CN114008769A - Substrate with built-in component and method for manufacturing substrate with built-in component - Google Patents

Substrate with built-in component and method for manufacturing substrate with built-in component Download PDF

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Publication number
CN114008769A
CN114008769A CN201980097514.4A CN201980097514A CN114008769A CN 114008769 A CN114008769 A CN 114008769A CN 201980097514 A CN201980097514 A CN 201980097514A CN 114008769 A CN114008769 A CN 114008769A
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Prior art keywords
component
substrate
electronic component
built
hole
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Inventor
松本彻
石原正胜
关保明
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Meiko Electronics Co Ltd
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Meiko Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0618—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/06181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The component built-in substrate 1 includes: a first partial substrate 10, the first partial substrate 10 being formed with a through-hole 15; a metal piece 16, the metal piece 16 being fixed to the through hole 15; an electronic component 20 having a first surface 21 provided with a first electrode terminal 22 in contact with the metal piece 16 and a second surface 23 opposite to the first surface 21 provided with a second electrode terminal 24; and a second partial substrate 40, the second partial substrate 40 including a second insulating layer 41 in which the electronic component 20 is embedded.

Description

Substrate with built-in component and method for manufacturing substrate with built-in component
Technical Field
The present invention relates to a substrate with a built-in component and a method for manufacturing the substrate with the built-in component.
Background
Printed wiring boards on which heat generating components are mounted generally have a heat dissipating mechanism on the board, as disclosed in the prior art of patent documents 1 and 2, for example. More specifically, these conventional techniques are configured such that a heat generating component and a heat sink are provided on both surfaces of a substrate, respectively, with a heat transfer member provided so as to penetrate the substrate interposed therebetween. Thus, heat generated from the heat generating component mounted on one surface of the substrate is transferred to the heat sink disposed on the other surface of the substrate via the heat transfer member and dissipated. In this case, the heat transfer member forming the heat radiation path between the heat generating component and the heat sink is formed of, for example, a metal sheet made of a copper block, so that the cross-sectional area of the heat radiation path can be more easily ensured than in the case where a plurality of thermal vias (thermal via) are formed, and heat can be efficiently radiated even when the amount of heat generated by the heat generating component is relatively large.
Here, the electronic component according to the related art of patent document 1 includes an electrode terminal on a surface opposite to a contact surface between substrates, and the electrode terminal is connected to a conductive pattern formed on a surface of the substrate by a bonding wire. In the electronic component according to the related art of patent document 2, the electrode terminal formed on the side of the contact surface with the substrate is connected to the conductive pattern formed on the surface of the substrate by solder. That is, in the electronic component mounted on the surface of the substrate, the heat dissipation mechanism via the heat transfer member as described above can be introduced regardless of which surface the electrode terminal is formed on.
Incidentally, among the heat generating components described above, electronic components such as inverters and converters have been made thinner in accordance with the recent increase in switching speed. Therefore, if the electronic component can be incorporated in a printed wiring board, the board can be miniaturized by saving the mounting area, and the influence of the wiring resistance and the reactance component can be reduced by shortening the wiring length, thereby improving the electric performance, as in the case of the conventional component-incorporated board.
Documents of the prior art
Patent document
Patent document 1: japanese patent No. 3922642
Patent document 2: japanese patent No. 5546778
Disclosure of Invention
Problems to be solved by the invention
However, in the conventional substrate with built-in components, the electrode terminals of the electronic component and the conductive patterns formed on the substrate are generally connected by the via holes, and when the electronic component having the electrode terminals formed on both surfaces thereof is built in the substrate, the via holes must be formed on both surfaces of the electronic component, and a heat dissipation mechanism using a metal sheet to efficiently dissipate heat cannot be introduced. Further, even if a plurality of thermal vias connecting the surface of the substrate and the built-in component are densely formed, efficient heat dissipation is still limited due to the limitation of the cross-sectional area of the heat dissipation path.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a substrate with a built-in component, which can improve heat dissipation characteristics even when an electronic component having electrode terminals formed on both surfaces thereof is built in, and a method for manufacturing the substrate with the built-in component.
Means for solving the problems
< first aspect of the invention >
A first aspect of the present invention is a component-embedded substrate including: a first partial substrate formed with a through-hole; a metal sheet fixed to the through hole; an electronic component having a first surface provided with a first electrode terminal in contact with the metal piece and a second surface opposite to the first surface provided with a second electrode terminal; and a second partial substrate including an insulating layer in which the electronic component is embedded.
The component-embedded substrate incorporates an electronic component having a first electrode terminal and a second electrode terminal on both surfaces thereof. Here, the electronic component is mounted on a circuit via the metal piece by contacting the metal piece with the first electrode terminal formed on the first surface, and the heat radiation path to the surface of the substrate is secured while the boundary surface with the metal piece is positioned inside the component-embedded substrate.
In this case, the heat radiation path can have a larger cross-sectional area than a conventional heat radiation mechanism in which a plurality of thermal vias are densely formed, and can radiate heat efficiently. Therefore, according to the component-embedded substrate of the first aspect of the present invention, even when an electronic component having electrode terminals formed on both surfaces thereof is embedded, the heat dissipation characteristics can be improved.
< second aspect of the invention >
A second aspect of the present invention is the substrate with a built-in component, wherein in the first aspect of the present invention, the metal piece is fixed to the through hole by mutual stress with an inner side surface of the through hole.
According to the substrate with a built-in component relating to the second aspect of the present invention, since it is not necessary to separately provide a material such as an adhesive or solder when fixing the metal piece to the through hole of the first partial substrate, it is possible to prevent an increase in cost and a decrease in electrical conductivity and thermal conductivity associated with the use of the material. In particular, when the metal piece is fixed to the through hole with solder, unless the melting start temperature of the solder is appropriately set, the solder used in the other part of the component-embedded substrate is melted by, for example, heating by reflow processing in the previous step and the subsequent step, and there is a possibility that the conductivity of the connecting portion with solder is lowered. In contrast, according to the substrate with a built-in component relating to the second aspect of the present invention, the metal piece can be fixed to the through hole without setting the melting start temperature of the solder or the like.
< third aspect of the invention >
A third aspect of the present invention is the substrate with a built-in component, wherein in the first or second aspect of the present invention, the metal piece has a shape contacting the entire first surface of the electronic component.
According to the component built-in substrate of the third aspect of the present invention, since the entire first surface of the electronic component can be configured as the heat radiation path via the metal sheet, heat can be efficiently radiated even for an electronic component that generates a relatively large amount of heat. Further, according to the substrate with a built-in component relating to the third aspect of the present invention, even when an electronic component that is susceptible to warpage of the substrate with a built-in component due to thinning is built in, the possibility of the via hole coming off can be reduced because warpage of the substrate with a built-in component is suppressed in addition to the protection of the electronic component by the metal piece.
< fourth aspect of the invention >
A fourth aspect of the present invention is a substrate with a built-in component, wherein in any one of the first to third aspects of the present invention, a conductive paste is applied to a contact surface between the first electrode terminal and the metal piece of the electronic component.
According to the component built-in substrate of the fourth aspect of the present invention, the electrically and thermally connected state between the first electrode terminal and the metal piece can be maintained satisfactorily by the conductive paste.
< fifth aspect of the invention >
A fifth aspect of the present invention is the component-embedded substrate according to any one of the first to fourth aspects of the present invention, wherein the component-embedded substrate includes a via hole penetrating the insulating layer and connected to the second electrode terminal of the electronic component, and the surface mount component is mounted so as to be in contact with the via hole.
According to the component built-in substrate of the fifth aspect of the present invention, the second electrode terminal of the electronic component and the surface mount component are directly connected through the via hole. Therefore, since the wiring length between the two is suppressed to be only the height of the via hole, the influence of wiring resistance and reactance components can be reduced, and the electrical characteristics can be improved.
< sixth aspect of the invention >
A sixth aspect of the present invention is a method for manufacturing a substrate with a built-in component, the substrate having an electronic component built therein, the electronic component having a first electrode terminal provided on a first surface and a second electrode terminal provided on a second surface opposite to the first surface, the method including: a through-hole forming step of forming a through-hole in the first partial substrate; a metal piece fixing step of fixing a metal piece to the through hole; a component mounting step of mounting the electronic component so that the metal piece is in contact with the first electrode terminal; and a component embedding step of forming a second partial substrate in which the electronic component is embedded through the insulating layer.
According to the method of manufacturing a substrate with a built-in component relating to the sixth aspect of the present invention, the metal piece is fixed to the through hole of the first partial substrate, the electronic component is provided so as to be in contact with the first electrode terminal, and then the electronic component is embedded through the insulating layer of the second partial substrate. The electronic component built in the component built-in substrate is mounted on the circuit via the metal piece by contacting the metal piece with the first electrode terminal formed on the first surface, and a heat radiation path to the surface of the substrate is secured while a boundary surface with the metal piece is positioned inside the component built-in substrate.
In this case, the heat radiation path can have a larger cross-sectional area than a conventional heat radiation mechanism in which a plurality of thermal vias are densely formed, and can radiate heat efficiently. Therefore, according to the sixth aspect of the present invention, it is possible to manufacture a component-embedded substrate capable of improving heat dissipation characteristics even when an electronic component having electrode terminals formed on both surfaces thereof is embedded therein.
< seventh aspect of the invention >
A seventh aspect of the present invention is a method for manufacturing a substrate with a built-in component, wherein in the sixth aspect of the present invention, in the metal piece fixing step, the metal piece is fixed to the through hole by mutual stress between an inner surface of the through hole and the metal piece.
According to the method for manufacturing a substrate with a built-in component relating to the seventh aspect of the present invention, since it is not necessary to separately provide a material such as an adhesive or solder when fixing the metal piece to the through hole of the first partial substrate, it is possible to prevent an increase in cost and a decrease in electrical conductivity and thermal conductivity associated with the use of the material. In particular, when the metal piece is fixed to the through hole with solder, unless the melting start temperature of the solder is appropriately set, the solder used in the other part of the component-embedded substrate is melted by, for example, heating by reflow processing in the previous step and the subsequent step, and there is a possibility that the conductivity of the connecting portion with solder is lowered. In contrast, according to the seventh aspect of the present invention, it is possible to manufacture a component-embedded substrate in which the metal piece can be fixed to the through hole without setting the melting start temperature of the solder or the like.
< eighth aspect of the present invention >
An eighth aspect of the present invention is a method for manufacturing a substrate with a built-in component, in the sixth or seventh aspect of the present invention, in the metal sheet fixing step, the metal sheet is set in a shape such that the entire first surface of the electronic component is in contact with the metal sheet.
According to the eighth aspect of the present invention, since the entire first surface of the electronic component can be configured as the heat radiation path via the metal sheet, it is possible to manufacture the component-embedded substrate capable of efficiently radiating heat even for an electronic component generating a relatively large amount of heat. In addition, according to the eighth aspect of the present invention, the following component built-in substrate can be manufactured: even when an electronic component which is easily affected by warpage of the component-embedded substrate due to thinning is embedded, the electronic component is protected by the metal sheet, and warpage of the component-embedded substrate is suppressed, so that the possibility of the via hole falling off can be reduced.
< ninth aspect of the present invention >
A ninth aspect of the present invention is a method for manufacturing a substrate with a built-in component, wherein in any one of the sixth aspect to the eighth aspect of the present invention, in the component providing step, a conductive paste is applied to a contact surface between the first electrode terminal of the electronic component and the metal sheet.
According to the ninth aspect of the present invention, it is possible to manufacture the component-embedded substrate capable of maintaining the electrical connection state and the thermal connection state between the first electrode terminal and the metal piece by the conductive paste.
< tenth aspect of the present invention >
A tenth aspect of the present invention is a method for manufacturing a substrate with a built-in component, wherein in any one of the sixth aspect to the ninth aspect of the present invention, the method includes a surface mounting step of forming a via hole penetrating the insulating layer and connected to the second electrode terminal of the electronic component, and mounting a surface mount component so as to be in contact with the via hole.
According to the tenth aspect of the present invention, since the second electrode terminal of the electronic component and the surface mount component are directly connected via the via hole, the wiring length between the two is suppressed to only the height of the via hole, and the component built-in substrate capable of reducing the influence of wiring resistance and reactance components and improving electrical characteristics can be manufactured.
Effects of the invention
According to the present invention, it is possible to provide a substrate with a built-in component, which can improve heat dissipation characteristics even when an electronic component having electrode terminals formed on both surfaces thereof is built in, and a method for manufacturing the substrate with the built-in component.
Drawings
Fig. 1 is a sectional view showing a through-hole forming process according to a first embodiment of the present invention.
Fig. 2 is a sectional view showing a metal sheet fixing step according to a first embodiment of the present invention.
Fig. 3 is a sectional view showing a component mounting step according to a first embodiment of the present invention.
Fig. 4 is a sectional view showing a component embedding step according to the first embodiment of the present invention.
Fig. 5 is a sectional view showing a via hole forming process according to the first embodiment of the present invention.
Fig. 6 is a sectional view showing a patterning process according to the first embodiment of the present invention.
Fig. 7 is a sectional view showing a surface mounting process according to the first embodiment of the present invention.
Fig. 8 is a sectional view showing a component-incorporating substrate according to a second embodiment of the present invention.
Fig. 9 is a sectional view showing a component-incorporating substrate according to a third embodiment of the present invention.
Fig. 10 is a sectional view showing a component mounting step according to a fourth embodiment of the present invention.
Fig. 11 is a sectional view showing a component-incorporating substrate according to a fourth embodiment of the present invention.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the present invention is not limited to the following description, and can be arbitrarily changed and implemented within a range in which the gist thereof is not changed. In addition, the drawings used in the description of the embodiments each schematically show a structural member, and in order to enhance understanding, partial emphasis, enlargement, reduction, omission, or the like is performed, and in some cases, the scale, shape, or the like of the structural member is not accurately shown.
< first embodiment >
Hereinafter, a method of manufacturing the component-embedded substrate 1 according to the first embodiment of the present invention and the component-embedded substrate 1 manufactured by the method will be described in detail with reference to fig. 1 to 7. As shown in fig. 7, a component built-in substrate 1 as a finished product incorporates an electronic component 20 as a heat generating component having electrodes formed on both surfaces thereof, and is provided with a heat dissipating mechanism for efficiently dissipating heat from the electronic component 20, and surface mount components 60 to 62 electrically connected to the electrodes. The component-embedded substrate 1 can be used for various applications such as electronic devices such as mobile phones, notebook personal computers, and digital cameras, and control devices for various in-vehicle devices.
A method for manufacturing a component-embedded substrate 1 according to a first embodiment of the present invention includes: a through-hole forming step, a metal sheet fixing step, a component mounting step, a component embedding step, a via hole forming step, a patterning step, and a surface mounting step.
Fig. 1 is a sectional view showing a through-hole forming process according to a first embodiment of the present invention. First, in the through-hole forming step, the first partial substrate 10 as a substrate for manufacturing the component-embedded substrate 1 is prepared, and the through-hole 15 is formed in the first partial substrate 10. Here, the first partial substrate 10 of the present embodiment includes a first conductive layer 11, a first inner layer pattern 12, a second inner layer pattern 13, and a first insulating layer 14.
More specifically, the first partial substrate 10 is provided with a first conductive layer 11 on one face and a first inner layer pattern 12 on the other face, with a plurality of second inner layer patterns 13 formed therebetween. The first conductive layer 11, the first inner layer pattern 12, and the second inner layer pattern 13 are metal layers that become circuit patterns by patterning, and are insulated from each other by the first insulating layer 14. However, the metal layers are partially connected by a via hole or the like, not shown, so that the circuit is formed as a whole. The first insulating layer 14 may include a core base material made of an insulating resin material and having rigidity, or may include a prepreg having fluidity when heated in a manufacturing process.
Then, in the through-hole forming process, through-holes 15 are formed on the first partial substrate 10 in positions, sizes, and shapes corresponding to the electronic components 20 provided in the subsequent process. In the present embodiment, a case where the through hole 15 having a cylindrical shape is formed will be described. The relationship between the electronic component 20 and the through hole 15 will be described in detail later.
In addition, the first and second inner layer patterns 12 and 13 are not essential structural members in the present invention. The number of the second inner layer patterns 13 may be changed as appropriate according to the specification of the component built-in substrate 1. When the first inner layer pattern 12 and the second inner layer pattern 13 are formed, patterning is performed at a stage of preparing the first partial substrate 10. In the present embodiment, the inner surface of the through hole 15 of the first partial substrate 10 is plated with copper, but the plating is not essential.
Fig. 2 is a sectional view showing a metal sheet fixing step according to a first embodiment of the present invention. The metal sheet 16 is made of a metal having electrical and thermal conductivity, and is, for example, a copper block. That is, the metal sheet 16 is a heat transfer member called a so-called copper insert, copper coin, or copper pin.
In the metal piece fixing step, the metal piece 16 is fixed so as to fill the through hole 15 formed in the first partial substrate 10.
The metal sheet 16 can be fixed in the through-opening 15 of the first partial substrate 10 by, for example, a press-fit method or a rivet method. More specifically, the press-fitting method is as follows: the metal piece 16, which is slightly larger than the inner diameter of the through hole 15 and has the same height as the thickness of the first partial substrate 10, is pressed into the through hole 15 by using, for example, a press, and fixed so that the through hole 15 is filled with the metal piece 16. The riveting method is a method comprising: the metal piece 16 having a height slightly smaller than the inner diameter of the through hole 15 and larger than the thickness of the first partial substrate 10 is disposed in the through hole 15, and the metal piece 16 is pressed and deformed by, for example, a press machine, and fixed so that the through hole 15 is filled with the metal piece 16.
In the metal piece fixing step of the present embodiment, in both of the press-fitting method and the caulking method, since the metal piece 16 is fixed to the through hole 15 by the mutual stress with the inner surface of the through hole 15, it is not necessary to separately provide a material such as an adhesive or solder.
Next, a component mounting step of mounting the electronic component 20 incorporated in the component built-in substrate 1 on the first partial substrate 10 will be described. Fig. 3 is a sectional view showing a component mounting step according to a first embodiment of the present invention.
Here, the electronic component 20 according to the present embodiment is a plate-like member thinner than the thickness of the component-embedded substrate 1, and is, for example, a so-called Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) used in an inverter, a converter, or the like. Power MOSFETs have a higher switching speed and higher conversion efficiency than general MOSFETs, but are parts that handle a large current, and therefore have a problem in dealing with heat generation associated with operation.
In the electronic component 20 according to the present embodiment, the first surface 21 is provided with the first electrode terminal 22, and the second surface 23 on the opposite side of the first surface 21 is provided with the two second electrode terminals 24. More specifically, the first electrode terminal 22 constitutes the entire first face 21 of the electronic component 20 as the drain terminal of the power MOSFET. Further, the two second electrode terminals 24 constitute a part of the second surface 23 of the electronic component 20 to serve as a source terminal and a gate terminal of the power MOSFET, respectively. The number, arrangement, and shape of the electrode terminals of the electronic component 20 may be different depending on the type of the electronic component 20.
In the component mounting step, the electronic component 20 is mounted on the metal sheet 16 so that the metal sheet 16 contacts the first electrode terminal 22 on the other surface of the first partial substrate 10, that is, on the surface on which the first inner layer pattern 12 is formed.
Preferably, a conductive paste 30 made of a paste material such as a conductive adhesive or solder is applied to the contact surface between the first electrode terminal 22 of the electronic component 20 and the metal piece 16. Accordingly, even when a slight gap is locally present between the electronic component 20 and the metal piece 16, the gap can be filled with the conductive paste 30, and the electrical connection state between the first electrode terminal 22 and the metal piece 16 can be maintained well, and heat generated by the electronic component 20 can be efficiently transmitted to the metal piece 16.
At this time, the conductive paste 30 is not formed as a single layer for separating the electronic component 20 and the metal piece 16, but is used only for filling up a minute gap which may be locally generated between the electronic component 20 and the metal piece 16. Therefore, the conductive paste 30 is suppressed to a maximum width of 10 μm or less between the electronic component 20 and the metal piece 16. Therefore, even when the conductive paste 30 is made of, for example, solder (thermal conductivity of Sn as a main component: about 50W/m · K) having lower thermal conductivity than copper (thermal conductivity: about 400W/m · K), the influence of suppressing the thermal conduction from the electronic component 20 to the metal piece 16 can be minimized.
Since the metal sheet 16 constitutes a heat radiation path of the electronic component 20, the cross-sectional area of the heat radiation path is preferably large. The metal sheet 16 in the present embodiment is set to have a shape including its size so as to contact the entire first surface 21 of the electronic component 20. More specifically, the metal piece 16 of the present embodiment having a cylindrical shape is formed to have a size in the horizontal direction larger than the electronic component 20 together with the through hole 15 of the first partial substrate 10. That is, the positions, sizes, and shapes of the through hole 15 and the metal piece 16 are set such that the outline of the metal piece 16 surrounds the outline of the electronic component 20 when the component-incorporating substrate 1 is viewed in plan.
After the electronic component 20 is mounted on the first partial substrate 10, a component embedding step of forming a second partial substrate 40 so as to embed the electronic component 20 is performed. Fig. 4 is a sectional view showing a component embedding step according to the first embodiment of the present invention.
More specifically, in the component burying step, the electronic component 20 is buried through the second insulating layer 41, and the second conductive layer 42 is provided on the surface of the second insulating layer 41, thereby forming the second partial substrate 40. At this time, the second insulating layer 41 may be configured by lamination molding using a thermoplastic resin or a thermosetting resin. The second insulating layer 41 may be a prepreg containing glass cloth as a reinforcing material, may be a resin sheet containing no glass cloth, or may contain a circuit pattern, not shown, at a position avoiding the electronic component 20.
After the second insulating layer 41 is formed, a via hole forming process is performed to form the via hole 50 at the second electrode terminal 24 of the electronic component 20. Fig. 5 is a sectional view showing a via hole forming process according to the first embodiment of the present invention.
In the via hole forming step, a via hole 50 for conducting the second conductive layer 42 of the second partial substrate 40 to the second electrode terminal 24 of the electronic component 20 is formed. For example, the second electrode terminal 24 is drilled by laser processing from the position of the second conductive layer 42 directly above the second electrode terminal 24, and the hole is filled with copper plating, whereby the via hole 50 for conducting the second conductive layer 42 and the second electrode terminal 24 can be formed.
After the via hole 50 is formed, a patterning step of patterning the first conductive layer 11 of the first partial substrate 10 and the second conductive layer 42 of the second partial substrate 40 is performed. Fig. 6 is a cross-sectional view showing a patterning process according to the first embodiment of the present invention.
In the patterning step, in order to form outer layer circuits on both surfaces of the component-embedded substrate 1, the metal layer of the first conductive layer 11 and the second conductive layer 42 in a portion where no circuit is formed is removed by etching. Here, the patterned first conductive layer 11 and second conductive layer 42 may be covered with a solder resist at portions that need to be insulated.
Then, a surface mounting step of mounting the surface mount components 60 to 62 and the heat sink 70 is performed on the first conductive layer 11 and the second conductive layer 42 after the patterning step. Fig. 7 is a sectional view showing a surface mounting process according to the first embodiment of the present invention.
In the surface mounting step, a plurality of components provided on the outer layer circuit of the component-embedded substrate 1 are mounted on the first conductive layer 11 and the second conductive layer 42, respectively. In the present embodiment, the surface-mounted components 60 to 62 are illustrated as components in which the first electrode terminal 22 and the two second electrode terminals 24 of the electronic component 20 are electrically connected to each other.
The surface-mount members 60 to 62 may have various shapes depending on the type thereof, but in the present embodiment, they are each exemplified as a member having a shape of having both end portions of the electrode cover member main body. In the component built-in substrate 1 shown in fig. 7, the surface mount components 60 and 61 are mounted such that their electrodes are in contact with the via holes 50, and are mounted by a known reflow process using solder, for example. In the component-embedded substrate 1 shown in fig. 7, the surface-mounted component 62 is mounted on the circuit of the first conductive layer 11 electrically connected to the metal piece 16 by a known reflow process using solder in the same manner.
Further, a heat sink 70 is provided so as to cover the metal sheet 16 on the surface of the component-embedded substrate 1 on which the first conductive layer 11 is formed. The heat sink 70 may be mounted at a position of the surface of the first conductive layer 11 containing the metal sheet 16 by an adhesive having thermal conductivity. In this case, when the metal sheet 16 and the heat sink 70 need to be insulated from each other, an adhesive having insulating properties is used. Then, the component-embedded substrate 1 shown in fig. 7 is completed through the above-described series of manufacturing steps.
As described above, in the substrate with built-in component 1 according to the present invention, the first electrode terminal 22 and the second electrode terminal 24 provided on both surfaces of the built-in electronic component 20 are electrically connected to the first conductive layer 11 and the second conductive layer 42, which are the outer layer patterns of the substrate with built-in component 1, respectively, and thereby a conductive path is secured. At this time, although the conductive paths are formed on both surfaces of the electronic component 20, the heat dissipation path from the first surface 21 to the first conductive layer 11 via the metal piece 16 is also formed, and therefore, heat can be efficiently dissipated according to the cross-sectional area of the metal piece 16. Therefore, according to the component-embedded substrate 1 of the present invention, even when the electronic component 20 having the electrode terminals formed on both surfaces thereof is embedded, the heat dissipation characteristic can be improved.
Here, in the metal piece fixing step, if it is assumed that, when the metal piece 16 is fixed to the through hole 15 of the first partial substrate 10 by using solder, unless the melting start temperature of the solder or the like is appropriately set, the solder used in the other part of the component-equipped substrate 1 is melted by, for example, heating by reflow processing in the previous step and the subsequent step, and there is a possibility that the conductivity of the connection portion by the solder is lowered. In contrast, according to the component built-in substrate 1 of the present invention, the metal piece and the through hole are fixed by mutual stress using, for example, a press machine. Therefore, the component-embedded substrate 1 does not need to separately provide a material such as an adhesive or solder, and the metal piece 16 can be fixed to the through hole 15 without setting a melting start temperature of the solder or the like, while preventing an increase in cost and a decrease in electrical conductivity and thermal conductivity associated with the use of the material.
The metal sheet 16 of the component-embedded substrate 1 according to the present invention is shaped such that the entire first surface 21 of the electronic component 20 is in contact with the metal sheet 16. Therefore, the entire first surface 21 of the electronic component 20 is configured as a heat radiation path through the metal sheet 16, and heat can be efficiently radiated even to the electronic component 20 having a relatively large amount of heat generation. Further, according to the substrate with built-in component 1 of the present invention, even when the electronic component 20 which is easily affected by the warpage of the substrate with built-in component 1 due to the thinning is built in, the metal piece 16 can reinforce the bending stress and prevent cracks and the like of the electronic component 20, and the warpage of the substrate with built-in component is suppressed, so that the possibility of the via hole coming off can be reduced.
Further, in the component-embedded substrate 1 according to the present invention, by applying the conductive paste 30 to the contact surface between the first electrode terminal 22 and the metal piece 16 of the electronic component 20, the electrical connection state and the thermal connection state between the first electrode terminal 22 and the metal piece 16 can be maintained well.
In the substrate with built-in component 1 according to the present invention, the surface mount components 60 and 61 electrically connected to the second electrode terminal 24 of the electronic component 20 are mounted in contact with the via hole 50, and therefore the wiring length between the two is suppressed to only the height of the via hole 50, and the influence of wiring resistance and reactance components can be reduced, thereby improving the electrical performance.
< second embodiment >
Next, a second embodiment of the present invention will be explained. In the component built-in substrate 2 according to the second embodiment, the configuration of the first conductive layer 11 of the component built-in substrate 1 according to the first embodiment is different from that of the first embodiment. Hereinafter, the description will be given of portions different from those of the first embodiment, and the same reference numerals will be given to the components common to the first embodiment, and detailed description thereof will be omitted.
Fig. 8 is a cross-sectional view showing a component-incorporating substrate 2 according to a second embodiment of the present invention. The component built-in substrate 2 according to the second embodiment increases the thickness of the first conductive layer 11 by plating the surface of the first conductive layer 11 with copper before the patterning step (fig. 6) described in the first embodiment.
As a result, as shown by the dashed oval DE in fig. 8, in the component-embedded substrate 2, a part of the first conductive layer 11 is formed between the metal piece 16 and the heat sink 70, and the conductivity between the metal piece 16 and the first conductive layer 11 is improved. Thus, the conductive path from the electronic component 20 to the surface-mounted component 62 via the metal piece 16 and the first conductive layer 11 can ensure a sufficient cross-sectional area with good conductivity even if the electronic component 20 is a component that handles a relatively large current.
< third embodiment >
Next, a third embodiment of the present invention will be explained. The component built-in substrate 3 according to the third embodiment is different from the first embodiment in that a third partial substrate 80 is formed between the second partial substrate 40 and the surface-mounted components 60 and 61 of the component built-in substrate 1 according to the first embodiment. Hereinafter, the description will be given of portions different from those of the first embodiment, and the same reference numerals will be given to the components common to the first embodiment, and detailed description thereof will be omitted.
Fig. 9 is a cross-sectional view showing a component-embedded substrate 3 according to a third embodiment of the present invention. The component built-in substrate 3 according to the third embodiment is provided with the third partial substrate 80 at a timing between the patterning step (fig. 6) and the surface mounting step (fig. 7) described in the first embodiment.
By laminating the third insulating layer 81 and the third conductive layer 82 on the second conductive layer 42 of the second partial substrate 40, the third partial substrate 80 can be formed using the same material and process as those of the second partial substrate 40. Then, the surface mount components 60 and 61 are mounted using the third conductive layer 82 as an outer layer circuit of the component built-in substrate 3.
In this case, as shown in fig. 9, since the surface mount component 60 and the electronic component 20 can be arranged with a positional shift between them like the two via holes 50 for conducting the components, the degree of freedom of the circuit configuration including the arrangement of the surface mount component 60 can be improved. Further, by arranging the two via holes 50, which are used to electrically connect the surface mount component 61 and the electronic component 20, on a straight line while aligning their positions, the number of conductive layers can be increased by adding the third partial substrate 80, and the increase in the wiring length between the surface mount component 61 and the electronic component 20 can be minimized.
< fourth embodiment >
Next, a fourth embodiment of the present invention will be explained. In the component-embedded substrate 4 according to the fourth embodiment, the shapes of the electronic component 20 and the metal piece 16 of the component-embedded substrate 1 according to the first embodiment are different from those of the first embodiment. Hereinafter, the description will be given of portions different from those of the first embodiment, and the same reference numerals will be given to the components common to those of the first embodiment, and the detailed description thereof will be omitted.
Fig. 10 is a sectional view showing a component mounting step according to a fourth embodiment of the present invention. The electronic component 20 ' of the component-embedded substrate 4 according to the fourth embodiment is provided with the first electrode terminal 22 ' protruding from the surface of the first surface 21, and two second electrode terminals 24 ' protruding from the surface of the second surface 23.
The metal piece 16 ' according to the fourth embodiment has a recess 16a formed in a surface on which the electronic component 20 ' is provided, the recess being fitted to the first electrode terminal 22 '. The concave portion 16a is formed in the sheet metal fixing step. That is, for example, in the case of the press-fitting method, the metal piece 16 'having the recess 16a formed in advance is press-fitted into the through hole 15 of the first partial substrate 10 to form the metal piece 16', and in the case of the caulking method, the metal piece 16 'is press-fitted using a press tool having substantially the same shape as the first surface 21 of the electronic component 20'.
Here, when the electronic component 20 'is mounted on the metal sheet 16', the conductive paste 30 may be applied to the contact surface of the two in the same manner as in the component mounting step in the first embodiment.
Fig. 11 is a sectional view of a component-embedded substrate 4 according to a fourth embodiment of the present invention. As shown in fig. 11, even if the first electrode terminal 22 'of the electronic component 20' has a shape protruding from the first surface 21, by providing the metal piece 16 'with the concave portion 16a, the entire first surface 21 of the electronic component 20' comes into contact with the metal piece 16 'while including the first electrode terminal 22'. Therefore, according to the component-embedded substrate 4, the electrical conductivity and the thermal conductivity of the electronic component 20 'and the metal piece 16' can be maintained well.
Description of the reference numerals
1-part built-in substrate
10 first partial substrate
11 first conductive layer
15 through hole
16 sheet metal
20 electronic component
21 first side
22 first electrode terminal
23 second side
24 second electrode terminal
40 second partial substrate
41 second insulating layer
42 second conductive layer
50 via hole

Claims (10)

1. A component-built-in substrate, comprising:
a first partial substrate formed with a through-hole;
the metal sheet is fixed on the through hole;
an electronic component having a first surface provided with a first electrode terminal in contact with the metal piece and a second surface opposite to the first surface provided with a second electrode terminal; and
a second partial substrate including an insulating layer in which the electronic component is embedded.
2. The component built-in substrate according to claim 1, wherein the metal piece is fixed to the through hole by mutual stress with an inner side surface of the through hole.
3. The component built-in substrate according to claim 1 or 2, wherein the metal sheet has a shape contacting the entire first surface of the electronic component.
4. The component built-in substrate according to any one of claims 1 to 3, wherein a conductive paste is coated on a contact surface between the first electrode terminal of the electronic component and the metal sheet.
5. The component built-in substrate according to any one of claims 1 to 4, comprising a via hole penetrating the insulating layer and connected to the second electrode terminal of the electronic component, wherein a surface-mount component is mounted in contact with the via hole.
6. A method for manufacturing a substrate with a built-in component, the substrate having a built-in electronic component, the electronic component having a first electrode terminal on a first surface and a second electrode terminal on a second surface opposite to the first surface,
the manufacturing method comprises the following steps:
a through-hole forming step of forming a through-hole in a first partial substrate;
a metal piece fixing step of fixing a metal piece to the through hole;
a component mounting step of mounting the electronic component so that the metal piece is in contact with the first electrode terminal; and
and a component embedding step of forming a second partial substrate in which the electronic component is embedded through an insulating layer.
7. The method of manufacturing a substrate with a built-in component according to claim 6, wherein in the metal piece fixing step, the metal piece is fixed to the through hole by mutual stress between an inner surface of the through hole and the metal piece.
8. The method of manufacturing the substrate with a built-in component according to claim 6 or 7, wherein in the metal sheet fixing step, the metal sheet is shaped so that the entire first surface of the electronic component is in contact with the metal sheet.
9. The method of manufacturing the component built-in substrate according to any one of claims 6 to 8, wherein in the component providing step, a conductive paste is applied to a contact surface between the first electrode terminal of the electronic component and the metal sheet.
10. The method of manufacturing a component built-in substrate according to any one of claims 6 to 9, comprising a surface mounting process in which a via hole that penetrates the insulating layer and is connected to the second electrode terminal of the electronic component is formed, and a surface mount component is mounted so as to be in contact with the via hole.
CN201980097514.4A 2019-06-14 2019-06-14 Substrate with built-in component and method for manufacturing substrate with built-in component Pending CN114008769A (en)

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