CN109545724A - Basket equipment is inserted in a kind of Wafer Cleaning water - Google Patents
Basket equipment is inserted in a kind of Wafer Cleaning water Download PDFInfo
- Publication number
- CN109545724A CN109545724A CN201811565906.2A CN201811565906A CN109545724A CN 109545724 A CN109545724 A CN 109545724A CN 201811565906 A CN201811565906 A CN 201811565906A CN 109545724 A CN109545724 A CN 109545724A
- Authority
- CN
- China
- Prior art keywords
- mobile
- basket
- silicon wafer
- cleaning water
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 238000004140 cleaning Methods 0.000 title claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 72
- 239000010703 silicon Substances 0.000 claims abstract description 72
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 71
- 230000005540 biological transmission Effects 0.000 claims description 12
- 241000239290 Araneae Species 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 52
- 230000033001 locomotion Effects 0.000 description 8
- 239000007921 spray Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000012634 fragment Substances 0.000 description 2
- 230000005571 horizontal transmission Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention provides basket equipment is inserted in a kind of Wafer Cleaning water, including sink, mobile suction means, silicon chip moving apparatus and nozzle, mobile suction means is respectively and fixedly installed to the two sides of sink, silicon chip moving apparatus can clamp silicon wafer and move back and forth setting in sink, nozzle is located under silicon chip moving apparatus, mobile suction means includes xyz mould group and vacuum chuck, vacuum chuck is arranged in xyz mould group and moves under the drive of xyz mould group along the direction xyz, and vacuum chuck removes silicon wafer cleaned on silicon chip moving apparatus.Basket equipment is inserted in Wafer Cleaning water of the present invention may be implemented vacuum chuck mobile device plug in basket into sink both ends collecting box progress water, it efficiently avoids artificially plugging in basket inefficiency, error rate height, be easy to scratch the drawbacks such as silicon wafer, the degree of automation is improved, is shortened working hours, cost of labor is solved.
Description
Technical field
The invention belongs to cleaning equipment technical fields, more particularly, to basket equipment slotting in a kind of Wafer Cleaning water.
Background technique
In semiconductor silicon single crystal manufacturing field, silicon wafer plugs in basket manually, will have a direct impact on product quality.Basket is inserted in artificial water
It will lead to scuffing silicon wafer, or even can maloperation.Using basket equipment is inserted in silicon wafer water automatically, it is possible to reduce artificial to scratch silicon wafer and mistake
Operation improves the degree of automation.It can be seen that the timeliness and accuracy of transhipment silicon wafer can be realized by plugging in basket equipment in the water, together
When reduce cost of labor, save manpower, improve the production efficiency in workshop.
Summary of the invention
In view of this, plugging in basket equipment in Wafer Cleaning water the present invention is directed to propose plug in basket equipment in a kind of Wafer Cleaning water
Vacuum chuck mobile device may be implemented to carry out plugging in basket in water to sink both ends collecting box, efficiently avoid artificially plugging in basket efficiency
Lowly, error rate is high, is easy to scratch the drawbacks such as silicon wafer, improves the degree of automation, shortens working hours, solves cost of labor.
In order to achieve the above objectives, the technical scheme of the present invention is realized as follows:
Basket equipment, including sink, mobile suction means, silicon chip moving apparatus and nozzle are inserted in a kind of Wafer Cleaning water, are moved
Dynamic suction means is respectively and fixedly installed to the two sides of sink, and silicon chip moving apparatus can clamp silicon wafer and the setting moved back and forth exists
In sink, nozzle is located under silicon chip moving apparatus, and mobile suction means includes xyz mould group and vacuum chuck, vacuum chuck setting
It is moved in xyz mould group and under the drive of xyz mould group along the direction xyz, vacuum chuck will be cleaned on silicon chip moving apparatus
Silicon wafer is removed.
Further, silicon chip moving apparatus includes transmission device and piece basket bracket, and piece basket bracket includes support plate and movement
Bracket, support plate is located among mobile bracket and the lower end of support plate is fixed in sink, and mobile bracket passes through connecting shaft
It is connect with support plate, transmission device is connect with mobile bracket, and transmission device drives mobile bracket to move along connecting shaft, support plate
Side is provided with idler wheel, can cooperate mobile stent clamping silicon wafer.
Further, mobile bracket includes left connection board and right connection board, is fixedly installed guide rod between the two, is supported
The hole passed through for guide rod is provided on plate, connecting shaft is pierced by both ends and the fixed company of bearing spider of left connection board and right connection board
It connects.
Further, idler wheel is fixed by mounting rod, and the rotation direction of idler wheel is vertical direction.
Further, silicon wafer is clamped between idler wheel and left connection board or right connection board, nozzle is positioned close to the one of idler wheel
The lower section of first silicon wafer and second silicon wafer contact surface of side.Nozzle spray is used for fragment, prevents vacuum chuck from once taking two
Piece.
Further, transmission device includes motor, horizontal conveying belt and link block, and motor drives horizontal conveying belt rotation,
Link block is fixed at horizontal transmission and takes, and link block is fixedly connected with left connection board or right connection board, and horizontal transmission is brought into
And mobile bracket is driven to move along connecting shaft.
Further, collecting box is provided in sink and positioned at the both ends of piece basket bracket.
Further, idler wheel is at least 2.
Working principle:
Silicon wafer is placed between idler wheel and right connection board, realizes silicon wafer feeding.
Two groups of vacuum chuck movements are driven, it is using two idler wheel rotations and nozzle spray that a vacuum chuck, which draws silicon wafer,
Silicon wafer is separated, the silicon wafer of absorption is placed into collecting box by another group of vacuum chuck, two groups of vacuum chuck crisscross motions
One takes one to put, and improves and plugs in basket efficiency in water.
Vacuum chuck draws silicon wafer separation, and mobile bracket simultaneously operation, motor driven horizontal conveying belt is mobile, link block with
With movement, mobile bracket is mobile, drives silicon wafer mobile indirectly, withstands on silicon wafer on two idler wheels, silicon wafer is drawn position and protected always
It holds constant, utilizes the secondary absorption silicon wafer of another vacuum chuck, circulation action.
Vacuum chuck may be implemented in xyz mould group can move along 3 directions.
Vacuum chuck: Beijing Science and Technology Ltd., Rui Jie robot, SC-IW-240.
Compared with the existing technology, basket equipment is inserted in Wafer Cleaning water of the present invention to have the advantage that
Basket equipment is inserted in Wafer Cleaning water of the present invention, and wafer chuck is lived in clearly by row by idler wheel and right connection board
It washes, is removed after to be cleaned by vacuum chuck, efficiently avoid artificially plugging in basket inefficiency, error rate height, be easy to scratch silicon
The drawbacks such as piece improve the degree of automation, shorten working hours, and solve cost of labor.
Detailed description of the invention
The attached drawing for constituting a part of the invention is used to provide further understanding of the present invention, schematic reality of the invention
It applies example and its explanation is used to explain the present invention, do not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the overall structure diagram that basket equipment is inserted in Wafer Cleaning water described in the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of silicon chip moving apparatus described in the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of piece basket bracket described in the embodiment of the present invention；
Fig. 4 is the structural schematic diagram of mobile suction means described in the embodiment of the present invention.
Description of symbols:
1- sink；2- nozzle；3-xyz mould group；4- vacuum chuck；5- support plate；6- connecting shaft；7- idler wheel；The left connection of 8-
Plate；9- right connection board；10- guide rod；11- bearing spider；12- motor；13- horizontal conveying belt；14- collecting box；15- silicon wafer.
Specific embodiment
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark
Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair
Limitation of the invention.In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply phase
To importance or implicitly indicate the quantity of indicated technical characteristic.The feature for defining " first ", " second " etc. as a result, can
To explicitly or implicitly include one or more of the features.In the description of the present invention, unless otherwise indicated, " multiple "
It is meant that two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood by concrete condition
Concrete meaning in the present invention.
The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
As shown in Figs 1-4, basket equipment, including sink 1, mobile suction means, silicon wafer movement are inserted in a kind of Wafer Cleaning water
Device and nozzle 2, mobile suction means are respectively and fixedly installed to the two sides of sink 1, silicon chip moving apparatus can clamp silicon wafer and
In sink 1, nozzle 2 is located under silicon chip moving apparatus for the setting of reciprocating movement, and mobile suction means includes xyz mould group 3 and true
Suction disk 4, vacuum chuck 4 are arranged in xyz mould group 3 and move under the drive of xyz mould group 3 along the direction xyz, vacuum chuck 4
Silicon wafer 15 cleaned on silicon chip moving apparatus is removed.
Above-mentioned silicon chip moving apparatus includes transmission device and piece basket bracket, and piece basket bracket includes support plate 5 and mobile bracket,
Support plate 5 is located among mobile bracket and the lower end of support plate 5 is fixed in sink 1, mobile bracket by connecting shaft 6 with
Support plate 5 connects, and transmission device is connect with mobile bracket, and transmission device drives mobile bracket to move along connecting shaft 6, support plate
5 sides are provided with idler wheel 7, can cooperate mobile stent clamping silicon wafer 15.
Above-mentioned mobile bracket includes left connection board 8 and right connection board 9, is fixedly installed guide rod 10 between the two, support
The hole passed through for guide rod 10 is provided on plate 5, connecting shaft 6 is pierced by both ends and the bearing spider of left connection board 8 and right connection board 9
11 are fixedly connected.
Above-mentioned rollers 7 are fixed by mounting rod, and the rotation direction of idler wheel 7 is vertical direction.
Silicon wafer is clamped between above-mentioned rollers 7 and left connection board 8 or right connection board 9, nozzle 2 is positioned close to the one of idler wheel 7
First silicon wafer 15 of side and the lower section of second 15 contact surface of silicon wafer.The water spray of nozzle 2 is used for fragment, prevents vacuum chuck 4 one
It is secondary to take two panels.Wherein cooperate the left connection board 8 of clamping silicon wafer 15 with idler wheel 7 or right connection board 9 is laminated structure, with 7 phase of idler wheel
Pair and can be realized the clamping of silicon wafer 15.
Above-mentioned transmission device includes motor 12, horizontal conveying belt 13 and link block, and motor 12 drives 13 turns of horizontal conveying belt
Dynamic, link block is fixed on horizontal conveying belt 13, and link block is fixedly connected with left connection board 8 or right connection board 9, and level passes
It send band 13 and then mobile bracket is driven to move along connecting shaft 6.
Collecting box 14 is provided in above-mentioned sink 1 and positioned at the both ends of piece basket bracket.
Above-mentioned rollers 7 are at least 2.
Working principle:
Silicon wafer 15 is placed between idler wheel 7 and right connection board 9, realizes 15 feeding of silicon wafer.
Two groups of vacuum chucks 4 are driven to act, it is using two rotations of idler wheel 7 and spray that a vacuum chuck 4, which draws silicon wafer 15,
The water spray of mouth 2 separates silicon wafer 15, and the silicon wafer 15 of absorption is placed into collecting box 14 by another group of vacuum chuck 4, and two groups true
4 crisscross motion one of suction disk takes one to put, and improves and plugs in basket efficiency in water.
Vacuum chuck 4 is drawn silicon wafer 15 and is separated, and mobile bracket simultaneously operation, motor 12 drives horizontal conveying belt 13 mobile,
Link block follows movement, and mobile bracket is mobile, drives silicon wafer 15 mobile indirectly, withstands on silicon wafer 15 on two idler wheels 7, silicon wafer 15
It draws position and remains constant, utilize 4 two absorption silicon wafers 15 of another vacuum chuck, circulation action.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (8)
1. plugging in basket equipment in a kind of Wafer Cleaning water, it is characterised in that: including sink (1), mobile suction means, the mobile dress of silicon wafer
It sets and is respectively and fixedly installed to the two sides of sink (1) with nozzle (2), mobile suction means, silicon chip moving apparatus can clamp silicon wafer
And the setting moved back and forth, in sink (1), nozzle (2) is located under silicon chip moving apparatus, mobile suction means includes xyz mould group
(3) it is arranged in xyz mould group (3) and under the drive of xyz mould group (3) with vacuum chuck (4), vacuum chuck (4) along the direction xyz
Mobile, vacuum chuck (4) removes silicon wafer (15) cleaned on silicon chip moving apparatus.
2. plugging in basket equipment in Wafer Cleaning water according to claim 1, it is characterised in that: silicon chip moving apparatus includes transmission
Device and piece basket bracket, piece basket bracket include support plate (5) and mobile bracket, and support plate (5) is located among mobile bracket and props up
The lower end of fagging (5) is fixed in sink (1), and mobile bracket is connect by connecting shaft (6) with support plate (5), transmission dress
It sets and is connect with mobile bracket, transmission device drives mobile bracket mobile along connecting shaft (6), and support plate (5) side is provided with rolling
It takes turns (7), mobile stent clamping silicon wafer (15) can be cooperated.
3. plugging in basket equipment in Wafer Cleaning water according to claim 2, it is characterised in that: mobile bracket includes left connection board
(8) and right connection board (9) it, is fixedly installed between the two guide rod (10), is provided in support plate (5) and is worn for guide rod (10)
The hole crossed, connecting shaft (6) is pierced by left connection board (8) and the both ends of right connection board (9) are fixedly connected with bearing spider (11).
4. plugging in basket equipment in Wafer Cleaning water according to claim 2, it is characterised in that: idler wheel (7) is solid by mounting rod
It is fixed, and the rotation direction of idler wheel (7) is vertical direction.
5. plugging in basket equipment in Wafer Cleaning water according to claim 3, it is characterised in that: idler wheel (7) and left connection board (8)
Or silicon wafer is clamped between right connection board (9), nozzle (2) is positioned close to first silicon wafer (15) of the side of idler wheel (7) and the
The lower section of two silicon wafer (15) contact surfaces.
6. plugging in basket equipment in Wafer Cleaning water according to claim 3, it is characterised in that: transmission device includes motor
(12), horizontal conveying belt (13) and link block, motor (12) drive horizontal conveying belt (13) rotation, and link block is fixed at water
On flat conveyer belt (13), link block is fixedly connected with left connection board (8) or right connection board (9), horizontal conveying belt (13) and then band
Dynamic mobile bracket is mobile along connecting shaft (6).
7. plugging in basket equipment in Wafer Cleaning water according to claim 1, it is characterised in that: in sink (1) and be located at piece basket
The both ends of bracket are provided with collecting box (14).
8. plugging in basket equipment in Wafer Cleaning water according to claim 4, it is characterised in that: idler wheel (7) is at least 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811565906.2A CN109545724B (en) | 2018-12-20 | 2018-12-20 | Basket inserting equipment in silicon wafer cleaning water |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811565906.2A CN109545724B (en) | 2018-12-20 | 2018-12-20 | Basket inserting equipment in silicon wafer cleaning water |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109545724A true CN109545724A (en) | 2019-03-29 |
| CN109545724B CN109545724B (en) | 2024-04-09 |
Family
ID=65855826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811565906.2A Active CN109545724B (en) | 2018-12-20 | 2018-12-20 | Basket inserting equipment in silicon wafer cleaning water |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109545724B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111069163A (en) * | 2019-12-04 | 2020-04-28 | 惠州易晖光电材料股份有限公司 | Nano mask material removing production line and production process thereof |
| CN113394150A (en) * | 2021-07-01 | 2021-09-14 | 杭州中为光电技术有限公司 | Silicon chip conveying and dispersing device |
| CN114769200A (en) * | 2022-04-26 | 2022-07-22 | 四川上特科技有限公司 | Wafer cleaning assembly, cleaning device and cleaning method |
| CN116581066A (en) * | 2023-07-07 | 2023-08-11 | 恒超源洗净科技(深圳)有限公司 | Semiconductor silicon wafer cleaning equipment |
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| CN203612657U (en) * | 2013-10-30 | 2014-05-28 | 深圳市新昂慧科技有限公司 | Automatic basket inserting machine |
| CN105529290A (en) * | 2015-12-07 | 2016-04-27 | 天津中环半导体股份有限公司 | Inserting full-automatic and cleaning device and cleaning technological process for silicon wafers |
| CN106783721A (en) * | 2017-03-24 | 2017-05-31 | 张家港市德昶自动化科技有限公司 | Silicon chip suction piece device and automatic inserting piece device |
| CN107051966A (en) * | 2017-03-08 | 2017-08-18 | 常州市科沛达超声工程设备有限公司 | Full-automatic silicon wafer cleans line and its method of work |
| CN107946212A (en) * | 2017-11-21 | 2018-04-20 | 乐山新天源太阳能科技有限公司 | The underwater automatic sheet-fetching plug-in sheet machine of silicon chip |
| CN209183514U (en) * | 2018-12-20 | 2019-07-30 | 天津中环领先材料技术有限公司 | Basket equipment is inserted in a kind of Wafer Cleaning water |
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2018
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| CN203612657U (en) * | 2013-10-30 | 2014-05-28 | 深圳市新昂慧科技有限公司 | Automatic basket inserting machine |
| CN105529290A (en) * | 2015-12-07 | 2016-04-27 | 天津中环半导体股份有限公司 | Inserting full-automatic and cleaning device and cleaning technological process for silicon wafers |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111069163A (en) * | 2019-12-04 | 2020-04-28 | 惠州易晖光电材料股份有限公司 | Nano mask material removing production line and production process thereof |
| CN113394150A (en) * | 2021-07-01 | 2021-09-14 | 杭州中为光电技术有限公司 | Silicon chip conveying and dispersing device |
| WO2023274076A1 (en) * | 2021-07-01 | 2023-01-05 | 杭州中为光电技术有限公司 | Silicon wafer conveying and dispersing device |
| US11728186B2 (en) | 2021-07-01 | 2023-08-15 | Hangzhou Zhongwei Photoelectric Technology Co., Ltd. | Device for conveying and dispersing silicon wafers |
| CN114769200A (en) * | 2022-04-26 | 2022-07-22 | 四川上特科技有限公司 | Wafer cleaning assembly, cleaning device and cleaning method |
| CN116581066A (en) * | 2023-07-07 | 2023-08-11 | 恒超源洗净科技(深圳)有限公司 | Semiconductor silicon wafer cleaning equipment |
| CN116581066B (en) * | 2023-07-07 | 2024-01-12 | 恒超源洗净科技(深圳)有限公司 | Semiconductor silicon wafer cleaning equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109545724B (en) | 2024-04-09 |
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