CN111069163A - Nano mask material removing production line and production process thereof - Google Patents
Nano mask material removing production line and production process thereof Download PDFInfo
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- CN111069163A CN111069163A CN201911228708.1A CN201911228708A CN111069163A CN 111069163 A CN111069163 A CN 111069163A CN 201911228708 A CN201911228708 A CN 201911228708A CN 111069163 A CN111069163 A CN 111069163A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
Abstract
The invention relates to the technical field of special material removal, and discloses a nanometer mask material removal production line and a production process thereof, wherein the production process comprises the following steps: immersing the operation platform in water in a water tank; controlling a feeding and conveying mechanism to convey a conductive structure plate to an operation platform, wherein the conductive structure plate comprises a substrate, a conductive film and a nanometer mask material which are sequentially stacked from inside to outside; the operating platform is provided with a plurality of through holes, and the vacuum adsorption device is controlled to extract gas in the through holes so as to adsorb and fix the conductive structure plate on the operating platform; and controlling the transmission displacement assembly to drive the erasing tool to perform wiping operation on the outer surface of the conductive structure plate so as to remove the nanometer mask material. The method can continuously remove the nanometer mask material in a large scale, can improve the efficiency of removing the nanometer mask material, and can prevent the outer surface of the conductive structure plate from being damaged in the process of removing the nanometer mask material.
Description
Technical Field
The invention relates to the technical field of special material removal, in particular to a nanometer mask material removal production line and a production process thereof.
Background
In recent years, the nano mask material is widely concerned and applied to the preparation of photoelectric nano structure materials, and has great potential application prospects in the fields of scientific research in colleges and universities, transparent conductive films, solar cells, sensors, surface enhanced Raman, touch display, transparent heating of automobiles, intelligent color-changing windows and the like, and the total market value can reach over 1000 million dollars, which means that the technology has a prospect of being applied in scale in the follow-up process. The conductive structure plate comprises a substrate, a conductive film and a nanometer mask material which are sequentially stacked from inside to outside, wherein the nanometer mask material is composed of a plurality of nanometer/micrometer balls deposited on the outer surface of the conductive film. The technology is to remove the nanometer mask material on the outer surface of the conductive structure plate to obtain the suede conductive structure plate. For example, the core invention patent (CN201110141276.8) realizes that a nano mask material of a transparent conductive film is prepared by using polystyrene microspheres and silica microspheres in a large area, and nano/micro spheres deposited on the surface of the transparent conductive film are removed by ultrasonic waves, so as to obtain the textured conductive glass special for the solar cell. The patented technology (CN201110141276.8) can cover the corresponding mass production of products with 86 inches and below, but the mass production of the products is greatly influenced due to the lack of a mass production line for removing the nanometer mask material used in the technology.
The ultrasonic removal technology is suitable for conductive structural plates with small areas and thin upper film, and has large limitation on the conductive structural plates with large areas or thick upper film, and the film layer structure of the conductive structural plates can be damaged by vibration. The nano mask material wiping device and the automatic wiping system thereof disclosed in the utility model patent (CN 206689077U) can replace ultrasonic removal equipment to achieve automatic removal of the nano mask material, can be applied to a conductive structure plate with a large area and a thick film, and can not damage the film structure of the conductive structure plate, and compared with a manual wiping technology, the efficiency is high, and the anti-scraping effect is good; however, continuous and large-scale production of removing the nano mask material cannot be realized, and the requirements in the patent technology (CN201110141276.8) cannot be matched, for example, automatic feeding and feeding of the conductive structure plate cannot be realized; for example, in the process of removing the nano mask material, automatic fixing and releasing of the product cannot be realized; and so on.
Because the outer surface of the conductive structure plate is the first conductive film and the nanometer mask material which are relatively fragile, how to improve the efficiency of removing the nanometer mask material and simultaneously how to prevent the outer surface of the conductive structure plate from being damaged in the process of removing the nanometer mask material is an important problem and a solution trend of the existing nanometer mask material removing process.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a continuous and large-scale production line for removing a nanometer mask material and a production process thereof, which can improve the efficiency of removing the nanometer mask material and simultaneously can prevent the outer surface of a conductive structure plate from being damaged in the process of removing the nanometer mask material.
The purpose of the invention is realized by the following technical scheme:
a production process of a nanometer mask material removal production line comprises the following steps:
immersing the operation platform in water in a water tank;
controlling a feeding and conveying mechanism to convey a conductive structural plate to the operating platform, wherein the conductive structural plate comprises a substrate, a conductive film and a nanometer mask material which are sequentially stacked from inside to outside;
the operating platform is provided with a plurality of through holes, and a vacuum adsorption device is controlled to extract gas in the through holes so as to adsorb and fix the conductive structure plate on the operating platform;
and controlling the transmission displacement assembly to drive an erasing tool to perform erasing operation on the outer surface of the conductive structure plate so as to remove the nanometer mask material and obtain the textured conductive structure plate.
In one embodiment, after the operation of obtaining the suede conductive structural plate, the air compression device is further controlled to release compressed air into the through holes so as to reduce the resistance of water to the suede conductive structural plate; and controlling a discharging and conveying mechanism to convey the suede conductive structure plate to leave the operating platform.
In one embodiment, the feeding transportation mechanism includes a transfer transportation displacement assembly and a lifting transportation displacement assembly, the operation platform has a groove, the lifting transportation displacement assembly is embedded in the groove, the transfer transportation displacement assembly is disposed at a position adjacent to the operation platform, and the operation of controlling the feeding transportation mechanism to transport the conductive structural plate onto the operation platform specifically includes: control move and carry the transportation displacement subassembly and drive electrically conductive structural slab is the upward movement, control the synchronous upward movement is done to the transportation displacement subassembly that goes up and down, control move and carry the transportation displacement subassembly and drive electrically conductive structural slab is to being close to the direction motion of the transportation displacement subassembly that goes up and down, with electrically conductive structural slab transports on the transportation displacement subassembly that goes up and down, control the transportation displacement subassembly that goes up and down drives electrically conductive structural slab is the downward movement, with electrically conductive structural slab transports on the operation platform.
In one embodiment, the feeding transportation mechanism further includes an X-axis transportation displacement assembly, an XY-axis transportation displacement assembly, and a Y-axis transportation displacement assembly, the Y-axis transportation displacement assembly is disposed at a position adjacent to the transfer transportation displacement assembly, the XY-axis transportation displacement assembly is disposed at a position adjacent to the Y-axis transportation displacement assembly, the X-axis transportation displacement assembly is disposed at a position adjacent to the XY-axis transportation displacement assembly, and before the transfer transportation displacement assembly is controlled to drive the conductive structure plate to perform an ascending motion operation, the X-axis transportation displacement assembly is further controlled to drive the conductive structure plate to move in a direction close to the XY-axis transportation displacement assembly, so as to transport the conductive structure plate to the XY-axis transportation displacement assembly; controlling the XY-axis transportation displacement assembly to drive the conductive structure plate to move towards the direction close to the Y-axis transportation displacement assembly so as to transport the conductive structure plate to the Y-axis transportation displacement assembly; and controlling the Y-axis transportation displacement assembly to drive the conductive structure plate to move towards the direction close to the shifting transportation displacement assembly so as to transport the conductive structure plate to the shifting transportation displacement assembly.
In one embodiment, the XY-axis transportation displacement assembly includes an X-axis transportation displacement device and a Y-axis transportation displacement device, the X-axis transportation displacement device is disposed between the X-axis transportation displacement assembly and the Y-axis transportation displacement assembly, the Y-axis transportation displacement device is slidably connected to the X-axis transportation displacement device, and the operation of controlling the XY-axis transportation displacement assembly to drive the conductive structure plate to move in a direction close to the Y-axis transportation displacement assembly specifically includes: and controlling the X-axis transportation displacement device to drive the conductive structure plate to do linear displacement motion on the X axis, and controlling the Y-axis transportation displacement device to drive the conductive structure plate to do linear displacement motion on the Y axis.
In one embodiment, the transfer displacement assembly includes an X-axis displacement module, a Y-axis displacement module, and a Z-axis displacement module, the erasing tool is disposed on the Z-axis displacement module, the Z-axis displacement module is slidably connected to the Y-axis displacement module, the Y-axis displacement module is slidably connected to the X-axis displacement module, the X-axis displacement module is disposed above the operation platform, and the operation of controlling the transfer displacement assembly to drive the erasing tool to perform the erasing operation on the outer surface of the conductive structural plate is specifically: controlling the X-axis displacement module to drive the erasing tool to move towards the direction close to the operating platform so as to transport the erasing tool to the position of the operating platform; controlling the Z-axis displacement module to drive the erasing tool to do descending motion so that the erasing tool is in contact with the conductive structure plate; and controlling the Y-axis displacement module to drive the erasing tool to do reciprocating displacement motion on the Y axis so that the erasing tool performs erasing operation on the outer surface of the conductive structure plate on the Y axis.
In one embodiment, the central 10mm to 30mm wide area of the wiping tool is 5mm to 10mm higher than both sides.
In one embodiment, the through holes are uniformly arranged on the operating platform at intervals, each through hole comprises an upper hole and a lower hole which are communicated with each other, the diameter of each upper hole is 1.0-1.5 mm, and the diameter of each lower hole is 6-8 mm.
In one embodiment, the lifting transportation displacement assembly comprises a water discharging motor and a bearing structure, the water discharging motor is in driving connection with the bearing structure, the bearing structure is provided with a connecting groove, the shifting transportation displacement assembly is provided with a connecting portion, and the connecting portion is used for being inserted into the connecting groove in a linking mode.
A nanomask material removal line, comprising:
the solid absorption bearing mechanism comprises a water tank, an operating platform and a vacuum adsorption device, wherein the operating platform is arranged in the water tank, the operating platform is provided with a plurality of through holes, the vacuum adsorption device is arranged below the operating platform, and the air inlet end of the vacuum adsorption device is communicated with the through holes;
the feeding and conveying mechanism is connected with the operating platform and is used for driving the conductive structural plate to do reciprocating displacement motion relative to the operating platform, and the conductive structural plate comprises a substrate, a conductive film and a nanometer mask material which are sequentially stacked from inside to outside; and
the automatic erasing mechanism comprises an erasing tool and a transmission displacement assembly, the erasing tool is connected with the transmission displacement assembly, and the transmission displacement assembly is used for driving the erasing tool to perform erasing operation on the outer surface of the conductive structure plate so as to remove the nanometer mask material.
Compared with the prior art, the invention has at least the following advantages:
according to the nanometer mask material removing production line and the production process thereof, the feeding and conveying mechanism automatically conveys the conductive structural plate, the vacuum adsorption device automatically adsorbs, fixes and releases the conductive structural plate, and the transmission displacement assembly drives the erasing tool to automatically realize the wiping operation on the outer surface of the conductive structural plate, so that the nanometer mask material on the outer surface of the conductive structural plate can be continuously removed in a large scale, and the high efficiency of removing the nanometer mask material can be improved. Particularly, the operation platform is immersed in the water tank, so that the wiping operation is carried out in the water, and under the lubrication action of the water, the friction between the wiping tool and the nanometer mask material and the conductive film can be reduced, so that the conductive film with softer texture is prevented from being damaged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a flowchart illustrating steps of a manufacturing process of a nanomask material removal line according to an embodiment of the present invention.
Fig. 2 is a schematic flow chart of a production process of a nano-mask material removal production line according to an embodiment of the invention.
Fig. 3 is a schematic structural diagram of a nanomask material removal production line according to an embodiment of the present invention.
Fig. 4 is a top view of an elevation transport displacement assembly of a feed transport mechanism of a nanomask material removal line in accordance with one embodiment of the present invention.
Fig. 5 is a front view of an elevation transport displacement assembly of a feed transport mechanism of a nanomask material removal line in accordance with one embodiment of the present invention.
Fig. 6 is a top view of an operation platform of a suction and fixing support mechanism of a nanomask material removal production line according to an embodiment of the present invention.
Fig. 7 is a front view of an operation platform of a suction and fixing carrying mechanism of a nanomask material removal production line according to an embodiment of the present invention.
Fig. 8 is a structural diagram of an automatic erasing mechanism of a nanomask material removal line according to an embodiment of the present invention.
Fig. 9 is a partial structural view of an automatic erasing mechanism of a nanomask material removal line according to an embodiment of the present invention.
Fig. 10 is a structural view of an erasing tool of an automatic erasing mechanism of a nanomask material removal line according to an embodiment of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In one embodiment, referring to fig. 1 to 9, a production process of a nano mask material removal production line includes the following steps:
s110, immersing the operation platform 122 in the water tank 121;
s120, controlling the feeding and conveying mechanism 110 to convey the conductive structure plate 20 to the operation platform, wherein the conductive structure plate 20 comprises a substrate 210, a conductive film 220 and a nanometer mask material 230 which are sequentially stacked from inside to outside;
s130, forming a plurality of through holes 1221 on the operation platform 122, and controlling a vacuum adsorption device to extract gas in the plurality of through holes 1221, so as to fix the conductive structure plate 20 on the operation platform 122 by adsorption;
s140, controlling the transmission displacement assembly 132 to drive the erasing tool 131 to perform an erasing operation on the outer surface of the conductive structure plate 20, so as to remove the nano-mask material 230, thereby obtaining the textured conductive structure plate 30.
Referring to fig. 1 to 9, a nano-mask material removing production line 10 includes a feeding and transporting mechanism 110, a sucking and fixing bearing mechanism 120, and an automatic erasing mechanism 130. The solid absorption bearing mechanism 120 comprises a water tank 121, an operation platform 122 and a vacuum adsorption device, wherein the operation platform 122 is arranged in the water tank 121, the operation platform 122 is provided with a plurality of through holes 1221, the vacuum adsorption device is arranged below the operation platform 122, and an air inlet end of the vacuum adsorption device is communicated with the plurality of through holes 1221. The feeding and transporting mechanism 110 is connected to the operating platform 122, the feeding and transporting mechanism 110 is used for driving the conductive structure plate to move back and forth relative to the operating platform 122, and the conductive structure plate 20 includes a substrate 210, a conductive film 220 and a nanometer mask material 230 which are sequentially stacked from inside to outside. The automatic erasing mechanism 130 includes an erasing tool 131 and a transferring and displacing assembly 132, the erasing tool 131 is connected to the transferring and displacing assembly 132, and the transferring and displacing assembly 132 is used for driving the erasing tool 131 to perform a wiping operation on the outer surface of the conductive structure plate 20 to remove the nano-mask material 230.
It should be noted that the feeding and transporting mechanism 110 automatically transports the conductive structure plate 20, the vacuum absorption device automatically absorbs, fixes and releases the conductive structure plate 20, and the transmission and displacement assembly 132 drives the erasing tool 131 to automatically wipe the outer surface of the conductive structure plate 20, so that the nano-mask material 230 on the outer surface of the conductive structure plate 20 can be continuously removed in a large scale, and the efficiency of removing the nano-mask material 230 can be improved. In the wiping process, the wiping tool 131 can rub against the outer surface of the conductive structure plate 20, so that the conductive film 220 with a softer texture is easily damaged; the nano-mask material 230 is erased and separated from the conductive film 220, and the separated nano-mask material 230 will also rub against the conductive film 220, which is also likely to damage the conductive film 220 with soft texture. In particular, the operation platform 122 is immersed in the water tank 121, so that the wiping operation is performed in the water, and under the lubrication action of the water, the friction between the wiping tool 131 and the nano-mask material 230 and the conductive film 220 can be reduced, so as to prevent the conductive film 220 with a soft texture from being damaged. In addition, when the vacuum adsorption device is used for exhausting air, the conductive structure plate 20 is adsorbed and pressed on the operation platform 122 with the porous structure under the action of negative pressure, and a plurality of circular gravure are easily formed on the conductive structure plate 20 under the action of strong negative pressure. The water pressure can lightly press the conductive structure plate 20 on the operation platform 122, so that the working energy consumption of the vacuum adsorption device and the working pressure on the conductive structure plate 20 are reduced, and the conductive structure plate 20 can be prevented from being adsorbed to form a plurality of circular gravure while ensuring that the conductive structure plate 20 is sufficiently adsorbed and fixed.
In one embodiment, the substrate 210 is a hard substrate or a flexible substrate. For example, the substrate 210 may be a hard substrate such as a glass plate, a stainless steel plate, or a ceramic plate. For example, the substrate 210 may be a flexible substrate such as a PET plate, a PC plate, a PMMA plate, a PI plate, or an ETFE plate. The nanometer mask material is composed of a plurality of nanometer/micrometer spheres deposited on the outer surface of the conductive film, and the nanometer/micrometer spheres are made of silicon dioxide or polystyrene. The material of the conductive film is indium tin oxide or zinc aluminum oxide.
In one embodiment, referring to fig. 2 and fig. 6, after the operation of obtaining the textured conductive structural plate 30, the air compression device is further controlled to release compressed air into the plurality of through holes 1221, so as to reduce the resistance of water to the textured conductive structural plate 30; and controlling the discharging and conveying mechanism 140 to convey the suede-like conductive structural plate 30 away from the operating platform 122.
Referring to fig. 2 and 6, the nanomask material removal line 10 further includes an output transport mechanism 140, and the output transport mechanism 140 has the same structure as the input transport mechanism 110. The suction-fixing bearing mechanism 120 further includes an air compression device disposed below the operating platform 122, and an air outlet end of the air compression device is communicated with the plurality of through holes 1221.
It should be noted that, when the vacuum adsorption device stops working, the water pressure has a certain resistance to the conductive structure plate 30, and the air compression device releases the compressed air into the plurality of through holes 1221 to reduce the resistance of water to the conductive structure plate 30, so that the conductive structure plate 30 is easily separated from the operation platform 122, and the conductive structure plate 30 is easily separated from the operation platform.
In order to further prevent the conductive structure plate 20 from being adsorbed downward to form a plurality of circular gravure, in an embodiment, referring to fig. 7, a plurality of through holes 1221 are uniformly arranged on the operation platform 122 at intervals, each through hole 1221 includes an upper hole 1221a and a lower hole 1221b that are communicated with each other, a diameter of the upper hole 1221a is 1.0mm to 1.5mm, and a diameter of the lower hole 1221b is 6mm to 8 mm. It should be noted that the upper holes 1221a are small and uniform enough, and the lower holes 1221b are large enough to pass a sufficient amount of compressed air, so that the special structure can further prevent the conductive structure plate 20 from being absorbed to form multiple circular intaglio prints while ensuring a sufficient amount of compressed air to pass through.
In an embodiment, referring to fig. 6, the operation platform 122 includes a supporting platform body and a plurality of bearing bumps, the bearing bumps are uniformly disposed on the supporting platform body at intervals, and each bearing bump is provided with a through hole 1221. This allows for a reasonably uniform distribution of the through-holes 1221.
In an embodiment, referring to fig. 6, the operation platform 122 is provided with a plurality of transverse slots 1122 and a plurality of longitudinal slots 1123, the plurality of transverse slots 1122 and the plurality of longitudinal slots 1123 are uniformly arranged on the support platform at intervals, the transverse slots and the longitudinal slots are connected in a longitudinal and transverse manner to form a plurality of rectangular receiving protrusions 1124, and each receiving protrusion is provided with a through hole 1221. This allows for a reasonably uniform distribution of the through-holes 1221.
In one embodiment, referring to fig. 3, the operation of controlling the feeding and transporting mechanism 110 to transport the conductive structural plate 20 to the operation platform 122 is as follows: control move and carry the transportation displacement subassembly and drive electrically conductive structural slab 20 is the rising movement, control the synchronous rising movement is done to the transportation displacement subassembly that goes up and down, control move and carry the transportation displacement subassembly drive electrically conductive structural slab 20 is to being close to the direction motion of the transportation displacement subassembly that goes up and down, with electrically conductive structural slab 20 transports on the transportation displacement subassembly that goes up and down, control the transportation displacement subassembly that goes up and down drives electrically conductive structural slab 20 is the descending movement, with electrically conductive structural slab 20 transports on operation platform 122.
Referring to fig. 3 and fig. 6, the feeding and transporting mechanism 110 includes a transferring and transporting displacement assembly 114 and a lifting and transporting displacement assembly 115, the operation platform 122 is provided with a groove 1225, the lifting and transporting displacement assembly 115 is embedded in the groove 1225, and the transferring and transporting displacement assembly 114 is disposed adjacent to the operation platform 122.
It should be noted that the transferring, transporting and displacing assembly 114 is used for driving the conductive structural plate 20 to make reciprocating displacement motion relative to the operating platform 122, the lifting, transporting and displacing assembly 115 is used for driving the conductive structural plate 20 to make reciprocating lifting and displacing motion relative to the operating platform 122, the transferring, transporting and displacing assembly 114 transports the conductive structural plate 20 to the lifting, transporting and displacing assembly 115, and then the lifting, transporting and displacing assembly 115 transports the conductive structural plate 20 to the operating platform 122, so as to achieve automatic transportation of the conductive structural plate 20.
In one embodiment, referring to fig. 3, the operation of controlling the feeding and transporting mechanism 110 to transport the conductive structural plate 20 to the operation platform 122 is as follows: control Z axle moves and carries the displacement device and drive electrically conductive structural slab 20 is the rising movement, controls lift transportation displacement subassembly 115 is synchronous rising movement, and control Y axle moves and carries the displacement device and drives electrically conductive structural slab 20 is to being close to lift transportation displacement subassembly 115's direction motion, with electrically conductive structural slab 20 transports on lift transportation displacement subassembly 115, control lift transportation displacement subassembly 115 drives electrically conductive structural slab 20 is the falling movement, with electrically conductive structural slab 20 transports on operation platform 122.
Referring to fig. 3, the transfer/transportation/displacement assembly 114 includes a Y-axis transfer/displacement device and a Z-axis transfer/displacement device, the Y-axis transfer/displacement device is disposed between the Y-axis transportation/displacement assembly and the operation platform 122, and the Z-axis transfer/displacement device is slidably connected to the X-axis transfer/displacement device.
It should be noted that the Y-axis shifting and displacing device is used for driving the conductive structural plate 20 to make reciprocating displacement motion between the Y-axis transporting and displacing assembly and the operating platform 122, and the Z-axis shifting and displacing device is used for driving the conductive structural plate 20 to make reciprocating lifting and displacing motion relative to the operating platform 122, so as to realize automatic transportation of the conductive structural plate 20.
In one embodiment, referring to fig. 3 and fig. 4, the lifting transportation displacement assembly 115 includes a water discharging motor 1151 and a carrying structure 1152, the water discharging motor 1151 is drivingly connected to the carrying structure 1152, the carrying structure 1152 is provided with a connecting groove 1152a, and the transferring transportation displacement assembly 114 is provided with a connecting portion, which is configured to be inserted into the connecting groove 1152a in a connected manner. It should be noted that, the connection portions are inserted into the connection grooves 1152a in a linking manner, so that the elevation transport displacement assembly 115 and the transfer transport displacement assembly 114 are stably connected, and then the transfer transport displacement assembly 114 transfers the conductive structure board 20 to the elevation transport displacement assembly 115, so as to realize the automatic and stable transfer of the conductive structure board 20.
In one embodiment, referring to fig. 3 and 4, the supporting structure 1152 is a hollow material. By reducing the amount of material used for load bearing structure 1152, the stability of the elevating transport displacement assembly 115 for elevating displacement motion is improved.
In one embodiment, referring to fig. 3, before the operation of controlling the transfer transportation displacement assembly 114 to drive the conductive structure plate 20 to perform the ascending motion, the X-axis transportation displacement assembly 111 is further controlled to drive the conductive structure plate 20 to move toward the direction close to the XY-axis transportation displacement assembly 112, so as to transport the conductive structure plate 20 to the XY-axis transportation displacement assembly 112; controlling the XY-axis transportation displacement assembly 112 to drive the conductive structure plate 20 to move towards the direction close to the Y-axis transportation displacement assembly 113, so as to transport the conductive structure plate 20 to the Y-axis transportation displacement assembly 113; the Y-axis transport displacement assembly 113 is controlled to drive the conductive structure plate 20 to move towards the direction close to the transfer transport displacement assembly 114, so as to transport the conductive structure plate 20 to the transfer transport displacement assembly 114.
Referring to fig. 3, the feeding and transporting mechanism 110 further includes an X-axis transporting and displacing assembly 111, an XY-axis transporting and displacing assembly 112, and a Y-axis transporting and displacing assembly 113, wherein the Y-axis transporting and displacing assembly 113 is disposed at a position adjacent to the transferring and transporting and displacing assembly 114, the XY-axis transporting and displacing assembly 112 is disposed at a position adjacent to the Y-axis transporting and displacing assembly 113, and the X-axis transporting and displacing assembly 111 is disposed at a position adjacent to the XY-axis transporting and displacing assembly 112.
It should be noted that the conductive structure board 20 on the X-axis transportation displacement assembly 111 is automatically transported to the operation platform 122 reasonably according to the sequence of the X-axis transportation displacement assembly 111 → the XY-axis transportation displacement assembly 112 → the Y-axis transportation displacement assembly 113 → the transfer transportation displacement assembly 114 → the lifting transportation displacement assembly 115 → the operation platform 122.
In one embodiment, referring to fig. 3, the operation of controlling the XY-axis transport displacement assembly 112 to drive the conductive structure plate 20 to move in the direction close to the Y-axis transport displacement assembly 113 specifically includes: and controlling the X-axis transportation displacement device to drive the conductive structural plate 20 to do linear displacement motion on the X axis, and controlling the Y-axis transportation displacement device to drive the conductive structural plate 20 to do linear displacement motion on the Y axis.
Referring to fig. 3, the XY-axis transport displacement assembly 112 includes an X-axis transport displacement device and a Y-axis transport displacement device, the X-axis transport displacement device is disposed between the X-axis transport displacement assembly 111 and the Y-axis transport displacement assembly 113, and the Y-axis transport displacement device is slidably connected to the X-axis transport displacement device.
It should be noted that the conductive structure plate 20 on the X-axis transport displacement assembly 111 is automatically transported to the Y-axis transport displacement assembly 113 reasonably according to the sequence of the X-axis transport displacement assembly 111 → the X-axis transport displacement assembly → the Y-axis transport displacement assembly 113.
In one embodiment, referring to fig. 8 and 9, the operation of controlling the transmission displacement assembly 132 to drive the erasing tool 131 to perform the erasing operation on the outer surface of the conductive structural plate 20 includes: controlling the X-axis displacement module 1321 to move the erasing tool 131 to a direction close to the operation platform 122, so as to transport the erasing tool 131 to the position of the operation platform 122; controlling the Z-axis displacement module 1323 to drive the erasing tool 131 to move downward, so that the erasing tool 131 is in contact with the conductive structure plate 20; and controlling the Y-axis displacement module 1322 to drive the erasing tool 131 to perform reciprocating displacement motion on the Y axis, so that the erasing tool 131 performs the wiping operation on the outer surface of the conductive structure plate 20 on the Y axis.
Referring to fig. 8 and 9, the transmission displacement assembly 132 includes an X-axis displacement module 1321, a Y-axis displacement module 1322 and a Z-axis displacement module 1323, the erasing tool 131 is disposed on the Z-axis displacement module 1323, the Z-axis displacement module 1323 is slidably connected to the Y-axis displacement module 1322, the Y-axis displacement module 1322 is slidably connected to the X-axis displacement module 1321, and the X-axis displacement module 1321 is disposed above the operation platform 122.
It should be noted that, the erasing tool 131 is driven to perform the lateral displacement motion, the longitudinal displacement motion and the lifting displacement motion by the X-axis displacement module 1321, the Y-axis displacement module 1322 and the Z-axis displacement module 1323, respectively, so that the erasing tool 131 performs the erasing operation on the outer surface of the conductive structure plate 20 in the Y-axis to automatically remove the nano-mask material 230 on the conductive film 220.
In order to further prevent the conductive film 220 from being damaged, in one embodiment, referring to fig. 10, the erasing tool 131 includes a connecting plate 1311, a shaping block 1312, and a sponge wiping block 1313, wherein the shaping block 1312 is connected to a bottom of the connecting plate 1311, and the sponge wiping block 1313 is connected to a bottom of the shaping block 1312. The sponge material is soft and elastic, and does not damage the conductive film 220. Due to the special porous structure, during the wiping process, a part of the nano-mask material 230 directly enters the sponge wiping block 1313 to reduce the friction of the nano-mask material 230 on the conductive film 220.
In one embodiment, referring to fig. 10, the shaping block 1312 is a T-shaped shaping block 1312, and the cross section of the shaping block 1312 is T-shaped, so that the sponge wiping block 1313 has an arc structure with a high middle and low two sides, and a wide area of 10mm to 30mm in the middle of the sponge wiping block 1313 is 5mm to 10mm higher than the two sides. The special arc-shaped structure with high middle and low two sides can easily wipe the nano-mask material 230 protruding on the surface of the conductive film 220, and the working efficiency is improved.
In one embodiment, referring to fig. 10, the erasing tool 131 further includes a hook set, the hook set includes a plurality of hooks, and the plurality of hooks are spaced at the bottom of the shaping block 1312. It should be noted that the hook is short and thin, so that the shaping block 1312 and the sponge wiping block 1313 can be firmly connected, and are difficult to pull down in the vertical direction and the horizontal direction; also, when the wiping tool 131 is tilted to a certain angle, the sponge wipe 1313 can be easily pulled down from the shaping block 1312.
In one embodiment, referring to fig. 8 and 9, the automatic erasing mechanism 130 further includes a feeding assembly 133 and a discharging assembly 134, wherein the discharging assembly 134 is provided with a saw-toothed portion for inserting and connecting with the sponge wiping block 1313, so that the discharging assembly 134 is firmly connected with the sponge wiping block 1313. The blanking assembly 134 is arranged below the wiping tool 131 and is used for driving the old sponge wiping block 1313 to move up and down in a displacement manner in a direction away from the shaping block 1312; the feeding assembly 133 is disposed under the wiping tool 131 and is used to drive the new sponge wiping block 1313 to move up and down in a direction close to the shaping block 1312 so as to press the sponge wiping block 1313 to the hook set, so that the sponge wiping block 1313 is firmly connected to the bottom of the shaping block 1312. It should be noted that, since the sponge wiper 1313 is a consumable product, the sponge wiper 1313 must be replaced with a new one after the nanomask material 230 is filled. The sponge wiping block 1313 can be automatically replaced through the feeding assembly 133 and the discharging assembly 134, and the working efficiency is improved.
In one embodiment, referring to fig. 8 and 9, the feeding assembly 133 includes a rotating motor, a rotating disc 1331 and a plurality of feeding devices 1332, the rotating motor is connected to the rotating disc 1331, and the plurality of feeding devices 1332 are respectively disposed on the rotating disc 1331 at intervals in a ring shape. The rotary motor drives the rotary disc 1331 to rotate, so that different loading devices 1332 respectively reach the position of the wiping tool 131, thereby completing the loading operation of the sponge wiping block 1313.
In one embodiment, referring to fig. 8 and 9, the feeding device 1332 includes a feeding cylinder and a placing plate, the feeding cylinder is connected to the placing plate, the placing plate can place 6 to 10 sponge wiping blocks 1313, and the feeding cylinder is used for pressing the sponge wiping blocks 1313 on the placing plate to the hook set, so that the sponge wiping blocks 1313 are firmly connected to the bottom of the shaping block 1312.
In any of the above embodiments, the transfer transportation displacement assembly 114, the X-axis transportation displacement assembly 111, the Y-axis transportation displacement assembly 113, the X-axis transportation displacement device, the Y-axis transportation displacement device, the X-axis displacement module 1321, the Y-axis displacement module 1322, the Z-axis displacement module 1323, and the unloading assembly 134 may be motors, cylinders, synchronous belt type linear modules, ball screw type linear modules, or other similar automatic displacement devices.
The production process of the nanometer mask material removing production line 10 is as follows:
1) the nanometer mask material removing production line 10 adopts two sets of systems to work simultaneously, namely a 1# system and a 2# system, the corresponding systems can be automatically identified after the feeding of the previous procedure, and the beat can be controlled within 60 seconds.
2) The conductive structure board 20 is transported to the operation platform 122 by the feeding transportation mechanism 110, in the feeding transportation mechanism 110, the conductive structure board 20 passes through the X-axis transportation displacement assembly 111 and runs to the XY-axis transportation displacement assembly 112, the sensor senses that no material is produced in the 1# system, the conductive structure board can be automatically identified and stopped, the conductive structure board is switched from the X-axis transportation displacement device to the Y-axis transportation displacement device, the conductive structure board is transported to the Y-axis transportation displacement assembly 113 along the Y-axis after the switching is completed, the transfer transportation displacement assembly 114 is lifted after the conductive structure board 20 is lifted to the corresponding height at the same position, the transfer transportation displacement assembly 114 is started to move to the water tank 121, the lifting transportation displacement assembly 115 synchronously starts to be lifted, the transfer transportation displacement assembly 114 is stopped after reaching a certain position through the PLC control time, the transfer transportation displacement assembly is inserted and connected with the lifting transportation displacement assembly 115, the connecting groove 1152a of the lifting transportation displacement assembly 115 needs to be designed, to ensure that the transfer transportation displacement assembly 114 can be precisely inserted into the connecting groove 1152a under the control of the PLC and the photo sensor switch. The lifting transportation displacement assembly 115 lifts the conductive structure plate 20, then the transferring transportation displacement assembly 114 returns along the original route, the lifting transportation displacement assembly 115 begins to descend, and after the lifting transportation displacement assembly 115 is immersed into the operation platform 122, the conductive structure plate 20 is completely and flatly placed on the operation platform 122. The transport displacement assembly 132 is started, the Z-axis displacement module 1323 is run at high speed on the Y-axis displacement module 1322, and the Y-axis displacement module 1322 is stepped at frequency on the X-axis displacement module 1321. The front end of the Z-axis displacement module 1323 has an erasing tool 131, the erasing tool 131 can remove the nano-mask material 230 on the surface of the conductive structure plate 20, and the sponge wiping block 1313 of the erasing tool 131 is replaced by the material assembly and the blanking assembly 134.
3) After the removing process is completed, the conductive structure plate 20 is changed into the textured conductive structure plate 30, the textured conductive structure plate 30 is conveyed away from the operation platform 122 by the discharging and conveying mechanism 140, at this time, a certain amount of gas is released in the plurality of through holes 1221 on the operation platform 122, the release of the gas is helpful for the textured conductive structure plate 30 to stably leave the water bath 121, in the discharging transportation mechanism 140, the lifting transportation displacement assembly 115 starts to work, the lifting transportation displacement assembly 115 works to a certain height, the transferring transportation displacement assembly 114 moves towards the water tank 121, and inserted into and connected with the lifting/lowering/transporting displacement assembly 115, the transferring/transporting displacement assembly 114 is lowered, the conductive structure plate 20 is placed on the transferring/transporting displacement assembly 114, then the X-axis transport displacement assembly is transported to the Y-axis transport displacement assembly 113, and finally the X-axis transport displacement assembly 111 and the XY-axis transport displacement assembly 112 enter the next process.
4) In both the # 1 system and the # 2 system, the transport displacement assembly 132 employs dual X-axis displacement modules and dual Y-axis displacement modules, i.e., each X-axis displacement module 1321 includes an X1-axis displacement module and an X2-axis displacement module, i.e., each Y-axis displacement module 1322 includes a Y1-axis displacement module and a Y2-axis displacement module, which ensures that in the event of a failure of one of the X-axis displacement modules 1321 or the Y-axis displacement module 1322, the remaining one of the X-axis displacement modules 1321 or the Y-axis displacement module 1322 can still operate normally, which minimizes the risk of potential loss.
Compared with the prior art, the invention has at least the following advantages:
according to the nanometer mask material removing production line 10 and the production process thereof, the feeding and conveying mechanism 110 automatically conveys the conductive structure plate 20, the vacuum adsorption device automatically sucks, fixes and releases the conductive structure plate 20, and the conveying displacement assembly 132 drives the erasing tool 131 to automatically wipe the outer surface of the conductive structure plate 20, so that the nanometer mask material 230 on the outer surface of the conductive structure plate 20 can be continuously removed in a large-scale manner, and the high efficiency of removing the nanometer mask material 230 can be improved. In particular, the operation platform 122 is immersed in the water tank 121, so that the wiping operation is performed in the water, and under the lubrication action of the water, the friction between the wiping tool 131 and the nano-mask material 230 and the conductive film 220 can be reduced, so as to prevent the conductive film 220 with a soft texture from being damaged.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A production process of a nanometer mask material removal production line is characterized by comprising the following steps:
immersing the operation platform in water in a water tank;
controlling a feeding and conveying mechanism to convey a conductive structural plate to the operating platform, wherein the conductive structural plate comprises a substrate, a conductive film and a nanometer mask material which are sequentially stacked from inside to outside;
the operating platform is provided with a plurality of through holes, and a vacuum adsorption device is controlled to extract gas in the through holes so as to adsorb and fix the conductive structure plate on the operating platform;
and controlling the transmission displacement assembly to drive an erasing tool to perform erasing operation on the outer surface of the conductive structure plate so as to remove the nanometer mask material and obtain the textured conductive structure plate.
2. The production process of the nanometer mask material removal production line according to claim 1, wherein after the operation of obtaining the textured conductive structure plate, an air compression device is further controlled to release compressed air into the plurality of through holes so as to reduce the resistance of water to the textured conductive structure plate; and controlling a discharging and conveying mechanism to convey the suede conductive structure plate to leave the operating platform.
3. The production process of the nanomask material removal production line according to claim 2, wherein the feeding transportation mechanism comprises a transferring transportation displacement assembly and a lifting transportation displacement assembly, the operation platform has a groove, the lifting transportation displacement assembly is embedded in the groove, the transferring transportation displacement assembly is disposed adjacent to the operation platform, and the operation of controlling the feeding transportation mechanism to transport the conductive structure plate to the operation platform is specifically: control move and carry the transportation displacement subassembly and drive electrically conductive structural slab is the upward movement, control the synchronous upward movement is done to the transportation displacement subassembly that goes up and down, control move and carry the transportation displacement subassembly and drive electrically conductive structural slab is to being close to the direction motion of the transportation displacement subassembly that goes up and down, with electrically conductive structural slab transports on the transportation displacement subassembly that goes up and down, control the transportation displacement subassembly that goes up and down drives electrically conductive structural slab is the downward movement, with electrically conductive structural slab transports on the operation platform.
4. The production process of the nanomask material removal line according to claim 3, the feeding and conveying mechanism also comprises an X-axis conveying and displacing component, an XY-axis conveying and displacing component and a Y-axis conveying and displacing component, the Y-axis transportation displacement assembly is arranged at the position adjacent to the shifting transportation displacement assembly, the XY-axis transportation displacement assembly is arranged at the position adjacent to the Y-axis transportation displacement assembly, the X-axis transport displacement assembly is arranged at a position adjacent to the XY-axis transport displacement assembly, before controlling the transfer transportation displacement assembly to drive the conductive structure plate to do ascending motion, controlling an X-axis transportation displacement assembly to drive the conductive structure plate to move towards the direction close to the XY-axis transportation displacement assembly so as to transport the conductive structure plate to the XY-axis transportation displacement assembly; controlling the XY-axis transportation displacement assembly to drive the conductive structure plate to move towards the direction close to the Y-axis transportation displacement assembly so as to transport the conductive structure plate to the Y-axis transportation displacement assembly; and controlling the Y-axis transportation displacement assembly to drive the conductive structure plate to move towards the direction close to the shifting transportation displacement assembly so as to transport the conductive structure plate to the shifting transportation displacement assembly.
5. The production process of the nanomask material removal production line according to claim 4, wherein the XY-axis transportation displacement assembly comprises an X-axis transportation displacement device and a Y-axis transportation displacement device, the X-axis transportation displacement device is disposed between the X-axis transportation displacement assembly and the Y-axis transportation displacement assembly, the Y-axis transportation displacement device is slidably connected to the X-axis transportation displacement device, and the operation of controlling the XY-axis transportation displacement assembly to drive the conductive structure plate to move in a direction close to the Y-axis transportation displacement assembly specifically comprises: and controlling the X-axis transportation displacement device to drive the conductive structure plate to do linear displacement motion on the X axis, and controlling the Y-axis transportation displacement device to drive the conductive structure plate to do linear displacement motion on the Y axis.
6. The production process of the nanomask material removal production line as claimed in claim 1, wherein the transfer displacement assembly comprises an X-axis displacement module, a Y-axis displacement module and a Z-axis displacement module, the erasing tool is disposed on the Z-axis displacement module, the Z-axis displacement module is slidably connected to the Y-axis displacement module, the Y-axis displacement module is slidably connected to the X-axis displacement module, the X-axis displacement module is disposed above the operation platform, and the operation of controlling the transfer displacement assembly to drive the erasing tool to perform the erasing operation on the outer surface of the conductive structure plate is specifically: controlling the X-axis displacement module to drive the erasing tool to move towards the direction close to the operating platform so as to transport the erasing tool to the position of the operating platform; controlling the Z-axis displacement module to drive the erasing tool to do descending motion so that the erasing tool is in contact with the conductive structure plate; and controlling the Y-axis displacement module to drive the erasing tool to do reciprocating displacement motion on the Y axis so that the erasing tool performs erasing operation on the outer surface of the conductive structure plate on the Y axis.
7. The production process of the nanometer mask material removing production line according to any one of claims 1 to 6, wherein the middle 10mm to 30mm wide area of the erasing tool is 5mm to 10mm higher than the two sides.
8. The production process of the nanometer mask material removal production line according to any one of claims 1 to 6, wherein a plurality of the through holes are uniformly arranged on the operation platform at intervals, each through hole comprises an upper hole and a lower hole which are communicated with each other, the diameter of the upper hole is 1.0mm to 1.5mm, and the diameter of the lower hole is 6mm to 8 mm.
9. The production process of the nanometer mask material removing production line according to any one of claims 1 to 6, wherein the lifting transportation displacement assembly comprises a water discharging motor and a bearing structure, the water discharging motor is in driving connection with the bearing structure, the bearing structure is provided with a connecting groove, and the transferring transportation displacement assembly is provided with a connecting part which is used for being inserted into the connecting groove in a connecting manner.
10. A nanomask material removal line, comprising:
the solid absorption bearing mechanism comprises a water tank, an operating platform and a vacuum adsorption device, wherein the operating platform is arranged in the water tank, the operating platform is provided with a plurality of through holes, the vacuum adsorption device is arranged below the operating platform, and the air inlet end of the vacuum adsorption device is communicated with the through holes;
the feeding and conveying mechanism is connected with the operating platform and is used for driving the conductive structural plate to do reciprocating displacement motion relative to the operating platform, and the conductive structural plate comprises a substrate, a conductive film and a nanometer mask material which are sequentially stacked from inside to outside; and
the automatic erasing mechanism comprises an erasing tool and a transmission displacement assembly, the erasing tool is connected with the transmission displacement assembly, and the transmission displacement assembly is used for driving the erasing tool to perform erasing operation on the outer surface of the conductive structure plate so as to remove the nanometer mask material.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111589754A (en) * | 2020-06-02 | 2020-08-28 | 井东风 | Surface treatment process for rolling and manufacturing aluminum foil |
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Effective date of registration: 20230801 Address after: Building 1-4, Phase II Factory Building, Chancheng New Area, Anyuan County, Ganzhou City, Jiangxi Province, 342100 Patentee after: Jiangxi Yihui Optoelectronic Technology Co.,Ltd. Address before: 516006 floors 1-2 of building g, No. 7, huitai Road, Huinan high tech Industrial Park, huiao Avenue, Huizhou City, Guangdong Province Patentee before: HUIZHOU E-FLY OPTOELECTRONIC MATERIALS Co.,Ltd. |