CN109476948A - 纳迪克酸酐聚合物及由其衍生的感光性组合物 - Google Patents

纳迪克酸酐聚合物及由其衍生的感光性组合物 Download PDF

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Publication number
CN109476948A
CN109476948A CN201780046385.7A CN201780046385A CN109476948A CN 109476948 A CN109476948 A CN 109476948A CN 201780046385 A CN201780046385 A CN 201780046385A CN 109476948 A CN109476948 A CN 109476948A
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hept
substituted
unsubstituted
bicyclo
methyl
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CN201780046385.7A
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Chinese (zh)
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B·卡纳普
C·伯恩斯
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Promerus LLC
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Promerus LLC
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/0226Quinonediazides characterised by the non-macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/04Anhydrides, e.g. cyclic anhydrides
    • C08F222/06Maleic anhydride
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F232/00Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F232/08Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F234/00Copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain and having one or more carbon-to-carbon double bonds in a heterocyclic ring
    • C08F234/02Copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain and having one or more carbon-to-carbon double bonds in a heterocyclic ring in a ring containing oxygen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D145/00Coating compositions based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Coating compositions based on derivatives of such polymers
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    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • GPHYSICS
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    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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    • G03F7/0755Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • GPHYSICS
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    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
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    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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    • G03F7/32Liquid compositions therefor, e.g. developers
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    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner
    • GPHYSICS
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    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/38Treatment before imagewise removal, e.g. prebaking

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201780046385.7A 2016-07-28 2017-07-28 纳迪克酸酐聚合物及由其衍生的感光性组合物 Pending CN109476948A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662367857P 2016-07-28 2016-07-28
US62/367,857 2016-07-28
PCT/US2017/044281 WO2018022952A1 (en) 2016-07-28 2017-07-28 Nadic anhydride polymers and photosensitive compositions derived therefrom

Publications (1)

Publication Number Publication Date
CN109476948A true CN109476948A (zh) 2019-03-15

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CN201780046385.7A Pending CN109476948A (zh) 2016-07-28 2017-07-28 纳迪克酸酐聚合物及由其衍生的感光性组合物

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Country Link
US (1) US10591818B2 (enExample)
JP (1) JP6765501B2 (enExample)
KR (1) KR102172939B1 (enExample)
CN (1) CN109476948A (enExample)
TW (1) TWI716619B (enExample)
WO (1) WO2018022952A1 (enExample)

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TWI772072B (zh) * 2020-06-25 2022-07-21 日商信越化學工業股份有限公司 化學增幅阻劑材料及圖案形成方法

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KR20170053442A (ko) * 2015-11-06 2017-05-16 롬엔드하스전자재료코리아유한회사 감광성 수지 조성물 및 이로부터 제조된 경화막
JP2018189738A (ja) * 2017-04-28 2018-11-29 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH ポジ型感光性シロキサン組成物、およびそれを用いて形成した硬化膜
WO2020037236A1 (en) 2018-08-17 2020-02-20 Massachusetts Institute Of Technology Degradable polymers of a cyclic silyl ether and uses thereof
TW202100575A (zh) 2019-05-31 2021-01-01 美商普羅梅勒斯有限公司 作為光學或3d印刷材料的快速可光固化的多環烯烴組成物
CN110437739B (zh) * 2019-07-15 2021-02-19 淮阴工学院 环氧复合涂料及其制备方法
US12326586B2 (en) 2019-09-20 2025-06-10 3M Innovative Properties Company Low wave-front error optical filter film
WO2021096591A1 (en) * 2019-11-15 2021-05-20 Massachusetts Institute Of Technology Functional oligomers and functional polymers including hydroxylated polymers and conjugates thereof and uses thereof
TWI850509B (zh) * 2019-12-30 2024-08-01 日商住友電木股份有限公司 催化多環烯烴組成物的uv活性衍生物
TWI850512B (zh) * 2019-12-30 2024-08-01 日商住友電木股份有限公司 作為光學材料之uv活性鈀催化多環烯烴聚合物組成物
JP2023548080A (ja) * 2020-10-30 2023-11-15 プロメラス, エルエルシー 貯蔵寿命が安定し、塊重合可能な改善されたポリシクロオレフィン組成物
EP4284854A1 (en) 2021-02-01 2023-12-06 Massachusetts Institute of Technology Reprocessable compositions
WO2022256399A2 (en) * 2021-06-01 2022-12-08 Massachusetts Institute Of Technology Latent-fluoride containing polymers for triggered degradation
TW202334271A (zh) * 2022-02-18 2023-09-01 美商普羅梅勒斯有限公司 Romp本體聚合及陽離子聚合型組成物用雙觸媒體系
TW202528839A (zh) * 2023-09-29 2025-07-16 美商普羅梅勒斯有限公司 含有不含pfas的多環烯烴聚合物之感光性組成物及由其製成的半導體裝置
TW202528838A (zh) * 2023-09-29 2025-07-16 美商普羅梅勒斯有限公司 含有不含pfas的多環烯烴三元共聚物之感光性組成物及由其製成的半導體裝置

Citations (4)

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