CN116581066A - Semiconductor silicon wafer cleaning equipment - Google Patents
Semiconductor silicon wafer cleaning equipment Download PDFInfo
- Publication number
- CN116581066A CN116581066A CN202310829024.7A CN202310829024A CN116581066A CN 116581066 A CN116581066 A CN 116581066A CN 202310829024 A CN202310829024 A CN 202310829024A CN 116581066 A CN116581066 A CN 116581066A
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- CN
- China
- Prior art keywords
- silicon wafer
- guide plate
- sealing
- cylinder
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 87
- 239000010703 silicon Substances 0.000 title claims abstract description 87
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 238000004140 cleaning Methods 0.000 title claims abstract description 66
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000002347 injection Methods 0.000 claims abstract description 45
- 239000007924 injection Substances 0.000 claims abstract description 45
- 230000007246 mechanism Effects 0.000 claims abstract description 28
- 238000007789 sealing Methods 0.000 claims description 71
- 239000012530 fluid Substances 0.000 claims description 19
- 238000007664 blowing Methods 0.000 claims description 8
- 238000005192 partition Methods 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 5
- 210000001503 joint Anatomy 0.000 claims description 5
- 230000004308 accommodation Effects 0.000 claims 2
- 239000007788 liquid Substances 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 62
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 238000005406 washing Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the technical field of silicon wafer cleaning, in particular to semiconductor silicon wafer cleaning equipment, which comprises a cleaning tank and a basket main body capable of being placed in the cleaning tank, wherein the basket main body comprises end plates, bottom toothed bars, side toothed bars, nozzles and a sliding traction mechanism, the nozzles are arranged between the two end plates towards a silicon wafer in a collecting way, the sliding traction mechanism is arranged on the outer sides of the end plates and is connected with the ends of the bottom toothed bars and the side toothed bars, and when the nozzles are communicated with a water injection pipe in the cleaning tank and cleaning liquid is sprayed out, the sliding traction mechanism can drive the bottom toothed bars and the side toothed bars to slide at the bottom end and the side of the silicon wafer, so that under the limit effect of the silicon wafer, the contacted dead angles of the silicon wafer can be exposed, and the problem that the silicon wafer is easy to slide down when the four corners of the silicon wafer are exposed in the conventional cleaning equipment is solved.
Description
Technical Field
The invention relates to the technical field of silicon wafer cleaning, in particular to semiconductor silicon wafer cleaning equipment.
Background
Silicon wafers are important elements for the production of solar cells, which require multiple processing steps in the production process. Among the numerous processing steps, the cleaning step of the silicon wafer surface has an important influence on the properties of the solar cell. The silicon wafer cleaning equipment is used for immersing the silicon wafer into an acid liquid pool or an alkali liquid pool to perform a series of chemical reactions so as to clean the silicon wafer. At present, a silicon wafer carrier can move in or out of silicon wafer cleaning equipment, but a cleaning dead angle exists in a region where the silicon wafer is in contact with a charging basket, and no matter how many times the silicon wafer is cleaned, good cleaning cannot be performed.
Chinese patent CN112397423B relates to a silicon wafer cleaning apparatus comprising: a cleaning pool and a basket body; the flower basket main body comprises two end plates which are arranged in parallel, three toothed bars and three support bars, wherein a sliding groove which extends obliquely downwards is respectively arranged at the position of each end plate positioned at each support bar, and the end part of each sliding groove is fixedly connected with a spreading spring which is in contact connection with each support bar; the inner side walls of the two short sides of the cleaning pool are respectively provided with a push block, and the push blocks are provided with a stepped push surface which is simultaneously contacted with the three support rods; the pushing block can push the supporting rod to slide along the sliding groove and compress the expanding spring so that the silicon wafer slides out from between the two clamping teeth to be contacted with the supporting rod; the clamping position of the clamping teeth on the silicon wafer can be exposed before the cleaning.
This cleaning equipment need remove through pushing motor drive ejector pad for the silicon chip can the landing and contact with the bracing piece again in cleaning process, thereby make the chucking position by the clamp tooth before on the silicon chip can expose, wash, however the silicon chip can break away from the clamp tooth in the in-process that is erodeed by the washing liquid, and then can break away from the basket of flowers main part.
Disclosure of Invention
To above-mentioned problem, provide a semiconductor silicon chip cleaning equipment, through the basket of flowers main part that is provided with slip traction mechanism, when making the water injection pipe switch-on and the washing liquid blowout in nozzle and the washing pond, slip traction mechanism can drive end rack and side rack and slide in the bottom and the side of silicon chip, and then under the effect that keeps spacing to the silicon chip, the quilt contact dead angle of silicon chip can expose, and then has solved current cleaning equipment when exposing the clearance four corners of silicon chip, the easy problem of landing of silicon chip.
In order to solve the problems in the prior art, the invention provides semiconductor silicon wafer cleaning equipment, which comprises a cleaning tank and a basket main body capable of being placed in the cleaning tank, wherein the basket main body comprises end plates, bottom toothed bars and side toothed bars, the two end plates are arranged in parallel, the bottom toothed bars and the side toothed bars are horizontally arranged between the two end plates, a silicon wafer is longitudinally inserted between the two end plates at equal intervals to form a silicon wafer set, the side toothed bars are abutted to the side edges of the silicon wafer, the bottom toothed bars are abutted to the bottom edges of the silicon wafer, a water injection pipe with an upward outlet is arranged at the bottom of the cleaning tank, the basket main body further comprises a nozzle and a sliding traction mechanism, the nozzle is arranged between the two end plates towards the silicon wafer set, the sliding traction mechanism is arranged at the outer side of the end plates and is connected with the end parts of the bottom toothed bars and the side toothed bars, after the basket main body is placed in the cleaning tank, the nozzle is communicated with the water injection pipe, and in the water injection pipe water outlet process of the nozzle is guided by the sliding traction mechanism to move the bottom toothed bars transversely and the side toothed bars are guided to move longitudinally.
Preferably, the flower basket main body further comprises a connecting square pipe, a threaded column and a connecting seat, wherein the connecting square pipe is slidably arranged on two sides of the two end plates, the threaded column penetrates through the connecting square pipe and is in threaded connection with the end plates, the connecting seat is arranged at two ends of the connecting square pipe, a first arrangement groove extending longitudinally is formed in the connecting seat, and the end part of the side toothed bar is slidably arranged in the first arrangement groove and is connected with the sliding traction mechanism.
Preferably, the sliding traction mechanism comprises a first guide plate, a fluid guide assembly and a reciprocating driving assembly, wherein the first guide plate is transversely arranged on the outer side of the connecting seat in a sliding manner, a first chute is arranged on the first guide plate, the end part of the side toothed bar penetrates through the first settling groove and is in sliding fit with the first chute, when the first guide plate moves outwards transversely, the side toothed bar moves longitudinally, the fluid guide assembly is arranged on the outer side of the end plate and is communicated with the nozzle, the fluid guide assembly is provided with a water inlet which can be butted with a water injection pipe and a gas blowing port which can be blown outwards for injecting water into the fluid guide assembly, the reciprocating driving assembly is arranged on the connecting seat and is connected with the first guide plate, the gas blowing port is communicated with the reciprocating driving assembly, and when gas is injected into the reciprocating driving assembly, the reciprocating driving assembly drives the first guide plate to reciprocate transversely.
Preferably, the lower part of end plate is provided with the second setting groove of horizontal extension, slip traction mechanism still includes second guide board and connecting rod, and the second guide pole sets up along vertical sliding the outside of end plate, be provided with the second chute on the second guide board, the tip of end rack bar pass behind the second setting groove with second chute sliding fit, when the second guide board moves down along the longitudinal direction, end rack bar lateral shifting, the one end of connecting rod with first guide board rotates to be connected in order to form first tie point, the other end of connecting rod with second guide board rotates to be connected in order to form the second tie point, and the second tie point is higher than first tie point.
Preferably, the fluid guiding assembly comprises a first sealing cylinder and a rotating shaft, the first sealing cylinder is longitudinally arranged on the outer side of the end plate, the first sealing cylinder is provided with a first sealing cavity and a second sealing cavity from bottom to top, the bottom end of the first sealing cavity can be communicated with the water injection pipe in a butt joint mode, the upper portion of the first sealing cavity is further provided with a water injection port communicated with a nozzle, the lower portion of the second sealing cavity is provided with an air inlet communicated with the outside, the air injection port is located at the top end of the second sealing cavity, the rotating shaft penetrates through the first sealing cylinder and is rotationally connected with the first sealing cylinder, and the circumferential surface of the rotating shaft is provided with a first arc-shaped guide vane located in the first sealing cavity and a second arc-shaped guide vane located in the second sealing cavity.
Preferably, the flower basket main body further comprises a total flow pipe connected with four corners of the two end plates, the end parts of the total flow pipe are communicated with the water injection port, the nozzles are axially and equidistantly arranged on the total flow, and each nozzle is provided with an inserting connection part communicated with the total flow pipe and a flat water outlet part obliquely facing the silicon wafer collection.
Preferably, the bottom of first sealed chamber is the horn mouth shape that the internal diameter from top to bottom gradually increases, be provided with the baffle between horn mouth and the first sealed chamber, the bottom of axis of rotation runs through the baffle and rotates with it to be connected, be provided with the inlet opening on the baffle.
Preferably, the first sealing cylinder comprises a lower cylinder body, an upper cylinder body and an end cover, wherein the bottom end of the lower cylinder body can be in butt joint communication with the water injection pipe, the top end of the lower cylinder body is opened, the top end of the upper cylinder body is opened, the bottom end of the upper cylinder body is closed, the bottom end of the upper cylinder body is sealed with the top end of the lower cylinder body in a jogged manner, the end cover is arranged at the top end of the upper cylinder body, and the rotating shaft penetrates through the bottom end of the upper cylinder body and is in rotating connection with the upper cylinder body.
Preferably, the reciprocating driving assembly comprises a second sealing cylinder, a piston, a plug and a spring, wherein the second sealing cylinder is transversely arranged on the connecting seat, an exhaust hole is formed in the sealing cylinder, an air inlet connected with the air injection port is formed in one end of the second sealing cylinder, the piston is slidably arranged in the second sealing cylinder, one end of the plug is connected with the first guide plate, the other end of the plug penetrates through the second sealing cylinder and is fixedly connected with the piston, and the spring is sleeved on the plug and is positioned in the second sealing cylinder.
Preferably, the outside of first guide board is provided with the push pedal of outside extension to and connect the set square of first guide board and push pedal, the outside of connecting seat still is provided with the polished rod, the polished rod runs through the push pedal and with its sliding fit.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, through the basket main body provided with the sliding traction mechanism, when the nozzle is communicated with the water injection pipe in the cleaning pool and the cleaning liquid is sprayed out, the sliding traction mechanism can drive the bottom toothed bar and the side toothed bar to slide at the bottom end and the side face of the silicon wafer, so that the contacted dead angle of the silicon wafer can be exposed under the effect of limiting the silicon wafer, and the problem that the silicon wafer easily slides down when the four corners of the silicon wafer are cleaned by the conventional cleaning equipment is solved.
Drawings
Fig. 1 is a perspective view of a semiconductor wafer cleaning apparatus.
Fig. 2 is a perspective view of a basket body in a semiconductor wafer cleaning apparatus.
Fig. 3 is a front view of a basket body in a semiconductor wafer cleaning apparatus.
Fig. 4 is a cross-sectional view at section A-A of fig. 3.
Fig. 5 is a partial enlarged view at B of fig. 4.
Fig. 6 is a partial enlarged view at C of fig. 4.
Fig. 7 is a cross-sectional view at section D-D of fig. 3.
Fig. 8 is an end perspective exploded view of a basket body in a semiconductor wafer cleaning apparatus.
Fig. 9 is an exploded perspective view of a reciprocating drive assembly in a semiconductor wafer cleaning apparatus.
Fig. 10 is an exploded perspective view of a fluid guide assembly in a semiconductor wafer cleaning apparatus.
The reference numerals in the figures are: 1-a cleaning pool; 11-a water injection pipe; 21-end plates; 212-a second seating groove; 22-bottom tooth bar; 23-side rack bar; 24-nozzle; 25-a sliding traction mechanism; 251-first guide plate; 2511—a first chute; 2512-push plate; 2513-triangle; 252-a first sealed cavity; 2521-a water fill port; 253—a second sealed cavity; 2531-an air inlet hole; 2532-gas injection port; 254-separator; 2541-water inlet holes; 255-lower cylinder; 256-upper cylinder; 257-end cap; 258-rotating shaft; 2581-a first arcuate deflector; 2582-a second arcuate deflector; 261-a second seal cartridge; 2611-vent holes; 2612-inlet; 262-piston; 263-plug; 264-a spring; 271-a second guide plate; 2711-second chute; 272-a connecting rod; 281-connecting square pipes; 282-threaded post; 283-connecting seat; 2831-first seating groove; 2832-polish rod; 29-total flow tube; 3-silicon wafer collection.
Detailed Description
The invention will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the invention and the specific objects and functions achieved.
As shown in fig. 1 and 2, the present invention provides:
the utility model provides a semiconductor silicon wafer cleaning equipment, includes washs pond 1 and can put into the basket of flowers main part in wasing pond 1, the basket of flowers main part includes end plate 21, end toothed bar 22 and side toothed bar 23, two end plate 21 parallel arrangement, end toothed bar 22 and side toothed bar 23 set up horizontally between two end plates 21, the equidistant longitudinal grafting of silicon chip is in order to form silicon chip collection 3 between two end plates 21, side toothed bar 23 butt is at the side of silicon chip, end toothed bar 22 butt is at the base of silicon chip, the bottom of wasing pond 1 is provided with the water injection pipe 11 that the export was up, the basket of flowers main part still includes nozzle 24 and slip traction mechanism 25, nozzle 24 sets up towards silicon chip collection 3 between two end plates 21, slip traction mechanism 25 sets up in the outside of end plate 21 and with end connection of end toothed bar 22 and side toothed bar 23, after the basket of flowers main part is put into washs pond 1, nozzle 24 communicates with water injection pipe 11, the in-process of nozzle 24 goes out water, slip traction mechanism 25 guide bottom toothed bar 22 and guide side toothed bar 23 lateral movement.
When the silicon wafer cleaning device is used, silicon wafers are sequentially inserted into the two end plates 21, the circumferential surfaces of the bottom tooth bar 22 and the side tooth bar 23 are provided with equidistant ring grooves, so that the bottom edge and the side edge of the silicon wafer can be limited in the ring grooves, the equidistant arrangement of the silicon wafers is ensured, and the side surfaces of the silicon wafers are convenient to clean.
After placing the silicon wafer, placing the basket main body in the cleaning tank 1, connecting the nozzle 24 and the water injection pipe 11, injecting water into the nozzle 24 through the water pump and the water injection pipe 11, so that the uniformly distributed nozzles 24 can spray cleaning liquid to the silicon wafer, in the process, the sliding traction mechanism 25 drives the bottom toothed bar 22 to move transversely and simultaneously drives the side toothed bar 23 to move longitudinally, and under the condition that the position of the silicon wafer set 3 relative to the end plate 21 is not changed, the contacted position of the silicon wafer can be exposed in the cleaning range of the nozzles 24, so that the silicon wafer can be cleaned stably.
According to the flower basket main body provided with the sliding traction mechanism 25, when the nozzle 24 is communicated with the water injection pipe 11 in the cleaning pool 1 and cleaning liquid is sprayed out, the sliding traction mechanism 25 can drive the bottom toothed bar 22 and the side toothed bar 23 to slide at the bottom end and the side face of a silicon wafer, so that under the effect of limiting the silicon wafer, the contacted dead angle of the silicon wafer can be exposed, and the problem that the silicon wafer is easy to slide when four corners of the silicon wafer are cleaned by the conventional cleaning equipment is solved.
As shown in fig. 2 and 8, the basket body further includes a connection square tube 281, a screw post 282 and a connection seat 283, the connection square tube 281 is slidably disposed at both sides of the two end plates 21, the screw post 282 penetrates the connection square tube 281 and is in screw connection with the end plates 21, the connection seat 283 is disposed at both ends of the connection square tube 281, a first disposition groove 2831 extending in a longitudinal direction is disposed on the connection seat 283, and an end portion of the side rack 23 is slidably disposed in the first disposition groove 2831 and is connected with the sliding traction mechanism 25.
For adapting to the silicon wafers with different sizes, the threaded posts 282 are rotated relative to the end plates 21, so that the connecting square tubes 281 transversely move on two sides of the two end plates 21, further, the connecting seats 283 connected with two ends of the connecting square tubes 281 can move on the outer sides of the end plates 21, the distance between the two connecting seats 283 can be adjusted, the side toothed bars 23 are arranged in parallel and located on two sides of the silicon wafer, the side toothed bars 23 on two sides can be connected with the two connecting seats 283 respectively, and the distance between the side toothed bars 23 can be adjusted, so that the silicon wafers with different sizes can be conveniently inserted.
As shown in fig. 3, 4 and 8, the sliding traction mechanism 25 includes a first guide plate 251, a fluid guide assembly and a reciprocating driving assembly, the first guide plate 251 is laterally slidably disposed on the outer side of the connection seat 283, a first chute 2511 is disposed on the first guide plate 251, an end portion of the side rack 23 passes through the first disposition groove 2831 and then is slidably engaged with the first chute 2511, when the first guide plate 251 moves laterally outwards, the side rack 23 moves longitudinally, the fluid guide assembly is disposed on the outer side of the end plate 21 and communicates with the nozzle 24, the fluid guide assembly has a water inlet that can be abutted with the water injection pipe 11, and a gas blowing port that can be injected with the water injection pipe 11 and is capable of blowing gas outwards, the reciprocating driving assembly is disposed on the connection seat 251 and connected with the first guide plate, and when the end portion of the side rack 23 moves laterally outwards, the reciprocating driving assembly drives the first guide plate 251 to reciprocate laterally.
After the flower basket main body is placed in the cleaning tank 1, the water inlet of the fluid guide assembly is communicated with the water injection pipe 11, and the fluid guide assembly is communicated with the nozzle 24, so that when the water injection pipe 11 is used for injecting water into the fluid guide assembly, the fluid guide assembly can blow air into the reciprocating drive assembly through the air blowing port, and further, when cleaning liquid is sprayed out through the nozzle 24 to clean a silicon wafer, the reciprocating drive assembly can drive the first guide plate 251 to transversely move, the first chute 2511 on the first guide plate 251 is in sliding fit with the end part of the side toothed bar 23, and meanwhile, the end part of the side toothed bar 23 is slidably arranged in the first positioning groove 2831 which longitudinally extends, so that the side toothed bar 23 can reciprocally slide on the side edge of the silicon wafer when the cleaning liquid passes through the fluid guide assembly.
As shown in fig. 9, the lower portion of the end plate 21 is provided with a second positioning slot 212 extending transversely, the sliding traction mechanism 25 further includes a second guide plate 271 and a connecting rod 272, the second guide plate 271 is slidably disposed on the outer side of the end plate 21 along the longitudinal direction, a second chute 2711 is disposed on the second guide plate 271, the end portion of the bottom tooth bar 22 passes through the second positioning slot 212 and then is slidably engaged with the second chute 2711, when the second guide plate 271 moves downward along the longitudinal direction, the bottom tooth bar 22 moves transversely, one end of the connecting rod 272 is rotatably connected with the first guide plate 251 to form a first connecting point, and the other end of the connecting rod 272 is rotatably connected with the second guide plate 271 to form a second connecting point, the second connecting point is higher than the first connecting point.
In order to enable the bottom toothed bar 22 to slide reciprocally at the bottom end of the silicon wafer, the first guide plate 251 and the second guide plate 271 are rotationally connected through the connecting rod 272, two first guide plates 251 are arranged on the outer side of the end plate 21, the two first guide plates 251 can drive the second guide plate 271 to move vertically on the outer side of the end plate 21 through the connecting rod 272 in the process of moving horizontally in opposite directions or in opposite directions, and the end part of the bottom toothed bar 22 passes through the second positioning groove 212 extending transversely and then is in sliding fit with the second chute 2711, so that the bottom toothed bar 22 can slide reciprocally at the bottom end of the silicon wafer, and further the dead angle is exposed.
As shown in fig. 5 and 10, the fluid guiding assembly includes a first sealing cylinder and a rotating shaft 258, the first sealing cylinder is longitudinally disposed at the outer side of the end plate 21, the first sealing cylinder is provided with a first sealing cavity 252 and a second sealing cavity 253 from bottom to top, the bottom end of the first sealing cavity 252 can be in butt joint communication with the water injection pipe 11, the upper portion of the first sealing cavity 252 is further provided with a water injection port 2521 communicated with the nozzle 24, the lower portion of the second sealing cavity 253 is provided with an air inlet 2531 communicated with the outside, the air injection port 2532 is located at the top end of the second sealing cavity 253, the rotating shaft 258 penetrates through the first sealing cylinder and is in rotating connection with the second sealing cavity 253, and the circumference surface of the rotating shaft 258 is provided with a first arc-shaped guide vane 2581 located in the first sealing cavity 252 and a second arc-shaped guide vane 2582 located in the second sealing cavity 253.
When the cleaning solution is injected into the first sealed cavity 252 from the water injection pipe 11, under the action of the first arc-shaped guide vane 2581, the rotating shaft 258 rotates in the first sealed cylinder, so that the second guide vane rotates in the second sealed cavity 253, the rotating second guide vane can pump external air into the reciprocating driving assembly through the air inlet hole 2531, the reciprocating driving assembly can drive the first guide plate 251 to slide on the connecting seat 283, and the cleaning solution in the first sealed cavity 252 is discharged from the high water injection port 2521 to the nozzle 24, so that the nozzle 24 can spray the cleaning solution to the silicon wafer in a fan shape.
As shown in fig. 7, the basket body further includes a total flow pipe 29 connecting four corners of the two end plates 21, the end portions of the total flow pipe 29 are communicated with the water injection ports 2521, the nozzles 24 are axially and equidistantly arranged on the total flow, and the nozzles 24 are provided with a plugging portion communicated with the total flow pipe 29 and a flat water outlet portion inclined towards the silicon wafer set 3.
The flow pipes 29 are arranged at four corners of the two end plates 21, the nozzles 24 are arranged on the flow pipes 29 at equal intervals, and the flat water outlet parts of the nozzles 24 face the silicon wafer, so that in the process of spraying cleaning liquid, because the side toothed bars 23 and the bottom toothed bars 22 are cylindrical, part of the cleaning liquid extends along the tangential direction of the side toothed bars 23 and the bottom toothed bars 22 when contacting the circumferential surfaces of the side toothed bars 23 and the bottom toothed bars 22, and further the cleaning liquid can completely clean the silicon wafer.
As shown in fig. 5, the bottom end of the first sealing cavity 252 is in a bell mouth shape with an inner diameter gradually increasing from top to bottom, a partition plate 254 is disposed between the bell mouth and the first sealing cavity 252, the bottom end of the rotating shaft 258 penetrates through the partition plate 254 and is rotationally connected with the partition plate 254, and a water inlet 2541 is disposed on the partition plate 254.
For the water injection pipe 11 can dock with the bottom of first sealed chamber 252 accurately with water injection pipe 11 for the bottom of first sealed chamber 252 is the horn mouth that the internal diameter from top to bottom gradually increases and forms, makes under the effect of horn mouth inclined plane, and water injection pipe 11 can be accurately put through with first sealed chamber 252, sets up baffle 254 simultaneously between horn mouth and first sealed chamber 252, makes the bottom of axis of rotation 258 can be steadily with baffle 254 rotation connection, and the washing liquid can flow into in the first sealed chamber 252 through inlet 2541 simultaneously.
As shown in fig. 5, the first sealing cylinder comprises a lower cylinder 255, an upper cylinder 256 and an end cap 257, wherein the bottom end of the lower cylinder 255 can be in butt joint communication with the water injection pipe 11, the top end of the lower cylinder 255 is open, the top end of the upper cylinder 256 is open and the bottom end is closed, the bottom end of the upper cylinder 256 is in embedded sealing with the top end of the lower cylinder 255, the end cap 257 is arranged at the top end of the upper cylinder 256, and the rotating shaft 258 penetrates through the bottom end of the upper cylinder 256 and is in rotating connection with the upper cylinder 256.
A first seal cartridge for seating the rotation shaft 258 can be formed by the lower cartridge body 255, the upper cartridge body 256, and the end cap 257, and thus can be formed to form a first seal chamber 252 for seating the first arc-shaped deflector 2581, and a second seal chamber 253 for seating the second arc-shaped deflector 2582.
As shown in fig. 6 and 9, the reciprocating driving assembly includes a second sealing cylinder 261, a piston 262, a plug 263 and a spring 264, wherein the second sealing cylinder 261 is transversely arranged on the connecting seat 283, an exhaust hole 2611 is arranged on the sealing cylinder, an air inlet 2612 connected with the air injection port 2532 is arranged at one end of the second sealing cylinder 261, the piston 262 is slidingly arranged in the second sealing cylinder 261, one end of the plug 263 is connected with the first guide plate 251, the other end of the plug 263 penetrates through the second sealing cylinder 261 and is fixedly connected with the piston 262, and the spring 264 is sleeved on the plug 263 and is positioned in the second sealing cylinder 261.
When the second arc-shaped guide plate 2582 rotates in the second sealing cavity 253 to pump air into the second sealing cylinder 261, the pressure of the piston 262 towards one end of the air inlet 2612 increases, so that the piston 262 overcomes the elastic force of the spring 264 to drive the plug 263 and the connecting seat 283 to slide, the first guide plate 251 on the connecting seat 283 can slide outwards, when the high-pressure cavity at one end of the piston 262 is communicated with the air outlet 2611, air in the high-pressure cavity is rapidly discharged outwards through the air outlet, meanwhile, the spring 264 resets to drive the piston 262 to reset, the plug rod and the connecting seat 283 are reset, and the rotating second arc-shaped guide plate 2582 continues to pump air into the second sealing cylinder 261, so that the operation is repeated, and the first guide plate 251 can reciprocate outside the end plate 21, so that the side toothed bar 23 can reciprocate in the vertical direction on the side surface of the silicon wafer.
As shown in fig. 9, the outside of the first guide plate 251 is provided with a push plate 2512 extending outwards, and a triangle 2513 connecting the first guide plate 251 and the push plate 2512, and the outside of the connection seat 283 is further provided with a polish rod 2832, and the polish rod 2832 penetrates through the push plate 2512 and is in sliding fit with the same.
Through set up the push pedal 2512 of outwards extending in the outside of first guide board 251 for the cock stem can drive first guide board 251 through push pedal 2512 and remove, and the triangle 2513 can evenly distribute rather than vertically first guide board 251 with the effort that push pedal 2512 received simultaneously, ensures the stability of structure, sets up polished rod 2832 simultaneously on connecting seat 283, can make polished rod 2832 run through push pedal 2512 and rather than sliding fit, with this slip direction that stabilizes first guide board 251.
The foregoing examples merely illustrate one or more embodiments of the invention, which are described in greater detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. The utility model provides a semiconductor silicon wafer cleaning equipment, includes washs pond (1) and can put into the basket of flowers main part in washs pond (1), basket of flowers main part includes end plate (21), end tooth pole (22) and side tooth pole (23), two end plates (21) parallel arrangement, end tooth pole (22) and side tooth pole (23) set up horizontally between two end plates (21), silicon chip equidistant along vertically pegging graft between two end plates (21) in order to form silicon chip collection (3), side tooth pole (23) butt is at the side of silicon chip, end tooth pole (22) butt is at the base of silicon chip, the bottom of washs pond (1) is provided with water injection pipe (11) that exports upwards, basket of flowers main part still includes nozzle (24) and slip traction mechanism (25), nozzle (24) set up towards collection (3) between two end plates (21), slip traction mechanism (25) set up in the outside of end plate (21) and with end tooth pole (22) and side tooth pole (23) are connected, water injection pipe (24) are put into in the lateral direction after the water injection pipe (24) of washs pond (1), and guiding the side rack (23) to move longitudinally.
2. The semiconductor silicon wafer cleaning device according to claim 1, wherein the basket body further comprises a connecting square tube (281), threaded columns (282) and connecting seats (283), the connecting square tube (281) is slidably arranged on two sides of the two end plates (21), the threaded columns (282) penetrate the connecting square tube (281) and are in threaded connection with the end plates (21), the connecting seats (283) are arranged on two ends of the connecting square tube (281), first arrangement grooves (2831) extending longitudinally are formed in the connecting seats (283), and the end portions of the side toothed bars (23) are slidably arranged in the first arrangement grooves (2831) and are connected with the sliding traction mechanism (25).
3. A semiconductor wafer cleaning apparatus according to claim 2, wherein the sliding traction mechanism (25) comprises a first guide plate (251), a fluid guide assembly and a reciprocating driving assembly, the first guide plate (251) is transversely and slidably arranged on the outer side of the connecting seat (283), a first chute (2511) is arranged on the first guide plate (251), the end part of the side rack (23) passes through the first accommodating groove (2831) and then is in sliding fit with the first chute (2511), the side rack (23) longitudinally moves when the first guide plate (251) moves outwards in the transverse direction, the fluid guide assembly is arranged on the outer side of the end plate (21) and is communicated with the nozzle (24), the fluid guide assembly is provided with a water inlet which can be butted with a water injection pipe (11) and a gas blowing port which can be blown outwards, and the reciprocating driving assembly is arranged on the connecting seat (283) and is connected with the first guide plate (251), and the gas blowing port is communicated with the reciprocating driving assembly and drives the reciprocating driving assembly to move towards the first gas blowing port (251) in the transverse direction when the reciprocating driving assembly moves towards the reciprocating driving assembly.
4. A semiconductor wafer cleaning apparatus according to claim 3, wherein the lower portion of the end plate (21) is provided with a second accommodation groove (212) extending laterally, the sliding traction mechanism (25) further comprises a second guide plate (271) and a connecting rod (272), the second guide plate is slidably disposed on the outer side of the end plate (21) in the longitudinal direction, a second chute (2711) is provided on the second guide plate (271), the end portion of the bottom tooth bar (22) is slidably engaged with the second chute (2711) after passing through the second accommodation groove (212), the bottom tooth bar (22) moves laterally when the second guide plate (271) moves down in the longitudinal direction, one end of the connecting rod (272) is rotatably connected with the first guide plate (251) to form a first connection point, and the other end of the connecting rod (272) is rotatably connected with the second guide plate (271) to form a second connection point, which is higher than the first connection point.
5. A semiconductor wafer cleaning apparatus according to claim 3 or 4, wherein the fluid guiding assembly comprises a first sealing cylinder and a rotating shaft (258), the first sealing cylinder is longitudinally arranged at the outer side of the end plate (21), the first sealing cylinder is provided with a first sealing cavity (252) and a second sealing cavity (253) from bottom to top, the bottom end of the first sealing cavity (252) can be in butt joint communication with the water injection pipe (11), the upper part of the first sealing cavity (252) is further provided with a water injection port (2521) communicated with the nozzle (24), the lower part of the second sealing cavity (253) is provided with an air inlet hole (2531) communicated with the outside, the air injection port (2532) is positioned at the top end of the second sealing cavity (253), the rotating shaft (258) penetrates through the first sealing cylinder and is in rotating connection with the first sealing cavity, and the circumference surface of the rotating shaft (258) is provided with a first arc-shaped deflector (2581) positioned in the first sealing cavity (252) and a second arc-shaped deflector (2582) positioned in the second sealing cavity (253).
6. A semiconductor silicon wafer cleaning device according to claim 5, characterized in that the basket body further comprises a total flow pipe (29) connecting four corners of the two end plates (21), the end of the total flow pipe (29) is communicated with the water injection port (2521), the nozzles (24) are arranged on the total flow at equal intervals along the axial direction, the nozzles (24) are provided with plug-in parts communicated with the total flow pipe (29), and flat water outlet parts which are inclined towards the silicon wafer collection (3).
7. The semiconductor wafer cleaning device according to claim 5, wherein the bottom end of the first sealing chamber (252) is in a bell mouth shape with an inner diameter gradually increasing from top to bottom, a partition plate (254) is arranged between the bell mouth and the first sealing chamber (252), the bottom end of the rotating shaft (258) penetrates through the partition plate (254) and is rotationally connected with the partition plate, and a water inlet hole (2541) is formed in the partition plate (254).
8. The semiconductor wafer cleaning apparatus according to claim 5, wherein the first sealing cylinder comprises a lower cylinder (255), an upper cylinder (256) and an end cap (257), wherein the bottom end of the lower cylinder (255) is in butt-joint communication with the water injection pipe (11), the top end of the lower cylinder (255) is opened, the top end of the upper cylinder (256) is opened and the bottom end is closed, the bottom end of the upper cylinder (256) is sealed with the top end of the lower cylinder (255) in a fitting manner, the end cap (257) is disposed at the top end of the upper cylinder (256), and the rotating shaft (258) penetrates through the bottom end of the upper cylinder (256) and is in rotating connection with the bottom end of the upper cylinder.
9. The semiconductor wafer cleaning apparatus according to claim 5, wherein the reciprocating drive assembly comprises a second sealing cylinder (261), a piston (262), a plug (263) and a spring (264), the second sealing cylinder (261) is transversely arranged on the connecting seat (283), an exhaust hole (2611) is arranged on the sealing cylinder, an air inlet (2612) connected with the air injection port (2532) is arranged at one end of the second sealing cylinder (261), the piston (262) is slidingly arranged in the second sealing cylinder (261), one end of the plug (263) is connected with the first guide plate (251), the other end of the plug (263) penetrates through the second sealing cylinder (261) and is fixedly connected with the piston (262), and the spring (264) is sleeved on the plug (263) and is located in the second sealing cylinder (261).
10. The semiconductor wafer cleaning apparatus according to claim 9, wherein the outer side of the first guide plate (251) is provided with a push plate (2512) extending outwards, and a triangle (2513) connecting the first guide plate (251) and the push plate (2512), and the outer side of the connection base (283) is further provided with a polish rod (2832), and the polish rod (2832) penetrates through the push plate (2512) and is in sliding fit with the push plate.
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| CN202310829024.7A CN116581066B (en) | 2023-07-07 | 2023-07-07 | Semiconductor silicon wafer cleaning equipment |
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| CN202310829024.7A CN116581066B (en) | 2023-07-07 | 2023-07-07 | Semiconductor silicon wafer cleaning equipment |
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| CN116581066B (en) | 2024-01-12 |
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