺、N-正己基马来酰亚胺、N-十二烷基马来酰亚胺、N-环戊基马来酰亚胺、N-环己基马来酰亚胺、N-(2,4-二甲基环己基)马来酰亚胺、N-乙烯基马来酰亚胺、N-(甲基)丙烯酰基马来酰亚胺、N-甲氧基甲基马来酰亚胺、N-(2-乙氧基乙基)马来酰亚胺、N-[3-(甲基)丙烯酰氧基丙基]马来酰亚胺、N-甲氧基羰基马来酰亚胺、N-(3-甲氧基羰基丙基)马来酰亚胺、N-(2-羟基乙基)马来酰亚胺、N-(4-羟基正丁基)马来酰亚胺、N-(2-羧基乙基)马来酰亚胺、N-(3-羧基丙基)马来酰亚胺、N-(5-羧基戊基)马来酰亚胺、N-苯基马来酰亚胺、N-(4-甲基苯基)马来酰亚胺、N-(3-甲基苯基)马来酰亚胺、N-(2-甲基苯基)马来酰亚胺、N-(2,6-二甲基苯基)马来酰亚胺、N-(2,6-二乙基苯基)马来酰亚胺、N-(4-苯乙烯基)马来酰亚胺、N-(4-甲氧基苯基)马来酰亚胺、N-(3-甲氧基苯基)马来酰亚胺、N-(2-甲氧基苯基)马来酰亚胺、N-(4-羟基苯基)马来酰亚胺、N-(3-羟基苯基)马来酰亚胺、N-(2-羟基苯基)马来酰亚胺、N-(4-羧基苯基)马来酰亚胺、N-(1-萘基)马来酰亚胺、N-苄基马来酰亚胺、N-(2-苯基乙基)马来酰亚胺等。
作为具有烯键式不饱和双键基团的环氧化合物,例如,可举出(甲基)丙烯酸缩水甘油酯、(甲基)丙烯酸(α-乙基)缩水甘油酯、(甲基)丙烯酸(α-正丙基)缩水甘油酯、(甲基)丙烯酸(α-正丁基)缩水甘油酯、(甲基)丙烯酸(3,4-环氧基)丁酯、(甲基)丙烯酸(3,4-环氧基)庚酯、(甲基)丙烯酸(3,4-环氧基环己基甲基)酯、(甲基)丙烯酸(α-乙基-6,7-环氧基)庚酯、烯丙基缩水甘油醚、乙烯基缩水甘油醚、2-乙烯基苄基缩水甘油醚、3-乙烯基苄基缩水甘油醚、4-乙烯基苄基缩水甘油醚、α-甲基-2-乙烯基苄基缩水甘油醚、α-甲基-3-乙烯基苄基缩水甘油醚、α-甲基-4-乙烯基苄基缩水甘油醚、2,3-二缩水甘油氧基甲基苯乙烯、2,4-二缩水甘油氧基甲基苯乙烯、2,5-二缩水甘油氧基甲基苯乙烯、2,6-二缩水甘油氧基甲基苯乙烯、2,3,4-三缩水甘油氧基甲基苯乙烯、2,3,5-三缩水甘油氧基甲基苯乙烯、2,3,6-三缩水甘油氧基甲基苯乙烯、3,4,5-三缩水甘油氧基甲基苯乙烯、2,4,6-三缩水甘油氧基甲基苯乙烯等。
丙烯酸聚合物也可以使用通过迈克尔加成(关于羰基,为β位)将多官能(甲基)丙烯酸酯化合物与多巯基化合物进行聚合而得到的物质。
作为多官能(甲基)丙烯酸酯化合物的优选具体例,可举出乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、四亚甲基二醇二(甲基)丙烯酸酯、三羟甲基丙烷三(甲基)丙烯酸酯、环氧乙烷改性三羟甲基丙烷三(甲基)丙烯酸酯、环氧丙烷改性三羟甲基丙烷三(甲基)丙烯酸酯、三羟甲基乙烷三(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、三季戊四醇八(甲基)丙烯酸酯、三季戊四醇七(甲基)丙烯酸酯、己内酯改性季戊四醇三(甲基)丙烯酸酯、己内酯改性季戊四醇四(甲基)丙烯酸酯、己内酯改性二季戊四醇六(甲基)丙烯酸酯、表氯醇改性六氢邻苯二甲酸二(甲基)丙烯酸酯、羟基三甲基乙酸新戊二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、环氧乙烷改性新戊二醇二(甲基)丙烯酸酯、环氧丙烷改性新戊二醇二(甲基)丙烯酸酯、己内酯改性羟基三甲基乙酸酯新戊二醇二(甲基)丙烯酸酯、硬脂酸改性季戊四醇二(甲基)丙烯酸酯、表氯醇改性邻苯二甲酸二(甲基)丙烯酸酯、聚(乙二醇四亚甲基二醇)二(甲基)丙烯酸酯、聚(丙二醇四亚甲基二醇)二(甲基)丙烯酸酯、聚酯(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚乙二醇-聚丙二醇-聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、表氯醇改性丙二醇二(甲基)丙烯酸酯、环氧丙烷改性双酚A二缩水甘油醚二(甲基)丙烯酸酯、聚硅氧烷二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、三环癸烷二甲醇二(甲基)丙烯酸酯、新戊二醇改性三羟甲基丙烷二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、环氧乙烷改性三丙二醇二(甲基)丙烯酸酯、三丙三醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、表氯醇改性丙三醇三(甲基)丙烯酸酯、环氧乙烷改性丙三醇三(甲基)丙烯酸酯、环氧丙烷改性丙三醇三(甲基)丙烯酸酯、环氧乙烷改性磷酸三(甲基)丙烯酸酯、己内酯改性三羟甲基丙烷三(甲基)丙烯酸酯、HPA改性三羟甲基丙烷三(甲基)丙烯酸酯、环氧乙烷改性三羟甲基丙烷三(甲基)丙烯酸酯、环氧丙烷改性三羟甲基丙烷三(甲基)丙烯酸酯、三羟甲基丙烷苯甲酸酯(甲基)丙烯酸酯、三((甲基)丙烯酰氧基乙基)异氰脲酸酯、烷氧基改性三羟甲基丙烷三(甲基)丙烯酸酯、二季戊四醇聚(甲基)丙烯酸酯、烷基改性二季戊四醇三(甲基)丙烯酸酯、双(三羟甲基)丙烷四(甲基)丙烯酸酯等(甲基)丙烯酸酯。这些化合物可以仅单独使用一种,也可以并用两种以上。
作为多巯基化合物,可举出1,2-二巯基乙烷、1,3-二巯基丙烷、1,4-二巯基丁烷、双二巯基乙硫醇(HS-CH2CH2-S-CH2CH2-SH)、三羟甲基丙烷三(巯基乙酸酯)、三羟甲基丙烷三(巯基丙酸酯)、季戊四醇四(巯基乙酸酯)、季戊四醇三(巯基乙酸酯)、季戊四醇四(巯基丙酸酯)、二季戊四醇六(巯基乙酸酯)、二季戊四醇六(巯基丙酸酯)等。这些化合物可以仅单独使用一种,也可以并用两种以上。
实施例
以下,对本发明的实施例进行说明。首先,对实施例及比较例中使用的材料进行说明。
[通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)]
(A-1)表面碳被覆层的平均厚度为1nm、且一次粒径为50nm的银粒子(NisshinEngineering株式会社制)。
[具有酸解离性基团的碱溶性树脂(B)]
(B-1)
向500ml烧瓶中加入2,2’-偶氮二异丁腈2g、PGMEA 50g。然后,加入甲基丙烯酸15.69g、苯乙烯37.45g、甲基丙烯酸二环戊基酯46.86g,于室温搅拌片刻,通过鼓泡将烧瓶内进行充分的氮置换后,于70℃加热搅拌5小时。接下来,向所得的溶液中加入甲基丙烯酸缩水甘油酯10.46g、二甲基苄基胺1g、对甲氧基苯酚0.2g、PGMEA 100g,于90℃加热搅拌4小时,得到丙烯酸树脂(B-1)的溶液。向得到的丙烯酸树脂(B-1)的溶液中加入PGMEA使固态成分浓度成为40质量%。丙烯酸树脂(B-1)的重均分子量(Mw)为25,000。
(B-2)
向500ml的烧瓶中加入2,2’-偶氮二异丁腈2g、PGMEA(丙二醇甲基醚乙酸酯)50g。然后,加入甲基丙烯酸23.26g、甲基丙烯酸苄基酯31.46g、甲基丙烯酸二环戊基酯32.80g,于室温搅拌片刻,通过鼓泡将烧瓶内进行充分的氮置换后,于70℃加热搅拌5小时。接下来,向所得的溶液中加入甲基丙烯酸缩水甘油酯12.69g、二甲基苄基胺1g、对甲氧基苯酚0.2g、PGMEA 100g,于90℃加热搅拌4小时,得到丙烯酸树脂(B-2)的溶液。向所得的丙烯酸树脂(B-2)的溶液中加入PGMEA使固态成分浓度成为40质量%。丙烯酸树脂(B-2)的重均分子量(Mw)为24,000。
[金属螯合性化合物(C)]
(C-1)ALCH:乙酰乙酸乙基铝二异丙酯(Kawaken Fine Chemicals(株)制)
(C-2)ALCH-TR:三(乙基乙酰乙酸根)合铝(Kawaken Fine Chemicals(株)制)
(C-3)Alumichelate M:乙酰乙酸烷基酯铝二异丙酯(Kawaken Fine Chemicals(株)制)
(C-4)Alumichelate D:单(乙酰丙酮根)双(乙基乙酰乙酸根)合铝(Kawaken FineChemicals(株)制)
(C-5)Alumichelate A(W):三(乙酰丙酮根)合铝(Kawaken Fine Chemicals(株)制)
(C-6)ZC-150:四(乙酰丙酮根)合锆(Matsumoto Fine Chemical(株)制)
(C-7)ZC-540:三丁氧基单(乙酰丙酮根)合锆(Matsumoto Fine Chemical(株)制)
(C-8)Neostann U-600:三辛酸铋/三(2-乙基己酸)铋(bismuth tri octoate/2-ethyl hexanoic acid)(日东化成(株)制)
[分散剂]
DISPERBYK(注册商标)21116(BYK-Chemie Japan株式会社制)。
[溶剂]
PGMEA:丙二醇单甲基醚乙酸酯(三协化学(株)制)
DPM:二丙二醇单甲基醚(东邦化学工业(株)制)。
[光聚合引发剂]
NCI-831(注册商标)(肟酯系化合物;ADEKA(株)制)。
[丙烯酸系单体]
Light acrylate(注册商标)PE-3A(共荣社化学(株)制)。
[包含有机成分的膜]
(X-1)
向500ml的烧瓶中加入AIBN 1g、PGMEA 50g。然后,加入甲基丙烯酸38.6g、甲基丙烯酸甲酯16.4g、苯乙烯16.4g,于室温搅拌片刻,通过鼓泡将烧瓶内进行充分地氮置换后,于70℃加热搅拌5小时。接下来,向得到的溶液中添加甲基丙烯酸缩水甘油酯28.6g、二甲基苄胺1g、对甲氧基苯酚0.2g、PGMEA 100g,于90℃加热搅拌4小时,得到丙烯酸聚合物的溶液。得到的丙烯酸聚合物的重均分子量(Mw)为29,000。
在黄色灯下,使OXE-02:0.25g、LA-87:0.50g、制成10wt%PGMEA溶液的TBC:0.50g溶解于PGMEA:14.19g、DAA:30.00g中,加入制成10wt%PGMEA溶液的BYK-333:0.30g(相当于浓度300ppm),进行搅拌。向其中加入制成50wt%PGMEA溶液的TEPIC-VL:6.49g、制成20wt%PGMEA溶液的EG-200:12.49g、DPHA:6.19g、得到的丙烯酸聚合物:9.36g、“V-259ME(商品名)”(新日铁住金化学(株)制):18.73g、及KBM-403:1.00g,进行搅拌。接着,用0.45μm的过滤器进行过滤,得到组合物(X-1)。
(X-2)
向“SUMIKAEXCEL PES 4100P(商品名)”(住友化学(株)制)10g中添加40g环己酮并搅拌。通过这样的方式得到固态成分浓度为20wt%的组合物(X-2)。
(X-3)
在干燥氮气流下,将2,2-双(3-氨基-4-羟基苯基)六氟丙烷(BAHF;中央硝子(株)制)29.3g(0.08摩尔)、1,3-双(3-氨基丙基)四甲基二硅氧烷1.24g(0.005摩尔)、作为封端剂的3-氨基苯酚3.27g(0.03摩尔)溶解于N-甲基-2-吡咯烷酮(NMP)150g中。向其中与50gNMP一同加入3,3’,4,4’-二苯基醚四甲酸二酐(ODPA;MANAC(株)制)31.0g(0.1摩尔),于20℃搅拌1小时,接着于50℃搅拌4小时。然后,添加15g的二甲苯,使水与二甲苯一同共沸,同时于150℃搅拌5小时。搅拌结束后,将溶液投入水3L中,收集白色沉淀。通过过滤收集该沉淀,用水洗涤3次后,通过80℃的真空干燥机干燥24小时,得到聚酰亚胺聚合物。向该聚酰亚胺聚合物7.5g中添加42.5g的GBL并搅拌。通过这样的方式得到固态成分浓度为15wt%的组合物(X-3)。
(X-4)
在黄色灯下,使“PBG-305(商品名)”(强力电子公司制):0.25g、“LA-87(商品名)”(ADEKA(株)制):0.50g、制成10wt%PGMEA溶液的TBC:0.50g溶解于PGMEA:2.24g、DAA:30.00g中,加入制成10wt%PGMEA溶液的BYK-333:0.30g(相当于浓度300ppm),并进行搅拌。向其中,加入“TAIC(商品名)”(日本化成(株)制):4.25g、制成10wt%PGMEA溶液的“OGSOLPG-100(商品名)”(Osaka Gas Chemicals(株)制):24.50g、“OGSOL EA-0250P(商品名)”(Osaka Gas Chemicals(株)制):1.25g、“M-315(商品名)”(共荣社(株)制):2.75g、“SIRIUS-501(商品名)”(大阪有机工业(株)制):3.12g、“V-259ME(商品名)”(新日铁住金化学(株)制):29.34g、及“KBM-403(商品名)”(信越化学工业(株)制):1.00g,并进行搅拌。接着,用0.45μm的过滤器进行过滤,得到组合物(X-4)。
[包含有机成分的膜的制作]
(Y-1)
使用旋涂机(MIKASA(株)制“1H-360S(商品名)”),以650rpm、5秒的条件将组合物(X-1)旋涂于无碱玻璃基板(OA-10G;日本电气硝子株式会社制)上,使用加热板(大日本网屏制造(株)制“SCW-636(商品名)”),将基板于100℃预烘烤2分钟,得到膜厚为2.5μm的预烘烤膜。使用平行光式掩模对准曝光机(CANON(株)制“PLA-501F(商品名)”),以超高压汞灯作为光源,隔着期望的掩模对预烘烤膜进行曝光。然后,使用自动显影装置(泷泽产业(株)制“AD-2000(商品名)”),用0.045wt%氢氧化钾水溶液喷淋显影60秒,接着用水漂洗30秒,进行图案加工。然后,使用烘箱(“IHPS-222”;ESPEC(株)制),于230℃实施(空气中)后烘烤30分钟,由此制作包含有机成分的膜(Y-1)。
(Y-2)
使用旋涂机(MIKASA(株)制“1H-360S(商品名)”),以650rpm、5秒的条件将组合物(X-2)旋涂于无碱玻璃基板(OA-10G;日本电气硝子株式会社制)上,使用加热板(大日本网屏制造(株)制“SCW-636(商品名)”),将基板于100℃预烘烤2分钟,得到膜厚为2.5μm的预烘烤膜,然后,使用烘箱(“IHPS-222”;ESPEC(株)制),于230℃实施(空气中)后烘烤30分钟,由此制作包含有机成分的膜(Y-2)。
(Y-3)
利用与上述(Y-2)的制作方法同样的步骤,由(X-3)制作(Y-3)。
(Y-4)
利用与上述(Y-1)的制作方法同样的步骤,由(X-4)制作(Y-4)。
[图案加工性评价]
使用无碱玻璃基板(OA-10;日本电气硝子株式会社制)或者涂布有上述(Y-1)~(Y-4)的基板,进行感光性树脂组合物的图案加工性评价。需要说明的是,使预烘烤后的膜厚为2.5μm,曝光时使用敏感度测定用的灰阶掩模。
将显影后以1比1的宽度形成30μm的线与间隙图案的曝光量(以下,将其称为最佳曝光量)作为敏感度,将最佳曝光量下的显影后的最小图案尺寸作为分辨率。
分辨率优选为5μm以下,更优选为2μm以下。
[导电性评价]
使用无碱玻璃基板(OA-10;日本电气硝子株式会社制)或者涂布有上述(Y-1)~(Y-4)的基板,制作体积电阻率评价用导电图案。需要说明的是,使预烘烤后的膜厚为0.6μm,隔着具有长方形透光图案(10mm×15mm)的光掩模进行曝光。
针对得到的体积电阻率评价图案,用表面电阻测定机(三菱油化株式会社制“Loresta(注册商标)-FP”)对表面电阻值ρs(Ω/□进行测定,用表面粗糙度形状测定机((株)东京精密制“Surfcom(注册商标)1400D”)对膜厚t(cm)进行测定,将两值相乘,从而算出体积电阻率(μΩ·cm)。体积电阻率优选小于100μΩ·cm,更优选小于65μΩ·cm。
[基板上残渣评价]
针对形成有上述体积电阻率评价图案的基板的未曝光部分,利用透射率评价对基板上的残渣进行评价。具体而言,针对未曝光部分,使用紫外可见分光光度计((株)岛津制作所制“MultiSpec-1500(商品名)”),测定膜形成前后的400nm处的透射率。然后,将膜形成前的透射率设为T0、膜形成后的透射率设为T时,算出由式(T0-T)/T0表示的透射率变化。透射率变化优选小于1.0%,更优选小于0.7%。
(实施例1)
首先,使用均化器,对80.00g的通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A-1)、6.25g的DISPERBYK21116、146.25g的PGMEA、150.00g的DPM,以1200rpm实施30分钟混合处理,进而,使用高压湿式无介质微粒化装置NANOMIZER(NANOMIZER(株))进行分散,得到银粒子分散体。针对382.50g的该银微粒分散体,混合10.00g的具有酸解离性基团的碱溶性树脂(B)、0.3g的金属螯合性化合物(C-1)、1.20g的NCI-831、6.00g的PE-3A,向由此得到的物质中添加50.00g的PGMEA、50.00g的DPM并进行搅拌,由此得到感光性树脂组合物1。
使用旋涂机(MIKASA(株)制“1H-360S(商品名)”),在以300rpm进行10秒、以500rpm进行2秒的条件下,将感光性树脂组合物1旋涂于包含有机成分的膜(Y-1)上,使用加热板(大日本网屏制造(株)制“SCW-636(商品名)”),将基板于100℃预烘烤2分钟,得到膜厚为1μm的预烘烤膜。使用平行光式掩模对准曝光机(CANON(株)制“PLA-501F(商品名)”)、以超高压汞灯作为光源,隔着期望的掩模对预烘烤膜进行曝光。然后,使用自动显影装置(泷泽产业(株)制“AD-2000(商品名)”),用0.045wt%氢氧化钾水溶液喷淋显影60秒,接着用水漂洗30秒,进行图案加工。将在曝光、显影后以1比1的宽度形成5μm的线与间隙图案的曝光量(以下记为“最佳曝光量”)作为敏感度。曝光量采用I线照度计进行测定。进而,测定最佳曝光量下的显影后的最小图案尺寸,作为分辨率。
另外,使用旋涂机(MIKASA(株)制“1H-360S(商品名)”),在以300rpm进行10秒、以500rpm进行2秒的条件,将感光性树脂组合物1另行地旋涂于包含有机成分的膜(Y-1)上,使用加热板(大日本网屏制造(株)制“SCW-636(商品名)”)将基板于100℃预烘烤2分钟,得到膜厚为1μm的预烘烤膜。使用平行光式掩模对准曝光机(CANON(株)制“PLA-501F(商品名)”)、以超高压汞灯作为光源,隔着期望的掩模对预烘烤膜进行曝光。然后,使用自动显影装置(泷泽产业(株)制“AD-2000(商品名)”),用0.045wt%氢氧化钾水溶液喷淋显影60秒,接着用水漂洗30秒,进行图案加工。然后,使用烘箱(“IHPS-222”;ESPEC(株)制)于230℃实施(空气中)后烘烤30分钟,由此得到体积电阻率评价图案。
针对得到的体积电阻率评价图案,用表面电阻测定机(Loresta(注册商标)-FP;三菱油化株式会社制)对表面电阻值ρs(Ω/□)进行测定,用表面粗糙度形状测定机(Surfcom(注册商标)1400D;株式会社东京精密制)对膜厚t(cm)进行测定,将两值相乘,由此算出体积电阻率(μΩ·cm)。
进而,针对形成有上述体积电阻率评价图案的基板的未曝光部分,利用透射率评价对基板上的残渣进行评价。具体而言,针对未曝光部分,使用分光光度计(U-3410;日立制作所株式会社制)测定膜形成前后的400nm处的透射率。然后,将膜形成前的透射率设为T0、膜形成后的透射率设为T时,算出由式(T0-T)/T0表示的透射率变化。透射率变化小于1%的情况下,可判断为残渣抑制的效果充分。将测得的分辨率及算出的体积电阻率及透射率变化的结果示于表1。
(实施例2~21及比较例1~11)
利用与实施例1同样的方法,得到表1记载的组成的感光性树脂组合物,针对各感光性树脂组合物,在表1~3中记载的基板上进行与实施例1同样的评价。将评价结果示于表1~3。需要说明的是,作为表中的玻璃基板,使用无碱玻璃基板(OA-10G;日本电气硝子株式会社制)。
[表1]
[表2]
[表3]
就实施例1~21而言,由添加金属螯合性化合物带来的残渣抑制的效果充分,并且分辨率为2μm以下。
另一方面,就比较例1~9而言,由于碱溶性树脂不具有酸解离性基团,因此微细图案的形成不充分。就比较例10及11而言,由于未添加金属螯合性化合物,因此残渣抑制的效果不充分。
产业上的可利用性
本发明的感光性树脂组合物可合适地用于在触摸面板、显示器、图像传感器、有机电致发光照明或太阳能电池等中使用的导电性图案的形成。
Claims (22)
1.感光性树脂组合物,其含有通过碳单质及/或碳化合物进行了表面被覆的导电性粒子(A)、具有酸解离性基团的碱溶性树脂(B)以及金属螯合性化合物(C)。
2.如权利要求1所述的感光性树脂组合物,其中,所述金属螯合性化合物(C)包含Au、Ag、Cu、Cr、Fe、Co、Ni、Bi、Pb、Zn、Pd、Pt、Al、Ti、Zr、W及/或Mo。
3.如权利要求1或2所述的感光性树脂组合物,其中,所述金属螯合性化合物(C)包含Al、Zr及/或Bi。
4.如权利要求1~3中任一项所述的感光性树脂组合物,其中,所述金属螯合性化合物(C)包含2个以上的配体。
5.如权利要求1~4中任一项所述的感光性树脂组合物,其中,所述导电性粒子(A)包含银。
6.如权利要求1~5中任一项所述的感光性树脂组合物,其中,所述导电性粒子(A)的一次粒径为1~700nm。
7.导电性图案的制造方法,其具备下述工序:
涂布工序,将权利要求1~6中任一项所述的感光性树脂组合物涂布于基板上而得到涂布膜;
干燥工序,对所述涂布膜进行干燥而得到干燥膜;
曝光显影工序,对所述干燥膜进行曝光及显影而形成图案;和
后烘烤工序,对所述图案进行后烘烤而得到导电性图案。
8.如权利要求7所述的导电性图案的制造方法,其中,所述导电性图案的宽度为5μm以下。
9.基板,其具备由权利要求1~6中任一项所述的感光性树脂组合物的固化物形成的导电性图案。
10.如权利要求9所述的基板,其至少在包含有机成分的膜上具备导电性图案。
11.如权利要求9或10所述的基板,其从基材侧起至少具备导电性图案、包含有机成分的膜与导电性图案的层叠体。
12.如权利要求10或11所述的基板,其中,所述包含有机成分的膜含有碱溶性树脂。
13.如权利要求12所述的基板,其中,所述包含有机成分的膜中的碱溶性树脂含有极性基团。
14.如权利要求12所述的基板,其中,所述包含有机成分的膜中的碱溶性树脂含有Cardo系树脂。
15.如权利要求14所述的基板,其中,所述包含有机成分的膜中的碱溶性树脂还包含丙烯酸树脂,并且Cardo系树脂与丙烯酸树脂的含量比(重量比)为1:10~10:1。
16.如权利要求10~15中任一项所述的基板,其中,所述包含有机成分的膜含有聚酰亚胺树脂、聚酰亚胺硅氧烷树脂、聚醚砜树脂、聚苯并噁唑树脂、芳族聚酰胺树脂、环氧树脂及/或磺酰胺树脂。
17.如权利要求16所述的基板,其中,所述包含有机成分的膜含有聚酰亚胺树脂、聚酰亚胺硅氧烷树脂、聚苯并噁唑树脂及/或芳族聚酰胺树脂。
18.触摸面板的制造方法,其至少具备下述工序:对将权利要求1~6中任一项所述的感光性树脂组合物涂布于基板上并进行干燥而得到的膜进行曝光、显影。
19.显示器的制造方法,其至少具备对权利要求1~6中任一项所述的感光性树脂组合物进行显影的工序。
20.图像传感器的制造方法,其至少具备对权利要求1~6中任一项所述的感光性树脂组合物进行显影的工序。
21.有机电致发光照明的制造方法,其至少具备对权利要求1~6中任一项所述的感光性树脂组合物进行显影的工序。
22.太阳能电池的制造方法,其至少具备对权利要求1~6中任一项所述的感光性树脂组合物进行显影的工序。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016193152 | 2016-09-30 | ||
JP2016-193152 | 2016-09-30 | ||
PCT/JP2017/024787 WO2018061384A1 (ja) | 2016-09-30 | 2017-07-06 | 感光性樹脂組成物、導電性パターンの製造方法、基板、タッチパネル及びディスプレイ |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109791352A true CN109791352A (zh) | 2019-05-21 |
CN109791352B CN109791352B (zh) | 2022-07-29 |
Family
ID=61759408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201780060041.1A Active CN109791352B (zh) | 2016-09-30 | 2017-07-06 | 感光性树脂组合物、导电性图案的制造方法、基板、触摸面板及显示器 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11422464B2 (zh) |
EP (1) | EP3521925B1 (zh) |
JP (1) | JP6841233B2 (zh) |
KR (1) | KR102399714B1 (zh) |
CN (1) | CN109791352B (zh) |
TW (1) | TWI797084B (zh) |
WO (1) | WO2018061384A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111001388A (zh) * | 2019-12-30 | 2020-04-14 | 中国科学院城市环境研究所 | 一种竹基生物炭除磷吸附剂的制备方法及其应用 |
CN112574623A (zh) * | 2020-11-30 | 2021-03-30 | 位速科技股份有限公司 | 高分子金属配合物涂布液与有机光伏元件 |
CN115210322A (zh) * | 2020-03-27 | 2022-10-18 | 东丽株式会社 | 树脂组合物、布线基板及导电性图案的制造方法 |
CN116018655A (zh) * | 2020-09-28 | 2023-04-25 | 东丽株式会社 | 感光性树脂组合物、带导电图案的基板、天线元件、图像显示装置的制造方法及触摸面板的制造方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6717439B1 (ja) * | 2018-11-30 | 2020-07-01 | 東レ株式会社 | 積層部材 |
JP7173147B2 (ja) * | 2019-06-11 | 2022-11-16 | 東レ株式会社 | 導電層付基板及びタッチパネル用部材 |
JP7264771B2 (ja) * | 2019-08-30 | 2023-04-25 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
JP7389071B2 (ja) * | 2020-06-17 | 2023-11-29 | 富士フイルム株式会社 | 導電性パターンの形成方法、メタルメッシュセンサーの製造方法、及び、構造体の製造方法 |
JP2022155693A (ja) * | 2021-03-31 | 2022-10-14 | キヤノン株式会社 | 成形装置、成形方法、および平坦化方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103180784A (zh) * | 2010-09-02 | 2013-06-26 | 东丽株式会社 | 感光性组合物、由其形成的固化膜及具有固化膜的元件 |
JP2014197171A (ja) * | 2013-03-05 | 2014-10-16 | 東レ株式会社 | 感光性樹脂組成物、保護膜及び絶縁膜並びにタッチパネル及びその製造方法 |
CN104737240A (zh) * | 2013-10-16 | 2015-06-24 | 日立化成株式会社 | 含有导电性纤维的层叠体、感光性导电膜、导电图案的制造方法、导电图案基板以及触摸面板 |
WO2015159655A1 (ja) * | 2014-04-16 | 2015-10-22 | 東レ株式会社 | 感光性樹脂組成物、導電性パターンの製造方法、基板、素子およびタッチパネル |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4062805B2 (ja) | 1999-01-06 | 2008-03-19 | 東レ株式会社 | 焼成用感光性導電ペーストおよび微細電極パターン形成方法 |
JP4437603B2 (ja) | 2000-09-06 | 2010-03-24 | 京都エレックス株式会社 | アルカリ現像型感光性ペースト組成物 |
JP2002169288A (ja) * | 2000-11-30 | 2002-06-14 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物及びそれを用いたポジ型レジスト基材 |
JP4963586B2 (ja) | 2005-10-17 | 2012-06-27 | 株式会社日清製粉グループ本社 | 超微粒子の製造方法 |
JP4637221B2 (ja) * | 2007-09-28 | 2011-02-23 | 富士フイルム株式会社 | ポジ型感光性樹脂組成物及びそれを用いた硬化膜形成方法 |
JP2010134003A (ja) * | 2008-12-02 | 2010-06-17 | Toray Ind Inc | ポジ型感光性ペースト |
JP2010189628A (ja) * | 2009-01-20 | 2010-09-02 | Toray Ind Inc | 黒色樹脂組成物、樹脂ブラックマトリクス、カラーフィルターおよび液晶表示装置 |
JP2013101861A (ja) | 2011-11-09 | 2013-05-23 | Toppan Printing Co Ltd | 感光性導電ペースト、導電回路パターン、タッチパネルセンサーおよび表示装置 |
JP2013196997A (ja) | 2012-03-22 | 2013-09-30 | Toray Ind Inc | 導電性組成物 |
JP5463498B1 (ja) | 2012-12-28 | 2014-04-09 | 東洋インキScホールディングス株式会社 | 感光性導電性インキ及びその硬化物 |
JP5708851B1 (ja) * | 2014-02-28 | 2015-04-30 | 東洋インキScホールディングス株式会社 | 感光性樹脂および感光性導電性インキ |
WO2016060856A1 (en) * | 2014-10-15 | 2016-04-21 | Eastman Kodak Company | Dispersed carbon-coated metal particles, articles and uses |
WO2016158864A1 (ja) | 2015-04-01 | 2016-10-06 | 東レ株式会社 | 感光性樹脂組成物、導電性パターンの製造方法、基板、タッチパネル及びディスプレイ |
-
2017
- 2017-07-06 KR KR1020197006487A patent/KR102399714B1/ko active IP Right Grant
- 2017-07-06 EP EP17855343.4A patent/EP3521925B1/en active Active
- 2017-07-06 US US16/336,940 patent/US11422464B2/en active Active
- 2017-07-06 WO PCT/JP2017/024787 patent/WO2018061384A1/ja active Application Filing
- 2017-07-06 JP JP2017557153A patent/JP6841233B2/ja active Active
- 2017-07-06 CN CN201780060041.1A patent/CN109791352B/zh active Active
- 2017-07-19 TW TW106124060A patent/TWI797084B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103180784A (zh) * | 2010-09-02 | 2013-06-26 | 东丽株式会社 | 感光性组合物、由其形成的固化膜及具有固化膜的元件 |
JP2014197171A (ja) * | 2013-03-05 | 2014-10-16 | 東レ株式会社 | 感光性樹脂組成物、保護膜及び絶縁膜並びにタッチパネル及びその製造方法 |
CN104737240A (zh) * | 2013-10-16 | 2015-06-24 | 日立化成株式会社 | 含有导电性纤维的层叠体、感光性导电膜、导电图案的制造方法、导电图案基板以及触摸面板 |
WO2015159655A1 (ja) * | 2014-04-16 | 2015-10-22 | 東レ株式会社 | 感光性樹脂組成物、導電性パターンの製造方法、基板、素子およびタッチパネル |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111001388A (zh) * | 2019-12-30 | 2020-04-14 | 中国科学院城市环境研究所 | 一种竹基生物炭除磷吸附剂的制备方法及其应用 |
CN111001388B (zh) * | 2019-12-30 | 2022-05-03 | 中国科学院城市环境研究所 | 一种竹基生物炭除磷吸附剂的制备方法及其应用 |
CN115210322A (zh) * | 2020-03-27 | 2022-10-18 | 东丽株式会社 | 树脂组合物、布线基板及导电性图案的制造方法 |
CN115210322B (zh) * | 2020-03-27 | 2023-10-20 | 东丽株式会社 | 树脂组合物、布线基板及导电性图案的制造方法 |
CN116018655A (zh) * | 2020-09-28 | 2023-04-25 | 东丽株式会社 | 感光性树脂组合物、带导电图案的基板、天线元件、图像显示装置的制造方法及触摸面板的制造方法 |
CN116018655B (zh) * | 2020-09-28 | 2024-02-02 | 东丽株式会社 | 感光性树脂组合物、带导电图案的基板、天线元件、图像显示装置的制造方法及触摸面板的制造方法 |
CN112574623A (zh) * | 2020-11-30 | 2021-03-30 | 位速科技股份有限公司 | 高分子金属配合物涂布液与有机光伏元件 |
CN112574623B (zh) * | 2020-11-30 | 2022-02-25 | 位速科技股份有限公司 | 高分子金属配合物涂布液与有机光伏元件 |
Also Published As
Publication number | Publication date |
---|---|
EP3521925A4 (en) | 2020-06-03 |
US11422464B2 (en) | 2022-08-23 |
CN109791352B (zh) | 2022-07-29 |
KR102399714B1 (ko) | 2022-05-19 |
US20190265592A1 (en) | 2019-08-29 |
WO2018061384A1 (ja) | 2018-04-05 |
EP3521925B1 (en) | 2021-08-25 |
JP6841233B2 (ja) | 2021-03-10 |
TW201831613A (zh) | 2018-09-01 |
TWI797084B (zh) | 2023-04-01 |
EP3521925A1 (en) | 2019-08-07 |
KR20190058465A (ko) | 2019-05-29 |
JPWO2018061384A1 (ja) | 2019-07-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109791352A (zh) | 感光性树脂组合物、导电性图案的制造方法、基板、触摸面板及显示器 | |
TWI757548B (zh) | 著色樹脂組成物、著色膜、彩色濾光片及液晶顯示裝置 | |
CN108885399A (zh) | 负型感光性树脂组合物、固化膜、具备固化膜的显示装置、及其制造方法 | |
TWI585527B (zh) | A photosensitive composition for black matrix and a method for producing the same | |
KR102216990B1 (ko) | 감광성 조성물, 경화막 및 유기 el 표시 장치 | |
CN110392864A (zh) | 负型感光性树脂组合物、固化膜、具备固化膜的元件及有机el显示器、以及其制造方法 | |
JP7120022B2 (ja) | 有機el表示装置、ならびに画素分割層および平坦化層の形成方法 | |
CN107407870B (zh) | 感光性树脂组合物、导电性图案的制造方法、基板、触摸面板及显示器 | |
TWI741109B (zh) | 有機el顯示裝置 | |
TW201245306A (en) | Black resin composition, resin black matrix substrate and touch panel | |
CN106462058B (zh) | 感光性树脂组合物、导电性图案的制造方法、基板、元件和触控面板 | |
CN109328322A (zh) | 负型感光性树脂组合物、固化膜、具备固化膜的元件、具备元件的显示装置、及有机el显示器 | |
JP6604251B2 (ja) | 感光性樹脂組成物、導電性パターンの製造方法、基板、タッチパネルおよびディスプレイ | |
TW202223012A (zh) | 感光性樹脂組成物、附有導電圖案之基板、天線元件、影像顯示裝置之製造方法及觸控面板之製造方法 | |
TW202204501A (zh) | 樹脂組成物、配線基板及導電性圖案之製造方法 | |
CN117043676A (zh) | 正型感光性颜料组合物、及含有其硬化物的硬化膜、以及有机el显示装置 | |
WO2018029747A1 (ja) | 感光性樹脂組成物、導電性パターンの製造方法、基板、タッチパネル及びディスプレイ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |