WO2022009300A1 - Substrate with insulating heat dissipation block and method for producing same - Google Patents
Substrate with insulating heat dissipation block and method for producing same Download PDFInfo
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- WO2022009300A1 WO2022009300A1 PCT/JP2020/026533 JP2020026533W WO2022009300A1 WO 2022009300 A1 WO2022009300 A1 WO 2022009300A1 JP 2020026533 W JP2020026533 W JP 2020026533W WO 2022009300 A1 WO2022009300 A1 WO 2022009300A1
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- heat dissipation
- insulating
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- block
- electronic component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
Definitions
- the present invention relates to a substrate with an insulating heat radiating block having insulating and heat radiating properties, and a method for manufacturing the same.
- a component-embedded board containing heat-generating electronic components such as power devices is known. Further, such an electronic component may be mounted on the outside of the substrate by using solder reflow or the like (component mounting board). In order to release the heat generated from these electronic components that are heating elements, heat is dissipated on the substrate by various methods.
- the heat-dissipating resin material which is highly filled with a ceramic filler and has heat-dissipating properties, has insulation and heat-dissipating properties by itself, so that it is possible to secure insulation to the outside of the circuit of the substrate and further heat-dissipating properties. Therefore, it is useful in such a case (see, for example, Patent Document 1).
- the heat-dissipating resin material having the insulating property which is highly filled with the above-mentioned ceramic filler, is formed over the entire surface of the substrate. Since this heat-dissipating resin material is very hard, there is a problem in workability. In particular, the wear of the drill bit becomes remarkable due to the influence of the ceramic filler when forming the through hole, and when trying to form an appropriate through hole, the bit life must be set extremely short. Similarly, the same problem occurs in external router processing.
- the present invention takes into consideration the above-mentioned prior art, and can arrange a heat radiating body having necessary heat radiating characteristics according to a necessary place, and can also improve the processability of a substrate. It is an object of the present invention to provide a substrate with a block and a method for manufacturing the same.
- an insulating layer made of an insulating resin material, a conductive layer arranged on both sides of the insulating layer, a substrate main body composed of the conductive layer and the insulating layer, and the substrate.
- a heat-generating electronic component disposed on one surface or inside of the main body, a heat dissipation path thermally connected to the electronic component and extending toward the other surface of the substrate body, and the most of the heat dissipation path.
- Insulation having an insulating region defined by the outer edge and an outer edge outside the heat dissipation region and inside the edge of the board body and attached to the other surface of the board body.
- a substrate with an insulating heat radiating block which is characterized by having a sexual heat radiating block.
- the insulating heat dissipation block has an outer edge on the outer side of the outer edge of the electronic component.
- a method for manufacturing a substrate with an insulating heat radiating block which comprises a substrate main body manufacturing step and a mounting step of mounting the insulating block on the other surface of the board main body.
- the insulating heat dissipation block since the outer edge of the insulating heat dissipation block is formed outside the heat dissipation area and inside the edge of the substrate main body, the insulating heat dissipation block is arranged at a position corresponding to this for each electronic component. be able to. For this reason, since the insulating heat radiating block of the required shape is arranged at the required place, waste of resources can be saved, and the insulating heat radiating block is also processed when machining by forming a through hole or the like. It is no longer necessary and the workability of the substrate body is improved.
- the outer edge of the insulating heat dissipation block is formed outside the outer edge of the electronic component, the area where heat is generated can be reliably captured and the heat dissipation is improved.
- the insulating heat dissipation block in order to determine the thickness of the insulating heat dissipation block in consideration of the rated voltage of the electronic component, if the insulating heat dissipation block is arranged by changing the thickness for each electronic component, appropriate insulation and heat dissipation are provided. Can realize sex. Further, since the insulating heat dissipation block is mounted on the other surface of the board body, even if the heat dissipation characteristics of the insulating heat dissipation block prepared in the block preparation process are different from the heat dissipation characteristics required by the electronic components, it is easy to do so. Since it can be replaced, there is no need to review the structure of the board body.
- an insulating heat radiating block 5 having an insulating property is attached to the surface of a substrate main body 4 composed of an insulating layer 2 and a conductive layer 3.
- the insulating layer 2 is made of an insulating resin material, and is, for example, a prepreg which is an adhesive sheet semi-cured by impregnating a glass cloth as a reinforcing material with an uncured thermosetting resin.
- the conductive layer 3 is formed of a conductive material such as copper and is arranged on both sides of the insulating layer 2.
- the substrate main body 4 may be a multilayer board in which the insulating layer 2 and the conductive layer 3 are composed of a plurality of layers.
- the board body 4 has an electronic component 6.
- the electronic component 6 shows an example of a component built-in board arranged inside the substrate main body 4.
- the electronic component 6 is accompanied by heat generation, and includes, for example, passive components such as resistors, capacitors, and inductors, and active components such as ICs, LSIs, and power devices.
- the electronic component 6 may be a component mounting board mounted and mounted on one surface of the board body 4.
- the electronic component 6 is thermally connected to the heat dissipation path 7 in order to release the generated heat.
- the heat dissipation path 7 is formed of vias and extends from the electronic component 6 toward the other surface of the substrate body 4. As shown in FIG. 2, when a plurality of heat dissipation paths 7 are provided, the region defined by the outermost edges thereof is the heat dissipation region 8.
- the above-mentioned insulating heat dissipation block 5 is attached to the surface on the side where the heat dissipation path 7 extends with respect to the substrate main body 4, that is, the other surface. Specifically, vias forming a heat dissipation path 7 are thermally connected to the metal foil 12 formed on the surface of the electronic component 6, and a plurality of heat dissipation paths 7 are formed on the other surface of the substrate body 4. All of them are connected to the conductive portion 13 formed of a part of the conductive layer 3. The insulating heat dissipation block 5 is thermally connected to the conductive portion 13.
- a copper foil (or other metal foil) 10 is formed on the insulating heat dissipation block 5 by spattering, joining, or the like.
- the insulating heat radiating block 5 is mounted on the conductive portion 13 of the substrate main body 4 with solder 11 via the copper foil 10. If the copper foil 10 is provided in this way, the insulating heat dissipation block 5 can be mounted by a simple method of using the solder 11. Instead of the copper foil 10, copper plating, tin plating, or NiAu plating may be used. Even if the insulating heat dissipation block 5 is not provided with the copper foil 10, it may be adhered to the conductive portion 13 by using a conductive adhesive such as Ag paste.
- the outer edge of the insulating heat dissipation block 5 is located outside the heat dissipation area 8 and inside the edge of the substrate main body 4. That is, the insulating heat radiating block 5 is arranged corresponding to each electronic component 6.
- the heat dissipation block is made of a material that has insulating properties and also has heat dissipation properties.
- AIN aluminum nitride
- Si3N4 silicon nitride
- High heat dissipation prepreg material can also be used.
- the insulating heat radiating block 5 With this insulating heat radiating block 5, the insulating property to the outside of the substrate main body 4 can be ensured, and heat dissipation can be further realized.
- the insulating heat dissipation block 5 is not arranged at the position of the opening of the through hole 9 exposed on the surface of the substrate body 4 (the substrate body). 4 has a through hole 9, and the insulating heat dissipation block 5 is not arranged with respect to the opening of the through hole 9). This eliminates the need to process the insulating heat radiating block 5 when processing the through hole 9, and improves workability.
- through-hole plating is formed in the through-hole 9, and electrical connection is made between both sides of the substrate main body 4.
- the insulating heat radiating block 5 is located at a position corresponding to the outer edge of the insulating heat radiating block 5 for each electronic component 6. Can be arranged. For this reason, since the insulating heat radiating block 5 having the required shape is arranged at the required place, waste of resources can be eliminated, and the insulating heat radiating block 5 can be machined by forming a through hole 9 or the like. There is no need to process it, and the workability of the substrate body 4 is improved.
- the insulating heat radiating block 5 may have an outer edge outside the outer edge of the electronic component 6. That is, even when the heat dissipation region 8 defined by the outer edges of the plurality of heat dissipation paths 7 is inside the outer edge of the electronic component 6, the outer edge of the insulating heat dissipation block 5 is outside the outer edge of the electronic component 6.
- the heat-generating region 8 can be reliably captured regardless of the position of the heat-dissipating region 8, and the heat-dissipating property can be improved.
- the present invention can be applied to the substrate main body 4 having various structures by arranging the insulating heat radiating block 5 in the right place in the right material.
- it can be applied to a thick copper substrate as shown in FIG. 3 (mainly a conductive layer 3 having a thickness of 105 ⁇ m or more).
- the electronic component 6 is mounted on one surface of the substrate body 4 (connected to the conductive layer 3 by the lead wire 14), and the heat dissipation path 7 extends from the electronic component 6 to the opposite surface of the substrate body 4. It is a through-hole plating formed in the through-hole 9. It can also be applied to the thermal via thickening structure of a thick copper substrate as shown in FIG.
- the substrate body is provided with a through hole for heat dissipation provided on a package substrate such as BGA, and the through hole for heat dissipation is the heat dissipation path 7.
- the heat dissipation path 7 is the heat dissipation pin 15 and the metal film 16 formed around the heat dissipation pin 15. Therefore, the insulating heat dissipation block 5 has an outer edge thereof outside the outer edge of the metal film 16 including the heat dissipation pin 15.
- a solder resist 17 for insulation is arranged on the surface of the substrate main body 4. Further, as shown in FIG. 6, it can be applied to the substrate main body 4 in which the copper block 17 is built for heat dissipation.
- the copper block 17 and a plurality of vias 18 extending from the copper block 17 toward the other surface of the substrate body 4 (two vias 18 via the conductive layer 3 in the figure) serve as the heat dissipation path 7.
- the outer edge of the insulating heat dissipation block 5 is located outside the heat dissipation region 8 defined by the outer edge of the heat dissipation path 7 (located outside the outer edge of the electronic component 6). ..
- a block preparation step is performed (step S1).
- This step is a step of preparing an insulating heat radiating block 5 having a thickness having required heat radiating characteristics in consideration of the rated voltage of the electronic component 6.
- the substrate main body manufacturing process is performed (step S2).
- This step is a step of forming the substrate main body 4 including the electronic component 6. Whether the electronic component 6 is built in or mounted on the board body 4, the board body 4 is manufactured by a manufacturing process corresponding to the electronic component 6.
- the mounting step is performed (step S3).
- This step is a step of attaching the insulating block 5 to the other surface (radiation path 7 side) of the substrate main body 4.
- various electronic components 6 are arranged on the substrate main body 4, so that the thickness of the insulating heat dissipation block 5 is determined in consideration of the rated voltage of the electronic components 6, and each electronic component 6 is determined.
- Appropriate heat dissipation can be realized by arranging the insulating heat dissipation block 5 by changing the thickness.
- the present invention is characterized in that it can realize the insulating property required by the thickness of the insulating heat radiating block 5. It is known that the larger the thickness, the higher the insulation. It is also known that the heat dissipation is enhanced by increasing the contact area of the insulating heat dissipation block 5 with the substrate main body 4.
- the block preparation step it is preferable to consider not only the thickness of the insulating heat dissipation block 5 but also the heat dissipation due to the size of the contact area with the substrate main body 4.
- a plurality of insulating heat radiating blocks 5 having a thickness corresponding to each of the electronic components 6 are arranged on the substrate main body 4. Further, since the insulating heat dissipation block 5 is mounted on the other surface of the substrate main body 4, it is assumed that the heat dissipation characteristics of the insulating heat dissipation block 5 prepared in the block preparation step are different from the heat dissipation characteristics required by the electronic component 6. However, since it can be easily replaced, it is not necessary to review the structure of the substrate body 4. In this way, by preparing each block 5 in consideration of the thickness and contact area of the insulating heat radiating block 5, appropriate heat insulating property and heat radiating property can be realized, and in combination with this, depending on the location. The block 5 can be easily replaced.
- Substrate with insulating heat dissipation block 2 Insulation layer 3: Conductive layer 4: Board body 5: Insulation heat dissipation block, 6: Electronic components, 7: Heat dissipation path, 8: Heat dissipation area, 9: Through hole 10,: Copper foil, 11: Solder, 12: Metal foil, 13: Conductive part, 14: Lead wire, 15: Heat dissipation pin, 16: Metal film, 17: Copper block, 18: Via
Abstract
This substrate (1) with an insulating heat dissipation block is provided with: an insulating layer (2) that is formed of an insulating resin material; conductive layers (3) that are arranged on both surfaces of the insulating layer (2); a substrate main body (4) that is composed of the conductive layers (3) and the insulating layer (2); an electronic component (6) that is arranged on one surface of or within the substrate main body (4), said electronic component generating heat; a heat dissipation path (7) that is thermally connected with the electronic component (6) and extends toward the other surface of the substrate main body (4); a heat dissipation region (8) that is defined by the outermost edge of the heat dissipation path (7); and an insulating heat dissipation block (5) which has insulating properties and is fitted to the other surface of the substrate main body (4) so that the outer edge thereof is outside the heat dissipation region (8), while being inside the edge of the substrate main body (4).
Description
本発明は、絶縁性且つ放熱性を備えた絶縁性放熱ブロック付き基板及びその製造方法に関する。
The present invention relates to a substrate with an insulating heat radiating block having insulating and heat radiating properties, and a method for manufacturing the same.
パワーデバイス等の発熱する電子部品を内蔵した部品内蔵基板が知られている。また、このような電子部品は基板の外側にもはんだリフロー等を用いて実装されることもある（部品搭載基板）。これら発熱体たる電子部品から発された熱を放出するため、種々の方法で放熱が基板には図られている。特にセラミックフィラーが高充填された絶縁性を有する放熱樹脂材は、それ単体で絶縁性と放熱性を備えていることから、基板の回路外への絶縁性を確保でき、さらに放熱性も確保できるためこのような場合に有用である（例えば特許文献１参照）。
A component-embedded board containing heat-generating electronic components such as power devices is known. Further, such an electronic component may be mounted on the outside of the substrate by using solder reflow or the like (component mounting board). In order to release the heat generated from these electronic components that are heating elements, heat is dissipated on the substrate by various methods. In particular, the heat-dissipating resin material, which is highly filled with a ceramic filler and has heat-dissipating properties, has insulation and heat-dissipating properties by itself, so that it is possible to secure insulation to the outside of the circuit of the substrate and further heat-dissipating properties. Therefore, it is useful in such a case (see, for example, Patent Document 1).
しかしながら、上述したセラミックフィラーが高充填された絶縁性を有する放熱樹脂材は、基板の全面に亘って形成されている。この放熱樹脂材は非常に硬いため、加工性に問題がある。特に、スルーホール形成時にセラミックフィラーの影響でドリルビットの摩耗が顕著となり、適正なスルーホールを形成しようとすると、ビットライフが極端に短く設定しなければならない。同様に、外形ルーター加工でも同じ問題が発生する。また、発熱部品ごとに発熱度合いが異なるため、基板に複数の部品が配されている場合、最も高い放熱性を要求する特性に応じた厚みの放熱樹脂材を基板の全面に亘って形成する必要があった。これは、発熱があまり高くない領域にも必要以上の放熱樹脂材が配されていることになり、資源の無駄となっている。
However, the heat-dissipating resin material having the insulating property, which is highly filled with the above-mentioned ceramic filler, is formed over the entire surface of the substrate. Since this heat-dissipating resin material is very hard, there is a problem in workability. In particular, the wear of the drill bit becomes remarkable due to the influence of the ceramic filler when forming the through hole, and when trying to form an appropriate through hole, the bit life must be set extremely short. Similarly, the same problem occurs in external router processing. Further, since the degree of heat generation differs for each heat-generating component, when a plurality of components are arranged on the substrate, it is necessary to form a heat-dissipating resin material having a thickness corresponding to the characteristic requiring the highest heat dissipation over the entire surface of the substrate. was there. This means that more heat-dissipating resin material is arranged than necessary even in areas where heat generation is not so high, which is a waste of resources.
本発明は、上記従来技術を考慮したものであり、必要な箇所に応じて必要な放熱特性を有する放熱体を配することができ、基板の加工性も併せて向上させることができる絶縁性放熱ブロック付き基板及びその製造方法を提供することを目的とする。
INDUSTRIAL APPLICABILITY The present invention takes into consideration the above-mentioned prior art, and can arrange a heat radiating body having necessary heat radiating characteristics according to a necessary place, and can also improve the processability of a substrate. It is an object of the present invention to provide a substrate with a block and a method for manufacturing the same.
前記目的を達成するため、本発明では、絶縁樹脂材料からなる絶縁層と、該絶縁層の両面側に配されている導電層と、該導電層及び前記絶縁層からなる基板本体と、該基板本体の一方の表面又は内部に配設されている発熱を伴う電子部品と、該電子部品と熱的に接続されて前記基板本体の他方の表面に向けて延びる放熱経路と、該放熱経路の最も外側の縁にて規定される放熱領域と、該放熱領域よりも外側且つ前記基板本体の縁よりも内側に外縁を有して前記基板本体の他方の表面に取付けられている絶縁性を有する絶縁性放熱ブロックとを備えたことを特徴とする絶縁性放熱ブロック付き基板を提供する。
In order to achieve the above object, in the present invention, an insulating layer made of an insulating resin material, a conductive layer arranged on both sides of the insulating layer, a substrate main body composed of the conductive layer and the insulating layer, and the substrate. A heat-generating electronic component disposed on one surface or inside of the main body, a heat dissipation path thermally connected to the electronic component and extending toward the other surface of the substrate body, and the most of the heat dissipation path. Insulation having an insulating region defined by the outer edge and an outer edge outside the heat dissipation region and inside the edge of the board body and attached to the other surface of the board body. Provided is a substrate with an insulating heat radiating block, which is characterized by having a sexual heat radiating block.
好ましくは、前記絶縁性放熱ブロックは、前記電子部品の外縁よりも外側に外縁を有している。
Preferably, the insulating heat dissipation block has an outer edge on the outer side of the outer edge of the electronic component.
また、本発明では、前記電子部品の定格電圧を考慮して必要な絶縁且つ放熱特性を有する厚みの前記絶縁性放熱ブロックを準備するブロック準備工程と、前記電子部品を含む前記基板本体を形成する基板本体製造工程と、前記絶縁性ブロックを前記基板本体の他方の表面に取付ける取付け工程とを備えたことを特徴とする絶縁性放熱ブロック付き基板の製造方法を提供する。
Further, in the present invention, a block preparation step of preparing the insulating heat radiating block having a thickness having necessary insulation and heat dissipation characteristics in consideration of the rated voltage of the electronic component, and forming the substrate main body including the electronic component. Provided is a method for manufacturing a substrate with an insulating heat radiating block, which comprises a substrate main body manufacturing step and a mounting step of mounting the insulating block on the other surface of the board main body.
本発明によれば、絶縁性放熱ブロックの外縁が放熱領域よりも外側且つ基板本体の縁よりも内側に形成されているので、電子部品毎にこれに対応する位置に絶縁性放熱ブロックを配することができる。このため、必要な箇所に必要な形状の絶縁性放熱ブロックが配されるので、資源の無駄を省くことができ、スルーホールの形成等で機械加工する際にも絶縁性放熱ブロックもろとも加工する必要がなくなり、基板本体の加工性も向上する。
According to the present invention, since the outer edge of the insulating heat dissipation block is formed outside the heat dissipation area and inside the edge of the substrate main body, the insulating heat dissipation block is arranged at a position corresponding to this for each electronic component. be able to. For this reason, since the insulating heat radiating block of the required shape is arranged at the required place, waste of resources can be saved, and the insulating heat radiating block is also processed when machining by forming a through hole or the like. It is no longer necessary and the workability of the substrate body is improved.
また、絶縁性放熱ブロックの外縁が電子部品の外縁よりも外側に形成されることで、発熱する領域を確実に捉えることができ、放熱性が向上する。
In addition, since the outer edge of the insulating heat dissipation block is formed outside the outer edge of the electronic component, the area where heat is generated can be reliably captured and the heat dissipation is improved.
また、本発明によれば、電子部品の定格電圧を考慮して絶縁性放熱ブロックの厚みを決定するため、電子部品毎に厚みを変えて絶縁性放熱ブロックを配すれば適切な絶縁性且つ放熱性を実現できる。また、絶縁性放熱ブロックは基板本体の他方の表面に実装されるので、ブロック準備工程にて準備した絶縁性放熱ブロックの放熱特性が電子部品が要求する放熱特性と異なっていたとしても、容易に交換することができるので、基板本体の構造見直しが不要となる。
Further, according to the present invention, in order to determine the thickness of the insulating heat dissipation block in consideration of the rated voltage of the electronic component, if the insulating heat dissipation block is arranged by changing the thickness for each electronic component, appropriate insulation and heat dissipation are provided. Can realize sex. Further, since the insulating heat dissipation block is mounted on the other surface of the board body, even if the heat dissipation characteristics of the insulating heat dissipation block prepared in the block preparation process are different from the heat dissipation characteristics required by the electronic components, it is easy to do so. Since it can be replaced, there is no need to review the structure of the board body.
図１及び図２に示すように、本発明に係る絶縁性放熱ブロック付き基板１は、絶縁層２と導電層３とからなる基板本体４の表面に絶縁性を有する絶縁性放熱ブロック５が取付けられているものである。絶縁層２は絶縁樹脂材料からなり、例えば補強材のガラス布に未硬化の熱硬化性樹脂を含浸させて半硬化にした接着シートたるプリプレグである。一方で導電層３は銅などの導電材料で形成されて絶縁層２の両面側に配されている。なお、基板本体４は絶縁層２と導電層３とが複数層からなる多層板であってもよい。
As shown in FIGS. 1 and 2, in the substrate 1 with an insulating heat radiating block according to the present invention, an insulating heat radiating block 5 having an insulating property is attached to the surface of a substrate main body 4 composed of an insulating layer 2 and a conductive layer 3. It is what has been done. The insulating layer 2 is made of an insulating resin material, and is, for example, a prepreg which is an adhesive sheet semi-cured by impregnating a glass cloth as a reinforcing material with an uncured thermosetting resin. On the other hand, the conductive layer 3 is formed of a conductive material such as copper and is arranged on both sides of the insulating layer 2. The substrate main body 4 may be a multilayer board in which the insulating layer 2 and the conductive layer 3 are composed of a plurality of layers.
基板本体４は電子部品６を有している。図の例では、電子部品６は基板本体４の内部に配設されている部品内蔵基板の例を示している。電子部品６は発熱を伴うものであり、例えば抵抗、コンデンサ、インダクタ等の受動部品やＩＣ、ＬＳＩ、パワーデバイス等の能動部品を含む。なお、後述するように電子部品６は基板本体４の一方の表面に実装されて搭載されている部品搭載基板であってもよい。電子部品６は発熱した熱を逃がすため、放熱経路７と熱的に接続されている。図の例では放熱経路７はビアにて形成されていて、電子部品６から基板本体４の他方の表面に向けて延びている。図２に示すように、複数の放熱経路７を有する場合はこれらの最も外側の縁にて規定されている領域が放熱領域８となる。
The board body 4 has an electronic component 6. In the example of the figure, the electronic component 6 shows an example of a component built-in board arranged inside the substrate main body 4. The electronic component 6 is accompanied by heat generation, and includes, for example, passive components such as resistors, capacitors, and inductors, and active components such as ICs, LSIs, and power devices. As will be described later, the electronic component 6 may be a component mounting board mounted and mounted on one surface of the board body 4. The electronic component 6 is thermally connected to the heat dissipation path 7 in order to release the generated heat. In the example shown in the figure, the heat dissipation path 7 is formed of vias and extends from the electronic component 6 toward the other surface of the substrate body 4. As shown in FIG. 2, when a plurality of heat dissipation paths 7 are provided, the region defined by the outermost edges thereof is the heat dissipation region 8.
上述した絶縁性放熱ブロック５は、基板本体４に対して放熱経路７が延びている側の表面、すなわち他方の表面に対して取付けられている。具体的には、電子部品６の表面に形成された金属箔１２に対して放熱経路７を形成するビアが熱的に接続され、複数の放熱経路７は基板本体４の他方の表面に形成されている導電層３の一部からなる導電部１３に全て接続されている。この導電部１３に対して絶縁性放熱ブロック５は熱的に接続される。絶縁性放熱ブロック５には銅箔（若しくは他の金属箔）１０がスパッタや接合等で形成されている。そして、絶縁性放熱ブロック５はこの銅箔１０を介してはんだ１１にて基板本体４の導電部１３に実装されている。このように銅箔１０を設ければ、はんだ１１を用いるという簡便な方法で絶縁性放熱ブロック５を実装できる。銅箔１０の代わりに銅めっきや錫めっき、ＮｉＡｕめっきを用いてもよい。なお、絶縁性放熱ブロック５に銅箔１０を設けずとも、Ａｇペースト等の導電性接着剤を用いて導電部１３に接着してもよい。
The above-mentioned insulating heat dissipation block 5 is attached to the surface on the side where the heat dissipation path 7 extends with respect to the substrate main body 4, that is, the other surface. Specifically, vias forming a heat dissipation path 7 are thermally connected to the metal foil 12 formed on the surface of the electronic component 6, and a plurality of heat dissipation paths 7 are formed on the other surface of the substrate body 4. All of them are connected to the conductive portion 13 formed of a part of the conductive layer 3. The insulating heat dissipation block 5 is thermally connected to the conductive portion 13. A copper foil (or other metal foil) 10 is formed on the insulating heat dissipation block 5 by spattering, joining, or the like. The insulating heat radiating block 5 is mounted on the conductive portion 13 of the substrate main body 4 with solder 11 via the copper foil 10. If the copper foil 10 is provided in this way, the insulating heat dissipation block 5 can be mounted by a simple method of using the solder 11. Instead of the copper foil 10, copper plating, tin plating, or NiAu plating may be used. Even if the insulating heat dissipation block 5 is not provided with the copper foil 10, it may be adhered to the conductive portion 13 by using a conductive adhesive such as Ag paste.
図２を参照すれば明らかなように、この絶縁性放熱ブロック５の外縁は、放熱領域８よりも外側に位置し、基板本体４の縁よりも内側に位置している。すなわち、絶縁性放熱ブロック５は電子部品６毎に対応して配置されることになる。放熱ブロックは絶縁性を有しさらに放熱性も有している材料にて形成されている。例えばセラミックス材料であり、窒化アルミニウム（ＡＩＮ）：１８０Ｗ／ｍ・Ｋ、窒化ケイ素（Ｓｉ３Ｎ４）：８５Ｗ／ｍ・Ｋが利用できる。高放熱プリプレグ材も利用できる。この絶縁性放熱ブロック５により、基板本体４外への絶縁性を担保でき、さらに放熱も実現することができる。なお、絶縁性放熱ブロック５は基板本体４の全体を貫通するスルーホール９が形成されている場合、基板本体４の表面に露出するスルーホール９の開口の位置には配されていない（基板本体４はスルーホール９を有し、絶縁性放熱ブロック５はスルーホール９の開口に対して非配置）。これにより、スルーホール９の加工時に絶縁性放熱ブロック５を加工する必要がなくなり、加工性が向上する。図の例ではスルーホール９内にスルーホールめっきが形成されていて、基板本体４の両面間に電気的接続が施されている。
As is clear from FIG. 2, the outer edge of the insulating heat dissipation block 5 is located outside the heat dissipation area 8 and inside the edge of the substrate main body 4. That is, the insulating heat radiating block 5 is arranged corresponding to each electronic component 6. The heat dissipation block is made of a material that has insulating properties and also has heat dissipation properties. For example, as a ceramic material, aluminum nitride (AIN): 180 W / m · K and silicon nitride (Si3N4): 85 W / m · K can be used. High heat dissipation prepreg material can also be used. With this insulating heat radiating block 5, the insulating property to the outside of the substrate main body 4 can be ensured, and heat dissipation can be further realized. When the through hole 9 penetrating the entire substrate body 4 is formed, the insulating heat dissipation block 5 is not arranged at the position of the opening of the through hole 9 exposed on the surface of the substrate body 4 (the substrate body). 4 has a through hole 9, and the insulating heat dissipation block 5 is not arranged with respect to the opening of the through hole 9). This eliminates the need to process the insulating heat radiating block 5 when processing the through hole 9, and improves workability. In the example of the figure, through-hole plating is formed in the through-hole 9, and electrical connection is made between both sides of the substrate main body 4.
このように、絶縁性放熱ブロック５の外縁が放熱領域８よりも外側且つ基板本体４の縁よりも内側に形成されているので、電子部品６毎にこれに対応する位置に絶縁性放熱ブロック５を配することができる。このため、必要な箇所に必要な形状の絶縁性放熱ブロック５が配されるので、資源の無駄を省くことができ、スルーホール９の形成等で機械加工する際にも絶縁性放熱ブロック５もろとも加工する必要がなくなり、基板本体４の加工性も向上する。また、絶縁性放熱ブロック５の位置から、電子部品６が内蔵されている場合には基板本体４のどこに電子部品６が配されているかを予測できる。特に電子部品６からの発熱を効率よく放熱する方法としては様々考えられるが、本発明では放熱経路７の外縁で規定される放熱領域８に着目し、これを基に絶縁性放熱ブロック５の外縁を規定したことに特徴を有する。このような思想にて絶縁性放熱ブロック５を配することが、上記種々の効果を効率よく得ることに寄与している。
As described above, since the outer edge of the insulating heat radiating block 5 is formed outside the heat radiating region 8 and inside the edge of the substrate main body 4, the insulating heat radiating block 5 is located at a position corresponding to the outer edge of the insulating heat radiating block 5 for each electronic component 6. Can be arranged. For this reason, since the insulating heat radiating block 5 having the required shape is arranged at the required place, waste of resources can be eliminated, and the insulating heat radiating block 5 can be machined by forming a through hole 9 or the like. There is no need to process it, and the workability of the substrate body 4 is improved. Further, from the position of the insulating heat dissipation block 5, when the electronic component 6 is built in, it is possible to predict where the electronic component 6 is arranged in the substrate main body 4. In particular, various methods for efficiently dissipating heat generated from the electronic component 6 can be considered, but in the present invention, attention is paid to the heat dissipation region 8 defined by the outer edge of the heat dissipation path 7, and the outer edge of the insulating heat dissipation block 5 is based on this. It is characterized by the fact that it is specified. Arranging the insulating heat radiating block 5 based on such an idea contributes to efficiently obtaining the above-mentioned various effects.
ここで、絶縁性放熱ブロック５は、電子部品６の外縁よりも外側に外縁を有していてもよい。すなわち、複数の放熱経路７の外側の縁で規定される放熱領域８が電子部品６の外縁よりも内側にあった場合でも、絶縁性放熱ブロック５の外縁が電子部品６の外側よりも外側に位置することで、放熱領域８の位置に関係なく、発熱する領域を確実に捉えることができ、放熱性を向上させることができる。
Here, the insulating heat radiating block 5 may have an outer edge outside the outer edge of the electronic component 6. That is, even when the heat dissipation region 8 defined by the outer edges of the plurality of heat dissipation paths 7 is inside the outer edge of the electronic component 6, the outer edge of the insulating heat dissipation block 5 is outside the outer edge of the electronic component 6. By locating the heat-generating region 8, the heat-generating region can be reliably captured regardless of the position of the heat-dissipating region 8, and the heat-dissipating property can be improved.
上述したように、適材適所に絶縁性放熱ブロック５を配すれば、種々の構造の基板本体４に本発明は適用可能である。例えば、図３のような厚銅基板（主として導電層３として１０５μｍ以上の厚さをもつもの）にも適用できる。この例では電子部品６は基板本体４の一方の表面に搭載されていて（リード線１４にて導電層３に接続）、放熱経路７は電子部品６から基板本体４の反対側の表面に延びるスルーホール９に形成されたスルーホールめっきである。また、図４のような厚銅基板のサーマルビア厚付け構造にも適用可能である。この例では、ＢＧＡ等のパッケージ基板に設けた放熱用のスルーホールが設けられている基板本体であり、この放熱用のスルーホールが放熱経路７となっている。また、図５のように電子部品６が内蔵されていて、銅などの放熱ピン１５により放熱が図られている基板本体４にも適用可能である。この場合は、放熱経路７は放熱ピン１５及びこの放熱ピン１５の周囲に形成された金属膜１６となる。したがって、絶縁性放熱ブロック５は放熱ピン１５を含む金属膜１６の外縁よりも外側にその外縁を有する。この例では基板本体４の表面に絶縁のためのソルダレジスト１７が配されている。また、図６のように放熱のために銅ブロック１７が内蔵されている基板本体４にも適用可能である。この例では銅ブロック１７及びこの銅ブロックか１７から基板本体４の他方の表面に向かって延びる複数のビア１８（図では導電層３を介した２層のビア１８）が放熱経路７となる。いずれの例でも、絶縁性放熱ブロック５の外縁は放熱経路７の外側の縁で規定される放熱領域８よりも外側に位置している（電子部品６の外縁よりも外側に位置している）。
As described above, the present invention can be applied to the substrate main body 4 having various structures by arranging the insulating heat radiating block 5 in the right place in the right material. For example, it can be applied to a thick copper substrate as shown in FIG. 3 (mainly a conductive layer 3 having a thickness of 105 μm or more). In this example, the electronic component 6 is mounted on one surface of the substrate body 4 (connected to the conductive layer 3 by the lead wire 14), and the heat dissipation path 7 extends from the electronic component 6 to the opposite surface of the substrate body 4. It is a through-hole plating formed in the through-hole 9. It can also be applied to the thermal via thickening structure of a thick copper substrate as shown in FIG. In this example, the substrate body is provided with a through hole for heat dissipation provided on a package substrate such as BGA, and the through hole for heat dissipation is the heat dissipation path 7. Further, as shown in FIG. 5, it can be applied to a substrate main body 4 in which an electronic component 6 is built in and heat is dissipated by a heat dissipation pin 15 made of copper or the like. In this case, the heat dissipation path 7 is the heat dissipation pin 15 and the metal film 16 formed around the heat dissipation pin 15. Therefore, the insulating heat dissipation block 5 has an outer edge thereof outside the outer edge of the metal film 16 including the heat dissipation pin 15. In this example, a solder resist 17 for insulation is arranged on the surface of the substrate main body 4. Further, as shown in FIG. 6, it can be applied to the substrate main body 4 in which the copper block 17 is built for heat dissipation. In this example, the copper block 17 and a plurality of vias 18 extending from the copper block 17 toward the other surface of the substrate body 4 (two vias 18 via the conductive layer 3 in the figure) serve as the heat dissipation path 7. In each example, the outer edge of the insulating heat dissipation block 5 is located outside the heat dissipation region 8 defined by the outer edge of the heat dissipation path 7 (located outside the outer edge of the electronic component 6). ..
次に、本発明に係る絶縁性放熱ブロック付き基板１の製造方法を説明する。まず、ブロック準備工程を行う（ステップＳ１）。この工程は、電子部品６の定格電圧を考慮して必要な放熱特性を有する厚みの絶縁性放熱ブロック５を準備する工程である。次に、基板本体製造工程を行う（ステップＳ２）。この工程は、電子部品６を含む基板本体４を形成する工程である。電子部品６が基板本体４に対して内蔵であっても搭載であっても、それに応じた製造プロセスにより基板本体４が製造される。そして、取付け工程を行う（ステップＳ３）。この工程は、絶縁性ブロック５を基板本体４の他方の表面（放熱経路７側）に取付ける工程である。
Next, a method for manufacturing the substrate 1 with an insulating heat dissipation block according to the present invention will be described. First, a block preparation step is performed (step S1). This step is a step of preparing an insulating heat radiating block 5 having a thickness having required heat radiating characteristics in consideration of the rated voltage of the electronic component 6. Next, the substrate main body manufacturing process is performed (step S2). This step is a step of forming the substrate main body 4 including the electronic component 6. Whether the electronic component 6 is built in or mounted on the board body 4, the board body 4 is manufactured by a manufacturing process corresponding to the electronic component 6. Then, the mounting step is performed (step S3). This step is a step of attaching the insulating block 5 to the other surface (radiation path 7 side) of the substrate main body 4.
このような製造工程によれば、基板本体４には種々の電子部品６が配されるので、電子部品６の定格電圧を考慮して絶縁性放熱ブロック５の厚みを決定し、電子部品６毎に厚みを変えて絶縁性放熱ブロック５を配すれば適切な放熱を実現できる。本発明は、この絶縁性放熱ブロック５の厚みによって求める絶縁性を実現できることに着目した点に特徴がある。厚みが大きければ絶縁性は高まることが分かっている。なお、絶縁性放熱ブロック５の基板本体４との接触面積を大きくすれば放熱性が高まることも分かっている。したがって、ブロック準備工程にて、絶縁性放熱ブロック５の厚みだけでなく、基板本体４との接触面積の大きさによる放熱性も考慮することが好ましい。電子部品６毎にそれに応じた厚みの絶縁性放熱ブロック５が基板本体４には複数配されることになる。また、絶縁性放熱ブロック５は基板本体４の他方の表面に実装されるので、ブロック準備工程にて準備した絶縁性放熱ブロック５の放熱特性が電子部品６が要求する放熱特性と異なっていたとしても、容易に交換することができるので、基板本体４の構造見直しが不要となる。このように、絶縁性放熱ブロック５の厚みや接触面積を考慮して各ブロック５を準備することで、適切な絶縁性及び放熱性を実現できるとともに、これと相俟ってその場所に応じたブロック５の交換も容易となる。
According to such a manufacturing process, various electronic components 6 are arranged on the substrate main body 4, so that the thickness of the insulating heat dissipation block 5 is determined in consideration of the rated voltage of the electronic components 6, and each electronic component 6 is determined. Appropriate heat dissipation can be realized by arranging the insulating heat dissipation block 5 by changing the thickness. The present invention is characterized in that it can realize the insulating property required by the thickness of the insulating heat radiating block 5. It is known that the larger the thickness, the higher the insulation. It is also known that the heat dissipation is enhanced by increasing the contact area of the insulating heat dissipation block 5 with the substrate main body 4. Therefore, in the block preparation step, it is preferable to consider not only the thickness of the insulating heat dissipation block 5 but also the heat dissipation due to the size of the contact area with the substrate main body 4. A plurality of insulating heat radiating blocks 5 having a thickness corresponding to each of the electronic components 6 are arranged on the substrate main body 4. Further, since the insulating heat dissipation block 5 is mounted on the other surface of the substrate main body 4, it is assumed that the heat dissipation characteristics of the insulating heat dissipation block 5 prepared in the block preparation step are different from the heat dissipation characteristics required by the electronic component 6. However, since it can be easily replaced, it is not necessary to review the structure of the substrate body 4. In this way, by preparing each block 5 in consideration of the thickness and contact area of the insulating heat radiating block 5, appropriate heat insulating property and heat radiating property can be realized, and in combination with this, depending on the location. The block 5 can be easily replaced.
１：絶縁性放熱ブロック付き基板、２：絶縁層、３：導電層、４：基板本体、５：絶縁性放熱ブロック、６：電子部品、７：放熱経路、８：放熱領域、９：スルーホール、１０：銅箔、１１：はんだ、１２：金属箔、１３：導電部、１４：リード線、１５：放熱ピン、１６：金属膜、１７：銅ブロック、１８：ビア
1: Substrate with insulating heat dissipation block 2: Insulation layer 3: Conductive layer 4: Board body 5: Insulation heat dissipation block, 6: Electronic components, 7: Heat dissipation path, 8: Heat dissipation area, 9: Through hole 10,: Copper foil, 11: Solder, 12: Metal foil, 13: Conductive part, 14: Lead wire, 15: Heat dissipation pin, 16: Metal film, 17: Copper block, 18: Via
Claims (3)
- 絶縁樹脂材料からなる絶縁層と、
該絶縁層の両面側に配されている導電層と、
該導電層及び前記絶縁層からなる基板本体と、
該基板本体の一方の表面又は内部に配設されている発熱を伴う電子部品と、
該電子部品と熱的に接続されて前記基板本体の他方の表面に向けて延びる放熱経路と、
該放熱経路の最も外側の縁にて規定される放熱領域と、
該放熱領域よりも外側且つ前記基板本体の縁よりも内側に外縁を有して前記基板本体の他方の表面に取付けられている絶縁性を有する絶縁性放熱ブロックとを備えたことを特徴とする絶縁性放熱ブロック付き基板。 An insulating layer made of an insulating resin material and
The conductive layers arranged on both sides of the insulating layer and
A substrate body composed of the conductive layer and the insulating layer,
Electronic components with heat generated on one surface or inside of the substrate body,
A heat dissipation path that is thermally connected to the electronic component and extends toward the other surface of the substrate body.
The heat dissipation area defined by the outermost edge of the heat dissipation path,
It is characterized by having an insulating heat radiating block having an outer edge outside the heat radiating region and inside the rim of the board body and having an insulating property attached to the other surface of the board body. Board with insulating heat dissipation block. - 前記絶縁性放熱ブロックは、前記電子部品の外縁よりも外側に外縁を有していることを特徴とする請求項１に記載の絶縁性放熱ブロック付き基板。 The substrate with an insulating heat radiating block according to claim 1, wherein the insulating heat radiating block has an outer edge outside the outer edge of the electronic component.
- 請求項１に記載の絶縁性放熱ブロック付き基板の製造方法であって、
前記電子部品の定格電圧を考慮して必要な絶縁且つ放熱特性を有する厚みの前記絶縁性放熱ブロックを準備するブロック準備工程と、
前記電子部品を含む前記基板本体を形成する基板本体製造工程と、
前記絶縁性ブロックを前記基板本体の他方の表面に取付ける取付け工程とを備えたことを特徴とする絶縁性放熱ブロック付き基板の製造方法。 The method for manufacturing a substrate with an insulating heat dissipation block according to claim 1.
A block preparation step for preparing the insulating heat dissipation block having a thickness having necessary insulation and heat dissipation characteristics in consideration of the rated voltage of the electronic component, and
A substrate body manufacturing process for forming the board body including the electronic components,
A method for manufacturing a substrate with an insulating heat dissipation block, which comprises a mounting step of mounting the insulating block on the other surface of the board body.
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| JP2016207743A (en) * | 2015-04-17 | 2016-12-08 | 新光電気工業株式会社 | Wiring board and manufacturing method therefor, and semiconductor device |
| JP2019029395A (en) * | 2017-07-26 | 2019-02-21 | 日本シイエムケイ株式会社 | Printed wiring board and manufacturing method of the same |
| JP6716045B1 (en) * | 2019-06-14 | 2020-07-01 | 株式会社メイコー | Component-embedded substrate and method for manufacturing component-embedded substrate |
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