KR102425944B1 - 다수의 가열 구역들을 갖는 기판 지지부 - Google Patents

다수의 가열 구역들을 갖는 기판 지지부 Download PDF

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KR102425944B1
KR102425944B1 KR1020177021355A KR20177021355A KR102425944B1 KR 102425944 B1 KR102425944 B1 KR 102425944B1 KR 1020177021355 A KR1020177021355 A KR 1020177021355A KR 20177021355 A KR20177021355 A KR 20177021355A KR 102425944 B1 KR102425944 B1 KR 102425944B1
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South Korea
Prior art keywords
heating
vacuum channel
circular vacuum
heater
substrate support
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Korean (ko)
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KR20170101973A (ko
Inventor
토모하루 마추시타
잘레팔리 라비
쳉-슝 차이
아라빈드 카맛트
시아오시옹 유안
만주나타 코파
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/037—Heaters with zones of different power density

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
KR1020177021355A 2014-12-31 2015-10-22 다수의 가열 구역들을 갖는 기판 지지부 Active KR102425944B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462098887P 2014-12-31 2014-12-31
US62/098,887 2014-12-31
US14/634,711 US9888528B2 (en) 2014-12-31 2015-02-27 Substrate support with multiple heating zones
US14/634,711 2015-02-27
PCT/US2015/056934 WO2016109008A1 (en) 2014-12-31 2015-10-22 Substrate support with multiple heating zones

Publications (2)

Publication Number Publication Date
KR20170101973A KR20170101973A (ko) 2017-09-06
KR102425944B1 true KR102425944B1 (ko) 2022-07-26

Family

ID=56166038

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177021355A Active KR102425944B1 (ko) 2014-12-31 2015-10-22 다수의 가열 구역들을 갖는 기판 지지부

Country Status (6)

Country Link
US (1) US9888528B2 (enExample)
JP (1) JP6974169B2 (enExample)
KR (1) KR102425944B1 (enExample)
CN (2) CN107112262B (enExample)
TW (1) TWI682489B (enExample)
WO (1) WO2016109008A1 (enExample)

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US12406864B2 (en) 2023-10-30 2025-09-02 Mico Ceramics Ltd. Susceptor

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JP6847610B2 (ja) * 2016-09-14 2021-03-24 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
US10468290B2 (en) * 2016-11-02 2019-11-05 Ultratech, Inc. Wafer chuck apparatus with micro-channel regions
US11598003B2 (en) 2017-09-12 2023-03-07 Applied Materials, Inc. Substrate processing chamber having heated showerhead assembly
US11330673B2 (en) * 2017-11-20 2022-05-10 Applied Materials, Inc. Heated substrate support
SG11202007857XA (en) 2018-02-09 2020-09-29 Applied Materials Inc Semiconductor processing apparatus having improved temperature control
US10910243B2 (en) 2018-08-31 2021-02-02 Applied Materials, Inc. Thermal management system
CN113169109B (zh) * 2018-11-30 2025-07-01 朗姆研究公司 用于增进热均匀性的具有多层加热器的陶瓷基座
US11562913B2 (en) * 2019-04-25 2023-01-24 Watlow Electric Manufacturing Company Multi-zone azimuthal heater
WO2020263939A1 (en) * 2019-06-25 2020-12-30 Applied Materials, Inc. Dual-function wafer backside pressure control and edge purge
US20210035851A1 (en) * 2019-07-30 2021-02-04 Applied Materials, Inc. Low contact area substrate support for etching chamber
CN114514602B (zh) * 2019-09-27 2025-11-07 朗姆研究公司 用于影响衬底支撑件的温度分布轮廓的可调式和不可调式热屏
JP7407752B2 (ja) * 2021-02-05 2024-01-04 日本碍子株式会社 ウエハ支持台
US20220367236A1 (en) * 2021-05-16 2022-11-17 Applied Materials, Inc. Heater pedestal with improved uniformity
EP4177031B1 (de) * 2021-06-14 2024-07-24 MULTIVAC Sepp Haggenmüller SE & Co. KG Arbeitsstation für folienverarbeitende verpackungsmaschine
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
TW202349558A (zh) * 2022-04-28 2023-12-16 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 靜電卡盤台座加熱器及用於選擇性地夾持及加熱基材之設備
JP2025534167A (ja) * 2022-10-24 2025-10-14 ラム リサーチ コーポレーション 処理ツールにおける熱流制御
JP2024155101A (ja) 2023-04-20 2024-10-31 住友電気工業株式会社 ウエハ保持体
WO2024257286A1 (ja) 2023-06-14 2024-12-19 住友電気工業株式会社 ウエハ保持台、および半導体処理装置

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JP2005203426A (ja) * 2004-01-13 2005-07-28 Hitachi High-Technologies Corp ウエハ載置用電極
JP2009076689A (ja) * 2007-09-20 2009-04-09 Tokyo Electron Ltd 基板処理装置及びそれに用いる基板載置台

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KR101343556B1 (ko) * 2012-05-18 2013-12-19 주식회사 케이에스엠컴포넌트 2차원적으로 배선된 열선을 포함하는 세라믹 히터
US9538583B2 (en) 2013-01-16 2017-01-03 Applied Materials, Inc. Substrate support with switchable multizone heater
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JP2005203426A (ja) * 2004-01-13 2005-07-28 Hitachi High-Technologies Corp ウエハ載置用電極
JP2009076689A (ja) * 2007-09-20 2009-04-09 Tokyo Electron Ltd 基板処理装置及びそれに用いる基板載置台

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12406864B2 (en) 2023-10-30 2025-09-02 Mico Ceramics Ltd. Susceptor

Also Published As

Publication number Publication date
CN107112262A (zh) 2017-08-29
WO2016109008A1 (en) 2016-07-07
US20160192444A1 (en) 2016-06-30
JP2018505551A (ja) 2018-02-22
CN109616428B (zh) 2023-02-03
CN109616428A (zh) 2019-04-12
US9888528B2 (en) 2018-02-06
TW201624607A (zh) 2016-07-01
CN107112262B (zh) 2021-09-03
TWI682489B (zh) 2020-01-11
JP6974169B2 (ja) 2021-12-01
KR20170101973A (ko) 2017-09-06

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