CN109616428B - 带有多个加热区的基板支撑件 - Google Patents

带有多个加热区的基板支撑件 Download PDF

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Publication number
CN109616428B
CN109616428B CN201811129813.5A CN201811129813A CN109616428B CN 109616428 B CN109616428 B CN 109616428B CN 201811129813 A CN201811129813 A CN 201811129813A CN 109616428 B CN109616428 B CN 109616428B
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Prior art keywords
heating
heater
heating zone
circular vacuum
substrate support
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CN201811129813.5A
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Chinese (zh)
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CN109616428A (zh
Inventor
松下智治
贾勒帕里·拉维
蔡振雄
阿拉维德·卡马斯
枭雄·袁
曼朱纳塔·科普帕
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/037—Heaters with zones of different power density
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

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  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
CN201811129813.5A 2014-12-31 2015-10-22 带有多个加热区的基板支撑件 Active CN109616428B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201462098887P 2014-12-31 2014-12-31
US62/098,887 2014-12-31
US14/634,711 US9888528B2 (en) 2014-12-31 2015-02-27 Substrate support with multiple heating zones
US14/634,711 2015-02-27
PCT/US2015/056934 WO2016109008A1 (en) 2014-12-31 2015-10-22 Substrate support with multiple heating zones
CN201580068865.4A CN107112262B (zh) 2014-12-31 2015-10-22 带有多个加热区的基板支撑件

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201580068865.4A Division CN107112262B (zh) 2014-12-31 2015-10-22 带有多个加热区的基板支撑件

Publications (2)

Publication Number Publication Date
CN109616428A CN109616428A (zh) 2019-04-12
CN109616428B true CN109616428B (zh) 2023-02-03

Family

ID=56166038

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CN201811129813.5A Active CN109616428B (zh) 2014-12-31 2015-10-22 带有多个加热区的基板支撑件
CN201580068865.4A Active CN107112262B (zh) 2014-12-31 2015-10-22 带有多个加热区的基板支撑件

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Application Number Title Priority Date Filing Date
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Country Status (6)

Country Link
US (1) US9888528B2 (enExample)
JP (1) JP6974169B2 (enExample)
KR (1) KR102425944B1 (enExample)
CN (2) CN109616428B (enExample)
TW (1) TWI682489B (enExample)
WO (1) WO2016109008A1 (enExample)

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JP6847610B2 (ja) * 2016-09-14 2021-03-24 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
US10468290B2 (en) * 2016-11-02 2019-11-05 Ultratech, Inc. Wafer chuck apparatus with micro-channel regions
US11598003B2 (en) * 2017-09-12 2023-03-07 Applied Materials, Inc. Substrate processing chamber having heated showerhead assembly
US11330673B2 (en) * 2017-11-20 2022-05-10 Applied Materials, Inc. Heated substrate support
SG11202007857XA (en) 2018-02-09 2020-09-29 Applied Materials Inc Semiconductor processing apparatus having improved temperature control
US10910243B2 (en) 2018-08-31 2021-02-02 Applied Materials, Inc. Thermal management system
CN113169109B (zh) * 2018-11-30 2025-07-01 朗姆研究公司 用于增进热均匀性的具有多层加热器的陶瓷基座
US11562913B2 (en) * 2019-04-25 2023-01-24 Watlow Electric Manufacturing Company Multi-zone azimuthal heater
TWI857083B (zh) * 2019-06-25 2024-10-01 美商應用材料股份有限公司 基板支撐基座與包括此基板支撐基座的處理腔室、以及處理方法與包含指令以實行此處理方法的非暫態電腦可讀取媒體
US20210035851A1 (en) * 2019-07-30 2021-02-04 Applied Materials, Inc. Low contact area substrate support for etching chamber
KR20220071220A (ko) * 2019-09-27 2022-05-31 램 리써치 코포레이션 기판 지지부들의 온도 분포 프로파일들에 영향을 주는 튜닝 가능한 열 차폐부 (heat shield) 및 튜닝 불가능한 열 차폐부
JP7407752B2 (ja) * 2021-02-05 2024-01-04 日本碍子株式会社 ウエハ支持台
US20220367236A1 (en) * 2021-05-16 2022-11-17 Applied Materials, Inc. Heater pedestal with improved uniformity
EP4177030A1 (de) * 2021-06-14 2023-05-10 MULTIVAC Sepp Haggenmüller SE & Co. KG Arbeitsstation für folienverarbeitende verpackungsmaschine
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
TW202349558A (zh) * 2022-04-28 2023-12-16 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 靜電卡盤台座加熱器及用於選擇性地夾持及加熱基材之設備
WO2024091389A1 (en) * 2022-10-24 2024-05-02 Lam Research Corporation Heat flow control in a processing tool
JP2024155101A (ja) 2023-04-20 2024-10-31 住友電気工業株式会社 ウエハ保持体
WO2024257286A1 (ja) 2023-06-14 2024-12-19 住友電気工業株式会社 ウエハ保持台、および半導体処理装置
KR102731017B1 (ko) 2023-10-30 2024-11-19 주식회사 미코세라믹스 세라믹 서셉터

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WO1999056307A1 (en) * 1998-04-28 1999-11-04 Applied Materials, Inc. Improved heater for use in substrate processing apparatus to deposit tungsten
JP2003007432A (ja) * 2001-06-21 2003-01-10 Nhk Spring Co Ltd セラミックスヒータ
TW563222B (en) * 2001-06-25 2003-11-21 Applied Materials Inc Apparatus and method for thermally isolating a heat chamber
JP2005136104A (ja) * 2003-10-29 2005-05-26 Ngk Spark Plug Co Ltd 静電チャック
KR20070105929A (ko) * 2006-04-27 2007-10-31 어플라이드 머티어리얼스, 인코포레이티드 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대
JP2009076689A (ja) * 2007-09-20 2009-04-09 Tokyo Electron Ltd 基板処理装置及びそれに用いる基板載置台
CN103733327A (zh) * 2011-08-08 2014-04-16 应用材料公司 具有加热器的基板支撑件

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JP2527836B2 (ja) * 1990-08-17 1996-08-28 日本碍子株式会社 半導体ウエハ―加熱装置
JP3210051B2 (ja) * 1992-01-16 2001-09-17 株式会社東芝 気相成長装置
US6001183A (en) * 1996-06-10 1999-12-14 Emcore Corporation Wafer carriers for epitaxial growth processes
US6617553B2 (en) * 1999-05-19 2003-09-09 Applied Materials, Inc. Multi-zone resistive heater
JP2002100460A (ja) * 2000-09-22 2002-04-05 Ibiden Co Ltd セラミックヒータおよびホットプレートユニット
JP4660926B2 (ja) 2001-01-09 2011-03-30 東京エレクトロン株式会社 枚葉式の処理装置
JP3897563B2 (ja) * 2001-10-24 2007-03-28 日本碍子株式会社 加熱装置
JP4642358B2 (ja) * 2004-01-13 2011-03-02 株式会社日立ハイテクノロジーズ ウエハ載置用電極
JP3769583B1 (ja) * 2004-07-09 2006-04-26 積水化学工業株式会社 基材処理装置及び方法
US8226769B2 (en) 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
US7705276B2 (en) * 2006-09-14 2010-04-27 Momentive Performance Materials Inc. Heater, apparatus, and associated method
JP2008207198A (ja) * 2007-02-26 2008-09-11 Matsushita Electric Ind Co Ltd 金型ガイド機構および金型
JP2009054871A (ja) * 2007-08-28 2009-03-12 Tokyo Electron Ltd 載置台構造及び処理装置
US20090274590A1 (en) 2008-05-05 2009-11-05 Applied Materials, Inc. Plasma reactor electrostatic chuck having a coaxial rf feed and multizone ac heater power transmission through the coaxial feed
US8274017B2 (en) * 2009-12-18 2012-09-25 Applied Materials, Inc. Multifunctional heater/chiller pedestal for wide range wafer temperature control
JP2012028428A (ja) * 2010-07-21 2012-02-09 Tokyo Electron Ltd 載置台構造及び処理装置
KR101343556B1 (ko) * 2012-05-18 2013-12-19 주식회사 케이에스엠컴포넌트 2차원적으로 배선된 열선을 포함하는 세라믹 히터
US9538583B2 (en) 2013-01-16 2017-01-03 Applied Materials, Inc. Substrate support with switchable multizone heater
US9853579B2 (en) 2013-12-18 2017-12-26 Applied Materials, Inc. Rotatable heated electrostatic chuck

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999056307A1 (en) * 1998-04-28 1999-11-04 Applied Materials, Inc. Improved heater for use in substrate processing apparatus to deposit tungsten
JP2003007432A (ja) * 2001-06-21 2003-01-10 Nhk Spring Co Ltd セラミックスヒータ
TW563222B (en) * 2001-06-25 2003-11-21 Applied Materials Inc Apparatus and method for thermally isolating a heat chamber
JP2005136104A (ja) * 2003-10-29 2005-05-26 Ngk Spark Plug Co Ltd 静電チャック
KR20070105929A (ko) * 2006-04-27 2007-10-31 어플라이드 머티어리얼스, 인코포레이티드 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대
JP2009076689A (ja) * 2007-09-20 2009-04-09 Tokyo Electron Ltd 基板処理装置及びそれに用いる基板載置台
CN103733327A (zh) * 2011-08-08 2014-04-16 应用材料公司 具有加热器的基板支撑件

Also Published As

Publication number Publication date
CN109616428A (zh) 2019-04-12
CN107112262A (zh) 2017-08-29
TWI682489B (zh) 2020-01-11
US9888528B2 (en) 2018-02-06
TW201624607A (zh) 2016-07-01
US20160192444A1 (en) 2016-06-30
WO2016109008A1 (en) 2016-07-07
KR20170101973A (ko) 2017-09-06
JP2018505551A (ja) 2018-02-22
KR102425944B1 (ko) 2022-07-26
CN107112262B (zh) 2021-09-03
JP6974169B2 (ja) 2021-12-01

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