CN112996269A - High-heat-dissipation-efficiency circuit board and manufacturing method thereof - Google Patents
High-heat-dissipation-efficiency circuit board and manufacturing method thereof Download PDFInfo
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- CN112996269A CN112996269A CN202110193654.0A CN202110193654A CN112996269A CN 112996269 A CN112996269 A CN 112996269A CN 202110193654 A CN202110193654 A CN 202110193654A CN 112996269 A CN112996269 A CN 112996269A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 230000017525 heat dissipation Effects 0.000 claims abstract description 93
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 238000009713 electroplating Methods 0.000 claims abstract description 7
- 238000005530 etching Methods 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 claims description 119
- 238000000034 method Methods 0.000 claims description 35
- 239000002335 surface treatment layer Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007747 plating Methods 0.000 abstract description 14
- 229910000679 solder Inorganic materials 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a circuit board with high heat dissipation efficiency and a manufacturing method thereof. The manufacturing method of the circuit board with high heat dissipation efficiency comprises the following steps. First, a substrate having a conductive layer is provided. Then, a through hole is formed on the substrate. Then, an electroplating layer is electroplated on the conductive layer of the substrate and in the through hole. Etching the plating layer and the conductive layer to form a circuit layer. A heat dissipation layer is formed on one side of the substrate by using a heat dissipation paste. In addition, a circuit board with high heat dissipation efficiency is also disclosed.
Description
The application is a divisional application of Chinese invention patent application (application number: 201710235659.9, application date: 2017, 4, 12 and the name of the invention: a high-heat-dissipation-efficiency circuit board and a manufacturing method thereof).
Technical Field
The present invention relates to a circuit board with high heat dissipation efficiency and a method for manufacturing the same, and more particularly, to a circuit board with high heat dissipation efficiency for a vehicle and a method for manufacturing the same.
Background
With the advancement of the automotive industry, new cars of various types continue to come into the market. Under the condition of considering both environmental protection and convenience, various electric vehicles or oil-electric hybrid electric vehicles also create bright sales scores under the efforts of various automobile factories.
However, the current electric vehicle or hybrid electric vehicle generates high heat during operation, which affects the performance and life of the electronic product. Among them, heat dissipation of devices such as Transmission Control Unit (TCU) is particularly regarded by the automobile industry.
In the current automobile industry, in order to overcome the circuit board requirement of high heat working environment, most of the current printed circuit boards use thick copper technology to achieve the heat dissipation requirement, but the thick copper operation has higher cost and complicated manufacturing process, and the weight of the finished printed circuit board product is increased, which causes considerable trouble to the subsequent assembly. In addition, some manufacturers use a metal heat sink to improve the heat dissipation efficiency, but the cost is increased and the weight of the product is increased. Therefore, how to improve the heat dissipation efficiency of the printed circuit board and reduce the production cost and the product weight is an issue that is really slow.
Disclosure of Invention
In view of this, the present invention discloses a method for manufacturing a circuit board with high heat dissipation efficiency, which can effectively improve the heat dissipation capability of the circuit board and further reduce the production cost of the circuit board.
According to one embodiment of the present disclosure, a method for manufacturing a circuit board with high heat dissipation efficiency includes the following steps. First, a substrate having a conductive layer is provided. Then, a through hole is formed on the substrate. Then, an electroplating layer is electroplated on the conductive layer of the substrate and in the through hole, and the electroplating layer and the conductive layer are etched to form a circuit layer. A heat dissipation layer is formed on one side of the substrate by using a heat dissipation paste.
The manufacturing method of the circuit board with high heat dissipation efficiency further comprises the step of heating the heat dissipation paste to solidify the heat dissipation layer.
In one embodiment, the heat spreading layer has a thickness of about 35 to 500 microns. In one embodiment, the heat spreading layer has a thickness of about 70 microns to about 200 microns.
In an embodiment of the invention, the method for manufacturing the circuit board with high heat dissipation efficiency further includes forming a hole plug in the through hole.
In an embodiment of the invention, the method for manufacturing the circuit board with high heat dissipation efficiency further includes forming a surface treatment layer on the circuit layer after the step of forming the hole plugs in the through holes.
In an embodiment of the invention, the method for manufacturing the circuit board with high heat dissipation efficiency further includes forming a surface treatment layer on the circuit layer, and then forming the hole plugs in the through holes.
In one embodiment, the plug comprises a resin plug.
In one embodiment, the via plug includes a thermal paste via plug formed on one side of the substrate simultaneously with the formation of the thermal layer using the thermal paste.
In one embodiment, the height of the hole plug is greater than about 25% of the thickness of the substrate.
According to another aspect of the present invention, a circuit board with high heat dissipation efficiency is provided, which includes a substrate having a conductive layer and a through hole, an electroplating layer formed on the conductive layer and in the through hole, and a heat dissipation paste layer formed on one side of the substrate. The heat dissipation paste layer also comprises a heat dissipation paste hole plug, and the height of the heat dissipation paste hole plug is about more than 25% of the thickness of the substrate.
In summary, the method for manufacturing a circuit board with high heat dissipation efficiency disclosed by the present invention can effectively improve the heat dissipation capability of the circuit board, and can be applied to the manufacturing process of various circuit boards, and can effectively provide the heat dissipation capability required by the circuit board and the solder mask capability of the circuit board, and can further shield the through holes on the circuit board, so as to prevent the efficiency and the service life of the electronic device from being affected by moisture through the through holes, and simultaneously save the manufacturing process required by the circuit board, and effectively reduce the production cost, no matter whether the through hole manufacturing process is performed first or then, or the through hole manufacturing process is omitted. The circuit board with high heat dissipation efficiency can be used for a vehicle circuit board or any circuit board which needs to work at high temperature, so that the heat dissipation capability of the circuit board is improved, the service life of the circuit board is prolonged, and the reliability of the circuit board is improved.
Drawings
Fig. 1A to fig. 1H are schematic diagrams illustrating a method for manufacturing a circuit board with high heat dissipation efficiency according to an embodiment of the invention;
fig. 2A to fig. 2H are schematic diagrams illustrating a method for manufacturing a circuit board with high heat dissipation efficiency according to another embodiment of the invention;
fig. 3A to fig. 3G are schematic diagrams illustrating a method for manufacturing a circuit board with high heat dissipation rate according to another embodiment of the invention.
Description of the symbols
110: substrate
120: conductive layer
130: perforation
140: electroplated coating
150: hole plug
160: circuit layer
162: opening of the container
170: welding-proof layer
180: heat dissipation layer
190: surface treatment layer
210: substrate
220: conductive layer
230: perforation
240: electroplated coating
250: hole plug
260: circuit layer
262: opening of the container
270: welding-proof layer
280: heat dissipation layer
290: surface treatment layer
310: substrate
320: conductive layer
330: perforation
340: electroplated coating
350: hole plug
360: circuit layer
362: opening of the container
370: welding-proof layer
380: heat dissipation layer
390: surface treatment layer
602: height
604: thickness of
606: height
608: thickness of
Detailed Description
The following detailed description of the embodiments with reference to the accompanying drawings is provided for purposes of illustration only and is not intended to limit the scope of the invention, which is defined by the appended claims, as a means for performing the same function, or any combination thereof. In addition, the drawings are for illustrative purposes only and are not drawn to scale. For ease of understanding, the same or similar elements will be described with the same reference numerals in the following description.
Also, the terms (terms) used throughout the specification and claims have the ordinary meaning as is accorded to each term used in this field, in the context of the present invention, and in any specific context, unless otherwise indicated. Certain terms used to describe the invention are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the invention.
As used herein, the terms "first," "second," …, etc., are not intended to be limited to the exact order or sequence presented, nor are they intended to be limiting, but rather are intended to distinguish one element from another or from another element or operation described by the same technical term.
Furthermore, as used herein, the terms "comprising," "including," "having," "containing," and the like are open-ended terms that mean including, but not limited to.
Referring to fig. 1A to fig. 1H, schematic diagrams of a method for manufacturing a circuit board with high heat dissipation efficiency according to an embodiment of the invention are disclosed. As shown in the figure, a method for manufacturing a circuit board with high heat dissipation efficiency comprises the following steps. First, referring to fig. 1A, a substrate 110 is provided, wherein the substrate 110 has at least one conductive layer 120. Referring to fig. 1B, a through hole 130 is formed on the substrate 110 to penetrate the substrate 110. Referring to fig. 1C, a plating layer 140 is plated on the conductive layer 120 of the substrate 110 and in the through hole 130. The conductive layer 120 may be a copper conductive layer, and the plating layer 140 may be a copper plating layer, but not limited thereto.
Referring next to fig. 1D, the through hole 130 is filled to form a plug 150. Referring to fig. 1E, the plating layer 140 and the conductive layer 120 are etched to form an opening 162, thereby forming a circuit layer 160.
Referring to fig. 1F, a solder mask layer 170 is formed on the circuit layer 160, such as by printing a solder mask on the circuit layer 160.
Referring to fig. 1G, a heat dissipation layer 180 is formed on one side of the substrate 110, for example, the other side of the substrate 110 opposite to the solder mask layer 170, by using a heat dissipation paste. To provide heat dissipation, solder mask, and insulation capabilities for the substrate 110 and the overlying circuitry and subsequently mounted components. The method for manufacturing the circuit board with high heat dissipation efficiency can utilize the printed heat dissipation paste on one side of the substrate 110 to improve the heat dissipation capability of the circuit board, also provide the solder mask capability of the circuit board, and further can shield the through hole on the circuit board so as to prevent the efficiency and the service life of the electronic device from being influenced by moisture through the through hole.
Referring to fig. 1H, a surface treatment is further performed on one side of the circuit layer 160 to form a surface treatment layer 190, which may be a gold layer, a silver layer, or a tin layer, but the invention is not limited thereto.
In an embodiment, the method for manufacturing a circuit board with high heat dissipation efficiency further includes heating the heat dissipation paste to cure the heat dissipation layer 180. In one embodiment, the heat spreading layer 180 has a thickness of about 35 microns to about 500 microns. In one embodiment, the heat spreading layer 180 has a thickness of about 70 microns to about 200 microns.
In one embodiment, the hole plug 150 may be a resin hole plug.
Further referring to fig. 2A to 2H, schematic diagrams of a method for manufacturing a circuit board with high heat dissipation efficiency according to another embodiment of the invention are disclosed. As shown in the figure, a method for manufacturing a circuit board with high heat dissipation efficiency comprises the following steps. First, referring to fig. 2A, a substrate 210 is provided, wherein the substrate 210 has at least one conductive layer 220. Referring to fig. 2B, a through hole 230 is formed on the substrate 210 to penetrate through the substrate 210. Referring to fig. 2C, a plating layer 240 is plated on the conductive layer 220 and in the through hole 230 of the substrate 210. The conductive layer 220 may be a copper conductive layer, and the plating layer 240 may be a copper plating layer, but not limited thereto.
Referring to fig. 2D, the plating layer 240 and the conductive layer 220 are etched to form an opening 262, thereby forming a circuit layer 260.
Referring to fig. 2E, a solder mask 270 is formed on the circuit layer 260, for example, a solder mask is printed on the circuit layer 260.
Referring to fig. 2F, a surface treatment is further performed on one side of the circuit layer 260 to form a surface treatment layer 290, which may be a gold layer, a silver layer, or a tin layer, but the invention is not limited thereto.
Referring to fig. 2G, the through hole 230 is filled to form a plug 250.
Referring to fig. 2H, a heat dissipation layer 280 is formed on one side of the substrate 210, for example, the other side of the substrate 210 opposite to the solder mask 270, by using a thermal paste. To provide heat dissipation, solder mask, and insulation capabilities for the substrate 210 and the overlying circuitry and subsequently mounted components. The method for manufacturing the circuit board with high heat dissipation efficiency can utilize the printed heat dissipation paste on one side of the substrate 210 to improve the heat dissipation capability of the circuit board, also provide the solder mask capability of the circuit board, and can shield the through hole on the circuit board so as to prevent the efficiency and the service life of an electronic device from being influenced by moisture through the through hole.
In one embodiment, the height 602 of the via plug 250 is about 25% or more of the thickness of the substrate 210, preferably 25% or more of the total thickness 604 of the substrate 210 plus the conductive layer 220, the plating layer 240, the surface treatment layer 290 and the heat dissipation layer 280, but not limited thereto.
In an embodiment, the method for manufacturing a circuit board with high heat dissipation efficiency further includes heating the heat dissipation paste to cure the heat dissipation layer 280. In one embodiment, the thickness of the heat dissipation layer 280 is about 35 microns to 500 microns. In one embodiment, the heat dissipation layer 280 has a thickness of about 70 microns to about 200 microns.
In one embodiment, the plug 250 may be a resin plug.
Referring to fig. 3A to 3G, schematic diagrams of a method for manufacturing a circuit board with high heat dissipation efficiency according to another embodiment of the invention are disclosed. As shown in the figure, a method for manufacturing a circuit board with high heat dissipation efficiency comprises the following steps. First, referring to fig. 3A, a substrate 310 is provided, the substrate 310 has at least one conductive layer 320. Referring to fig. 3B, a through hole 330 is formed on the substrate 310 to penetrate the substrate 310. Referring to fig. 3C, an electroplating layer 340 is electroplated on the conductive layer 320 and in the through hole 330 of the substrate 310. The conductive layer 320 may be a copper conductive layer, and the plating layer 340 may be a copper plating layer, but not limited thereto.
Referring to fig. 3D, the plating layer 340 and the conductive layer 320 are etched to form an opening 362, thereby forming a circuit layer 360.
Referring to fig. 3E, a solder mask 370 is formed on the circuit layer 360, such as by printing a solder mask on the circuit layer 360.
Referring to fig. 3F, a surface treatment is further performed on one side of the circuit layer 360 to form a surface treatment layer 390, which may be a gold layer, a silver layer or a tin layer, but the invention is not limited thereto.
Referring to fig. 3G, a heat dissipation layer 380 is formed on one side of the substrate 310, for example, the other side of the substrate 310 opposite to the solder mask 370, by using a thermal paste. To provide heat dissipation, solder mask, and insulation capabilities for the substrate 310 and the overlying circuitry and subsequently mounted components. It is noted that, while a thermal paste is used to form a thermal layer 380 on one side of the substrate 310, a via plug 350 may be formed in the through hole 330 at the same time, i.e., a thermal paste is formed in the through hole 330. In some embodiments, the thermal paste has functions of heat dissipation and insulation, so as to improve the heat dissipation capability of the circuit board and improve the insulation capability between circuits.
Therefore, the method for manufacturing the circuit board with high heat dissipation efficiency of the present invention can utilize the printed heat dissipation paste to form the heat dissipation paste hole on one side of the substrate 310 and simultaneously plug the heat dissipation paste hole in the through hole 330, thereby not only improving the heat dissipation capability of the circuit board, but also providing the solder mask capability of the circuit board, and further shielding the through hole on the circuit board, so as to prevent the efficiency and the service life of the electronic device from being affected by moisture through the through hole, further saving the required manufacturing process, and reducing the production cost.
In one embodiment, the height 606 of the via plug 350 is about 25% or more of the thickness of the substrate 310, preferably 25% or more of the total thickness 608 of the substrate 310 plus the conductive layer 320, the plating layer 340, the surface treatment layer 390 and the heat dissipation layer 380, but not limited thereto.
In an embodiment, the method for manufacturing a circuit board with high heat dissipation efficiency further includes heating the heat dissipation paste to cure the heat dissipation layer 380. In one embodiment, the heat spreading layer 380 has a thickness of about 35 microns to about 500 microns. In one embodiment, the heat spreading layer 380 has a thickness of about 70 microns to about 200 microns.
In summary, the method for manufacturing a circuit board with high heat dissipation efficiency of the present invention can effectively improve the heat dissipation capability of the circuit board, and can be applied to the manufacturing process of various circuit boards, and can effectively provide the heat dissipation capability required by the circuit board and the solder mask capability of the circuit board, even if the plugging process is performed first or then, or the plugging process is omitted, thereby shielding the through holes on the circuit board, preventing the moisture from affecting the efficiency and the service life of the electronic device through the through holes, saving the manufacturing process required by the circuit board, and effectively reducing the production cost. The circuit board with high heat dissipation efficiency can be used for a vehicle circuit board or any circuit board which needs to work at high temperature, so that the heat dissipation capability of the circuit board is improved, the service life of the circuit board is prolonged, and the reliability of the circuit board is improved.
While the invention has been described with reference to the above embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention, and therefore, the scope of the invention should be determined by that of the appended claims.
Claims (10)
1. A method for manufacturing a circuit board with high heat dissipation efficiency comprises the following steps:
providing a substrate, wherein the substrate is provided with a conductive layer;
forming a through hole on the substrate;
electroplating an electroplated layer on the conductive layer and in the through hole of the substrate;
etching the electroplated layer and the conductive layer to form a circuit layer; and
a heat dissipation layer is formed on one side of the substrate by using a heat dissipation paste, and the thickness of the heat dissipation layer is about 35-500 microns.
2. The method according to claim 1, further comprising heating the thermal paste to cure the thermal layer.
3. The method according to claim 1, wherein the heat dissipation layer has a thickness of about 70 to 200 μm.
4. The method according to claim 1, further comprising forming a hole in the through hole.
5. The method according to claim 4, further comprising forming a surface treatment layer on the circuit layer after the step of forming the hole plug in the through hole.
6. The method according to claim 4, further comprising forming a surface treatment layer on the circuit layer before forming the hole plug in the through hole.
7. The method according to claim 6, wherein the hole plug comprises a resin hole plug.
8. The method according to claim 6, wherein the hole plug comprises a thermal paste hole plug, and the thermal paste is used to form the thermal layer and simultaneously form the thermal layer on one side of the substrate.
9. The method according to claim 8, wherein the height of the thermal paste plug is greater than about 25% of the thickness of the substrate.
10. A circuit board with high heat dissipation efficiency comprises:
a substrate having a conductive layer and a through hole;
an electroplating layer formed on the conductive layer and in the through hole of the substrate; and
and the heat dissipation layer is formed on one side of the substrate, wherein the heat dissipation layer further comprises a heat dissipation paste hole plug, the height of the heat dissipation paste hole plug is about more than 25% of the thickness of the substrate, and the thickness of the heat dissipation layer is about 35-500 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110193654.0A CN112996269A (en) | 2017-04-12 | 2017-04-12 | High-heat-dissipation-efficiency circuit board and manufacturing method thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110193654.0A CN112996269A (en) | 2017-04-12 | 2017-04-12 | High-heat-dissipation-efficiency circuit board and manufacturing method thereof |
| CN201710235659.9A CN108697004A (en) | 2017-04-12 | 2017-04-12 | High cooling efficiency circuit board and preparation method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710235659.9A Division CN108697004A (en) | 2017-04-12 | 2017-04-12 | High cooling efficiency circuit board and preparation method thereof |
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| CN112996269A true CN112996269A (en) | 2021-06-18 |
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| CN202110193654.0A Pending CN112996269A (en) | 2017-04-12 | 2017-04-12 | High-heat-dissipation-efficiency circuit board and manufacturing method thereof |
| CN201710235659.9A Pending CN108697004A (en) | 2017-04-12 | 2017-04-12 | High cooling efficiency circuit board and preparation method thereof |
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| CN201710235659.9A Pending CN108697004A (en) | 2017-04-12 | 2017-04-12 | High cooling efficiency circuit board and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1028608A2 (en) * | 1999-02-12 | 2000-08-16 | Peters Research GmbH + Co. KG | Process and coating composition for applying heat-sink paste to circuit boards |
| JP2006173612A (en) * | 2004-12-13 | 2006-06-29 | Shobin Kigyo Kofun Yugenkoshi | Substrate having high thermal conductivity and process for manufacturing it |
| CN104363704A (en) * | 2014-10-30 | 2015-02-18 | 江门崇达电路技术有限公司 | Manufacturing method of thick hole copper PCB |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003007937A (en) * | 2001-06-26 | 2003-01-10 | Fujikura Ltd | Electronic part mounting module and manufacturing method thereof |
| JP2005183559A (en) * | 2003-12-18 | 2005-07-07 | Nec Corp | Printed wiring board and method for manufacturing the same |
| CN201232984Y (en) * | 2008-07-22 | 2009-05-06 | 梁进义 | Radiating module for LED lamp |
| JP5463205B2 (en) * | 2010-05-27 | 2014-04-09 | 日本メクトロン株式会社 | Flexible circuit board |
| CN102164455B (en) * | 2011-01-18 | 2012-11-14 | 武汉正维电子技术有限公司 | Process for assembling radio frequency power amplifier circuit board |
| CN202008405U (en) * | 2011-03-31 | 2011-10-12 | 北京奔龙铁道电气设备有限公司 | Absorption type temperature sensor of railway locomotive |
| CN103383983A (en) * | 2012-05-02 | 2013-11-06 | 茂邦电子有限公司 | Light emitting diode encapsulation, PCB type radiating substrate used for light emitting diode encapsulation and manufacturing method of PCB type radiating substrate |
| TWI481082B (en) * | 2012-06-15 | 2015-04-11 | Mao Bang Electronic Co Ltd | A light emitting diode package and use of the heat dissipation module |
| CN204968336U (en) * | 2015-10-13 | 2016-01-13 | 武汉锐科控制系统有限公司 | Saddle heat radiation structure |
-
2017
- 2017-04-12 CN CN202110193654.0A patent/CN112996269A/en active Pending
- 2017-04-12 CN CN201710235659.9A patent/CN108697004A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1028608A2 (en) * | 1999-02-12 | 2000-08-16 | Peters Research GmbH + Co. KG | Process and coating composition for applying heat-sink paste to circuit boards |
| JP2006173612A (en) * | 2004-12-13 | 2006-06-29 | Shobin Kigyo Kofun Yugenkoshi | Substrate having high thermal conductivity and process for manufacturing it |
| CN104363704A (en) * | 2014-10-30 | 2015-02-18 | 江门崇达电路技术有限公司 | Manufacturing method of thick hole copper PCB |
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| CN108697004A (en) | 2018-10-23 |
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