CN113109199B - Experimental device and method for single diamond abrasive particle ultrasonic vibration scribing silicon wafer - Google Patents
Experimental device and method for single diamond abrasive particle ultrasonic vibration scribing silicon wafer Download PDFInfo
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- CN113109199B CN113109199B CN202110405631.1A CN202110405631A CN113109199B CN 113109199 B CN113109199 B CN 113109199B CN 202110405631 A CN202110405631 A CN 202110405631A CN 113109199 B CN113109199 B CN 113109199B
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- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
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Abstract
An experimental device and method for single diamond abrasive particle ultrasonic vibration scribing of a silicon wafer. The device comprises a dynamometer, an inclined platform, a diamond pointed cutter, a strip-shaped cutter head, a key, a second screw, a first screw, a third screw, a cutter handle, a dynamic balance cutter, an ultrasonic vibrator clamp, an ultrasonic vibrator, an arc-shaped pressing plate, a linear sliding rail, a sliding block and a connecting plate; the invention can flexibly adjust the distance and the depth of the scribing stripes, and can completely obtain the scratches with the depth step change through one experiment, thereby quickly and accurately obtaining the data of various scribing depth grades. The deep grading is realized under the same scribing condition, so that unstable factors in the experimental process are avoided, and the experimental times are saved.
Description
Technical Field
The invention belongs to the technical field of material performance testing and processing, and particularly relates to an experimental device and method for single diamond abrasive particle ultrasonic vibration scribing of a silicon wafer.
Background
Silicon wafers are basic materials for manufacturing semiconductor chips and have important applications in the semiconductor field. The mechanical processing of silicon wafers is mainly grinding and lapping. In the process of grinding silicon wafers, the actual grinding process of the grinding wheel can be regarded as a cutting process under the combined action of a large number of single abrasive grains which are arranged on the surface of the grinding wheel and have irregular distribution and different shapes. In the grinding mechanism research of experimental materials, a complex abrasive grain comprehensive action process is generally abstracted into a simplified single-grain scribing process to explore the essential abrasive grain cutting problem. Therefore, the cutting action of a single abrasive grain is the basis of grinding, and the scribing, plowing and cutting of a single abrasive grain are the basic modes of grinding, and become important means for recognizing a complex grinding process.
The existing test means for the scratching, plowing and cutting behaviors of a single abrasive particle mainly have four forms: linear scoring, wedge scoring, ball disc scoring and simple pendulum scoring. The analysis of a large number of existing documents and published patents shows that the four testing methods have corresponding defects. The scribing speed of the linear scribing and the wedge surface scribing tests is far lower than the linear speed of a grinding wheel for grinding, so that the real machining process of the abrasive particles is difficult to simulate. The ball disc scoring test is actually a typical tribological test method, with material removal much different from abrasive machining. The single pendulum scratch test is considered as a test means closest to the process of removing the material by the abrasive particles, but the test stability is poor, the scratches below micrometers are short, the scratches change violently, the scratch depth is mostly dozens or even hundreds of micrometers, and the depth of action is greatly different from the actual depth of action of the single abrasive particles. In any case, the above methods cannot maintain a stable contact state between the abrasive grains and the workpiece with high accuracy all the time, and therefore, it is difficult to achieve stable scribing. The above problems have greatly limited the advancement of single grit scoring test technology.
In addition, aiming at the material damage evolution, the brittleness-ductility transition and the grinding grain critical grinding depth research during the grinding processing of the silicon wafer material, the part with the depth of the single grinding grain etching groove being more than dozens of micrometers has almost no practical significance, and only the part with the depth being less than the micrometers is the object to be mainly observed, measured and analyzed. In order to comprehensively analyze the grinding performance of the silicon wafer, the part of the groove depth generated by grinding with a single abrasive particle is required to be long enough and the part of the groove depth is required to be stable, otherwise, local detail characteristics in the brittle-ductile transition process of the material during grinding and processing of the experimental material are difficult to observe.
Disclosure of Invention
In order to solve the problems, the invention aims to provide an experimental device and method for scribing a silicon wafer by ultrasonic vibration of a single diamond abrasive particle.
In order to achieve the purpose, the experimental device for scribing the silicon wafer by ultrasonic vibration of the single diamond abrasive particle comprises a dynamometer, an inclined platform, a diamond pointed cutter, a strip-shaped cutter head, a key, a second screw, a first screw, a third screw, a cutter handle, a dynamic balance cutter, an ultrasonic vibrator clamp, an ultrasonic vibrator, an arc-shaped pressing plate, a linear sliding rail, a sliding block and a connecting plate; wherein, the dynamometer is connected with the acoustic emission system; the ultrasonic vibrator clamp comprises a bottom plate and two supporting seats, the bottom plate is fixed on the top surface of the dynamometer by using a first screw, and the lower ends of the two supporting seats are arranged on one side of the top surface of the bottom plate at intervals; the linear slide rail is arranged on the other side of the top surface of the bottom plate along the left-right direction; the slide block is arranged on the linear slide rail in a sliding way; the edge of the inclined platform is fixed on the top surface of the connecting plate by using a screw, and the bottom surface of the connecting plate is fixed on the sliding block, so that the connecting plate, the inclined platform and the sliding block can move left and right along the linear sliding rail, the top surface of the inclined platform is used for placing a sample, and one end of the top surface, close to the supporting seat, is lower than the other end of the top surface; one end of the bottom surface of the strip-shaped cutter head is sequentially recessed from outside to inside to form a first screw hole, a second screw hole, a third screw hole, a plurality of corresponding cutter mounting holes, a through hole is formed in the middle of the bottom surface of the strip-shaped cutter head in the vertical direction, and a clamping ring is mounted at the upper port of the through hole; the upper end of the diamond pointed cutter is in threaded connection with any one of the first screw hole, the second screw hole and the third screw hole on the strip-shaped cutter head, and the cutter point at the lower end is in contact with the surface of the sample during the experiment; the upper end of the dynamic balance cutter is fixed in a cutter mounting hole corresponding to the mounting position of the diamond point-shaped cutter on the strip-shaped cutter head, and the extension length of the cutter point at the lower end of the diamond point-shaped cutter is greater than that of the cutter point at the lower end of the dynamic balance cutter; the lower end of the tool shank is inserted into the snap ring and fixed by a third screw penetrating through the through hole from bottom to top, the lower parts of the two sides are fixed on the two side parts of the snap ring by a key and a second screw respectively, and the upper end of the tool shank is fixed on the end surface of a main shaft of the numerical control machine; the middle part of the ultrasonic vibrator is fixed on a supporting seat of the inclined plane platform by utilizing an arc-shaped pressing plate, and one end of the ultrasonic vibrator is in threaded connection with the side surface of the inclined plane platform.
The inclined plane platform is made of aviation aluminum alloy materials, the total mass is less than 500g, the top surface inclination angle is 0.2 degrees, the top surface roughness is less than Ra0.1, and the planeness grade is less than IT 2.
The extension length of the tool tip of the dynamic balance tool is 2mm less than that of the diamond point-shaped tool.
The diamond point-shaped cutter is a diamond angle cutter, wherein the shape of the cutter point part is a regular quadrangular pyramid, the included angle between the opposite edge surfaces is 115 degrees, and the length of a top chisel edge is 0.2-50 mu m.
The experimental method of the experimental device for etching the silicon wafer by using the single diamond abrasive particle ultrasonic vibration comprises the following steps in sequence:
1) cutting a silicon wafer material into a disc shape, and grinding and polishing the top surface and the bottom surface to prepare a sample; then, adhering the bottom surface of the sample to the top surface of the inclined platform by adopting glue, fixing the edge of the inclined platform on the top surface of a connecting plate by utilizing a screw, and fixing the bottom surface of the connecting plate on a sliding block;
2) one end of the ultrasonic vibrator is connected to the side surface of the inclined plane platform in a threaded manner, and the middle part of the ultrasonic vibrator is fixed to the upper end of a supporting seat of the ultrasonic vibrator clamp through an arc-shaped pressing plate; then fixing the ultrasonic vibrator clamp on the top surface of the dynamometer through a first screw;
3) according to the tested curvature radius of the stripes, the upper end of the diamond pointed cutter is connected into any one of the first screw hole, the second screw hole and the third screw hole on the bottom surface of the strip-shaped cutter by a wrench in a threaded manner, then the upper end of the dynamic balance cutter is fixed in a cutter mounting hole corresponding to the mounting position of the diamond pointed cutter on the strip-shaped cutter, and the extension length of the cutter point of the dynamic balance cutter is 2mm less than that of the diamond pointed cutter; then inserting the lower end of the cutter handle into the snap ring and fixing the cutter handle by using a third screw penetrating through the strip-shaped cutter head from bottom to top, fixing the lower parts of the two sides at the two side parts of the snap ring by using a key and a second screw respectively, and fixing the upper end of the cutter handle on the end surface of a main shaft of a numerical control machine;
4) enabling a tool point at the lower end of the diamond pointed tool to slowly touch the surface of the test piece, and finishing tool setting in the height direction when the vertical pressure displayed on the dynamometer reaches 1.5-2N;
5) starting a main shaft of a numerical control machine tool, enabling a strip-shaped cutter head to rotate at a speed of 3000 revolutions per minute, and simultaneously controlling the main shaft to feed in the horizontal direction through the numerical control machine tool, wherein the feeding direction is horizontally and rightwards translated along a tool setting point until the diamond pointed cutter is completely separated from a sample, in the process, a tool tip at the lower end of the diamond pointed cutter cuts a series of scratch stripes from deep to shallow on the top surface of the sample, and meanwhile, data in the cutting process are collected through a dynamometer and an acoustic emission system;
6) stopping the rotation of a main shaft of the numerical control machine tool, changing the positions of a diamond pointed cutter and a dynamic balance cutter on a strip-shaped cutter head, repeating the step 4) to finish tool setting in the height direction, starting an ultrasonic vibrator, and repeating the operation of the step 5), thereby scribing a series of scratch stripes from deep to shallow in a scratch-free area on the top surface of the sample;
7) taking down the sample by using a debonding agent, detecting the microscopic morphology of each scratch stripe, and comparing the difference between the actual cutting depth and the theoretical cutting depth of each scratch stripe; and finally, cutting the sample along the length direction of the scratch, detecting the damage and crack propagation of the subsurface of the experimental material, and comparing the influence of ultrasonic vibration on the surface appearance and crack propagation of the scratch stripes.
In the step 1), the thickness of the sample is 1.5-2 mm, and the roughness of the polished top surface and the polished bottom surface is less than Ra0.07.
In the step 3), the curvature radius of the stripes is 30-100 mm.
In the step 5), the feeding speed of the main shaft is 3000 mm/min; the distance between the scratch stripes is 1mm, and the sampling frequency of the dynamometer is 6-20 KHZ.
In the step 6), the vibration frequency of the ultrasonic vibrator is 16-25KHZ, and the amplitude is 0.2-5 μm.
The experimental device and the method for scribing the silicon wafer by the ultrasonic vibration of the single diamond abrasive particle have the advantages and positive effects that: the stable contact between the abrasive particles and the test piece on a long scribing distance can be ensured, the depth grading gradient of each scribing stripe is changed, and the distance between the scribing stripes is controllable. The high-speed and high-precision scribing of the diamond pointed cutter is realized, so that physical quantities such as cutting force, chip deformation, acoustic emission and the like in the scribing process of a single abrasive particle can be stably and accurately collected, and related test results can be used for researching a material removal mechanism and a friction and wear process in grinding. In addition, the device can flexibly adjust the distance and the depth of the scratch stripes, and the scratch with the depth step change can be completely obtained through one-time experiment, so that various grading data of the scratching depth can be quickly and accurately obtained. The invention actually combines the scribing test experiment and the experiment sample, and realizes the depth grading under the same scribing condition, thereby avoiding unstable factors in the experiment process, saving the experiment times and improving the precision of the scribing experiment of single abrasive particles.
Drawings
FIG. 1 is an exploded view of the overall structure of a single diamond abrasive particle ultrasonic vibration silicon wafer scribing experimental device provided by the invention.
FIG. 2 is an assembly view of the overall structure of the experimental apparatus for single diamond abrasive particle ultrasonic vibration silicon wafer scribing provided by the invention.
Fig. 3 is a schematic diagram of the bottom structure of a strip cutter head in the experimental apparatus for single diamond abrasive particle ultrasonic vibration scribing silicon wafer provided by the invention.
FIG. 4 is a schematic structural view of a strip cutter head in the experimental apparatus for ultrasonic vibration scribing of a silicon wafer by using single diamond abrasive particles provided by the invention.
FIG. 5 is a schematic structural view of an ultrasonic vibrator clamp in the single diamond abrasive particle ultrasonic vibration silicon wafer scribing experimental device provided by the invention.
Fig. 6 is a schematic diagram of a connection plate structure in the single diamond abrasive particle ultrasonic vibration silicon wafer scribing experimental apparatus provided by the invention.
FIG. 7 is a schematic view of a linear slide rail structure in the single diamond abrasive particle ultrasonic vibration silicon wafer scribing experimental device provided by the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without any creative efforts shall fall within the protection scope of the present invention.
As shown in fig. 1 to 7, the experimental apparatus for scribing a silicon wafer by ultrasonic vibration of a single diamond abrasive particle provided by the present invention comprises a force measuring instrument 1, an inclined plane platform 2, a diamond point-shaped tool 3, a strip-shaped tool pan 4, a key 5, a second screw 6, a first screw 7, a third screw 9, a tool shank 10, a dynamic balance tool 11, an ultrasonic vibrator clamp 12, an ultrasonic vibrator 13, an arc-shaped pressing plate 14, a linear sliding rail 15, a slider 16 and a connecting plate 17; wherein, the dynamometer 1 is connected with an acoustic emission system; the ultrasonic vibrator clamp 12 comprises a bottom plate 12-1 and two supporting seats 12-2, wherein the bottom plate 12-1 is fixed on the top surface of the dynamometer 1 by using a first screw 7, and the lower ends of the two supporting seats 12-2 are arranged on one side of the top surface of the bottom plate 12-1 at intervals; the linear slide rail 15 is arranged on the other side of the top surface of the bottom plate 12-1 along the left-right direction; the slide block 16 is installed on the linear slide rail 15 in a sliding manner; the edge of the inclined platform 2 is fixed on the top surface of a connecting plate 17 by using screws, and the bottom surface of the connecting plate 17 is fixed on a sliding block 16, so that the connecting plate 17, the inclined platform 2 and the sliding block 16 can move left and right along a linear slide rail 15, the top surface of the inclined platform 2 is used for placing a sample 8, and one end of the top surface, which is close to a supporting seat 12-2, is lower than the other end; one end of the bottom surface of the strip-shaped cutter head 4 is sequentially recessed from outside to inside to form first to third screw holes 4-1, 4-2 and 4-3, the other end of the bottom surface is recessed to form a plurality of corresponding cutter mounting holes 4-4, the middle part of the bottom surface is provided with a through hole 4-6 along the vertical direction, and the upper port of the through hole 4-6 is provided with a clamping ring 4-5; the upper end of the diamond pointed cutter 3 is in threaded connection with any one of first to third screw holes 4-1, 4-2 and 4-3 on the strip-shaped cutter head 4, and the cutter point at the lower end is in contact with the surface of a sample 8 during an experiment; the upper end of the dynamic balance cutter 11 is fixed in a cutter mounting hole 4-4 corresponding to the mounting position of the diamond point-shaped cutter 3 on the strip-shaped cutter head 4, and the extension length of the cutter point at the lower end of the diamond point-shaped cutter 3 is greater than that of the cutter point at the lower end of the dynamic balance cutter 11; the lower end of the cutter handle 10 is inserted into the clamping ring 4-5 and is fixed by a third screw 9 penetrating through the through hole 4-6 from bottom to top, the lower parts of the two sides are respectively fixed on the two side parts of the clamping ring 4-5 by a key 5 and a second screw 6, and the upper end is fixed on the end surface of a main shaft of the numerical control machine; the middle part of the ultrasonic vibrator 13 is fixed on a supporting seat 12-2 of the inclined plane platform 2 by an arc-shaped pressing plate 14, and one end of the ultrasonic vibrator is connected on the side surface of the inclined plane platform 2 in a threaded mode.
The inclined platform 2 is made of aviation aluminum alloy materials, the total mass is less than 500g, the top surface inclination angle is 0.2 degrees, the top surface roughness is less than Ra0.1, and the planeness grade is less than IT 2.
The extension length of the tool tip of the dynamic balance tool 11 is 2mm less than that of the diamond point-shaped tool 3.
The diamond point-shaped cutter 3 adopts a diamond angle cutter, wherein the shape of the cutter point part is a regular quadrangular pyramid, the included angle of the opposite edge surfaces is 115 degrees, and the length of a top chisel edge is 0.2-50 mu m.
The experimental method of the experimental device for etching the silicon wafer by using the single diamond abrasive particle ultrasonic vibration comprises the following steps in sequence:
1) cutting a silicon wafer material into a disc shape, and grinding and polishing the top surface and the bottom surface until the roughness is less than Ra0.07 and the thickness is 1.5-2 mm, thereby preparing a sample 8; then adhering the bottom surface of the sample 8 on the top surface of the inclined platform 2 by adopting 502 glue, fixing the edge of the inclined platform 2 on the top surface of the connecting plate 17 by utilizing a screw, and fixing the bottom surface of the connecting plate 17 on the sliding block 16;
2) one end of an ultrasonic vibrator 13 is connected to the side surface of the inclined plane platform 2 in a threaded manner, and the middle part of the ultrasonic vibrator is fixed at the upper end of a supporting seat 12-2 of an ultrasonic vibrator clamp 12 through an arc-shaped pressing plate 14; then fixing the ultrasonic vibrator clamp 12 on the top surface of the dynamometer 1 through a first screw 7;
3) according to the tested curvature radius of the stripes, the upper end of the diamond pointed cutter 3 is connected in any one of first to third screw holes 4-1, 4-2 and 4-3 on the bottom surface of the strip-shaped cutter head 4 through a wrench in a threaded manner, then the upper end of the dynamic balance cutter 11 is fixed in a cutter mounting hole 4-4 corresponding to the mounting position of the diamond pointed cutter 3 on the strip-shaped cutter head 4, and the extension length of the cutter point of the dynamic balance cutter 11 is 2mm smaller than that of the cutter point of the diamond pointed cutter 3; then, the lower end of a cutter handle 10 is inserted into a clamping ring 4-5 and is fixed by a third screw 9 penetrating through the strip-shaped cutter head 4 from bottom to top, the lower parts of two sides are respectively fixed on two side parts of the clamping ring 4-5 by a key 5 and a second screw 6, and the upper end is fixed on the end surface of a main shaft of a numerical control machine; the curvature radius of the stripes is 30-100 mm.
4) The tool tip at the lower end of the diamond pointed tool 3 slowly touches the surface of the test piece 8, and when the pressure in the vertical direction displayed on the dynamometer 1 reaches 1.5-2N, tool setting in the height direction is completed;
5) starting a main shaft of a numerical control machine tool, enabling a strip-shaped cutter head 4 to rotate at a speed of 3000 revolutions per minute, controlling the main shaft to feed in the horizontal direction through the numerical control machine tool at the same time, enabling the feeding direction to horizontally translate right along a tool setting point until the diamond pointed cutter 3 is completely separated from the sample 8, in the process, a tool nose at the lower end of the diamond pointed cutter 3 carves a series of scratch stripes from deep to shallow on the top surface of the sample 8, and meanwhile, collecting data in the carving process through a force measuring instrument 1 and an acoustic emission system; the distance between the scratch stripes is 1mm, and the sampling frequency of the dynamometer 1 is 6-20 KHZ.
6) Stopping the rotation of a spindle of the numerical control machine tool, changing the positions of the diamond pointed cutter 3 and the dynamic balance cutter 11 on the strip-shaped cutter head 4, repeating the step 4) to finish tool setting in the height direction, starting the ultrasonic vibrator 13, and repeating the step 5), thereby scribing a series of scratch stripes from deep to shallow in the scratch-free area on the top surface of the sample 8; the vibration frequency of the ultrasonic vibrator 13 is 16-25KHZ, and the amplitude is 0.2-5 μm.
7) Taking down the sample 8 by using a debonding agent, detecting the microscopic morphology of each scratch stripe, and comparing the difference between the actual cutting depth and the theoretical cutting depth of each scratch stripe; and finally, cutting the sample 8 along the length direction of the scratch, detecting the damage and crack propagation of the subsurface of the experimental material, and comparing the influence of ultrasonic vibration on the surface appearance and crack propagation of the scratch stripes.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and any minor modifications, equivalent replacements and improvements made to the above embodiment according to the technical spirit of the present invention should be included in the protection scope of the technical solution of the present invention.
Claims (9)
1. The utility model provides a single diamond grit ultrasonic vibration ruling silicon chip experimental apparatus which characterized in that: the single diamond abrasive particle ultrasonic vibration silicon wafer scribing experimental device comprises a dynamometer (1), an inclined plane platform (2), a diamond point-shaped cutter (3), a strip-shaped cutter (4), a key (5), a second screw (6), a first screw (7), a third screw (9), a cutter handle (10), a dynamic balance cutter (11), an ultrasonic vibrator clamp (12), an ultrasonic vibrator (13), an arc-shaped pressing plate (14), a linear sliding rail (15), a sliding block (16) and a connecting plate (17); wherein, the dynamometer (1) is connected with an acoustic emission system; the ultrasonic vibrator clamp (12) comprises a bottom plate (12-1) and two supporting seats (12-2), the bottom plate (12-1) is fixed on the top surface of the dynamometer (1) through a first screw (7), and the lower ends of the two supporting seats (12-2) are installed on one side of the top surface of the bottom plate (12-1) at intervals; the linear slide rail (15) is arranged on the other side of the top surface of the bottom plate (12-1) along the left-right direction; the slide block (16) is arranged on the linear slide rail (15) in a sliding way; the edge of the inclined platform (2) is fixed on the top surface of a connecting plate (17) by using a screw, the bottom surface of the connecting plate (17) is fixed on a sliding block (16), so that the connecting plate (17), the inclined platform (2) and the sliding block (16) can move left and right along a linear sliding rail (15), the top surface of the inclined platform (2) is used for placing a sample (8), and one end of the top surface, close to the supporting seat (12-2), is lower than the other end of the top surface; one end of the bottom surface of the strip-shaped cutter head (4) is sequentially recessed from outside to inside to form first to third screw holes (4-1, 4-2, 4-3), the other end of the bottom surface is recessed to form a plurality of corresponding cutter mounting holes (4-4), a through hole (4-6) is formed in the middle of the bottom surface along the vertical direction, and a clamping ring (4-5) is mounted at the upper port of the through hole (4-6); the upper end of the diamond pointed cutter (3) is in threaded connection with any one of first to third screw holes (4-1, 4-2, 4-3) on the strip-shaped cutter head (4), and the cutter point at the lower end is in contact with the surface of a test sample (8) during an experiment; the upper end of the dynamic balance cutter (11) is fixed in a cutter mounting hole (4-4) corresponding to the mounting position of the diamond point-shaped cutter (3) on the strip-shaped cutter head (4), and the extension length of the cutter point at the lower end of the diamond point-shaped cutter (3) is greater than that of the cutter point at the lower end of the dynamic balance cutter (11); the lower end of the cutter handle (10) is inserted into the clamping ring (4-5) and is fixed by a third screw (9) penetrating through the through hole (4-6) from bottom to top, the lower parts of the two sides are fixed on the two side parts of the clamping ring (4-5) by a key (5) and a second screw (6) respectively, and the upper end of the cutter handle is fixed on the end surface of a main shaft of the numerical control machine; the middle part of the ultrasonic vibrator (13) is fixed on a supporting seat (12-2) of the inclined plane platform (2) by an arc-shaped pressing plate (14), and one end of the ultrasonic vibrator is in threaded connection with the side surface of the inclined plane platform (2).
2. The single diamond abrasive grain ultrasonic vibration scribing silicon wafer experimental device according to claim 1, wherein: the inclined plane platform (2) is made of aviation aluminum alloy materials, the total mass is less than 500g, the top surface inclination angle is 0.2 degrees, the top surface roughness is less than Ra0.1, and the planeness grade is less than IT 2.
3. The single diamond abrasive grain ultrasonic vibration scribing silicon wafer experimental device according to claim 1, wherein: the extension length of the tool tip of the dynamic balance tool (11) is 2mm less than that of the diamond point-shaped tool (3).
4. The single diamond abrasive grain ultrasonic vibration scribing silicon wafer experimental device according to claim 1, wherein: the diamond point-shaped cutter (3) adopts a diamond angle cutter, wherein the shape of the cutter point part is a regular quadrangular pyramid, the included angle of the opposite edge surfaces is 115 degrees, and the length of a top chisel edge is 0.2-50 mu m.
5. An experimental method for scribing a silicon wafer by using the single diamond abrasive particle ultrasonic vibration scribing experimental device of any one of claims 1 to 4, wherein: the experimental method comprises the following steps which are carried out in sequence:
1) cutting a silicon wafer material into a disc shape, and grinding and polishing the top surface and the bottom surface to prepare a sample (8); then, adhering the bottom surface of the sample (8) to the top surface of the inclined platform (2) by adopting glue, fixing the edge of the inclined platform (2) on the top surface of a connecting plate (17) by utilizing a screw, and fixing the bottom surface of the connecting plate (17) on a sliding block (16);
2) one end of an ultrasonic vibrator (13) is connected to the side surface of the inclined plane platform (2) in a threaded manner, and the middle part of the ultrasonic vibrator is fixed to the upper end of a supporting seat (12-2) of an ultrasonic vibrator clamp (12) through an arc-shaped pressing plate (14); then fixing the ultrasonic vibrator clamp (12) on the top surface of the dynamometer (1) through a first screw (7);
3) according to the tested curvature radius of the stripes, the upper end of the diamond point-shaped cutter (3) is connected in any one of first to third screw holes (4-1, 4-2, 4-3) on the bottom surface of the strip-shaped cutter head (4) through a wrench in a threaded manner, then the upper end of the dynamic balance cutter (11) is fixed in a cutter mounting hole (4-4) corresponding to the mounting position of the diamond point-shaped cutter (3) on the strip-shaped cutter head (4), and the extension length of the cutter point of the dynamic balance cutter (11) is 2mm less than that of the diamond point-shaped cutter (3); then inserting the lower end of the cutter handle (10) into the clamping ring (4-5) and fixing the cutter handle by using a third screw (9) penetrating through the strip-shaped cutter head (4) from bottom to top, wherein the lower parts of the two sides are respectively fixed on the two side parts of the clamping ring (4-5) by using a key (5) and a second screw (6), and the upper end of the cutter handle is fixed on the end surface of a main shaft of the numerical control machine;
4) the tool tip at the lower end of the diamond pointed tool (3) slowly touches the surface of the test piece (8), and when the vertical pressure displayed on the dynamometer (1) reaches 1.5-2N, tool setting in the height direction is completed;
5) starting a main shaft of a numerical control machine tool, enabling a strip-shaped cutter head (4) to rotate at a speed of 3000 revolutions per minute, and simultaneously controlling the main shaft to feed in the horizontal direction through the numerical control machine tool, wherein the feeding direction is horizontally translated rightwards along a tool setting point until the diamond pointed cutter (3) is completely separated from the sample (8), in the process, a tool tip at the lower end of the diamond pointed cutter (3) carves a series of scratch stripes from deep to shallow on the top surface of the sample (8), and meanwhile, data in the carving process are collected through a dynamometer (1) and a sound emission system;
6) stopping the rotation of a spindle of the numerical control machine tool, changing the positions of a diamond point-shaped cutter (3) and a dynamic balance cutter (11) on a strip-shaped cutter head (4), repeating the step 4) to finish tool setting in the height direction, starting an ultrasonic vibrator (13), and repeating the step 5), so that a series of scratch stripes from deep to shallow are scribed in a scratch-free area on the top surface of the sample (8);
7) taking down the sample (8) by using a debonding agent, detecting the microscopic morphology of each scratch stripe, and comparing the difference between the actual cutting depth and the theoretical cutting depth of each scratch stripe; and finally, cutting the sample (8) along the length direction of the scratch, detecting the damage and crack propagation of the subsurface of the experimental material, and comparing the influence of ultrasonic vibration on the surface appearance and crack propagation of the scribed stripes.
6. The experimental method according to claim 5, characterized in that: in the step 1), the thickness of the sample (8) is 1.5-2 mm, and the roughness of the top surface and the bottom surface after grinding and polishing is less than Ra0.07.
7. The experimental method according to claim 5, characterized in that: in the step 3), the curvature radius of the stripes is 30-100 mm.
8. The experimental method according to claim 5, characterized in that: in the step 5), the feeding speed of the main shaft is 3000 mm/min; the distance between the scratch stripes is 1mm, and the sampling frequency of the dynamometer (1) is 6-20 KHZ.
9. The experimental method according to claim 5, characterized in that: in the step 6), the vibration frequency of the ultrasonic vibrator (13) is 16-25KHZ, and the amplitude is 0.2-5 μm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110405631.1A CN113109199B (en) | 2021-04-15 | 2021-04-15 | Experimental device and method for single diamond abrasive particle ultrasonic vibration scribing silicon wafer |
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| CN202110405631.1A CN113109199B (en) | 2021-04-15 | 2021-04-15 | Experimental device and method for single diamond abrasive particle ultrasonic vibration scribing silicon wafer |
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| CN113109199A CN113109199A (en) | 2021-07-13 |
| CN113109199B true CN113109199B (en) | 2022-07-08 |
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