CN109686550B - 线圈电子组件 - Google Patents
线圈电子组件 Download PDFInfo
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- CN109686550B CN109686550B CN201811112983.2A CN201811112983A CN109686550B CN 109686550 B CN109686550 B CN 109686550B CN 201811112983 A CN201811112983 A CN 201811112983A CN 109686550 B CN109686550 B CN 109686550B
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- 239000011247 coating layer Substances 0.000 claims abstract description 49
- 239000012212 insulator Substances 0.000 claims abstract description 39
- 239000006249 magnetic particle Substances 0.000 claims abstract description 34
- 239000011810 insulating material Substances 0.000 claims abstract description 5
- 238000000231 atomic layer deposition Methods 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 19
- 230000008569 process Effects 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000007747 plating Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000011324 bead Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
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- 229910052802 copper Inorganic materials 0.000 description 2
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- 239000010409 thin film Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
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- 238000012827 research and development Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
本公开提供一种线圈电子组件,所述线圈电子组件包括:主体,包括绝缘体;线圈部,嵌在所述主体中;聚集体,分散在所述绝缘体中,其中,所述聚集体分别包括多个磁性颗粒;涂覆层,使用绝缘材料形成在所述聚集体的表面上;以及外电极,连接到所述线圈部。
Description
本申请要求于2017年10月18日提交到韩国知识产权局的第10-2017-0135379号韩国专利申请的优先权的权益,所述韩国专利申请的公开内容通过引用被全部包含于此。
技术领域
本公开涉及一种线圈电子组件。
背景技术
根据诸如数字电视(TV)、移动电话、膝上型计算机等的电子装置的小型化和薄型化,对在这样的电子装置中使用的线圈电子组件的小型化和薄型化的需求已经增大。为了满足这样的需求,已经积极对各种绕组型或薄膜型线圈电子组件进行研究和开发。
关于线圈电子组件的小型化和薄型化的主要问题在于:在小型化和薄型化的同时保持现有线圈电子组件的特性。为了保持这样的特性,应该增加填充有磁性材料的芯部中的磁性材料的比。然而,由于电感器的主体的强度的变化、取决于主体的绝缘性质的频率特性的变化等,因此在增大磁性材料的比的方面存在限制。
作为制造线圈电子组件的方法的示例,已经使用通过在线圈上堆叠然后压制磁性颗粒、树脂等彼此混合的片来实现主体的方法,并且铁氧体、金属等可用作磁性颗粒。当使用金属磁性颗粒时,就线圈电子组件的诸如磁导率等的特性而言,增大金属磁性颗粒的含量是有利的。然而,在这种情况下,主体的绝缘性质劣化,从而会劣化线圈电子组件的击穿电压特性。
发明内容
本公开的一方面可提供一种线圈电子组件,其中,可通过改善主体和线圈图案之间的电绝缘而改善线圈电子组件的电特性和磁特性。
根据本公开的一方面,一种线圈电子组件包括:主体,包括绝缘体;线圈部,嵌在所述主体中;聚集体,分散在所述绝缘体中,其中,所述聚集体分别包括多个磁性颗粒;涂覆层,使用绝缘材料形成在所述聚集体的表面上;以及外电极,连接到所述线圈部。
所述聚集体可具有多孔结构。
所述涂覆层可以是原子层沉积(ALD)层。
所述涂覆层可具有1μm或更小的厚度。
所述涂覆层可利用氧化铝形成。
所述绝缘体和所述涂覆层可利用不同的材料形成。
所述绝缘体可利用绝缘树脂形成,并且所述涂覆层可利用陶瓷形成。
所述绝缘体和所述涂覆层可利用不同的陶瓷材料形成。
所述绝缘体和所述涂覆层可使用相同的材料按照一体化的结构形成。
所述绝缘体和所述涂覆层可利用氧化铝形成。
所述磁性颗粒可具有导电性。
所述磁性颗粒可利用Fe基合金形成。
根据本公开的另一方面,一种线圈电子组件包括:主体,具有嵌在所述主体中的线圈部;以及外电极,连接到所述线圈部。所述主体包含在所述主体的绝缘体中的多个磁性颗粒,并且所述多个磁性颗粒涂覆有绝缘材料以形成涂覆层。
附图说明
通过下面结合附图进行的详细描述,本公开的以上和其他方面、特征及优点将被更加清楚地理解,在附图中:
图1是示出包括线圈电子组件的电子装置的示例的示意图;
图2是示出根据本公开的示例性实施例的线圈电子组件的示意性截面图;
图3是图2的区域A的放大图;
图4是示出通过原子层沉积(ALD)形成薄膜的原理的示图;
图5是示出根据另一示例性实施例的线圈电子组件中的主体的区域的示意性截面图。
具体实施方式
现在将在下文中参照附图详细地描述本公开的示例性实施例。
电子装置
图1是示出使用线圈电子组件的电子装置的示例的示意图。
参照图1,可领会的是,在电子装置中使用了各种电子组件。例如,可使用应用处理器、直流(DC)到DC转换器、通信处理器、无线局域网络(WLAN)模块、蓝牙(BT)模块、无线保真(WiFi)模块、调频器(FM)、全球定位系统(GPS)模块、近场通信(NFC)模块、电源管理集成电路(PMIC)、电池、开关模式电池充电器(SMBC)、液晶显示器(LCD)、有源矩阵有机发光二极管(AMOLED)、音频编解码器、通用串行总线(USB)2.0/3.0模块、高清晰度多媒体接口(HDMI)、CAM、蜂窝射频(RF)模块、键盘(key board)、直流输入端子(DC IN)等。在这种情况下,可在这些电子组件之间根据线圈电子组件的用途适当地使用各种线圈电子组件,以消除噪声等。例如,可使用功率电感器1、高频(HF)电感器2、普通磁珠3、用于高频(GHz)的磁珠4和共模滤波器5等。
详细地,功率电感器1可用于以磁场形式储存电力以保持输出电压,从而稳定电力。此外,高频(HF)电感器2可用于执行阻抗匹配,以确保所需的频率或阻挡噪声和交流(AC)分量。此外,普通磁珠3可用于消除电源和信号线的噪声或消除高频纹波。此外,用于高频(GHz)的磁珠4可用于消除与音频相关的信号线和电力线的高频噪声。此外,共模滤波器5可用于使电流以差分模式流过共模滤波器5并且仅消除共模噪声。
电子装置可以是典型的智能电话,但不限于此。电子装置还可以是例如个人数字助理、数字摄像机、数码相机、网络系统、计算机、监视器、电视机、视频游戏机、智能手表等。除了以上描述的装置之外,电子装置还可以是本领域技术人员公知的各种其他电子装置。
线圈电子组件
为了便于说明,将在下文中描述根据本公开的线圈电子组件,具体地,电感器。然而,根据本公开的线圈电子组件也可用作如上所述的用于各种目的的线圈电子组件。
图2是示出根据本公开的示例性实施例的线圈电子组件的示意性截面图。图3是图2的区域A的放大图。图4是示出通过原子层沉积(ALD)形成薄膜的原理的示图。
根据本公开的示例性实施例的线圈电子组件100可包括作为主要组件的主体101、线圈部103以及外电极105和106,并且可包括形成在线圈部103的表面上以使线圈部103绝缘的绝缘层104。线圈部103可嵌在主体101中。在这种情况下,支撑线圈部103的支撑构件102可设置在主体101中。
线圈部103可在电子装置内按照各种功能运行。例如,线圈电子组件100可以是功率电感器。在这种情况下,线圈部103可用于以磁场形式储存电力以保持输出电压,结果使电力稳定。在这种情况下,构成线圈部103的线圈图案可分别堆叠在支撑构件102的相对的表面上,并且可通过贯穿支撑构件102的导电过孔彼此电连接。线圈部103可具有螺旋形形状,并且包括形成在螺旋形形状的最外部分处的引线部。为了电连接到外电极105和106的目的,引线部可暴露到主体101的外部。
构成线圈部103的线圈图案可通过在现有技术中使用的诸如图案镀覆工艺、各向异性镀覆工艺、各向同性镀覆工艺等的镀覆工艺形成,并且也可通过这些工艺中的多个工艺按照多层结构形成。
支撑线圈部103的支撑构件102可利用聚丙二醇(PPG)基板、铁氧体基板、金属基软磁基板等形成。另外,为了将线圈部103与设置在主体101中的磁性颗粒112电分离,可使用形成在线圈部103的表面上的绝缘层104,并且绝缘层104可利用氧化物膜、聚合物材料等形成,并且也可使用ALD层。
外电极105和106可形成在主体101的外表面上,并且可连接到线圈部103,更具体地,可连接到线圈部103的引线部。外电极105和106可利用包括具有优异的导电性的金属的膏(诸如包括镍(Ni)、铜(Cu)、锡(Sn)或银(Ag)或其合金的导电膏)形成。另外,镀覆层(未示出)还可形成在外电极105和106上。在这种情况下,镀覆层可包括从由镍(Ni)、铜(Cu)和锡(Sn)构成的组中选择的一种或更多种金属。例如,镍(Ni)层和锡(Sn)层可顺序地形成在镀覆层中。
如图3所示,在本示例性实施例中,主体101可包括绝缘体111和以聚集体S的形式分散在绝缘体111中的多个磁性颗粒112。另外,涂覆层113可使用绝缘材料形成在聚集体S的表面上。诸如环氧树脂的绝缘树脂可用作绝缘体111。除了树脂之外,另一种材料可被用作绝缘体111的材料。例如,绝缘体111可利用诸如氧化铝、氧化硅等的陶瓷形成。
磁性颗粒112可利用具有磁性性质的导电材料形成。这样的材料的示例可包括Fe基合金。详细地,磁性颗粒112可利用具有Fe-Si-B-Nb-Cr组合物的纳米晶粒基合金、Fe-Ni基合金等形成。当磁性颗粒112使用如上所述的Fe基合金实现时,主体101的磁性性质(诸如磁导率等)可以是优异的,但主体101会容易受到静电放电(ESD)的影响,并且因此在磁性颗粒112之间以及磁性颗粒112和线圈部103之间可需要适当的绝缘结构。也就是说,当磁性颗粒112的绝缘性质劣化时,线圈电子组件的击穿电压特性会劣化,使得在磁性颗粒112之间或磁性颗粒112与线圈部103之间会形成导电路径,导致诸如电感器的电感减小等的特性的劣化。
在本示例性实施例中,如图3所示,磁性颗粒112可以以聚集体S的形式实现,并且涂覆层113可形成在聚集体S的表面上以使磁性颗粒112有效地绝缘。通过聚集多个颗粒获得的聚集体S可具有多孔结构,并且聚集体S可通过弱烧结磁性颗粒112形成或使用少量的粘合剂成分在磁性颗粒112之间诱导产生颈缩形成。
覆盖聚集体S的表面的涂覆层113可以是原子层沉积(ALD)层以提供磁性颗粒112的有效绝缘结构。如图4所示,ALD可以是能够在周期性地供应和排出反应物的工艺中通过表面化学反应在目标物P的表面上按照原子层A1和A2的水平执行非常均匀的涂覆的工艺,并且通过ALD获得的ALD层可具有小的厚度并且具有优异的绝缘性质。另外,ALD层可具有优异的厚度均匀性,并且可在耐热性和热膨胀特性方面得到提高。ALD工艺可用于在聚集体S的细小的腔中有效地形成涂覆层113并且提供整个主体101的均匀的绝缘性质。在这种情况下,通过ALD形成的涂覆层113可利用诸如氧化铝(Al2O3)、氧化硅(SiO2)等的陶瓷形成。涂覆层113的厚度可大约为1μm或更小,更优选地,可大约为100nm或更小。
涂覆层113和绝缘体111可利用不同的材料形成。作为示例,如上所述,绝缘体111可利用绝缘树脂形成,并且涂覆层113可利用陶瓷形成。另外,绝缘体111和涂覆层113可利用不同的陶瓷材料形成。在这种情况下,涂覆层113可通过ALD工艺形成,并且绝缘体111可利用诸如化学气相沉积等的另一工艺以及ALD工艺形成。当绝缘体111和涂覆层113两者利用陶瓷形成时,由于磁性材料的增加,可改善主体101的磁性特性。
同时,如在图5的变型示例中,绝缘体和涂覆层可使用相同的材料按照一体化的结构形成,并且绝缘体和涂覆层具有一体化的结构,并且可因此统称为涂覆层113'。具有一体化的结构的绝缘体和涂覆层113'可利用诸如氧化铝等的陶瓷形成。在这种情况下,绝缘体和涂覆层113'可通过相同的工艺形成,或者可通过不同的工艺获得。涂覆层113'可通过ALD工艺形成,并且绝缘体111可通过诸如化学气相沉积等的另一工艺以及ALD工艺形成。详细地,涂覆聚集体S的表面的涂覆层可通过ALD工艺形成,并且考虑到绝缘体区域具有相对大的体积的事实,覆盖涂覆层的绝缘体区域可通过诸如化学气相沉积等的工艺形成。
如以上所阐述的,在根据本公开的示例性实施例的线圈电子组件中,可改善主体与线圈图案之间的电绝缘性质,从而可改善线圈电子组件的电特性和磁特性。
虽然以上已经示出和描述了示例性实施例,但是对于本领域技术人员将明显的是,在不脱离由所附权利要求限定的本发明的范围的情况下,可进行修改和变型。
Claims (11)
1.一种线圈电子组件,包括:
主体,包括绝缘体和分散在所述绝缘体中的多个聚集体,并且所述多个聚集体中的每个聚集体是多个磁性颗粒彼此接触而聚在一起并且具有多孔结构的聚集体;
线圈部,嵌在所述主体中;
涂覆层,形成在所述多个聚集体中的所述每个聚集体的表面上以包裹所述每个聚集体;以及
外电极,连接到所述线圈部,
其中,所述多个聚集体彼此间隔开,所述绝缘体的材料填充到相邻的所述聚集体之间,使得所述多个聚集体表面上的涂覆层除了与所述磁性颗粒接触外,仅与所述绝缘体接触,并且所述涂覆层沿着多个所述磁性颗粒的表面形成,在相邻的所述磁性颗粒之间所述涂覆层的延伸方向发生转折,
其中,所述涂覆层利用陶瓷形成,所述绝缘体和所述涂覆层利用不同的材料形成。
2.根据权利要求1所述的线圈电子组件,其中,所述涂覆层是原子层沉积层。
3.根据权利要求1所述的线圈电子组件,其中,所述涂覆层具有1μm或更小的厚度。
4.根据权利要求1所述的线圈电子组件,其中,所述涂覆层利用氧化铝形成。
5.根据权利要求1所述的线圈电子组件,其中,所述绝缘体包括绝缘树脂。
6.根据权利要求1所述的线圈电子组件,其中,所述绝缘体和所述涂覆层利用不同的陶瓷材料形成。
7.根据权利要求1所述的线圈电子组件,其中,所述磁性颗粒是导电的。
8.根据权利要求7所述的线圈电子组件,其中,所述磁性颗粒利用Fe基合金形成。
9.一种线圈电子组件,包括:
主体,包括绝缘体和分散在所述绝缘体中的多个聚集体,并且所述多个聚集体中的每个聚集体是多个磁性颗粒彼此接触而聚在一起并且具有多孔结构的聚集体,并且具有嵌在所述主体中的线圈部;
外电极,连接到所述线圈部;以及
涂覆层,形成在所述多个聚集体中的所述每个聚集体的表面上以包裹所述每个聚集体,并且
其中,所述涂覆层是原子层沉积层,并且所述涂覆层利用绝缘材料形成,所述绝缘体和所述涂覆层利用不同的材料形成,所述多个聚集体彼此间隔开,所述绝缘体的材料填充到相邻的所述聚集体之间,使得所述多个聚集体表面上的涂覆层除了与所述磁性颗粒接触外,仅与所述绝缘体接触,并且所述涂覆层沿着多个所述磁性颗粒的表面形成,在相邻的所述磁性颗粒之间所述涂覆层的延伸方向发生转折。
10.根据权利要求9所述的线圈电子组件,其中,所述涂覆层具有1μm或更小的厚度。
11.根据权利要求9所述的线圈电子组件,其中,所述涂覆层利用氧化铝形成。
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