JP7407752B2 - ウエハ支持台 - Google Patents
ウエハ支持台 Download PDFInfo
- Publication number
- JP7407752B2 JP7407752B2 JP2021017029A JP2021017029A JP7407752B2 JP 7407752 B2 JP7407752 B2 JP 7407752B2 JP 2021017029 A JP2021017029 A JP 2021017029A JP 2021017029 A JP2021017029 A JP 2021017029A JP 7407752 B2 JP7407752 B2 JP 7407752B2
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- Prior art keywords
- heater
- heaters
- wafer
- ceramic base
- jumper
- Prior art date
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- 239000000919 ceramic Substances 0.000 claims description 25
- 230000015572 biosynthetic process Effects 0.000 claims description 14
- 230000005611 electricity Effects 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/007—Heaters using a particular layout for the resistive material or resistive elements using multiple electrically connected resistive elements or resistive zones
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/014—Heaters using resistive wires or cables not provided for in H05B3/54
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Ceramic Engineering (AREA)
- Plasma & Fusion (AREA)
- Inorganic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
ウエハ載置面を有するセラミック基体と、
前記セラミック基体に埋設された複数のヒータと、
を備え、
前記セラミック基体は、前記ウエハ載置面から前記ウエハ載置面とは反対側の面に向かって、第1ヒータ形成面、前記第2ヒータ形成面及び前記第3ヒータ形成面をこの順に有し、
前記複数のヒータは、前記第1ヒータ形成面に設けられた第1ヒータ、前記第2ヒータ形成面に設けられた第2ヒータ及び前記第3ヒータ形成面に設けられた第3ヒータを含み、
前記第1ヒータは、前記セラミック基体の中心に位置するように設けられ、
前記第2ヒータは、前記第1ヒータの外周に位置するように設けられ、
前記第3ヒータは、前記第2ヒータに重なるように設けられ、前記第3ヒータ形成面が半径方向の線分によって複数に分割されたゾーンのそれぞれに設けられている、
ものである。
Claims (6)
- ウエハ載置面を有するセラミック基体と、
前記セラミック基体に埋設された複数のヒータと、
を備え、
前記セラミック基体は、前記ウエハ載置面から前記ウエハ載置面とは反対側の面に向かって、第1ヒータ形成面、第2ヒータ形成面及び第3ヒータ形成面をこの順に有し、
前記複数のヒータは、前記第1ヒータ形成面に設けられた第1ヒータ、前記第2ヒータ形成面に設けられた第2ヒータ及び前記第3ヒータ形成面に設けられた第3ヒータを含み、
前記第1ヒータは、前記セラミック基体の中心に位置するように設けられ、
前記第2ヒータは、前記第1ヒータの外周に位置するように設けられ、
前記第3ヒータは、平面視で前記第2ヒータに重なるように設けられ、前記第3ヒータ形成面が半径方向の線分によって複数に分割されたゾーンのそれぞれに設けられている、
ウエハ支持台。 - 第2ヒータ用ジャンパは、前記第2ヒータ形成面に設けられ、
第3ヒータ用ジャンパは、前記第3ヒータ形成面に設けられている、
請求項1に記載のウエハ支持台。 - 前記第1ヒータ、前記第2ヒータおよび前記第3ヒータはコイル形状であり、前記第2ヒータ用ジャンパは、前記第2ヒータのコイル中心よりも前記ウエハ載置面とは反対側の面側に接続され、
前記第3ヒータ用ジャンパは、前記第3ヒータのコイル中心よりも前記ウエハ載置面側に接続されている、
請求項2に記載のウエハ支持台。 - 前記第1ヒータ、前記第2ヒータおよび前記第3ヒータに電気を供給する端子穴は、各ヒータの深さに比例して深くなっている、
請求項1~3のいずれか1項に記載のウエハ支持台。 - 前記セラミック基体は、前記複数のヒータよりも前記ウエハ載置面側にRF電極を有すると共に、前記ウエハ載置面とは反対側の面に筒状のシャフトを有し、
前記第1ヒータに電気を供給するロッドと、前記第2ヒータに電気を供給するロッドと、前記第3ヒータに電気を供給するロッドと、前記RF電極に接続されたロッドは、前記シャフトから突出した部分の長さがすべて同じである、
請求項1~4のいずれか1項に記載のウエハ支持台。 - 前記第2ヒータは、前記第2ヒータ形成面を前記セラミック基体と同心円状の境界によって複数に分割されたゾーンのそれぞれに設けられている、
請求項1~5のいずれか1項に記載のウエハ支持台。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021017029A JP7407752B2 (ja) | 2021-02-05 | 2021-02-05 | ウエハ支持台 |
US17/577,599 US20220254662A1 (en) | 2021-02-05 | 2022-01-18 | Wafer support table |
KR1020220006976A KR20220113258A (ko) | 2021-02-05 | 2022-01-18 | 웨이퍼 지지대 |
CN202210063877.XA CN114883165A (zh) | 2021-02-05 | 2022-01-20 | 晶片支撑台 |
TW111103088A TWI799108B (zh) | 2021-02-05 | 2022-01-25 | 晶圓承載台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021017029A JP7407752B2 (ja) | 2021-02-05 | 2021-02-05 | ウエハ支持台 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022120251A JP2022120251A (ja) | 2022-08-18 |
JP7407752B2 true JP7407752B2 (ja) | 2024-01-04 |
Family
ID=82667608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021017029A Active JP7407752B2 (ja) | 2021-02-05 | 2021-02-05 | ウエハ支持台 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220254662A1 (ja) |
JP (1) | JP7407752B2 (ja) |
KR (1) | KR20220113258A (ja) |
CN (1) | CN114883165A (ja) |
TW (1) | TWI799108B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003123943A (ja) | 2001-10-17 | 2003-04-25 | Ngk Insulators Ltd | 加熱装置 |
JP2003288975A (ja) | 2002-03-27 | 2003-10-10 | Ngk Insulators Ltd | セラミックヒーター、セラミックヒーターの製造方法、および金属部材の埋設品 |
JP3156031U (ja) | 2009-09-29 | 2009-12-10 | 日本碍子株式会社 | セラミックスヒーター |
JP2018056332A (ja) | 2016-09-29 | 2018-04-05 | 日本特殊陶業株式会社 | 加熱装置 |
WO2019008889A1 (ja) | 2017-07-07 | 2019-01-10 | 住友電気工業株式会社 | 半導体基板加熱用の基板載置台 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2533679B2 (ja) * | 1990-08-17 | 1996-09-11 | 日本碍子株式会社 | 盤状セラミックスヒ―タ―及びその製造方法 |
TWM400082U (en) * | 2010-09-01 | 2011-03-11 | Boogang Semiconductor Co Ltd | Wafer heating device |
CN111052343B (zh) * | 2018-07-04 | 2023-10-03 | 日本碍子株式会社 | 晶圆支撑台 |
CN111385917B (zh) * | 2018-12-29 | 2022-07-15 | 中微半导体设备(上海)股份有限公司 | 一种用于组装esc的多平面多路可调节温度的加热器 |
-
2021
- 2021-02-05 JP JP2021017029A patent/JP7407752B2/ja active Active
-
2022
- 2022-01-18 KR KR1020220006976A patent/KR20220113258A/ko not_active Application Discontinuation
- 2022-01-18 US US17/577,599 patent/US20220254662A1/en active Pending
- 2022-01-20 CN CN202210063877.XA patent/CN114883165A/zh active Pending
- 2022-01-25 TW TW111103088A patent/TWI799108B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003123943A (ja) | 2001-10-17 | 2003-04-25 | Ngk Insulators Ltd | 加熱装置 |
JP2003288975A (ja) | 2002-03-27 | 2003-10-10 | Ngk Insulators Ltd | セラミックヒーター、セラミックヒーターの製造方法、および金属部材の埋設品 |
JP3156031U (ja) | 2009-09-29 | 2009-12-10 | 日本碍子株式会社 | セラミックスヒーター |
JP2018056332A (ja) | 2016-09-29 | 2018-04-05 | 日本特殊陶業株式会社 | 加熱装置 |
WO2019008889A1 (ja) | 2017-07-07 | 2019-01-10 | 住友電気工業株式会社 | 半導体基板加熱用の基板載置台 |
Also Published As
Publication number | Publication date |
---|---|
TW202232633A (zh) | 2022-08-16 |
TWI799108B (zh) | 2023-04-11 |
KR20220113258A (ko) | 2022-08-12 |
US20220254662A1 (en) | 2022-08-11 |
CN114883165A (zh) | 2022-08-09 |
JP2022120251A (ja) | 2022-08-18 |
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