CN108982275A - A kind of ultrasonic wave added high speed single-point scratching experimental rig and test method - Google Patents
A kind of ultrasonic wave added high speed single-point scratching experimental rig and test method Download PDFInfo
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- CN108982275A CN108982275A CN201811156694.2A CN201811156694A CN108982275A CN 108982275 A CN108982275 A CN 108982275A CN 201811156694 A CN201811156694 A CN 201811156694A CN 108982275 A CN108982275 A CN 108982275A
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- 238000006748 scratching Methods 0.000 title claims abstract description 45
- 230000002393 scratching effect Effects 0.000 title claims abstract description 45
- 238000010998 test method Methods 0.000 title claims description 7
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 14
- 239000010432 diamond Substances 0.000 claims abstract description 14
- 239000002245 particle Substances 0.000 claims abstract description 10
- 238000012360 testing method Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- 238000005498 polishing Methods 0.000 claims description 7
- 239000006061 abrasive grain Substances 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 6
- 230000003321 amplification Effects 0.000 claims description 3
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 3
- 239000004576 sand Substances 0.000 claims description 2
- 239000011229 interlayer Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/56—Investigating resistance to wear or abrasion
- G01N3/565—Investigating resistance to wear or abrasion of granular or particulate material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0001—Type of application of the stress
- G01N2203/0005—Repeated or cyclic
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Abstract
The invention discloses a kind of ultrasonic wave added high speed single-points to scratch experimental rig, and multilayered structure grinding wheel is mounted on the main shaft of high-speed precision grinder, drives multilayered structure grinding wheel high-speed rotation by grinding machine spindle；Groove is arranged in the axially distributed varigrained grinding layer of multilayered structure grinding wheel, difference grinding interlayer, and mountable diamond penetrator in groove generates the scratch of certain cutting-in to the high speed rotation after knife by multilayered structure grinding wheel in specimen surface.Ultrasonic generator is connected by conducting wire with energy converter, amplitude transformer, so that amplitude transformer is generated the ultrasonic frequency vibratory of certain amplitude, energy converter is mounted on dynamometer, and dynamometer is mounted on the workbench of high-speed precision grinder；Sample is fixed in amplitude transformer by fixture clamping, the ultrasonic frequency vibratory of certain amplitude is generated under the drive of amplitude transformer, and can carry out axial feed, radial feed by high-speed precision grinder.The present invention realize can ultrasonic wave added single abrasive particle high speed scratching, device is simple and convenient to operate.
Description
Technical field
The present invention relates to ultrasonic vibration aided grinding manufacture fields, and in particular to a kind of ultrasonic wave added high speed single-point scratching test dress
It sets and test method.
Background technique
The hard brittle materials such as monocrystalline silicon, sapphire, optical glass and engineering ceramics are because of its high rigidity, high intensity, high abrasion
A series of excellent mechanical-physical characters such as property, high-fire resistance and corrosion resistance, be widely used in aerospace, optics with
And the fields such as semiconductor.But it since the hardness of these materials is high, brittleness is big, chemical inertness is good, to realize and its high-efficiency and precision is added
Work is more difficult.
Supersonic vibration assistant grinding is a kind of effective ways for processing hard brittle material, it is auxiliary by applying ultrasonic vibration
The process except material is pruned in grinding aid.Not only machining accuracy is high for supersonic vibration assistant grinding, and can reduce grinding force and grinding temperature
Degree reduces wheel topography and abrasion, so that processing efficiency also improves a lot.Supersonic vibration assistant grinding adds especially suitable for hardly possible
The high-efficiency precision of the high rigidity such as work material such as titanium alloy, high-strength steel, composite material, engineering ceramics, glass, high-ductility, high intensity etc.
Close processing.
Its essence of grinding process is the swiping of a large amount of discrete abrasive grains completions for being distributed in wheel face, ploughs plough, shear action
Resultant effect, complicated processing mechanism dramatically hinders the understanding to Grinding Process.Single abrasive particle scratching examination
It tests to be widely used as a kind of common method and simulates the interaction process of abrasive grain and workpiece, to better understand grinding
Process discloses grinding principle.Correspondingly, the test of ultrasonic wave added single abrasive particle scratching is also commonly used for ultrasonic vibration aided grinding mechanism
Research.Single-point scratching test is generally divided into two kinds, and one is the plane scratching of fixed cutting-in, another kind is the pendulum model for becoming cutting-in
Scratching.Though plane scratching can get fixed cutting-in, it is slower often to scratch speed, although and pendulum model scratching speed can reach
To speed identical with grinding, but fixed cutting-in cannot be obtained.However, in order to preferably disclose ultrasonic vibration aided grinding machine
Reason, carrying out the ultrasonic wave added single abrasive particle high speed scratching test in the case of fixing cutting-in is very important.
Summary of the invention
It is an object of the invention to overcome the deficiency of the prior art, provides a kind of ultrasonic wave added high speed single-point scratching test dress
It sets and test method, supersonic vibration assistant grinding technology and high speed single-point scratching system is mutually compound, reach through the invention pair
The plane of the high-revolving constant cutting-in of single abrasive particle scratches test, can be used for cross grinding, grinding and polishing.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of ultrasonic wave added high speed single-point scratching experimental rig, comprising: high-speed grinding precision horizontal surface grinding machine, multilayered structure sand
Wheel, ultrasonic vibration system, dynamometer and sample；
The high-speed precision grinder includes main shaft, workbench, grinding machine main body, control panel；
The ultrasonic vibration system includes amplitude transformer, energy converter, ultrasonic generator；
The multilayered structure grinding wheel is mounted on the main shaft of the high-speed precision grinder, is driven by manipulation grinding machine spindle more
Layer structure grinding wheel high-speed rotation；The multilayered structure grinding wheel is distributed varigrained grinding layer along the axial direction of grinding wheel base body；It is different
Groove is set between the grinding layer of granularity, diamond penetrator is installed in groove；
The ultrasonic generator is connected by conducting wire with energy converter, amplitude transformer, and the amplitude transformer is connect with the energy converter,
The energy converter is mounted on the dynamometer, and the dynamometer is mounted on the workbench of the high-speed precision grinder, is led to
It crosses signal amplification and data acquires the data of sample stress during being scratched；The sample is fixed on change by fixture clamping
On width bar, and axial feed, radial feed can be carried out by high-speed precision grinder, make to be mounted on the multilayered structure grinding wheel on grinding machine
Sample is roughly ground, refined and is polished by varigrained grinding layer, to obtain arc identical with wheel face curvature
Smooth surface；To the high-speed rotation for utilizing multilayered structure grinding wheel after knife, cut so that specimen surface is fixed in diamond penetrator
Deep ultrasonic wave added high speed single-point scratching, generates the scratch of certain cutting-in in specimen surface.
In a preferred embodiment: the vibration frequency of the amplitude transformer is within the scope of 20-50KHz, and amplitude is in 5-50 μm of model
In enclosing.
In a preferred embodiment: by abrasive grain cutting-in when adjusting high speed grinding machine parameter change scratching after knife and scratching speed
Degree.
In a preferred embodiment: the wear particle size and material property of the varigrained grinding layer are variable.
In a preferred embodiment: there are many angles of fixed diamond pressure head in the groove, to carry out multiple angles
Scratching test.
In a preferred embodiment: further including load cell, acoustic emission sensor and high-speed camera, for high speed
Scratching process is detected.
In a preferred embodiment: the direction that ultrasonic vibration applies is the axial direction, radially or tangentially along grinding wheel.
A kind of test method of experimental rig as described above, includes the following steps:
Step 1, by multilayered structure grinding wheel clamping on the main shaft of high-speed grinding grinding machine, and dynamic balancing is adjusted；
Step 2, sample is fixed in amplitude transformer by fixture；
Step 3, dynamometer is fixed on the feeding platform of grinding machine；
Step 4, grinding machine spindle rotation drives the rotation of multilayered structure grinding wheel, and control feeding grinds multilayered structure grinding wheel coarseness
A layer registration coupon is cut, the corase grinding on surface, the concave circular arcs face roughly ground are carried out to sample；
Step 5, by the axial feed of grinding machine, the fine granularity grinding layer of multilayered structure grinding wheel is arrived in replacement, to corase grinding circular arc
It is refined in face；
Step 6, by the axial feed of grinding machine, the polishing grinding layer of multilayered structure grinding wheel is arrived in replacement, to corase grinding arc surface
It is polished；
Step 7, diamond penetrator is installed on multilayered structure grinding wheel, to knife after adjusting dynamic balancing, starts ultrasound
Device, setting scratching depth and multilayered structure grinding wheel speed pass through so that diamond penetrator carries out high speed scratching to sample arc surface
Dynamometer is by sample stress signal collection into computer；
Step 8, by controlling feeding grinder, pressure head is exited.
The beneficial effects of the present invention are:
1, supersonic vibration assistant grinding technology and high speed single-point scratching system are combined, solves grinding wheel and easily blocks, imitates
The problems such as rate is low.
2, the present invention uses grinding wheel, cooperates high-precision high-speed grinding machine, fast can accurately obtain high-precision processing table
Face controls to precise high-efficiency abrasive grain cutting-in and scratching speed.
3, the shock effect and interference effect occurred when the present invention can effectively distinguish scratching, to ultrasonic vibration aided grinding
Mechanism carry out deeper into academic research.
Detailed description of the invention
Fig. 1 is the overall schematic that ultrasonic wave added high speed single-point of the present invention scratches device；
Fig. 2 is the partial enlarged view of Fig. 1；
Fig. 3 is the structural schematic diagram of multilayer grinding wheel；
In Fig. 4 1. -4. be variation schematic diagram of the sample after device is processed.
Specific embodiment
The invention will be further described with present embodiment with reference to the accompanying drawing.
Shown in referring to figures 1-4, a kind of ultrasonic wave added high speed single-point scratching experimental rig, including high-speed grinding precision plane
Grinding machine 1, multilayered structure grinding wheel 2, sample 3, ultrasonic vibration system 4 and dynamometer 5.The high-speed precision grinder 1 includes main shaft, work
Make platform, grinding machine main body, control panel.Shown ultrasonic vibration system 4 includes amplitude transformer, energy converter, ultrasonic generator.The multilayer
Structure grinding wheel 2 is mounted on the main shaft of the high-speed precision grinder, drives 2 high-speed rotation of grinding wheel by manipulation 1 main shaft of grinding machine；Institute
The axial direction that multilayered structure grinding wheel 2 is stated along grinding wheel base body 25 is distributed varigrained grinding layer, may be implemented the corase grinding to sample 3,
Groove is arranged between varigrained grinding layer, installs diamond penetrator 24 in groove for fine grinding and polishing, to passing through grinding wheel after knife
2 high speed rotation generates the scratch of certain cutting-in on 3 surface of sample.The ultrasonic generator passes through conducting wire and energy converter, luffing
Bar is connected, and the amplitude transformer is connect with the energy converter, and the energy converter is mounted on the dynamometer, and the dynamometer 5 is pacified
Be mounted on the workbench of the high-speed precision grinder 1, by signal amplification and data acquisition scratched during sample by
The data of power；The sample 3 is fixed in amplitude transformer by fixture clamping, and by high-speed precision grinder 1 can carry out it is axial into
Give, radial feed, make to be mounted on the multilayered structure grinding wheel 2 on grinding machine 3 surface of sample is roughly ground, accurate and polishing, to obtain
Arc smooth surface identical with wheel face curvature is obtained, the final high-speed rotation for utilizing grinding wheel 2 consolidates 5 surface of sample
Determine the ultrasonic wave added high speed single-point scratching of cutting-in.
In use, sample 3 is mounted in amplitude transformer by fixture, and is done under the action of ultrasonic vibration system 4
Ultrasonic vibration, amplitude and frequency can be designed and select as needed.Flat rate is usually vibrated within the scope of 20-50KHz, amplitude
In 5-50 μ m.
It can be by abrasive grain cutting-in when adjusting high speed grinding machine parameter change scratching after knife and scratching speed, maximum scratching speed
Degree depends on the maximum grinding speed of high speed grinding machine, and the grinding speed of existing high-speed precision grinder 1 is up to 300m/S, even more
Height, scratching depth can be configured by grinding machine spindle feed system, scratch the precision of depth dependent on grinding machine spindle feeding system
The precision of system.
According to actual tests needs, the wear particle size of axial varigrained grinding layer and material property can on grinding wheel 2
To change, to obtain different degrees of specimen surface；In groove can there are many fixed diamond pressure head 24 angle, with carry out
The scratching of multiple angles is tested.
Can according to actual needs, the detection devices such as load cell, acoustic emission sensor and high-speed camera, for pair
High speed scratching process is detected.
The direction that ultrasonic vibration applies can be the axial direction along grinding wheel, radially or tangentially, can be used to carry out different directions
Apply the single abrasive particle high speed scratching test of ultrasonic vibration auxiliary.
The test method of above-mentioned ultrasonic wave added high speed single-point scratching experimental rig, includes the following steps:
Step 1, by 2 clamping of multilayered structure grinding wheel on the main shaft of high-speed grinding grinding machine 1, and dynamic balancing is adjusted；
Step 2, sample 3 is fixed in amplitude transformer by fixture；
Step 3, dynamometer 5 is fixed on the feeding platform of grinding machine 1；
Step 4,1 main axis of grinding machine drives multilayered structure grinding wheel 2 to rotate, and control feeding makes 2 coarse grain of multilayered structure grinding wheel
21 registration coupon 3 of grinding layer is spent, the corase grinding on surface, the concave circular arcs face roughly ground are carried out to sample 3；
Step 5, by the axial feed of grinding machine 1, the fine granularity grinding layer 22 of multilayered structure grinding wheel 2 is arrived in replacement, to corase grinding
Arc surface is refined；
Step 6, by the axial feed of grinding machine 1, the polishing grinding layer 23 of multilayered structure grinding wheel 2 is arrived in replacement, justifies to corase grinding
Cambered surface is polished；
Step 7, diamond penetrator 24 is installed on multilayered structure grinding wheel 2, to knife after adjusting dynamic balancing, starts ultrasound hair
Raw device, setting scratching depth and multilayered structure grinding wheel speed, carry out high speed scratching to sample arc surface, will be tried by dynamometer 5
Sample stress signal collection is into computer.
Step 8, it is fed by control grinding machine 1, pressure head is exited.
The foregoing is only a preferred embodiment of the present invention, but the design concept of the present invention is not limited to this,
Anyone skilled in the art in the technical scope disclosed by the present invention, using this design carries out the present invention non-
Substantive change belongs to the behavior for invading the scope of the present invention.
Claims (8)
1. a kind of ultrasonic wave added high speed single-point scratches experimental rig, characterized by comprising: high-speed grinding precision horizontal surface grinding machine, more
Layer structure grinding wheel, ultrasonic vibration system, dynamometer and sample；
The high-speed precision grinder includes main shaft, workbench, grinding machine main body, control panel；
The ultrasonic vibration system includes amplitude transformer, energy converter, ultrasonic generator；
The multilayered structure grinding wheel is mounted on the main shaft of the high-speed precision grinder, drives multilayered structure sand by grinding machine spindle
Take turns high-speed rotation；The multilayered structure grinding wheel is distributed varigrained grinding layer along the axial direction of grinding wheel base body；Varigrained mill
It cuts and groove is set between layer, diamond penetrator is installed in groove；
The ultrasonic generator is connected by conducting wire with energy converter, amplitude transformer, and the amplitude transformer is connect with the energy converter, described
Energy converter is mounted on the dynamometer, and the dynamometer is mounted on the workbench of the high-speed precision grinder, passes through letter
Number amplification and data acquisition scratched during sample stress data；The sample is fixed on amplitude transformer by fixture clamping
On, and axial feed, radial feed can be carried out by high-speed precision grinder, make to be mounted on the multilayered structure grinding wheel on grinding machine and passes through
Varigrained grinding layer is roughly ground sample, refined and is polished, smooth to obtain arc identical with wheel face curvature
Surface；To the high-speed rotation for utilizing multilayered structure grinding wheel after knife, so that cutting-in is fixed to specimen surface in diamond penetrator
Ultrasonic wave added high speed single-point scratching, generates the scratch of certain cutting-in in specimen surface.
2. a kind of ultrasonic wave added high speed single-point according to claim 1 scratches experimental rig, it is characterised in that: the luffing
Vibration of bar frequency is within the scope of 20-50KHz, and amplitude is in 5-50 μ m.
3. a kind of ultrasonic wave added high speed single-point according to claim 1 scratches experimental rig, it is characterised in that: by knife
The maximum grinding speed of abrasive grain cutting-in and scratching speed when adjusting high speed grinding machine parameter change scratching afterwards, maximum scratching speed and grinding machine
Degree is consistent.
4. a kind of ultrasonic wave added high speed single-point according to claim 1 scratches experimental rig, it is characterised in that: the difference
The wear particle size and material property of the grinding layer of granularity are variable.
5. a kind of ultrasonic wave added high speed single-point according to claim 1 scratches experimental rig, it is characterised in that: the groove
In there are many fixed diamond pressure head angle, with carry out multiple angles scratching test.
6. a kind of ultrasonic wave added high speed single-point according to claim 1 scratches experimental rig, it is characterised in that: further include surveying
Force snesor, acoustic emission sensor and high-speed camera, for being detected to ultrasonic wave added single abrasive particle high speed scratching process.
7. a kind of ultrasonic wave added high speed single-point according to claim 1 scratches experimental rig, it is characterised in that: ultrasonic vibration
The direction of application is the axial direction, radially or tangentially along grinding wheel.
8. a kind of test method of experimental rig of any of claims 1-7, which is characterized in that including walking as follows
It is rapid:
Step 1, by multilayered structure grinding wheel clamping on the main shaft of high-speed grinding grinding machine, and dynamic balancing is adjusted；
Step 2, sample is fixed in amplitude transformer by fixture；
Step 3, dynamometer is fixed on the feeding platform of grinding machine；
Step 4, grinding machine spindle rotation drives the rotation of multilayered structure grinding wheel, and control feeding makes multilayered structure grinding wheel coarseness grinding layer
Registration coupon carries out the corase grinding on surface, the concave circular arcs face roughly ground to sample；
Step 5, by the axial feed of grinding machine, the fine granularity grinding layer of multilayered structure grinding wheel is arrived in replacement, to corase grinding arc surface into
Row fine grinding；
Step 6, by the axial feed of grinding machine, the polishing grinding layer of multilayered structure grinding wheel is arrived in replacement, carries out to fine grinding arc surface
Polishing；
Step 7, diamond penetrator is mounted on multilayered structure grinding wheel, to knife after adjusting dynamic balancing, starts ultrasonic generator, if
Scratching depth and multilayered structure grinding wheel speed are set, so that diamond penetrator carries out high speed scratching to sample arc surface, passes through dynamometry
Instrument is by sample stress signal collection into computer；
Step 8, by controlling feeding grinder, pressure head is exited.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111238983A (en) * | 2020-01-23 | 2020-06-05 | 大连理工大学 | Ultrasonic elliptical vibration scratching test method |
| CN113109199A (en) * | 2021-04-15 | 2021-07-13 | 中国民航大学 | Experimental device and method for single diamond abrasive particle ultrasonic vibration scribing silicon wafer |
| CN114216847A (en) * | 2021-11-19 | 2022-03-22 | 南方科技大学 | Constant-temperature single-point scratching experimental device, feeding system thereof and single-point scratching experimental method |
| CN114216846A (en) * | 2021-11-19 | 2022-03-22 | 南方科技大学 | Single-point scratching experimental device, feeding system thereof and single-point scratching experimental method |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111238983A (en) * | 2020-01-23 | 2020-06-05 | 大连理工大学 | Ultrasonic elliptical vibration scratching test method |
| CN111238983B (en) * | 2020-01-23 | 2021-10-15 | 大连理工大学 | Ultrasonic elliptical vibration scratching test method |
| CN113109199A (en) * | 2021-04-15 | 2021-07-13 | 中国民航大学 | Experimental device and method for single diamond abrasive particle ultrasonic vibration scribing silicon wafer |
| CN113109199B (en) * | 2021-04-15 | 2022-07-08 | 中国民航大学 | Experimental device and method for single diamond abrasive particle ultrasonic vibration scribing silicon wafer |
| CN114216847A (en) * | 2021-11-19 | 2022-03-22 | 南方科技大学 | Constant-temperature single-point scratching experimental device, feeding system thereof and single-point scratching experimental method |
| CN114216846A (en) * | 2021-11-19 | 2022-03-22 | 南方科技大学 | Single-point scratching experimental device, feeding system thereof and single-point scratching experimental method |
| CN114216846B (en) * | 2021-11-19 | 2024-01-12 | 南方科技大学 | Single-point scratching experiment device, feeding system thereof and single-point scratching experiment method |
| CN114216847B (en) * | 2021-11-19 | 2024-01-16 | 南方科技大学 | Constant-temperature single-point scratching experiment device, feeding system thereof and single-point scratching experiment method |
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