CN209949535U

CN209949535U - IGBT heat conduction printed circuit board

Info

Publication number: CN209949535U
Application number: CN201920354825.1U
Authority: CN
Inventors: 李国庆
Original assignee: Zhuhai Hangda Technology Co Ltd
Current assignee: Zhuhai Hangda Technology Co Ltd
Priority date: 2019-03-19
Filing date: 2019-03-19
Publication date: 2020-01-14
Anticipated expiration: 2029-03-19

Abstract

The utility model discloses a IGBT heat conduction printed circuit board, including heat dissipation basic unit, insulating layer and the circuit layer that stacks gradually the setting, be provided with a plurality of fretwork patterns on the circuit layer, the fretwork pattern intussuseption is filled with the heat conduction thing, heat conduction thing lower surface is connected with the insulating layer. The IGBT heat conduction printed circuit board utilizes the metal plate to replace the traditional electroplated copper layer, thereby not only ensuring the high-current conductivity of the whole circuit layer, but also utilizing the whole circuit layer to conduct heat; wherein the design has hollow out construction and fills the heat-conducting object in the circuit layer for when passing through heavy current, the heat-conducting object can spread the heat on the circuit layer to the insulating layer fast, and heat conduction is to the basic unit that dispels the heat at last. The whole circuit board is simple in structure, good in heat dissipation performance and suitable for being used in high-current electronic fields such as frequency converters.

Description

IGBT heat conduction printed circuit board

Technical Field

The utility model relates to a circuit board technical field especially relates to a IGBT heat conduction printed circuit board.

Background

Printed circuit boards are one of the important components of the electronics industry. Almost every electronic device, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, requires the use of printed circuit boards for electrical interconnection between electronic components such as integrated circuits.

An Insulated Gate Bipolar Transistor (IGBT) is a composite fully-controlled voltage-driven power semiconductor device consisting of a Bipolar Junction Transistor (BJT) and an insulated Gate field effect transistor (MOS). The semiconductor devices are usually integrated on a printed circuit board, and with the development of high-current electronic equipment such as a frequency converter, the current required to be borne by the chip is also enhanced, the heat generated during the operation of the chip is also increased continuously, and if the heat generated by the IGBT chip is not dissipated in time, the operation of the IGBT chip is seriously influenced.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a simple structure, easy processing and good heat-conducting property IGBT heat-conducting printed circuit board.

The utility model provides a technical scheme that its technical problem adopted does:

the utility model provides a IGBT heat conduction printed circuit board, is including heat dissipation basic unit, insulating layer and the circuit layer that stacks gradually the setting, be provided with a plurality of fretwork patterns on the circuit layer, the fretwork pattern intussuseption is filled with heat conduction thing, heat conduction thing lower surface is connected with the insulating layer.

As an improvement of the technical scheme, the heat dissipation base layer is provided with a boss, the insulating layer and the circuit layer are provided with through holes matched with the boss, the boss penetrates through the through holes, and the top surface of the boss and the upper surface of the circuit layer are coplanar.

As an improvement of the technical scheme, the circuit layer is obtained by copper plate etching processing.

As an improvement of the technical scheme, the thickness of the circuit layer is 280-350 mu m.

As an improvement of the technical scheme, the heat dissipation base layer is composed of a copper plate or an aluminum plate.

In an improvement of the above technical solution, the heat conductor is an ink resin.

As an improvement of the technical scheme, the heat dissipation base layer is made of 5052 alloy aluminum.

The beneficial effects of the utility model are that:

the IGBT heat conduction printed circuit board utilizes the metal plate to replace the traditional electroplated copper layer, thereby not only ensuring the high-current conductivity of the whole circuit layer, but also utilizing the whole circuit layer to conduct heat; wherein the design has hollow out construction and fills the heat-conducting object in the circuit layer for when passing through heavy current, the heat-conducting object can spread the heat on the circuit layer to the insulating layer fast, and heat conduction is to the basic unit that dispels the heat at last. The whole circuit board is simple in structure, good in heat dissipation performance and suitable for being used in high-current electronic fields such as frequency converters.

Drawings

The present invention will be further described with reference to the accompanying drawings and specific embodiments, wherein:

fig. 1 is a schematic structural diagram of an embodiment of the present invention.

Detailed Description

Referring to fig. 1, the utility model discloses a IGBT heat conduction printed circuit board, including heat dissipation basic unit 1, insulating layer 2 and the circuit layer 3 that stacks gradually the setting, be provided with a plurality of fretwork patterns on the circuit layer 3, the fretwork pattern intussuseption is filled with heat conduction thing 4, heat conduction thing 4 lower surfaces is connected with insulating layer 2. Wherein, in order to improve the effect of installation, in this application, be provided with boss 5 on the heat dissipation basic unit 1, insulating layer 2 and circuit layer 3 are provided with the through-hole that matches boss 5, boss 5 wears to establish in the through-hole, and boss 5's top surface and circuit layer 3 upper surface coplanar. The boss 5 can provide a mounting position for the installation of the IGBT chip, and can directly transfer the heat generated by the boss to the heat dissipation base layer 1, so that the heat dissipation can be well performed. The heat sink base layer 1 is in this application made of 5052 alloyed aluminum.

The circuit layer 3 is obtained by etching a copper plate, the thickness of the circuit layer 3 is 280-350 μm, and obviously, the circuit layer 3 cannot be obtained by a traditional copper deposition electroplating process, and therefore, the circuit layer is obtained by directly pressing the copper plate with the thickness. In the present application, such a thick wiring layer 3 is selected for the purpose of solving the problems of high conductivity and heat dissipation. Because the current required by the IGBT is large, the traditional common circuit board cannot well transmit large current and is difficult to radiate under the large current, so that the circuit board is easy to burn out.

Furthermore, in order to better dissipate heat, the heat dissipation base layer 1 is composed of a copper plate or an aluminum plate, the heat conductor 4 is ink resin, and the heat conductor 4 is printed on the hollowed-out pattern by adopting vacuum silk screen printing. To a certain extent, the circuit layer 3 can be firmly fastened on the insulating layer 2 by the heat conductor 4 due to the thicker circuit layer 3; at the same time, the heat of the circuit layer 3 is also transferred to the insulating layer 2 via the heat conductor 4 more quickly and over a larger area.

In addition, the utility model also provides a processing method of the IGBT heat conduction printed circuit board, which needs to select the heat dissipation base layer 1 and the insulating layer 2 according to the preset specification, and a lug boss 5 is processed on the heat dissipation base layer 1; taking a metal plate with a preset specification, and processing pits on the metal plate by adopting a processing mode of pattern transfer and chemical etching, wherein the depth of each pit is 1/3-1/2 of the thickness of the metal plate; filling heat conductors 4 into the pits on the obtained metal plate, and filling the pits with the heat conductors 4; taking an insulating layer 2 with a preset specification, and processing a through hole matched with the boss 5 on the insulating layer 2 and the metal plate obtained in the step 3; then, sequentially laminating the insulating layer 2 with the processed through hole and a metal plate on the heat dissipation base layer 1, and stacking the insulating layer and the metal plate according to the matching of the boss 5 and the through hole, wherein one side of the metal plate with the heat conductor 4 is attached to the insulating layer 2; putting the stacked heat dissipation base layer 1, the insulating layer 2 and the metal plate into a laminating machine to be laminated into an integral structure to obtain a primary circuit board; on one side of the metal plate on the primary circuit board, performing secondary exposure processing on the metal plate at a position corresponding to the pit by using image transfer, and performing secondary etching on the metal plate at the position of the secondary processing by using chemical etching to completely expose the heat conductor 4 in the metal plate; filling a heat conductor 4 into the metal plate on the primary circuit board for the second time, and filling the pit obtained by secondary etching with the heat conductor 4; and carrying out post-treatment to obtain a finished product circuit board.

The utility model discloses in, heat conduction thing 4 all adopts the mode of vacuum silk screen printing to fill, and heat conduction thing 4 need fill out the fretwork pattern completely. In the pressing operation of the present application, the pressing parameters of the heat dissipation base layer 1, the insulating layer 2 and the metal plate can be completely pressed by referring to the pressing parameters of the conventional circuit board, and no special requirement exists, so the description is omitted here. Because the thickness of the metal plate is larger than that of the circuit layer of the conventional circuit board, the redundant copper material needs to be removed by adopting multiple times of chemical etching. In the present application, the depth of the dimple is 1/2 the thickness of the sheet metal, which is chosen to better control the depth of the dimple. In the present application, the post-processing includes solder resist layer fabrication, text layer fabrication, surface treatment fabrication, profile forming processing, function inspection, and appearance inspection.

The IGBT heat conduction printed circuit board utilizes the metal plate to replace the traditional electroplated copper layer, thereby not only ensuring the high-current conductivity of the whole circuit layer 3, but also utilizing the whole circuit layer 3 to conduct heat; wherein the design has hollow out construction and fills heat conduction thing 4 in the circuit layer 3 for when passing through heavy current, heat conduction thing 4 can spread the heat on the circuit layer 3 to insulating layer 2 fast, and heat conduction is to heat dissipation basic unit 1 at last. The whole circuit board is simple in structure, good in heat dissipation performance and suitable for being used in high-current electronic fields such as frequency converters.

The above description is only a preferred embodiment of the present invention, but the present invention is not limited to the above embodiments, and the technical effects of the present invention should be all included in the protection scope of the present invention as long as the technical effects are achieved by any of the same or similar means.

Claims

1. The utility model provides a IGBT heat conduction printed circuit board which characterized in that: including heat dissipation basic unit (1), insulating layer (2) and the circuit layer (3) that stack gradually the setting, be provided with a plurality of fretwork patterns on the circuit layer (3), the fretwork pattern intussuseption is filled with heat conduction thing (4), heat conduction thing (4) lower surface is connected with insulating layer (2).

2. The IGBT thermal conduction printed circuit board according to claim 1, wherein: be provided with boss (5) on heat dissipation basic unit (1), insulating layer (2) and circuit layer (3) are provided with the through-hole that matches boss (5), boss (5) are worn to establish in the through-hole, and the top surface of boss (5) and circuit layer (3) upper surface coplanar.

3. The IGBT thermal conduction printed circuit board according to claim 1, wherein: the circuit layer (3) is obtained by etching and processing a copper plate.

4. An IGBT thermal conduction printed circuit board according to claim 1 or 3, characterized in that: the thickness of the circuit layer (3) is 280-350 mu m.

5. The IGBT thermal conduction printed circuit board according to claim 1, wherein: the heat dissipation base layer (1) is composed of a copper plate or an aluminum plate.

6. The IGBT thermal conduction printed circuit board according to claim 1, wherein: the heat conductor (4) is ink resin.

7. The IGBT thermal conduction printed circuit board according to claim 1, wherein: the heat dissipation base layer (1) is made of 5052 alloy aluminum.