CN109729741B - 半导体装置 - Google Patents

半导体装置 Download PDF

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CN109729741B
CN109729741B CN201780052168.9A CN201780052168A CN109729741B CN 109729741 B CN109729741 B CN 109729741B CN 201780052168 A CN201780052168 A CN 201780052168A CN 109729741 B CN109729741 B CN 109729741B
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conductor
semiconductor
lead
module
semiconductor element
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CN109729741A (zh
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大西正己
平尾高志
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Hitachi Astemo Ltd
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Abstract

在对用于半导体装置的半导体元件进行多并联化时，谋求成品率的提高、可靠性的提高。本发明的半导体装置具备：第1子模块，其具有被夹在第1导体和第2导体之间的第1半导体元件以及传递该第1半导体元件的控制信号的第1引线；第2子模块，其具有被夹在第3导体和第4导体之间的第2半导体元件以及传递该第2半导体元件的控制信号的第2引线；第5导体，其覆盖所述第1导体和所述第3导体而形成，并且与该第1导体和该第3导体相接合；以及第6导体，其覆盖所述第2导体和所述第4导体而形成，并且与该第2导体和该第4导体相接合，所述第1导体以不与所述第1引线中的第1连接部重叠的方式形成，所述第1连接部用于与所述第2引线连接。

Description

半导体装置
技术领域
本发明涉及半导体装置，特别涉及用于电力转换装置的半导体装置。
背景技术
近年来，在用于从直流电源产生交流电的电力转换装置中，由于发电规模的增大、动力装置的高输出化而寻求应对大电流的装置，该直流电源是作为风力发电、太阳光发电设备以及车载用电机等的动力电路的驱动电路所必须的。
然而，通过将这些电力转换装置设置在发电装置或动力驱动装置的附近，能够使动力装置等高效率运作，因此这些装置的小型·轻量化的需求也在提高。
在专利文献1中记载的半导体装置通过用2个导体构件夹住多个半导体元件的构造而变成1个模块。
另一方面，伴随着电力转换装置的高输出化的要求，将用于电力转换装置的半导体装置的半导体元件多并联地设置的情况在增多。
现有技术文献
专利文献
专利文献1：日本专利特开2002-110893号公报
发明内容
发明要解决的问题
本发明的问题是在对用于半导体装置的半导体元件进行多并联化时，谋求成品率的提高、可靠性的提高。
解决问题的技术手段
为了解决上述问题，本发明涉及的半导体装置具备：第1子模块，其具有被夹在第1导体和第2导体之间的第1半导体元件以及传递该第1半导体元件的控制信号的第1引线；第2子模块，其具有被夹在第3导体和第4导体之间的第2半导体元件以及传递该第2半导体元件的控制信号的第2引线；第5导体，其覆盖所述第1导体和所述第3导体而形成，并且与该第1导体和该第3导体相接合；以及第6导体，其覆盖所述第2导体和所述第4导体而形成，并且与该第2导体和该第4导体相接合，所述第1导体以不与所述第1引线中的第1连接部重叠的方式形成，所述第1连接部用于与所述第2引线连接。
发明效果
根据本发明，在对用于半导体装置的半导体元件进行多并联化时，能够谋求成品率的提高、可靠性的提高。
附图说明
图1是电力转换装置100的展开立体图。
图2是功率半导体模块101a的整体立体图。
图3是从功率半导体模块101a上拆除模块壳体220以及密封树脂207而得的电路体300的外部立体图。
图4是电路体300的展开立体图。
图5(a)是功率半导体模块101a具备的第1子模块421以及第2子模块422的展开立体图。
图5(b)是图5(a)所示的第1子模块421以及第2子模块422的俯视图。
图6是从穿过图4的线BB的截面的从箭头方向观察到的截面图。
具体实施方式
使用附图对用于实施本发明涉及的半导体装置的形态进行说明。
图1是电力转换装置100的展开立体图。
直流电压被施加至DC连接器104，直流电流由3个功率半导体模块101a至101c转换为交流电流。交流电流通过汇流条106并从AC连接器103输出3相交流电压。此时用电容器107吸收从3个功率半导体模块101a至101c产生的高次谐波成分，由此来抑制对电池的电压变动等。
控制基板102是电机控制用的基板，进行如下控制：将由3个功率半导体模块101a至101c产生的交流电压控制为由电机驱动指令值赋予的值。
另外，驱动基板105对用于驱动3个功率半导体模块101a至101c的信号进行控制，并且根据栅极电压的时间控制来对从AC连接器103输出的电压进行控制。
壳体108兼作功率半导体模块101a至101c的冷却用水通道，抑制在功率半导体模块101a至101c的切换时产生的热所引起的温度上升。
图2是功率半导体模块101a的整体立体图。功率半导体模块101b以及101c是和功率半导体模块101a同样的构成，因此省略说明。
功率半导体模块101a具有栅极控制端子201a以及201b、直流端子的N(Negative，负极)端子202、直流端子的P(Positive，正极)端子204以及交流输出用的AC端子203。
功率半导体模块101a将直流电压施加于N端子202、P端子204，并交互地将驱动信号输入栅极控制端子201a以及201b，由此，交流电压从AC控制端子203输出。
配线绝缘部206将栅极控制端子201a、201b、直流端子的N端子202、P端子204以及交流输出用的AC端子203分别绝缘，并提高端子间的绝缘。
另外，在模块壳体220内部配置有后述的切换用的半导体元件。密封树脂207提高配线绝缘部206和模块壳体220的绝缘性。
模块壳体220由凸缘208、设置有散热片210的散热部211以及连接凸缘208和散热部211的连接部209构成。从半导体元件产生的热通过水冷用的液体从散热部211散热。配线绝缘部206由固定部205固定于模块壳体220。
图3是从功率半导体模块101a上拆除模块壳体220以及密封树脂207而得的电路体300的外部立体图。图4是电路体300的展开立体图。图5(a)是功率半导体模块101a具备的第1子模块421以及第2子模块422的展开立体图。图5(b)是图5(a)所示的第1子模块421以及第2子模块422的俯视图。图6是从穿过图4的线BB的截面的从箭头方向观察到的截面图。
图5(a)所示的第1子模块421具有被夹在第1导体401a和第2导体402a之间的第1半导体元件409以及传递该第1半导体元件409的控制信号的第1引线411。第1导体401a与第1半导体元件409经由焊接材料相连。第2导体402a夹着第1半导体元件409被配置于与第1导体401a相对的位置。
第2子模块422具有被夹在第3导体403a和第4导体404a之间的第2半导体元件410以及传递该第2半导体元件410的控制信号的第2引线412。第3导体403a与第2半导体元件410经由焊接材料相连。第4导体404a夹着第2半导体元件410被配置于与第3导体403a相对的位置。
在本实施方式中，第1半导体元件409、第2半导体元件410分别设置了4个，但是2个以上的多个即可。
在本实施方式中，第1子模块421以及第2子模块422构成逆变电路的上臂电路。图4所示的第3子模块423以及第4子模块424与第1子模块421的构造以及功能相同，因此省略说明。第3子模块423以及第4子模块424构成逆变电路的下臂电路。
如图5(a)所示，电线416连接第1引线411与第1半导体元件409的控制电极。第1连接部413连接第1子模块421与第2子模块422。
如图3以及图4所示，第5导体405a覆盖第1导体401a和第3导体403a而形成，并且与第1导体401a和第3导体403a相接合。第6导体406a覆盖第2导体402a和第4导体404a而形成，并且与第2导体402a和第4导体404a相接合。接合例如使用焊接材料。
此外，第3子模块423具有第7导体401b和第8导体402b，第7导体401b和第8导体402b以相对的方式配置。第4子模块424具有第9导体403b和第10导体404b，第9导体403b和第10导体404b以相对的方式配置。
第11导体405b覆盖第7导体401b和第9导体403b而形成，并且与第7导体401b和第9导体403b相接合。第12导体406b覆盖第8导体402b和第10导体404b而形成，并且与第8导体402b和第10导体404b相接合。接合例如使用焊接材料。
通过分开构成第1子模块421和第2子模块422，从而在各个子模块中，能够对各种电气特性、产生的热分布等进行测定，变得能够分选子模块。由此，能够达成在由第5导体405a和第6导体406a连接多个子模块时的成品率的提高、可靠性的提高。
如图5(b)所示，从第1导体401a和第2导体402a的排列方向观察时，第1导体401a设置了第1凹部431，该第1凹部431形成为与第1连接部413相对的部分开槽。同样地，第3导体403a设置了第2凹部432，该第2凹部432形成为与第1连接部413相对的部分开槽。也就是说，从第1导体401a和第2导体402a的排列方向观察时，第1导体401a以及第3导体403a以不与第1连接部413重叠的方式形成了各自的外形。
当相邻地配置第1子模块421和第2子模块422时，第1凹部431与第2凹部432相连，并且第1连接部413经由第1凹部431和第2凹部432变为可见状态。由此，第1子模块420和第2子模块421的控制的各电极的连接工作经由第1凹部431和第2凹部432来进行，连接工序变得容易并且连接可靠性提高。
此外，第1凹部431分别形成于第1导体401a的相对的边。另外第2凹部432分别形成于第3导体403a相对的边。由此，即使在将2个第2子模块422配置于第1子模块421的两端的情况下，子模块的引线彼此的连接部也会变为经由第1凹部431和第2凹部432而连接部可见的状态，在使用3个以上的子模块的情况下，连接工序也变得容易并且连接可靠性提高。
另外在本实施方式中，如在图5(a)所示，第1引线411被配置于2个第1半导体元件409之间。由此，能够极力减少对各第1半导体元件409的驱动信号的传递距离的差。另外还能够使热源分散，并且能够防止由于热量集中而引起的可靠性降低。
尤其是，在第1子模块420中设置有2个队列，每个队列排列有2个第1半导体元件409。第1引线411被配置于这2个队列之间。由此，即使在设置了4个以上的第1半导体元件409的情况下，也能极力减少对各第1半导体元件409的驱动信号的传递距离的差。
此外，关于引线，第2子模块421至第4子模块424也是同样的构成。
另外如图4以及图6所示，第6导体406a形成收纳第2导体402a和第4导体404a的凹部430。由此，由于多个子模块安装时的定位精度的提高、接触面积的增加而引起的低电阻化以及低热阻化变得可能。
另外如图6所示，第5导体405a形成收纳第1导体401a和第3导体403a的凹部433。由此，由于多个子模块安装时的定位精度的提高、接触面积的增加而引起的低电阻化以及低热阻化变得可能。
另外如图5(a)所示，在本实施方式中，第1引线411被安装于配线基板513之上。此外第1引线411也可以以埋设于配线基板513并且第1连接部413露出的方式来构成。
而且第2导体402a形成收纳配线基板513的一部分的凹部532。由此，配线基板513安装时的定位精度的提高、减少对多个第1半导体元件409的驱动信号的距离的差变得可能。
在本实施方式中，能够由第1子模块420以及第2子模块421构成逆变电路的上下臂的一个臂，并且变得能够构成能够增加电流容量的逆变器。另外，通过改变子模块的并联数量，能够实现多种逆变器的电流容量。
符号说明
100…电流转换装置、101a…功率半导体模块、101b…功率半导体模块、101c…功率半导体模块、102…控制基板、103…AC连接器、104…DC连接器、105…驱动基板、106…汇流条、107…电容器、108…壳体、201a…栅极控制端子、201b…栅极控制端子、202…N端子、203…AC端子、204…P端子、205…固定部、206…配线绝缘部、207…密封树脂、208…凸缘、209…连接部、211…散热部、210…散热片、220…模块壳体、300…电路体、401a…第1导体、401b…第7导体、402a…第2导体、402b第8导体、403a…第3导体、403b…第9导体、404a…第4导体、404b…第10导体、405a…第5导体、405b…第11导体、406a…第6导体、406b…第12导体、409…第1半导体元件、410…第2半导体元件、411…第1引线、412…第2引线、413…第1连接部、416…电线、421…第1子模块、422…第2子模块、423…第3子模块、424…第4子模块、430…凹部、431…第1凹部、432…第2凹部、433…凹部、513…配线基板、532…凹部。

Claims (8)

1.一种半导体装置，其特征在于，具备：
第1子模块，其具有被夹在第1导体和第2导体之间的第1半导体元件以及传递该第1半导体元件的控制信号的第1引线；
第2子模块，其具有被夹在第3导体和第4导体之间的第2半导体元件以及传递该第2半导体元件的控制信号的第2引线；
第5导体，其覆盖所述第1导体和所述第3导体而形成，并且与该第1导体和该第3导体相接合；以及
第6导体，其覆盖所述第2导体和所述第4导体而形成，并且与该第2导体和该第4导体相接合，
所述第1导体以不与所述第1引线中的第1连接部重叠的方式形成，所述第1连接部用于与所述第2引线连接。
2.根据权利要求1所述的半导体装置，其特征在于，
所述第3导体以不与所述第2引线中的第1连接部重叠的方式形成，所述第1连接部用于与所述第1引线连接。
3.根据权利要求1所述的半导体装置，其特征在于，
所述第1半导体元件由多个半导体元件构成，
所述第1引线被配置于夹在所述1个以上的半导体元件之间的位置。
4.根据权利要求3所述的半导体装置，其特征在于，
所述第2半导体元件由多个半导体元件构成，
所述第2引线被配置于夹在所述1个以上的半导体元件之间的位置。
5.根据权利要求1所述的半导体装置，其特征在于，
所述第6导体形成收纳所述第2导体和所述第4导体的凹部。
6.根据权利要求5所述的半导体装置，其特征在于，
所述第5导体形成收纳所述第1导体和所述第3导体的凹部。
7.根据权利要求3所述的半导体装置，其特征在于，
所述第1子模块具有供所述第1引线安装的第1配线基板，
所述第2导体形成收纳所述第1配线基板的凹部。
8.根据权利要求1至7中的任一项所述的半导体装置，其特征在于，
由所述第1子模块以及所述第2子模块构成逆变电路的上下臂的一个臂。
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JP2018046033A (ja) 2018-03-22
US20190229032A1 (en) 2019-07-25

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