TWI682489B - 帶有多個加熱區的基板支撐件 - Google Patents

帶有多個加熱區的基板支撐件 Download PDF

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Publication number
TWI682489B
TWI682489B TW104134575A TW104134575A TWI682489B TW I682489 B TWI682489 B TW I682489B TW 104134575 A TW104134575 A TW 104134575A TW 104134575 A TW104134575 A TW 104134575A TW I682489 B TWI682489 B TW I682489B
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TW
Taiwan
Prior art keywords
heating
heater
heating zone
vacuum channel
channels
Prior art date
Application number
TW104134575A
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English (en)
Chinese (zh)
Other versions
TW201624607A (zh
Inventor
松下智治
拉菲傑立巴利
蔡振雄
卡曼司亞拉文德
袁小雄
高帕曼裘那薩
Original Assignee
美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201624607A publication Critical patent/TW201624607A/zh
Application granted granted Critical
Publication of TWI682489B publication Critical patent/TWI682489B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/037—Heaters with zones of different power density
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
TW104134575A 2014-12-31 2015-10-21 帶有多個加熱區的基板支撐件 TWI682489B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462098887P 2014-12-31 2014-12-31
US62/098,887 2014-12-31
US14/634,711 US9888528B2 (en) 2014-12-31 2015-02-27 Substrate support with multiple heating zones
US14/634,711 2015-02-27

Publications (2)

Publication Number Publication Date
TW201624607A TW201624607A (zh) 2016-07-01
TWI682489B true TWI682489B (zh) 2020-01-11

Family

ID=56166038

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104134575A TWI682489B (zh) 2014-12-31 2015-10-21 帶有多個加熱區的基板支撐件

Country Status (6)

Country Link
US (1) US9888528B2 (enExample)
JP (1) JP6974169B2 (enExample)
KR (1) KR102425944B1 (enExample)
CN (2) CN109616428B (enExample)
TW (1) TWI682489B (enExample)
WO (1) WO2016109008A1 (enExample)

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JP6847610B2 (ja) * 2016-09-14 2021-03-24 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
US10468290B2 (en) * 2016-11-02 2019-11-05 Ultratech, Inc. Wafer chuck apparatus with micro-channel regions
US11598003B2 (en) * 2017-09-12 2023-03-07 Applied Materials, Inc. Substrate processing chamber having heated showerhead assembly
US11330673B2 (en) * 2017-11-20 2022-05-10 Applied Materials, Inc. Heated substrate support
SG11202007857XA (en) 2018-02-09 2020-09-29 Applied Materials Inc Semiconductor processing apparatus having improved temperature control
US10910243B2 (en) 2018-08-31 2021-02-02 Applied Materials, Inc. Thermal management system
CN113169109B (zh) * 2018-11-30 2025-07-01 朗姆研究公司 用于增进热均匀性的具有多层加热器的陶瓷基座
US11562913B2 (en) * 2019-04-25 2023-01-24 Watlow Electric Manufacturing Company Multi-zone azimuthal heater
TWI857083B (zh) * 2019-06-25 2024-10-01 美商應用材料股份有限公司 基板支撐基座與包括此基板支撐基座的處理腔室、以及處理方法與包含指令以實行此處理方法的非暫態電腦可讀取媒體
US20210035851A1 (en) * 2019-07-30 2021-02-04 Applied Materials, Inc. Low contact area substrate support for etching chamber
KR20220071220A (ko) * 2019-09-27 2022-05-31 램 리써치 코포레이션 기판 지지부들의 온도 분포 프로파일들에 영향을 주는 튜닝 가능한 열 차폐부 (heat shield) 및 튜닝 불가능한 열 차폐부
JP7407752B2 (ja) * 2021-02-05 2024-01-04 日本碍子株式会社 ウエハ支持台
US20220367236A1 (en) * 2021-05-16 2022-11-17 Applied Materials, Inc. Heater pedestal with improved uniformity
EP4177030A1 (de) * 2021-06-14 2023-05-10 MULTIVAC Sepp Haggenmüller SE & Co. KG Arbeitsstation für folienverarbeitende verpackungsmaschine
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
TW202349558A (zh) * 2022-04-28 2023-12-16 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 靜電卡盤台座加熱器及用於選擇性地夾持及加熱基材之設備
WO2024091389A1 (en) * 2022-10-24 2024-05-02 Lam Research Corporation Heat flow control in a processing tool
JP2024155101A (ja) 2023-04-20 2024-10-31 住友電気工業株式会社 ウエハ保持体
WO2024257286A1 (ja) 2023-06-14 2024-12-19 住友電気工業株式会社 ウエハ保持台、および半導体処理装置
KR102731017B1 (ko) 2023-10-30 2024-11-19 주식회사 미코세라믹스 세라믹 서셉터

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US5128515A (en) * 1990-05-21 1992-07-07 Tokyo Electron Sagami Limited Heating apparatus
US20030062359A1 (en) * 1999-05-19 2003-04-03 Henry Ho Multi-zone resistive heater
US20110147363A1 (en) * 2009-12-18 2011-06-23 Applied Materials, Inc. Multifunctional heater/chiller pedestal for wide range wafer temperature control

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JP2527836B2 (ja) * 1990-08-17 1996-08-28 日本碍子株式会社 半導体ウエハ―加熱装置
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JP2009054871A (ja) * 2007-08-28 2009-03-12 Tokyo Electron Ltd 載置台構造及び処理装置
JP4913695B2 (ja) * 2007-09-20 2012-04-11 東京エレクトロン株式会社 基板処理装置及びそれに用いる基板載置台
US20090274590A1 (en) 2008-05-05 2009-11-05 Applied Materials, Inc. Plasma reactor electrostatic chuck having a coaxial rf feed and multizone ac heater power transmission through the coaxial feed
JP2012028428A (ja) * 2010-07-21 2012-02-09 Tokyo Electron Ltd 載置台構造及び処理装置
US10242890B2 (en) * 2011-08-08 2019-03-26 Applied Materials, Inc. Substrate support with heater
KR101343556B1 (ko) * 2012-05-18 2013-12-19 주식회사 케이에스엠컴포넌트 2차원적으로 배선된 열선을 포함하는 세라믹 히터
US9538583B2 (en) 2013-01-16 2017-01-03 Applied Materials, Inc. Substrate support with switchable multizone heater
US9853579B2 (en) 2013-12-18 2017-12-26 Applied Materials, Inc. Rotatable heated electrostatic chuck

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5128515A (en) * 1990-05-21 1992-07-07 Tokyo Electron Sagami Limited Heating apparatus
US20030062359A1 (en) * 1999-05-19 2003-04-03 Henry Ho Multi-zone resistive heater
US20110147363A1 (en) * 2009-12-18 2011-06-23 Applied Materials, Inc. Multifunctional heater/chiller pedestal for wide range wafer temperature control

Also Published As

Publication number Publication date
CN109616428A (zh) 2019-04-12
CN107112262A (zh) 2017-08-29
US9888528B2 (en) 2018-02-06
TW201624607A (zh) 2016-07-01
US20160192444A1 (en) 2016-06-30
WO2016109008A1 (en) 2016-07-07
KR20170101973A (ko) 2017-09-06
JP2018505551A (ja) 2018-02-22
KR102425944B1 (ko) 2022-07-26
CN107112262B (zh) 2021-09-03
CN109616428B (zh) 2023-02-03
JP6974169B2 (ja) 2021-12-01

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