CN109609073A - 粘接剂组合物和连接体 - Google Patents
粘接剂组合物和连接体 Download PDFInfo
- Publication number
- CN109609073A CN109609073A CN201811479821.2A CN201811479821A CN109609073A CN 109609073 A CN109609073 A CN 109609073A CN 201811479821 A CN201811479821 A CN 201811479821A CN 109609073 A CN109609073 A CN 109609073A
- Authority
- CN
- China
- Prior art keywords
- circuit
- adhesive
- adhesive composite
- film
- methyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013215763 | 2013-10-16 | ||
JP2013-215763 | 2013-10-16 | ||
CN201410546529.3A CN104559898A (zh) | 2013-10-16 | 2014-10-15 | 粘接剂组合物和连接体 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410546529.3A Division CN104559898A (zh) | 2013-10-16 | 2014-10-15 | 粘接剂组合物和连接体 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109609073A true CN109609073A (zh) | 2019-04-12 |
Family
ID=53036679
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811479821.2A Pending CN109609073A (zh) | 2013-10-16 | 2014-10-15 | 粘接剂组合物和连接体 |
CN201410546529.3A Pending CN104559898A (zh) | 2013-10-16 | 2014-10-15 | 粘接剂组合物和连接体 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410546529.3A Pending CN104559898A (zh) | 2013-10-16 | 2014-10-15 | 粘接剂组合物和连接体 |
Country Status (4)
Country | Link |
---|---|
JP (3) | JP2015098575A (ko) |
KR (2) | KR102321167B1 (ko) |
CN (2) | CN109609073A (ko) |
TW (1) | TW201525096A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111334198A (zh) * | 2020-03-27 | 2020-06-26 | 顺德职业技术学院 | Uv双组份双固化型结构胶 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017090659A1 (ja) * | 2015-11-25 | 2017-06-01 | 日立化成株式会社 | 回路接続用接着剤組成物及び構造体 |
TWI761477B (zh) * | 2017-03-30 | 2022-04-21 | 日商太陽油墨製造股份有限公司 | 導電性接著劑、硬化物、電子零件及電子零件之製造方法 |
CN111286005B (zh) * | 2020-04-13 | 2021-09-10 | 江苏和和新材料股份有限公司 | 一种功能性热塑性聚氨酯及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008195852A (ja) * | 2007-02-14 | 2008-08-28 | Hitachi Chem Co Ltd | フィルム状接着剤組成物及びこの組成物を用いた回路端子の接続構造体 |
WO2009057376A1 (ja) * | 2007-10-29 | 2009-05-07 | Hitachi Chemical Company, Ltd. | 回路接続材料、接続構造体及びその製造方法 |
JP2010248455A (ja) * | 2009-04-20 | 2010-11-04 | Bridgestone Corp | チオール基含有接着性樹脂組成物 |
CN102763283A (zh) * | 2010-11-09 | 2012-10-31 | 索尼化学&信息部件株式会社 | 各向异性导电膜 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2610900B2 (ja) | 1987-10-27 | 1997-05-14 | ソニーケミカル 株式会社 | 熱硬化型異方性導電接着シート及びその製造方法 |
JP3587859B2 (ja) | 1997-03-31 | 2004-11-10 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
JP5140996B2 (ja) * | 2006-08-29 | 2013-02-13 | 日立化成工業株式会社 | 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 |
JP4941554B2 (ja) * | 2007-05-09 | 2012-05-30 | 日立化成工業株式会社 | フィルム状回路接続材料及び回路部材の接続構造 |
JP2011057870A (ja) * | 2009-09-10 | 2011-03-24 | Aica Kogyo Co Ltd | 樹脂組成物 |
-
2014
- 2014-09-05 JP JP2014180891A patent/JP2015098575A/ja active Pending
- 2014-10-13 TW TW103135305A patent/TW201525096A/zh unknown
- 2014-10-15 KR KR1020140139057A patent/KR102321167B1/ko active IP Right Grant
- 2014-10-15 CN CN201811479821.2A patent/CN109609073A/zh active Pending
- 2014-10-15 CN CN201410546529.3A patent/CN104559898A/zh active Pending
-
2018
- 2018-09-19 JP JP2018175012A patent/JP2019019333A/ja active Pending
-
2020
- 2020-02-12 JP JP2020021361A patent/JP7014236B2/ja active Active
-
2021
- 2021-10-27 KR KR1020210144166A patent/KR102478959B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008195852A (ja) * | 2007-02-14 | 2008-08-28 | Hitachi Chem Co Ltd | フィルム状接着剤組成物及びこの組成物を用いた回路端子の接続構造体 |
WO2009057376A1 (ja) * | 2007-10-29 | 2009-05-07 | Hitachi Chemical Company, Ltd. | 回路接続材料、接続構造体及びその製造方法 |
JP2010248455A (ja) * | 2009-04-20 | 2010-11-04 | Bridgestone Corp | チオール基含有接着性樹脂組成物 |
CN102763283A (zh) * | 2010-11-09 | 2012-10-31 | 索尼化学&信息部件株式会社 | 各向异性导电膜 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111334198A (zh) * | 2020-03-27 | 2020-06-26 | 顺德职业技术学院 | Uv双组份双固化型结构胶 |
CN111334198B (zh) * | 2020-03-27 | 2021-10-15 | 顺德职业技术学院 | Uv双组份双固化型结构胶 |
Also Published As
Publication number | Publication date |
---|---|
TW201525096A (zh) | 2015-07-01 |
JP2015098575A (ja) | 2015-05-28 |
KR102478959B1 (ko) | 2022-12-16 |
KR102321167B1 (ko) | 2021-11-02 |
CN104559898A (zh) | 2015-04-29 |
JP2019019333A (ja) | 2019-02-07 |
KR20210134875A (ko) | 2021-11-11 |
KR20150044403A (ko) | 2015-04-24 |
JP2020109173A (ja) | 2020-07-16 |
JP7014236B2 (ja) | 2022-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Tokyo, Japan Applicant after: Lishennoco Co.,Ltd. Address before: Tokyo, Japan Applicant before: HITACHI CHEMICAL Co.,Ltd. |