CN108697004A - High cooling efficiency circuit board and preparation method thereof - Google Patents
High cooling efficiency circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN108697004A CN108697004A CN201710235659.9A CN201710235659A CN108697004A CN 108697004 A CN108697004 A CN 108697004A CN 201710235659 A CN201710235659 A CN 201710235659A CN 108697004 A CN108697004 A CN 108697004A
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- China
- Prior art keywords
- layer
- circuit board
- substrate
- cooling efficiency
- high cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of high cooling efficiency circuit board and preparation method thereof.The production method of the high cooling efficiency circuit board includes the following steps.First, a substrate is provided, and substrate has a conductive layer.Then, a perforation is formed in substrate.Then, one electroplated layer of plating is on the conductive layer of substrate and among perforation.Electroplated layer and conductive layer are etched, to form a circuit layer.Using a thermal grease to form a heat dissipating layer in the side of substrate.In addition, a kind of high cooling efficiency circuit board is also disclosed.
Description
Technical field
The present invention relates to a kind of high cooling efficiency circuit boards and preparation method thereof, more particularly to a kind of high cooling efficiency vehicle
With circuit board and preparation method thereof.
Background technology
With the progress of auto industry, various novel automobile lists successively.It is environmentally friendly and convenient in the case that taking into account,
Various electric vehicle either oil-electric vehicle also under the effort of each depot, creates the achievement of sale of bright eye.
However, existing electric vehicle either oil-electric vehicle in the running, will produce high fever, so that influencing
Performance to electronic product and service life.Wherein, especially with gearbox control (Transmission Control Unit;TCU)
Etc. equipment heat dissipation be even more paid attention to by automobile industry.
Automobile industry now, in order to overcome the circuit board demand of high fever working environment, printed circuit board is most of at present
It is using thick copper technology to reach radiating requirements, but cost is higher in thick copper operation and manufacture craft is cumbersome, and increases printing
The weight of circuit board finished product also causes comparable puzzlement to subsequently assembling.In addition, some producers are then using pasting metal fin
(heat sink) in printed circuit board rear, to improve radiating efficiency, however its not only cost increases, can also be added to simultaneously
The weight of product.Therefore, the radiating efficiency of printed circuit board how is improved, and reduces production cost and product weight, is to carve not in fact
Hold slow project.
Invention content
In view of this, the present invention discloses a kind of production method of high cooling efficiency circuit board, electricity can be effectively promoted
The heat-sinking capability of road plate can more reduce the cost of board production.
According to an embodiment disclosed in this invention, a kind of production method of high cooling efficiency circuit board is related to,
It comprises the steps of.First, a substrate is provided, and substrate has a conductive layer.Then, a perforation is formed in substrate.Then, electric
An electroplated layer is plated on the conductive layer of substrate and among perforation, electroplated layer and conductive layer are etched, to form a circuit layer.Profit
With a thermal grease to form a heat dissipating layer in the side of substrate.
The production method of the high cooling efficiency circuit board of the present invention also includes heating thermal grease to cure heat dissipating layer.
In one embodiment, about 35 microns to 500 microns of the thickness of heat dissipating layer.In one embodiment, the thickness of heat dissipating layer
About 70 microns to 200 microns.
In one embodiment, the production method of high cooling efficiency circuit board of the invention also includes to form a stopple in wearing
Among hole.
In one embodiment, the production method of high cooling efficiency circuit board of the invention is also included in and forms stopple in wearing
After the step of among hole, a surface-treated layer is formed on circuit layer.
In one embodiment, the production method of high cooling efficiency circuit board of the invention also includes to form a surface treatment
Then layer just forms stopple among perforation on circuit layer.
In one embodiment, stopple includes a resin stopple.
In one embodiment, stopple includes a thermal grease stopple, is to utilize thermal grease, in base while to form heat dissipating layer
The side of plate is formed simultaneously.
In one embodiment, the height of above-mentioned stopple is approximately more than the 25% of substrate thickness.
According to another state sample implementation of the present invention, the present invention provides a kind of high cooling efficiency circuit board, includes substrate tool
There are a conductive layer and a perforation, among an electroplated layer is formed on the conductive layer of substrate and perforates and a thermal grease
The side of layer formation substrate.Wherein, heat dissipation layer of paste also includes a thermal grease stopple, and the height of thermal grease stopple is approximately more than substrate thickness
The 25% of degree.
In conclusion the production method of high cooling efficiency circuit board disclosed in this invention, can effectively improve circuit
The heat-sinking capability of plate, and can be adapted for the production process of various circuit boards simultaneously, it either first carries out consent and makes work
Skill or after carry out making plug holes, or omit making plug holes, the heat radiation energy needed for circuit board can be effectively provided
Power, and the anti-welding ability of circuit board is provided, the perforation on circuit board can be more covered, is influenced to avoid moisture by perforating
The efficiency of electronic device and service life, while the manufacture craft needed for circuit board is saved, it is effectively reduced production cost.The present invention's
High cooling efficiency circuit board can be used in automobile-used circuit board, or any required circuit board to work at high temperature, to carry
The heat-sinking capability of high circuit board, while extending the service life of circuit board, increase the reliability of circuit board.
Description of the drawings
Figure 1A to Fig. 1 H is a kind of showing for the production method of high cooling efficiency circuit board depicted in one embodiment of the invention
It is intended to;
Fig. 2A to Fig. 2 H is a kind of production method of high cooling efficiency circuit board depicted in another embodiment of the present invention
Schematic diagram;
Fig. 3 A to Fig. 3 G are a kind of showing for the production method of high rate of heat dissipation circuit board depicted in further embodiment of this invention
It is intended to.
Symbol description
110:Substrate
120:Conductive layer
130:Perforation
140:Electroplated layer
150:Stopple
160:Circuit layer
162:Opening
170:Soldermask layer
180:Heat dissipating layer
190:Surface-treated layer
210:Substrate
220:Conductive layer
230:Perforation
240:Electroplated layer
250:Stopple
260:Circuit layer
262:Opening
270:Soldermask layer
280:Heat dissipating layer
290:Surface-treated layer
310:Substrate
320:Conductive layer
330:Perforation
340:Electroplated layer
350:Stopple
360:Circuit layer
362:Opening
370:Soldermask layer
380:Heat dissipating layer
390:Surface-treated layer
602:Highly
604:Thickness
606:Highly
608:Thickness
Specific implementation mode
It not is to limit that the embodiment that the appended attached drawing of embodiment cooperation is described in detail, but is provided, which is set forth below,
The range that the present invention is covered, and the description of structure operation is non-to limit the sequence of its execution, it is any to be reconfigured by element
Structure, the produced device having and other effects, is all the range that is covered of the present invention.In addition, attached drawing is only to illustrate for mesh
, and map not according to full size.To make to be easy to understand, similar elements or similar components will be with identical symbols in following the description
It indicates to illustrate.
In addition, the word (terms) used in full piece specification and claim usually has in addition to having and especially indicating
Have each word using in this area, in the content of the invention with the usual meaning in special content.It is certain describing
The present invention word by it is lower or this specification other places discuss, retouched for the present invention with providing those skilled in the art
State additional guiding.
About " first " used herein, " second " ... etc., not especially censure the meaning of order or cis-position, also
The non-element described with same technique term just for the sake of difference limiting the present invention or operation.
Secondly, used word "comprising" herein, " comprising ", " having ", " containing " etc., are open
Term, that is, mean including but not limited to.
A to Fig. 1 H refering to fig. 1, it is open according to a kind of high cooling efficiency circuit board depicted in one embodiment of the invention
The schematic diagram of production method.As shown, a kind of production method of high cooling efficiency circuit board, includes the following steps.First,
A refering to fig. 1, provides a substrate 110, and substrate 110 has an at least conductive layer 120.B refering to fig. 1 forms a perforation 130 in base
On plate 110, to run through substrate 110.C refering to fig. 1, plating one electroplated layer 140 on the conductive layer 120 of substrate 110 and
Among perforation 130.Wherein, above-mentioned conductive layer 120 can be a bronze medal conductive layer, and electroplated layer 140 can be then bronze medal plating
Layer, however it's not limited to that.
Referring next to Fig. 1 D, filling perforation 130, to form a stopple 150.E refering to fig. 1, etching electroplated layer 140 and conduction
Layer 120 to form opening 162, and then forms a circuit layer 160.
Referring next to Fig. 1 F, a soldermask layer 170 is formed in the top of circuit layer 160, e.g. prints a solder mask in electricity
On road floor 160.
G refering to fig. 1, using a thermal grease, to form a heat dissipating layer 180 in the side of substrate 110, e.g. substrate 110
The other side relative to soldermask layer 170.With provide the radiating of substrate 110 and top circuit and subsequent installation element, it is anti-welding with
And the ability of insulation.The production method of the high cooling efficiency circuit board of the present invention can utilize printing thermal grease in substrate 110
Side, and the heat-sinking capability of circuit board is improved, and the anti-welding ability of circuit board is provided, it can more cover wearing on circuit board
Hole influences efficiency and the service life of electronic device to avoid moisture by perforation.
Fig. 1 H are further regarded to, a surface treatment are more carried out in the side of circuit layer 160, to form a surface-treated layer
190, can be a change layer gold, a change silver layer an either change tin layers, so the present invention is not limited to this.
In one embodiment, the production method of high cooling efficiency circuit board of the invention also includes heating thermal grease, with solid
Change heat dissipating layer 180.In one embodiment, about 35 microns to 500 microns of the thickness of heat dissipating layer 180.In one embodiment, heat dissipating layer
About 70 microns to 200 microns of 180 thickness.
In one embodiment, above-mentioned stopple 150 can be a resin stopple.
Fig. 2A to Fig. 2 H is further regarded to, it is open according to a kind of high cooling efficiency depicted in another embodiment of the present invention
The schematic diagram of the production method of circuit board.As shown, a kind of production method of high cooling efficiency circuit board, includes following step
Suddenly.First, refering to Fig. 2A, a substrate 210 is provided, substrate 210 has an at least conductive layer 220.Refering to Fig. 2 B, a perforation is formed
230 on substrate 210, to run through substrate 210.Refering to Fig. 2 C, one electroplated layer 240 of plating in substrate 210 conductive layer 220 it
Among upper and perforation 230.Wherein, above-mentioned conductive layer 220 can be a bronze medal conductive layer, and electroplated layer 240 can be then one
Copper electroplated layer, however it's not limited to that.
Referring next to Fig. 2 D, etching electroplated layer 240 and conductive layer 220 to form opening 262, and then form a circuit layer
260。
Referring next to Fig. 2 E, a soldermask layer 270 is formed in the top of circuit layer 260, e.g. prints a solder mask in electricity
On road floor 260.
Refering to Fig. 2 F, a surface treatment is more carried out in the side of circuit layer 260, it, can to form a surface-treated layer 290
To be a change layer gold, a change silver layer an either change tin layers, however the present invention is not limited to this.
Refering to Fig. 2 G, filling perforation 230, to form a stopple 250.
Refering to Fig. 2 H, using a thermal grease, to form a heat dissipating layer 280 in the side of substrate 210, e.g. substrate 210
The other side relative to soldermask layer 270.With provide the radiating of substrate 210 and top circuit and subsequent installation element, it is anti-welding with
And the ability of insulation.The production method of the high cooling efficiency circuit board of the present invention can utilize printing thermal grease in substrate 210
Side, and the heat-sinking capability of circuit board is improved, and the anti-welding ability of circuit board is provided, it can more cover wearing on circuit board
Hole influences efficiency and the service life of electronic device to avoid moisture by perforation.
In one embodiment, the height 602 of stopple 250 is about 25% or more of 210 thickness of substrate, preferably substrate 210
In addition conductive layer 220, electroplated layer 240, surface-treated layer 290 and heat dissipating layer 280 overall thickness 604 25% or more, however
It's not limited to that.
In one embodiment, the production method of high cooling efficiency circuit board of the invention also includes heating thermal grease, with solid
Change heat dissipating layer 280.In one embodiment, about 35 microns to 500 microns of the thickness of heat dissipating layer 280.In one embodiment, heat dissipating layer
About 70 microns to 200 microns of 280 thickness.
In one embodiment, above-mentioned stopple 250 can be a resin stopple.
Further refering to Fig. 3 A to Fig. 3 G, a kind of open high heat dissipation according to depicted in further embodiment of this invention is imitated
The schematic diagram of the production method of rate circuit board.As shown, a kind of production method of high cooling efficiency circuit board, includes following
Step.First, refering to Fig. 3 A, a substrate 310 is provided, substrate 310 has an at least conductive layer 320.Refering to Fig. 3 B, forms one and wear
Hole 330 is on substrate 310, to run through substrate 310.Refering to Fig. 3 C, one electroplated layer 340 of plating is in the conductive layer 320 of substrate 310
On and perforation 330 among.Wherein, above-mentioned conductive layer 320 can be a bronze medal conductive layer, and electroplated layer 340 can be then
One bronze medal electroplated layer, however it's not limited to that.
Referring next to Fig. 3 D, etching electroplated layer 340 and conductive layer 320 to form opening 362, and then form a circuit layer
360。
Referring next to Fig. 3 E, a soldermask layer 370 is formed in the top of circuit layer 360, e.g. prints a solder mask in electricity
On road floor 360.
Refering to Fig. 3 F, a surface treatment is more carried out in the side of circuit layer 360, it, can to form a surface-treated layer 390
To be a change layer gold, a change silver layer an either change tin layers, so the present invention is not limited to this.
Refering to Fig. 3 G, using a thermal grease, to form a heat dissipating layer 380 in the side of substrate 310, e.g. substrate 310
The other side relative to soldermask layer 370.With provide the radiating of substrate 310 and top circuit and subsequent installation element, it is anti-welding with
And the ability of insulation.It is worth noting that, using a thermal grease, to form a heat dissipating layer 380 in the side of substrate 310 while
A stopple 350 can be more formed simultaneously using thermal grease among perforation 330, that is, a thermal grease stopple is formed using thermal grease
Among perforation 330.In some embodiments, thermal grease has the function of heat dissipation and insulation, to promote the heat radiation energy of circuit board
Power, while promoting the insulating capacity between circuit.
Therefore, the production method of high cooling efficiency circuit board of the invention can utilize printing thermal grease in substrate 310
Side and be formed simultaneously thermal grease stopple in perforation 330 among, not only improve circuit board heat-sinking capability, but also provide circuit
The anti-welding ability of plate can more cover the perforation on circuit board, to avoid moisture by perforation influence electronic device efficiency with
Service life can more save required manufacture craft, reduce production cost.
In one embodiment, the height 606 of stopple 350 is about 25% or more of the thickness of substrate 310, preferably substrate
310 add 25% or more of the overall thickness 608 of conductive layer 320, electroplated layer 340, surface-treated layer 390 and heat dissipating layer 380, so
And it's not limited to that.
In one embodiment, the production method of high cooling efficiency circuit board of the invention also includes heating thermal grease, with solid
Change heat dissipating layer 380.In one embodiment, about 35 microns to 500 microns of the thickness of heat dissipating layer 380.In one embodiment, heat dissipating layer
About 70 microns to 200 microns of 380 thickness.
In conclusion the production method of the high cooling efficiency circuit board of the present invention can effectively improve the heat dissipation of circuit board
Ability, and can be adapted for the production process of various circuit boards simultaneously, either first carry out making plug holes or laggard
Row making plug holes, or making plug holes are omitted, the heat-sinking capability needed for circuit board can be effectively provided, and
The anti-welding ability for providing circuit board, can more cover the perforation on circuit board, influence electronic device by perforation to avoid moisture
Efficiency and the service life, while saving the manufacture craft needed for circuit board, be effectively reduced production cost.The high heat dissipation effect of the present invention
Rate circuit board can be used in automobile-used circuit board, or any required circuit board to work at high temperature, to improve circuit board
Heat-sinking capability, while extending the service life of circuit board, increase the reliability of circuit board.
Although disclosing the present invention in conjunction with embodiment of above, it is not limited to the present invention, any this field
Have usual skill, without departing from the spirit and scope of the present invention, can be used for a variety of modifications and variations, therefore the guarantor of the present invention
Shield range should be subject to what the appended claims were defined.
Claims (11)
1. a kind of production method of high cooling efficiency circuit board, including:
A substrate is provided, which has a conductive layer;
A perforation is formed in the substrate;
An electroplated layer is electroplated on the conductive layer of the substrate and among the perforation;
The electroplated layer and the conductive layer are etched, to form a circuit layer;And
Using a thermal grease, to form a heat dissipating layer in the side of the substrate.
It, should with solidification 2. the production method of high cooling efficiency circuit board as described in claim 1 also includes to heat the thermal grease
Heat dissipating layer.
3. the production method of high cooling efficiency circuit board as claimed in claim 2, wherein about 35 microns of the thickness of the heat dissipating layer
To 500 microns.
4. the production method of high cooling efficiency circuit board as claimed in claim 3, wherein about 70 microns of the thickness of the heat dissipating layer
To 200 microns.
5. the production method of high cooling efficiency circuit board as described in claim 1, also include formed a stopple in the perforation it
In.
6. the production method of high cooling efficiency circuit board as claimed in claim 5 is also included in and forms the stopple in the perforation
Among the step of after, formed a surface-treated layer on the circuit layer.
7. the production method of high cooling efficiency circuit board as claimed in claim 5 also includes to form a surface-treated layer in this
On circuit layer, the stopple is then just formed among the perforation.
8. the production method of high cooling efficiency circuit board as claimed in claim 7, the wherein stopple include resin stopple.
9. the production method of high cooling efficiency circuit board as claimed in claim 7, the wherein stopple include thermal grease stopple, profit
With the thermal grease, side while to form the heat dissipating layer in the substrate is formed simultaneously.
10. the production method of high cooling efficiency circuit board as claimed in claim 9, the height of the wherein thermal grease stopple are about big
In the 25% of the substrate thickness.
11. a kind of high cooling efficiency circuit board, including:
Substrate, the substrate have conductive layer and perforation;
Electroplated layer is formed on the conductive layer of the substrate and among the perforation;And
Radiate layer of paste, forms the side of the substrate, and wherein the heat dissipation layer of paste also includes thermal grease stopple, the height of the thermal grease stopple
Degree is approximately more than the 25% of the substrate thickness.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710235659.9A CN108697004A (en) | 2017-04-12 | 2017-04-12 | High cooling efficiency circuit board and preparation method thereof |
| CN202110193654.0A CN112996269A (en) | 2017-04-12 | 2017-04-12 | High-heat-dissipation-efficiency circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710235659.9A CN108697004A (en) | 2017-04-12 | 2017-04-12 | High cooling efficiency circuit board and preparation method thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110193654.0A Division CN112996269A (en) | 2017-04-12 | 2017-04-12 | High-heat-dissipation-efficiency circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108697004A true CN108697004A (en) | 2018-10-23 |
Family
ID=63843524
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110193654.0A Pending CN112996269A (en) | 2017-04-12 | 2017-04-12 | High-heat-dissipation-efficiency circuit board and manufacturing method thereof |
| CN201710235659.9A Pending CN108697004A (en) | 2017-04-12 | 2017-04-12 | High cooling efficiency circuit board and preparation method thereof |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110193654.0A Pending CN112996269A (en) | 2017-04-12 | 2017-04-12 | High-heat-dissipation-efficiency circuit board and manufacturing method thereof |
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| CN104363704A (en) * | 2014-10-30 | 2015-02-18 | 江门崇达电路技术有限公司 | Manufacturing method of thick hole copper PCB |
| CN204968336U (en) * | 2015-10-13 | 2016-01-13 | 武汉锐科控制系统有限公司 | Saddle heat radiation structure |
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Application publication date: 20181023 |