CN109156093A - 用于高功率密度emi屏蔽的电子器件的热管理的系统和方法 - Google Patents
用于高功率密度emi屏蔽的电子器件的热管理的系统和方法 Download PDFInfo
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- CN109156093A CN109156093A CN201780029991.8A CN201780029991A CN109156093A CN 109156093 A CN109156093 A CN 109156093A CN 201780029991 A CN201780029991 A CN 201780029991A CN 109156093 A CN109156093 A CN 109156093A
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- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
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- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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Abstract
用于高功率密度EMI屏蔽的电子器件的热管理的系统和方法。在一个实施例中,一种电子模块包括:电路板;安装到电路板的至少一个集成电路;安装到电路板的至少一个电磁干扰(EMI)屏蔽栅,其中,该至少一个集成电路安装在由EMI屏蔽栅限定的周界内;散热EMI屏蔽盖,固定在该至少一个EMI屏蔽栅上,其中,散热EMI屏蔽盖将该至少一个集成电路密封在该至少一个EMI屏蔽栅内;其中,散热EMI屏蔽盖包括与该至少一个集成电路导热接触的弹簧加载的热界面。
Description
相关申请的交叉引用
本申请要求于2016年4月4日提交的题为“SYSTEMS AND METHODS FOR THERMALMANAGEMENT FOR HIGH POWER DENSITY EMI SHIELDED ELECTRONIC DEVICES”的美国临时专利申请62/317,929的优先权和权益,该申请通过引用整体并入本文。
背景技术
发送和接收射频(RF)信号的现代产品通常包括数字组件和一个或多个集成天线。集成天线和数字组件都容易受到拾取噪声的影响,这些噪声会对由组件处理的信号引入干扰。在这些组件周围添加电磁干扰(EMI)屏蔽件在减轻这种干扰方面是有效的。然而,特别是在高频RF通信应用中,数字组件通常使用集成片上系统(SOC)器件来实现。随着持续的技术进步,这些器件以越来越小的加工尺寸(footprint)来进行制造,因此与这些器件相关联的功率密度也相应提高。倒装芯片球栅阵列(Flip-Chip Ball Grid Array,FC-BGA)是一种安装技术,其对于高功率密度SOC器件已经变得普遍,因为低外壳阻抗避免了在EMI屏蔽件所包围的区域内产生不必要的热量。即使如此,FC-BGA SOC器件的有源区产生在小区域中集中的大量热量,并且热量通常必须利用完全包围在EMI屏蔽件内的器件消散,以使SOC器件保持可操作。
发明内容
本公开的实施例提供用于高功率密度EMI屏蔽的电子器件的热管理的方法和系统,并且将通过阅读和研究以下说明书来理解。
在一个实施例中,一种电子模块包括:电路板;至少一个集成电路,安装到电路板;至少一个电磁干扰(EMI)屏蔽栅(fence),安装到电路板,其中,该至少一个集成电路安装在由EMI屏蔽栅限定的周界内;散热EMI屏蔽盖,固定在该至少一个EMI屏蔽栅上,其中,散热EMI屏蔽盖将该至少一个集成电路密封在该至少一个EMI屏蔽栅内;其中,散热EMI屏蔽盖包括与该至少一个集成电路导热接触的弹簧加载的热界面。
附图说明
当考虑优选实施例的描述和以下附图时,能够更容易地理解本公开的实施例并且其进一步的优点和用途将更加明显,其中:
图1、图1A和图1B是例示本公开的一个实施例的无线电模块100的示图;
图1C是例示本公开的一个实施例的示例集中式无线电接入网络(C-RAN)的示图;
图1D是例示本公开的一个实施例的示例分布式天线系统(DAS)的示图;
图2和图2A是例示本公开的一个实施例的无线电模块100的一种实施方式的示图,其中EMI屏蔽栅内的多个组件导热耦合到散热EMI屏蔽盖;以及
图3是例示本公开的一个实施例的无线电模块100的替代实施方式的示图,该实施方式将不同EMI屏蔽栅内的多个组件耦合到公共的散热EMI屏蔽盖。
根据惯例,各种描述的特征未按比例绘制,而是用于强调与本文所述的实施例相关的特征。相似的附图标记在整个图和文本中表示相似的元件。
具体实施方式
在以下的详细描述中,参考形成其一部分的附图,并且其中通过可以实践的特定示例性实施例示出。足够详细地描述这些实施例以使得本领域技术人员能够实践这些实施例,并且应该理解,可以利用其他实施例,并且可以在不脱离本公开的范围的情况下进行逻辑、机械和电气变化。因此,以下详细描述不应被视为具有限制意义。
本公开的实施例提供了同时解决高功率集成数字电子器件的热管理和电磁干扰(EMI)管理的系统和方法。例如,本文公开的实施例可以实施为管理从相对紧凑的区域(诸如高频RF信号处理器件)发出强热的小型集成器件封装件的热量和EMI。如下面更详细解释的,本文公开的实施例将用于保护组件免受数字噪声影响的EMI屏蔽件与用于高功率倒装芯片BGA和类似高功率密度电子器件的冷却机制集成。然而,应该注意,这些实施例也可以用于管理大型器件的热量和EMI,其中大型器件包括将受益于热管理和电磁干扰(EMI)管理的任何集成电路。
本文描述的实施例呈现了将EMI屏蔽件与散热器组合的解决方案,诸如图1、图1A和图1B中所示的示例无线电模块100所示。图1是无线电模块100的组装横截面视图,图1A例示无线电模块100的分解视图,以及图1B例示其中散热EMI屏蔽盖110被移除以露出EMI屏蔽栅116内的组件的俯视图。
尽管各种实施例将模块100指代为利用本文描述的热和EMI管理解决方案的“无线电模块”,但应该理解,本公开不限于此。即,特别地,已知在射频(RF)处操作的电子器件与EMI屏蔽件结合使用。然而,包括高密度发热组件的其他电子器件也可以与EMI屏蔽件结合使用。因此,明确地预期,本文中关于无线电模块的热和EMI管理的任何实施例的描述通常也适用于更广泛的电子模块。
在替代实施方式中,模块100可以包括无线网络接入点(诸如无线局域网接入点)、蜂窝无线电接入网络(RAN)、分布式天线系统(DAS)远程天线单元,或蜂窝基站或演进节点B(例如,用于云或集中式RAN(C-RAN)架构系统的无线电点)的组件。在一些实施方式中,无线电模块100可以包括具有集成天线的任何产品。在其他实施方式中,模块不包括集成天线。
作为另一示例,图1C是例示本公开的一个实施例的C-RAN 10的框图。在该实施例中,一个或多个控制器12通过以太网网络14耦合到多个无线电点16。在C-RAN 10的一个实施方式中,以太网网络14通过铜线来实施,并且还可以包括通过铜线耦合的一个或多个以太网开关。在其他实施方式中,可以使用其他传输介质,诸如但不限于光纤线缆。2013年2月7日提交的题为“RADIO ACCESS NETWORKS”的美国专利申请序列No.13/762,283公开了C-RAN 10的替代示例架构,该申请通过引用整体并入本文。利用本公开的实施例,一个或多个无线电点16可以包括电子模块100,电子模块100诸如是包括热和EMI管理的无线电模块100,其包括与EMI屏蔽栅组合安装的散热EMI屏蔽盖,如下所述。在这样的实施例中,空中接口的基带处理的一部分在远程无线电点16中进行,因此减少在控制器12和无线电点16之间前程(front-hauled)的数据量。本文描述的实施例通过为执行处理的高功率密度组件提供热和EMI管理来便于将基带处理转移到远程无线电点16。
例如,图1D是例示本公开的一个实施例的分布式天线系统20的框图。DAS 20包括通过多个数字传输链路24耦合到多个远程天线单元(如26所示)的主机单元22。远程天线单元26可以直接耦合到主机单元22或经由一个或多个中间器件间接耦合到主机单元22。数字传输链路24可以包括如图1D所示的光纤链路,但是在其他实施方式中,可以包括其他材料,诸如但不限于铜线。在下行链路方向上,DAS20用作RF信号的点对多点传输。由DAS 20在主机单元22处(例如,从基站(BS)25)接收的下行链路信号被同时传输到每个远程天线单元26。在上行链路方向上,在每个远程天线单元26处收集的RF信号被传输到主机单元22,其中RF信号被聚合以向更上游的组件提供统一的RF信号。2013年6月13日提交的题为“Distributed Antenna System Architectures”的美国专利申请序列No.13/495,220公开了DAS 20的替代示例架构,该申请通过引用整体并入本文。利用本公开的实施例,一个或多个远程天线单元26可以包括电子模块100,电子模块100诸如是包括热和EMI管理的无线电模块100,其包括与EMI屏蔽栅组合安装的散热EMI屏蔽盖,如下所述。
返回参考图1、图1A和图1B,无线电模块100包括安装在电路板105上的集成器件120,集成器件120具有有源区122。在一个实施例中,有源区122在进行操作时可以周期性地或连续地产生和散发热量,这可以被表征为具有高功率密度。在一个实施例中,集成器件120包括使用倒装芯片架构制造的片上系统,并且使用球栅阵列(BGA)安装技术来电耦合到电路板105。球栅阵列安装界面通常用于具有高功率密度的器件。倒装芯片架构(也称为可控塌陷芯片连接或C4架构)对于这种应用也是有益的,因为它们避免了将芯片电耦合到电路板的引线接合的热影响和低效率。倒装芯片BGA器件的使用被提供为示例,并且明确指出,在其他实施例中,集成器件120可以包括其他制造架构和/或安装技术。
无线电模块100还包括EMI屏蔽栅116,该EMI屏蔽栅116接合到电路板105以在器件120周围限定周界,这在图1B中通过示例示出。EMI屏蔽栅116可以由EMI屏蔽件领域的技术人员已知的材料构成。EMI屏蔽栅116可以包括例如折叠金属或金属镀覆材料。在一些实施例中,除了集成器件120之外,一个或多个电子芯片器件125也可以在由EMI屏蔽栅116限定的周界内安装到电路板105上。EMI屏蔽栅116可以在将其他电子器件部件安装到电路板105上的制造过程期间被接合到电路板105。
如图1所示,无线电模块100还包括散热EMI屏蔽盖110,其包括具有多个散热鳍(fin)112的EMI屏蔽盖114。散热鳍112可以包括引脚(pin)鳍阵列或其他散热鳍配置。散热盖114的底表面包括槽119,该槽对应于EMI屏蔽栅116的位置并与之对准。即,当散热EMI屏蔽盖110被靠近EMI屏蔽栅116安装时,EMI屏蔽栅116至少部分地插入槽119中,使得散热盖114的一部分在EMI屏蔽栅116的顶部的上方和下方延伸。将栅116插入槽119中既延长了EMI信号泄漏绕过EMI屏蔽栅116必须行进的路径,又使该路径复杂化。图1和图1A所示的实施例还在栅116和EMI屏蔽盖114之间的界面处引入可选的弹簧特征件118,以进一步抑制高频EMI传输。弹簧特征件118是一种增强,以适应在EMI屏蔽盖114和EMI屏蔽栅116之间的界面处可能留有小路径处的制造容差。弹簧特征件118可以包括例如当被压缩在EMI屏蔽盖114和EMI屏蔽栅116之间时填充那些EMI信号泄漏路径的折叠金属条或其他材料。
EMI屏蔽盖114的底表面或内表面通过弹簧加载的热界面135热耦合到集成器件120的有源区122,并且包括压缩停止支柱(standoff)140,以防止由于过度压缩而对集成器件120造成损坏。弹簧加载的热界面135提供双重目的,即建立从集成器件120的有源区122到散热鳍112的直接低阻导热路径的界面,同时还在有源区122上维持弹簧加载力以确保维持导热界面。
如图1和图1A所示,在一个实施例中,弹簧加载的热界面135包括散热器(heatspreader)134,该散热器耦合到热间隙垫136。在一个实施例中,弹簧加载的热界面135通过热间隙垫136附接至EMI屏蔽盖114,其定位成至少部分地嵌入EMI屏蔽盖114的凹穴(pocket)137中。高流动热界面材料(TIM)132可以应用于集成器件120的有源区,以进一步促进导热流。随着有源区122在集成器件120的操作期间升温,高流动TIM 132变得液化了。因此,仅需要被应用在热量集中的部位,该部位对应于集成器件120的有源发热区122。因此,对于集成器件120的整个表面区域包括芯片的有源部分的实施方式,高流动TIM 132可以用于覆盖整个表面区域。当散热EMI屏蔽盖110安装在栅116上方的位置时,散热器134变成经由高流动TIM 132与集成器件120的有源区122导热接触。这种配置在有源区122和散热EMI屏蔽盖110之间提供非常低的热阻界面。散热EMI屏蔽盖110还用作密封EMI屏蔽栅116的盖。
散热器134用于快速吸收来自集成器件120的有源区122的高密度热能,并且将该热量传导地扩散到更大的区域,从而降低热密度。在一个实施例中,散热器134可以使用铜或铝金属板或块(slug)来实施。然后,热量可以通过热间隙垫136以消散到EMI屏蔽盖114的主体中,并且然后通过散热鳍112散发到周围环境中。热间隙垫136包括弹性体材料,该弹性体材料产生由散热器134施加到集成器件120的有源区122上的弹簧加载力。在一个实施方式中,热间隙垫136可以包括硅酮基橡胶。在其他实施方式中,可以使用本领域技术人员已知的其他热间隙垫材料。制造部件的尺寸差异,甚至符合制定容差的差异能够以两个否则相同的电路板组件将相对于彼此具有轻微的尺寸差异的方式累积。散热器134通过热间隙垫136的弹性特性施加在集成器件120的有源区122上的弹簧加载力意味着,当组装模块100的元件时,弹簧加载的热界面135将适应这些差异,并仍然提供从集成器件120的有源区122到散热EMI屏蔽盖110的导热路径。此外,在操作中,热间隙垫136的弹性特性确保即使在可能产生模块100中的元件的热膨胀或收缩的热瞬态期间,也构成集成器件120的有源区122与散热EMI屏蔽盖110之间的热界面。
一个或多个压缩停止支柱140从EMI屏蔽盖114的底表面向下延伸到电路板105,并且定位在由EMI屏蔽栅116围绕的区域内。压缩停止支柱140容纳紧固硬件142,以将散热EMI屏蔽盖110固定到EMI屏蔽栅116上,其中紧固硬件142穿过电路板105。压缩停止支柱140到底部(即,与电路板105接触)的长度也被设定为提供热间隙垫136的期望压缩量的程度,并且用于防止将过大的压力置于集成器件120上。
图1B是模块100的俯视图例示,其中散热EMI屏蔽盖110被移除以露出由EMI屏蔽栅116限定的周界内的组件。如图1B所示,集成器件120在EMI屏蔽栅116的周界内安装在电路板105上。高流动TIM 132、散热器134和热间隙垫136均使用剥离式视图例示,以示出这些元件在集成器件120的有源区122上的分层布置。高流动TIM132在集成器件120的有源区122上方。有源区122表示集成器件120中产热电路集中从而导致该区域中的高热密度的区域。散热器134定位在高流动TIM 132上方,并且由热间隙垫136的部分压缩的弹性材料进行弹簧加载以向下推到有源区122上。在一些实施例中,散热器134的尺寸被设定为至少覆盖有源区122的区域,并且在一些实施例中,延伸超出有源区122的区域。
如图1、图1A和图1B所示,在一些实施例中,一个或多个附加电子器件125也可以存在于由EMI屏蔽栅116限定的周界内。在一些情况下,这些器件125可以充分地进行操作而不需要将它们传导地耦合到散热EMI屏蔽盖110进行消散热量。然而,在其他实施例中,如图2和图2A所示,一个或多个附加电子器件125也可以按照与关于集成器件120描述的方式类似的方式通过弹簧加载的热界面传导地耦合到散热EMI屏蔽盖110。
例如,图2例示了无线电模块100的替代实施方式200,其中公共的弹簧加载的热界面235包括散热器234和热间隙垫236,其适应EMI屏蔽栅116内的多个电子器件。例如,在该示例实施例中,集成器件120的有源区122经由高流动TIM 132热耦合到弹簧加载的热界面235。附加电子器件125经由第二高流动TIM 232也热耦合到弹簧加载的热界面235。弹簧加载的热界面235以与关于上述弹簧加载的热界面135所描述的相同的方式发挥作用,以维持散热器234与电子器件125和集成器件120的有源区122两者之间的持续接触,以便于热量传递到散热EMI屏蔽盖110。
图2A例示了无线电模块100的替代实施方式的另一变型250,其中分开的弹簧加载的热界面适应集成器件120和至少一个附加的第二电子器件125的热管理。弹簧加载的热界面135以与上述的图1中的无线电模块100相同的方式,将集成器件120的有源区122传导地耦合到散热EMI屏蔽盖110。在该实施例中,包括第二弹簧加载的热界面235,该第二弹簧加载的热界面235包括经由第二高流动TIM 232热耦合到器件125的第二散热器234和第二热间隙垫236。弹簧加载的热界面235也以与关于以上的弹簧加载的热界面135所述的相同的方式发挥作用,以维持散热器234与第二电子器件125之间的持续接触,以便于热量传递到散热EMI屏蔽盖110。
图3例示了无线电模块100的又一替代实施方式300。如图3所示,在一些实施例中,单个散热EMI屏蔽盖可以用作多个分开的EMI屏蔽栅的盖并为位于这些分开的EMI屏蔽栅内的多个器件提供热管理。例如,在图3的实施例中,集成器件120位于电路板105上由EMI屏蔽栅116围绕的第一区域内,而第二集成器件320位于电路板105上由EMI屏蔽栅围绕的第二区域内。分开的EMI屏蔽栅116和316都由公共的散热EMI屏蔽盖310覆盖。与上述实施例一样,散热EMI屏蔽盖310包括具有多个散热鳍312的EMI屏蔽盖314。如上所述,集成器件120通过弹簧加载的热界面135导热耦合到EMI屏蔽盖314。
类似地,第二集成器件320通过弹簧加载的热界面335导热耦合到EMI屏蔽盖314。更具体地,第二集成器件320包括有源区322。有源区322在进行操作时可以周期性地或连续地产生和散发热量,这可以被表征为具有高功率密度。在一个实施例中,集成器件320包括使用倒装芯片架构制造的片上系统,并且使用球栅阵列(BGA)安装技术电耦合到电路板105。弹簧加载的热界面335包括散热器334,该散热器被耦合到热间隙垫336。在一个实施例中,弹簧加载的热界面335通过热间隙垫336附接至EMI屏蔽盖314,其中EMI屏蔽盖314定位成至少部分地嵌入EMI屏蔽盖314的凹穴中。高流动热界面材料(TIM)332可以应用于集成器件320的有源区322,以进一步促进导热流。随着有源区322在集成器件320的操作期间升温,高流动TIM 332变得液化了。如上所述,热间隙垫336的弹性特性确保即使在热瞬态期间,也构成集成器件320的有源区322与散热EMI屏蔽盖310之间的热界面,并且适应制造容差。散热器334用于快速吸收来自集成器件320的有源区322的高密度热能,并且将该热量传导地扩散到更大的区域,从而降低热密度。在一个实施例中,散热器334可以使用铜或铝金属板或块来实施。热量可以然后通过热间隙垫336以消散到EMI屏蔽盖314的主体中,然后通过散热鳍312散发到周围环境中。
示例性实施例
示例1包括一种电子模块,该模块包括:电路板;至少一个集成电路,安装到电路板;至少一个电磁干扰(EMI)屏蔽栅,安装到电路板,其中,该至少一个集成电路安装在由EMI屏蔽栅限定的周界内;以及散热EMI屏蔽盖,固定在该至少一个EMI屏蔽栅上,其中,散热EMI屏蔽盖将该至少一个集成电路密封在该至少一个EMI屏蔽栅内;其中,散热EMI屏蔽盖包括与该至少一个集成电路导热接触的弹簧加载的热界面。
示例2包括示例1的模块,其中,散热EMI屏蔽盖包括:EMI屏蔽盖构件,具有与至少一个EMI屏蔽栅接合的第一表面和包括多个散热鳍的相对的第二表面。
示例3包括示例2的模块,其中,EMI屏蔽盖构件包括从第一表面延伸的一个或多个压缩停止支柱,其中,该一个或多个压缩停止支柱具有限制弹簧加载的热界面的压缩的校准长度。
示例4包括示例3的模块,其中,EMI屏蔽盖构件通过一个或多个紧固件安装到电路板,该一个或多个紧固件穿过电路板并进入一个或多个压缩停止支柱。
示例5包括示例2-3中任一示例的模块,其中,与至少一个EMI屏蔽栅接合的第一表面包括与EMI屏蔽栅对准的至少一个槽,其中,至少一个EMI屏蔽至少部分地插入该至少一个槽中。
示例6包括示例5的模块,还包括:弹簧特征件,位于至少一个EMI屏蔽栅和EMI屏蔽盖构件之间的界面处。
示例7包括示例2-6中任一示例的模块,其中,弹簧加载的热界面包括耦合到热间隙垫的散热器,其中,热间隙垫耦合到EMI屏蔽盖的第一表面,并且散热器导热耦合到至少一个集成电路的有源区。
示例8包括示例7的模块,其中,散热器包括铜块。
示例9包括示例7-8中任一示例的模块,其中,散热器的表面面积大于至少一个集成电路的有源区的表面面积。
示例10包括示例7-9中任一示例的模块,其中,散热器通过高流动热界面材料导热耦合到至少一个集成电路的有源区。
示例11包括示例1-10中任一示例的模块,其中,至少一个集成电路包括倒装芯片架构,并且通过球栅阵列(BGA)安装技术耦合到电路板。
示例12包括示例1-11中任一示例的模块,其中,至少一个集成电路包括片上系统器件。
示例13包括示例1-12中任一示例的模块,其中,至少一个集成电路包括射频信号处理器件,并且电子模块是无线电模块。
示例14包括示例1-13中任一示例的模块,其中,两个或更多个电子器件通过公共的弹簧加载的热界面热耦合到散热EMI屏蔽盖。
示例15包括示例1-14中任一示例的模块,其中,第一电子器件通过第一弹簧加载的热界面热耦合到散热EMI屏蔽盖,并且第二电子器件通过第二弹簧加载的热界面热耦合到散热EMI屏蔽盖。
示例16包括示例1-15中任一示例的模块,其中,该模块是以下之一的组件:无线网络接入点;蜂窝基站;和分布式天线系统。
示例17包括一种用于集成电路器件的热和电磁干扰(EMI)管理系统,该系统包括:至少一个电磁干扰(EMI)屏蔽栅,其中,集成电路器件在由EMI屏蔽栅限定的周界内安装到基板;散热EMI屏蔽盖,固定在该至少一个EMI屏蔽栅上,其中,散热EMI屏蔽盖将至少一个集成电路密封在该至少一个EMI屏蔽栅内;其中,散热EMI屏蔽盖包括弹簧加载的热界面,该弹簧加载的热界面配置为抵靠该至少一个集成电路压缩。
示例18包括示例17的系统,其中,基板包括电路板。
示例19包括示例17-18中任一示例的系统,其中,散热EMI屏蔽盖包括:EMI屏蔽盖构件,具有与至少一个EMI屏蔽栅接合的第一表面和包括多个散热鳍的相对的第二表面。
示例20包括示例19的系统,其中,EMI屏蔽盖构件包括从第一表面延伸的一个或多个压缩停止支柱,其中,该一个或多个压缩停止支柱具有限制弹簧加载的热界面的压缩的校准长度。
示例21包括示例19-20中任一示例的系统,其中,EMI屏蔽盖构件通过一个或多个紧固件安装到基板,该一个或多个紧固件穿过基板并进入一个或多个压缩停止支柱。
示例22包括示例19-21中任一示例的系统,其中,与至少一个EMI屏蔽栅接合的第一表面包括与该至少一个EMI屏蔽栅对准的至少一个槽,其中,至少一个EMI屏蔽至少部分地插入至少一个槽中。
示例23包括示例17-22中任一示例的系统,其中,弹簧加载的热界面包括耦合到热间隙垫的散热器,其中,热间隙垫耦合到EMI屏蔽盖的第一表面;并且其中,散热器配置为导热耦合到集成电路的有源区。
示例24包括示例23的系统,其中,散热器包括铜块。
示例25包括示例23-24中任一示例的系统,其中,散热器的表面面积大于至少一个集成电路的有源区的表面面积。
示例26包括示例23-25中任一示例的系统,还包括:高流动热界面材料,位于散热器与集成电路的有源区之间。
示例27包括一种无线网络接入点,其包括如权利要求1-26中任一项所述的电子模块。
示例28包括一种用于云RAN架构系统的无线电点,其包括如权利要求1-26中任一项所述的电子模块。
示例29包括一种蜂窝无线电接入网络(RAN)系统,其包括如权利要求1-26中任一项所述的电子模块。
示例30包括一种分布式天线系统,该系统包括:耦合到主机单元的多个远程天线单元,其中,一个或多个远程天线单元包括如权利要求1-26中任一项所述的电子模块。
示例31包括一种用于集成电路器件的热和电磁干扰(EMI)管理的方法,该方法包括:将一个或多个集成电路器件围绕在由至少一个电磁干扰(EMI)屏蔽栅限定的周界内;将散热EMI屏蔽盖固定在该至少一个EMI屏蔽栅上,其中,散热EMI屏蔽盖将至少一个集成电路密封在该至少一个EMI屏蔽栅内,其中,散热EMI屏蔽盖包括弹簧加载的热界面;以及将弹簧加载的热界面抵靠该一个或多个集成电路器件施加。
示例32包括示例31的方法,其中,散热EMI屏蔽盖包括:EMI屏蔽盖构件,具有与至少一个EMI屏蔽栅接合的第一表面和包括多个散热鳍的相对的第二表面。
示例33包括示例31-32中任一示例的方法,其中,弹簧加载的热界面包括耦合到热间隙垫的散热器,方法还包括:将热间隙垫导热耦合到EMI屏蔽盖的第一表面;并且将散热器导热耦合到至少一个集成电路的有源区。
示例34包括示例33的方法,其中,散热器包括铜块。
示例35包括示例33-34中任一示例的方法,其中,散热器的表面面积大于至少一个集成电路的有源区的表面面积。
示例36包括示例33-35中任一示例的方法,其中,散热器通过高流动热界面材料导热耦合到至少一个集成电路的有源区。
示例37包括示例32-36中任一示例的方法,其中,EMI屏蔽盖构件包括从第一表面延伸的一个或多个压缩停止支柱,其中,该一个或多个压缩停止支柱具有限制弹簧加载的热界面的压缩的校准长度。
尽管本文已经例示和描述了特定实施例,但本领域普通技术人员应该理解,被计算为用于实现相同目的的任何布置可以替代所示的特定实施例。本申请旨在涵盖所呈现的实施例的任何修改或变化。因此,显而易见的是,本公开的实施例仅由其权利要求及其等同物限制。
Claims (37)
1.一种电子模块,所述模块包括:
电路板;
至少一个集成电路,安装到所述电路板;
至少一个电磁干扰EMI屏蔽栅,安装到所述电路板,其中,所述至少一个集成电路安装在由所述EMI屏蔽栅限定的周界内;以及
散热EMI屏蔽盖,固定到所述至少一个EMI屏蔽栅上,其中,所述散热EMI屏蔽盖将所述至少一个集成电路密封在所述至少一个EMI屏蔽栅内;并且
其中,所述散热EMI屏蔽盖包括与所述至少一个集成电路导热接触的弹簧加载的热界面。
2.根据权利要求1所述的模块,其中,所述散热EMI屏蔽盖包括:
EMI屏蔽盖构件,具有与所述至少一个EMI屏蔽栅接合的第一表面和包括多个散热鳍的相对的第二表面。
3.根据权利要求2所述的模块,其中,所述EMI屏蔽盖构件包括从所述第一表面延伸的一个或多个压缩停止支柱,其中,所述一个或多个压缩停止支柱具有限制所述弹簧加载的热界面的压缩的校准长度。
4.根据权利要求3所述的模块,其中,所述EMI屏蔽盖构件通过一个或多个紧固件安装到所述电路板,其中所述一个或多个紧固件穿过所述电路板并进入所述一个或多个压缩停止支柱。
5.根据权利要求2所述的模块,其中,与所述至少一个EMI屏蔽栅接合的第一表面包括与所述EMI屏蔽栅对准的至少一个槽,其中,所述至少一个EMI屏蔽至少部分地插入所述至少一个槽中。
6.根据权利要求5所述的模块,还包括:弹簧特征件,位于所述至少一个EMI屏蔽栅和所述EMI屏蔽盖构件之间的界面处。
7.根据权利要求2所述的模块,其中,所述弹簧加载的热界面包括耦合到热间隙垫的散热器,其中,所述热间隙垫耦合到所述EMI屏蔽盖的第一表面,并且所述散热器导热耦合到所述至少一个集成电路的有源区。
8.根据权利要求7所述的模块,其中,所述散热器包括铜块。
9.根据权利要求7所述的模块,其中,所述散热器的表面面积大于所述至少一个集成电路的有源区的表面面积。
10.根据权利要求7所述的模块,其中,所述散热器通过高流动热界面材料导热耦合到所述至少一个集成电路的有源区。
11.根据权利要求1所述的模块,其中,所述至少一个集成电路包括倒装芯片架构,并且通过球栅阵列(BGA)安装技术耦合到所述电路板。
12.根据权利要求1所述的模块,其中,所述至少一个集成电路包括片上系统器件。
13.根据权利要求1所述的模块,其中,所述至少一个集成电路包括射频信号处理器件,并且所述电子模块是无线电模块。
14.根据权利要求1所述的模块,其中,两个或更多个电子器件通过公共的、弹簧加载的热界面热耦合到所述散热EMI屏蔽盖。
15.根据权利要求1所述的模块,其中,第一电子器件通过第一弹簧加载的热界面热耦合到所述散热EMI屏蔽盖,并且第二电子器件通过第二弹簧加载的热界面热耦合到所述散热EMI屏蔽盖。
16.根据权利要求1所述的模块,其中,所述模块是以下之一的组件:
无线网络接入点;
蜂窝基站;以及
分布式天线系统。
17.一种用于集成电路器件的热和电磁干扰(EMI)管理系统,所述系统包括:
至少一个电磁干扰EMI屏蔽栅,其中,所述集成电路器件在由所述EMI屏蔽栅限定的周界内安装到基板;和
散热EMI屏蔽盖,固定在所述至少一个EMI屏蔽栅上,其中,所述散热EMI屏蔽盖将所述至少一个集成电路密封在所述至少一个EMI屏蔽栅内;
其中,所述散热EMI屏蔽盖包括弹簧加载的热界面,所述弹簧加载的热界面被配置为抵靠所述至少一个集成电路压缩。
18.根据权利要求17所述的系统,其中,所述基板包括电路板。
19.根据权利要求17所述的系统,其中,所述散热EMI屏蔽盖包括:
EMI屏蔽盖构件,具有与所述至少一个EMI屏蔽栅接合的第一表面和包括多个散热鳍的相对的第二表面。
20.根据权利要求19所述的系统,其中,所述EMI屏蔽盖构件包括从所述第一表面延伸的一个或多个压缩停止支柱,其中,所述一个或多个压缩停止支柱具有限制所述弹簧加载的热界面的压缩的校准长度。
21.根据权利要求19所述的系统,其中,所述EMI屏蔽盖构件通过一个或多个紧固件安装到所述基板,所述一个或多个紧固件穿过所述基板并进入所述一个或多个压缩停止支柱。
22.根据权利要求19所述的系统,其中,与所述至少一个EMI屏蔽栅接合的第一表面包括与所述至少一个EMI屏蔽栅对准的至少一个槽,其中,所述至少一个EMI屏蔽至少部分地插入所述至少一个槽中。
23.根据权利要求17所述的系统,其中,所述弹簧加载的热界面包括耦合到热间隙垫的散热器,其中,所述热间隙垫耦合到所述EMI屏蔽盖的第一表面;并且
其中,所述散热器配置为导热耦合到所述集成电路的有源区。
24.根据权利要求23所述的系统,其中,所述散热器包括铜块。
25.根据权利要求23所述的系统,其中,所述散热器的表面面积大于所述至少一个集成电路的有源区的表面面积。
26.根据权利要求23所述的系统,还包括:高流动热界面材料,位于所述散热器与所述集成电路的有源区之间。
27.一种用于集成电路器件的热和电磁干扰(EMI)管理的方法,所述方法包括:
将一个或多个集成电路器件围绕在由至少一个电磁干扰EMI屏蔽栅限定的周界内;
将散热EMI屏蔽盖固定在所述至少一个EMI屏蔽栅上,其中,所述散热EMI屏蔽盖将所述至少一个集成电路密封在所述至少一个EMI屏蔽栅内,其中,所述散热EMI屏蔽盖包括弹簧加载的热界面;以及
对所述一个或多个集成电路器件施加所述弹簧加载的热界面。
28.根据权利要求27所述的方法,其中,所述散热EMI屏蔽盖包括:
EMI屏蔽盖构件,具有与所述至少一个EMI屏蔽栅接合的第一表面和包括多个散热鳍的相对的第二表面。
29.根据权利要求28所述的方法,其中,所述EMI屏蔽盖构件包括从所述第一表面延伸的一个或多个压缩停止支柱,其中,所述一个或多个压缩停止支柱具有限制所述弹簧加载的热界面的压缩的校准长度。
30.根据权利要求27所述的方法,其中,所述弹簧加载的热界面包括耦合到热间隙垫的散热器,所述方法还包括:
将所述热间隙垫导热耦合到所述EMI屏蔽盖的第一表面;以及
将所述散热器导热耦合到所述至少一个集成电路的有源区。
31.根据权利要求30所述的方法,其中,所述散热器包括铜块。
32.根据权利要求30所述的方法,其中,所述散热器的表面面积大于所述至少一个集成电路的有源区的表面面积。
33.根据权利要求30所述的方法,其中,所述散热器通过高流动热界面材料导热耦合到所述至少一个集成电路的有源区。
34.一种无线网络接入点,包括根据权利要求1-15中任一项所述的电子模块。
35.一种用于云RAN架构系统的无线电点,包括根据权利要求1-15中任一项所述的电子模块。
36.一种蜂窝无线电接入网络(RAN)系统,包括根据权利要求1-15中任一项所述的电子模块。
37.一种分布式天线系统,所述系统包括:
耦合到主机单元的多个远程天线单元,其中,所述远程天线单元中的一个或多个包括根据权利要求1-15中任一项所述的电子模块。
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KR102306843B1 (ko) | 2021-09-29 |
US20170290209A1 (en) | 2017-10-05 |
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