CN108795373A - 一种led封装用填充型导电银胶 - Google Patents
一种led封装用填充型导电银胶 Download PDFInfo
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Abstract
本发明公开了一种LED封装用填充型导电银胶,属于光电材料技术领域。本发明研制的LED封装用填充型导电银胶包括以下重量份数的原料:100~200份改性环氧树脂,15~30份固化剂,1~3份促进剂,20~25份稀释剂,2~5份偶联剂,40~100份复配银粉,10~20份合金粉;其中改性环氧树脂为硅橡胶和有机硅烷嵌端改性的环氧树脂,复配银粉是由片状、纤维状和球形颗粒状三种不同形貌的银粉复配而成,而合金粉则是由40~60份金属铟,40~55份金属锡,2~4份金属镍,2~4份金属锌,0.6~0.8份金属铋构成。本发明技术方案制备的导电银胶具有优异的导电性能的特点,在光电材料技术行业的发展中具有广阔的前景。
Description
技术领域
本发明公开了一种LED封装用填充型导电银胶,属于光电材料技术领域。
背景技术
导电银胶是,它通常以为主要,通过基体树脂的粘接作用把导电粒子结合在一起,形成导电通路,实现被粘材料的导电连接。由于导电银胶的基体树脂是一种胶黏剂,可以选择适宜的固化温度进行粘接,如环氧树脂胶黏剂可以在室温至150℃固化,远低于锡铅焊接的200℃以上的焊接温度,这就避免了焊接高温可能导致的材料变形、电子器件的热损伤和内应力的形成。同时,由于电子元件的小型化、微型化及印刷电路板的高密度化和高度集成化的迅速发展,铅锡焊接的0.65mm的最小节距远远满足不了导电连接的实际需求,而导电银胶可以制成浆料,实现很高的线分辨率,而且导电银胶工艺简单,易于操作,可提高生产效率,也避免了锡铅焊料中重金属铅引起的环境污染。所以导电银胶是替代铅锡焊接,实现导电连接的理想选择。
导电银胶已广泛应用于液晶显示屏(LCD)、发光二极管(LED)、集成电路(IC)芯片、印刷线路板组件(PCBA)、点阵块、陶瓷电容、薄膜开关、智能卡、射频识别等电子元件和组件的封装和粘接,有逐步取代传统的锡焊焊接的趋势。导电银胶主要由树脂基体、导电粒子和分散添加剂、助剂等组成。市场上使用的导电银胶大都是填料型。
填料型导电银胶的树脂基体,原则上讲,可以采用各种胶勃剂类型的树脂基体,常用的一般有热固性胶黏剂如环氧树脂、有机硅树脂、聚酰亚胺树脂、酚醛树脂、聚氨酯、丙烯酸树脂等胶黏剂体系。这些胶黏剂在固化后形成了导电银胶的分子骨架结构,提供了力学性能和粘接性能保障,并使导电填料粒子形成通道。由于环氧树脂可以在室温或低于150℃固化,并且具有丰富的配方可设计性能,环氧树脂基导电银胶占主导地位。导电银胶要求导电粒子本身要有良好的导电性能粒径要在合适的范围内,能够添加到导电银胶基体中形成导电通路。导电填料可以是金、银、铜、铝、锌、铁、镍的粉末和石墨及一些导电化合物。
而传统的传统填充型导电银胶在产品制备过程中,导电性能不佳,而传统工艺采用不同形貌复配的银粉进行填充后,导电性能略有改善,但填料银粉之间的接触电阻较高,且银粉的填充以及导电网络的形成难以充分渗透进入致密的树脂交联网络中,导致产品最终的导电性能无法进一步提升提升,给实际应用带来一定的困难,因此这也是目前在填充型导电银胶方面急需解决的问题。
发明内容
本发明主要解决的技术问题是:针对传统填充型导电银胶在产品制备过程中,导电性能不佳,而传统工艺采用不同形貌复配的银粉进行填充后,导电性能略有改善,但填料银粉之间的接触电阻较高,且银粉的填充以及导电网络的形成难以充分渗透进入致密的树脂交联网络中,导致产品最终的导电性能无法进一步提升的缺陷,提供了一种LED封装用填充型导电银胶。
为了解决上述技术问题,本发明所采用的技术方案是:
一种LED封装用填充型导电银胶,包括以下重量份数的原料组成:
改性环氧树脂 100~200份
固化剂 15~30份
促进剂 1~3份
稀释剂 20~25份
偶联剂 2~5份
复配银粉 40~100份
合金粉 10~20份
所述合金粉是由以下重量份数的金属构成:40~60份金属铟,40~55份金属锡,2~4份金属镍,2~4份金属锌,0.6~0.8份金属铋。
所述复配银粉是由以下重量份数的不同形貌银粉复配而成:30~50份片状银粉,20~30份纤维状银粉,10~30份球形颗粒状银粉。
所述改性环氧树脂为硅橡胶和有机硅烷嵌段改性的环氧树脂。
所述固化剂为间苯二胺、间苯二甲胺、二氨基二苯基甲烷、二氨基二苯基砜或4-氯邻苯二胺中的任意一种。
所述促进剂为咪唑类促进剂、胺类促进剂或苯酚中的任意一种。
所述稀释剂为无水乙醇、乙二醇或缩水甘油醚中的任意一种。
所述偶联剂为硅烷偶联剂KH-550,硅烷偶联剂KH-560,硅烷偶联剂KH-570,铝酸酯偶联剂或钛酸酯偶联剂中的任意一种。
本发明的有益效果是:
(1)本发明技术方案以嵌段改性的环氧树脂作为基体树脂,相比于传统的普通环氧树脂而言,通过改性处理后,基体树脂的侧链基团更加庞大,从而使形成的交联网络的分子链和分子链之间间距增大,使交联网络中的空隙增大,而交联网络空隙的增大,则有利于各种填料充分进入树脂形成的交联网络内部,实现对交联网络内部的有效填充,使产品中导电网络更加严密,再者,本申请通过添加芳香类的固化剂,其分子结构相比于普通小分子胺类固化剂而言更加庞大,从而有利于进一步拓宽交联网络间隙,从而有利于对交联网络内部空隙的进一步有效致密填充,从而使产品的导电率提高;
(2)本发明技术方案通过添加自制合金粉,其熔点较低,在产品加热固化过程中,在树脂完全固化前即可发生熔融,熔融后的合金可良好的分散并包覆周围不同形貌的银粉,待冷却凝固后,可使不同形貌的银粉之间形成冶金结合,降低了不同形貌银粉之间的接触电阻,且得益于环氧树脂交联网络的有效拓宽,有利于合金熔融后在交联网络中渗透和扩散,从而使银粉之间的冶金结合率提高,且合金粉中镍和铋的添加,有利于提高合金体系的抗电迁移性,最终使产品的导电性能得到进一步提升。
具体实施方式
按重量份数计,依次取100~120份环氧树脂,3~5份过氧化苯甲酰叔丁酯,8~10份甲基苯基乙烯基硅橡胶,2~4份偶氮二异丁腈,6~8份聚苯基甲基硅氧烷,先将环氧树脂、过氧化苯甲酰叔丁酯和甲基苯基乙烯基硅橡胶混合后,于温度为75~98℃,转速为600~800r/min条件下,恒温搅拌反应2~3h后,再加入偶氮二异丁腈和聚苯基甲基硅氧烷,继续于温度为125~130℃,转速为400~600r/min条件下,恒温搅拌反应3~5h,出料,得嵌段改性环氧树脂,即为改性环氧树脂;按重量份数计,依次取40~60份金属铟,40~55份金属锡,2~4份金属镍,2~4份金属锌,0.6~0.8份金属铋,混合倒入坩埚中,于氩气保护状态下加热至完全熔融后,搅拌混合10~20min,经冷却固化后,粉碎,过180目筛,得合金粉;按重量份数计,依次取30~50份片状银粉,20~30份纤维状银粉,10~30份球形颗粒状银粉,搅拌混合30~45min,得复配银粉;按重量份数计,依次取100~200份改性环氧树脂,15~30份固化剂,1~3份促进剂,20~25份稀释剂,2~5份偶联剂,40~100份复配银粉,10~20份合金粉,先将改性环氧树脂和稀释剂倒入混料机中,于转速为600~800r/min条件下搅拌混合2~3h后,再加入偶联剂、复配银粉和合金粉,继续搅拌混合2~3h后,再加入促进剂和固化剂,继续搅拌混合45~60min后,出料,即得LED封装用填充型导电银胶。所述固化剂为间苯二胺、间苯二甲胺、二氨基二苯基甲烷、二氨基二苯基砜或4-氯邻苯二胺中的任意一种。所述促进剂为咪唑类促进剂、胺类促进剂或苯酚中的任意一种。所述稀释剂为无水乙醇、乙二醇或缩水甘油醚中的任意一种。所述偶联剂为硅烷偶联剂KH-550,硅烷偶联剂KH-560,硅烷偶联剂KH-570,铝酸酯偶联剂或钛酸酯偶联剂中的任意一种。
实例1
按重量份数计,依次取120份环氧树脂,5份过氧化苯甲酰叔丁酯,10份甲基苯基乙烯基硅橡胶,4份偶氮二异丁腈,8份聚苯基甲基硅氧烷,先将环氧树脂、过氧化苯甲酰叔丁酯和甲基苯基乙烯基硅橡胶混合后,于温度为98℃,转速为800r/min条件下,恒温搅拌反应3h后,再加入偶氮二异丁腈和聚苯基甲基硅氧烷,继续于温度为130℃,转速为600r/min条件下,恒温搅拌反应5h,出料,得嵌段改性环氧树脂,即为改性环氧树脂;按重量份数计,依次取60份金属铟,55份金属锡,4份金属镍,4份金属锌,0.8份金属铋,混合倒入坩埚中,于氩气保护状态下加热至完全熔融后,搅拌混合20min,经冷却固化后,粉碎,过180目筛,得合金粉;按重量份数计,依次取50份片状银粉,30份纤维状银粉,30份球形颗粒状银粉,搅拌混合45min,得复配银粉;按重量份数计,依次取200份改性环氧树脂,30份固化剂,3份促进剂,25份稀释剂,5份偶联剂,100份复配银粉,20份合金粉,先将改性环氧树脂和稀释剂倒入混料机中,于转速为800r/min条件下搅拌混合3h后,再加入偶联剂、复配银粉和合金粉,继续搅拌混合3h后,再加入促进剂和固化剂,继续搅拌混合60min后,出料,即得LED封装用填充型导电银胶。所述固化剂为间苯二胺。所述促进剂为咪唑类促进剂。所述稀释剂为无水乙醇。所述偶联剂为硅烷偶联剂KH-550。
实例2
按重量份数计,依次取60份金属铟,55份金属锡,4份金属镍,4份金属锌,0.8份金属铋,混合倒入坩埚中,于氩气保护状态下加热至完全熔融后,搅拌混合20min,经冷却固化后,粉碎,过180目筛,得合金粉;按重量份数计,依次取50份片状银粉,30份纤维状银粉,30份球形颗粒状银粉,搅拌混合45min,得复配银粉;按重量份数计,依次取200份环氧树脂,30份固化剂,3份促进剂,25份稀释剂,5份偶联剂,100份复配银粉,20份合金粉,先将环氧树脂和稀释剂倒入混料机中,于转速为800r/min条件下搅拌混合3h后,再加入偶联剂、复配银粉和合金粉,继续搅拌混合3h后,再加入促进剂和固化剂,继续搅拌混合60min后,出料,即得LED封装用填充型导电银胶。所述固化剂为间苯二胺。所述促进剂为咪唑类促进剂。所述稀释剂为无水乙醇。所述偶联剂为硅烷偶联剂KH-550。
实例3
按重量份数计,依次取120份环氧树脂,5份过氧化苯甲酰叔丁酯,10份甲基苯基乙烯基硅橡胶,4份偶氮二异丁腈,8份聚苯基甲基硅氧烷,先将环氧树脂、过氧化苯甲酰叔丁酯和甲基苯基乙烯基硅橡胶混合后,于温度为98℃,转速为800r/min条件下,恒温搅拌反应3h后,再加入偶氮二异丁腈和聚苯基甲基硅氧烷,继续于温度为130℃,转速为600r/min条件下,恒温搅拌反应5h,出料,得嵌段改性环氧树脂,即为改性环氧树脂;按重量份数计,依次取60份金属铟,55份金属锡,4份金属镍,4份金属锌,0.8份金属铋,混合倒入坩埚中,于氩气保护状态下加热至完全熔融后,搅拌混合20min,经冷却固化后,粉碎,过180目筛,得合金粉;按重量份数计,依次取50份片状银粉,30份纤维状银粉,30份球形颗粒状银粉,搅拌混合45min,得复配银粉;按重量份数计,依次取200份改性环氧树脂,30份乙二胺,3份促进剂,25份稀释剂,5份偶联剂,100份复配银粉,20份合金粉,先将改性环氧树脂和稀释剂倒入混料机中,于转速为800r/min条件下搅拌混合3h后,再加入偶联剂、复配银粉和合金粉,继续搅拌混合3h后,再加入促进剂和乙二胺,继续搅拌混合60min后,出料,即得LED封装用填充型导电银胶。所述促进剂为咪唑类促进剂。所述稀释剂为无水乙醇。所述偶联剂为硅烷偶联剂KH-550。
实例4
按重量份数计,依次取120份环氧树脂,5份过氧化苯甲酰叔丁酯,10份甲基苯基乙烯基硅橡胶,4份偶氮二异丁腈,8份聚苯基甲基硅氧烷,先将环氧树脂、过氧化苯甲酰叔丁酯和甲基苯基乙烯基硅橡胶混合后,于温度为98℃,转速为800r/min条件下,恒温搅拌反应3h后,再加入偶氮二异丁腈和聚苯基甲基硅氧烷,继续于温度为130℃,转速为600r/min条件下,恒温搅拌反应5h,出料,得嵌段改性环氧树脂,即为改性环氧树脂;按重量份数计,依次取60份金属铟,55份金属锡,4份金属锌,混合倒入坩埚中,于氩气保护状态下加热至完全熔融后,搅拌混合20min,经冷却固化后,粉碎,过180目筛,得合金粉;按重量份数计,依次取50份片状银粉,30份纤维状银粉,30份球形颗粒状银粉,搅拌混合45min,得复配银粉;按重量份数计,依次取200份改性环氧树脂,30份固化剂,3份促进剂,25份稀释剂,5份偶联剂,100份复配银粉,20份合金粉,先将改性环氧树脂和稀释剂倒入混料机中,于转速为800r/min条件下搅拌混合3h后,再加入偶联剂、复配银粉和合金粉,继续搅拌混合3h后,再加入促进剂和固化剂,继续搅拌混合60min后,出料,即得LED封装用填充型导电银胶。所述固化剂为间苯二胺。所述促进剂为咪唑类促进剂。所述稀释剂为无水乙醇。所述偶联剂为硅烷偶联剂KH-550。
实例5
按重量份数计,依次取120份环氧树脂,5份过氧化苯甲酰叔丁酯,10份甲基苯基乙烯基硅橡胶,4份偶氮二异丁腈,8份聚苯基甲基硅氧烷,先将环氧树脂、过氧化苯甲酰叔丁酯和甲基苯基乙烯基硅橡胶混合后,于温度为98℃,转速为800r/min条件下,恒温搅拌反应3h后,再加入偶氮二异丁腈和聚苯基甲基硅氧烷,继续于温度为130℃,转速为600r/min条件下,恒温搅拌反应5h,出料,得嵌段改性环氧树脂,即为改性环氧树脂;按重量份数计,依次取50份片状银粉,30份纤维状银粉,30份球形颗粒状银粉,搅拌混合45min,得复配银粉;按重量份数计,依次取200份改性环氧树脂,30份固化剂,3份促进剂,25份稀释剂,5份偶联剂,100份复配银粉,先将改性环氧树脂和稀释剂倒入混料机中,于转速为800r/min条件下搅拌混合3h后,再加入偶联剂、复配银粉继续搅拌混合3h后,再加入促进剂和固化剂,继续搅拌混合60min后,出料,即得LED封装用填充型导电银胶。所述固化剂为间苯二胺。所述促进剂为咪唑类促进剂。所述稀释剂为无水乙醇。所述偶联剂为硅烷偶联剂KH-550。
对比例:南京某科技发展有限公司生产的导电银胶。
将实例1至实例5所得的导电银胶及对比例产品进行性能检测,具体检测方法如下:
导电性能:按照GJB548A检测试件的电阻率。
具体检测结果如表1所示:
表1导电银胶具体检测结果
检测项目 | 实例1 | 实例2 | 实例3 | 实例4 | 实例5 | 对比例 |
电阻率/×10-4Ω·cm | 2.8 | 3.4 | 6.9 | 12.8 | 10.6 | 13.7 |
由表1检测结果可知,本发明技术方案制备的导电银胶具有优异的导电性能的特点,在光电材料技术行业的发展中具有广阔的前景。
Claims (8)
1.一种LED封装用填充型导电银胶,其特征在于包括以下重量份数的原料组成:
改性环氧树脂 100~200份
固化剂 15~30份
促进剂 1~3份
稀释剂 20~25份
偶联剂 2~5份
复配银粉 40~100份
合金粉 10~20份。
2.根据权利要求1所述的一种LED封装用填充型导电银胶,其特征在于,所述合金粉是由以下重量份数的金属构成:40~60份金属铟,40~55份金属锡,2~4份金属镍,2~4份金属锌,0.6~0.8份金属铋。
3.根据权利要求1所述的一种LED封装用填充型导电银胶,其特征在于,所述复配银粉是由以下重量份数的不同形貌银粉复配而成:30~50份片状银粉,20~30份纤维状银粉,10~30份球形颗粒状银粉。
4.根据权利要求1所述的一种LED封装用填充型导电银胶,其特征在于,所述改性环氧树脂为硅橡胶和有机硅烷嵌段改性的环氧树脂。
5.根据权利要求1所述的一种LED封装用填充型导电银胶,其特征在于,所述固化剂为间苯二胺、间苯二甲胺、二氨基二苯基甲烷、二氨基二苯基砜或4-氯邻苯二胺中的任意一种。
6.根据权利要求1所述的一种LED封装用填充型导电银胶,其特征在于,所述促进剂为咪唑类促进剂、胺类促进剂或苯酚中的任意一种。
7.根据权利要求1所述的一种LED封装用填充型导电银胶,其特征在于,所述稀释剂为无水乙醇、乙二醇或缩水甘油醚中的任意一种。
8.根据权利要求1所述的一种LED封装用填充型导电银胶,其特征在于,所述偶联剂为硅烷偶联剂KH-550,硅烷偶联剂KH-560,硅烷偶联剂KH-570,铝酸酯偶联剂或钛酸酯偶联剂中的任意一种。
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CN110280757A (zh) * | 2019-07-09 | 2019-09-27 | 湖南省国银新材料有限公司 | 一种用于叠瓦导电胶的混合金属粉及其制备方法 |
CN112745788A (zh) * | 2019-10-30 | 2021-05-04 | 深圳市聚飞光电股份有限公司 | 导电银胶及其制备方法、发光器件 |
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CN112745788A (zh) * | 2019-10-30 | 2021-05-04 | 深圳市聚飞光电股份有限公司 | 导电银胶及其制备方法、发光器件 |
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