WO2022009300A1 - Substrat doté d'un bloc de dissipation de chaleur isolant et procédé de production correspondant - Google Patents

Substrat doté d'un bloc de dissipation de chaleur isolant et procédé de production correspondant Download PDF

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Publication number
WO2022009300A1
WO2022009300A1 PCT/JP2020/026533 JP2020026533W WO2022009300A1 WO 2022009300 A1 WO2022009300 A1 WO 2022009300A1 JP 2020026533 W JP2020026533 W JP 2020026533W WO 2022009300 A1 WO2022009300 A1 WO 2022009300A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
insulating
substrate
block
electronic component
Prior art date
Application number
PCT/JP2020/026533
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English (en)
Japanese (ja)
Inventor
徹 松本
Original Assignee
株式会社メイコー
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Publication date
Application filed by 株式会社メイコー filed Critical 株式会社メイコー
Priority to PCT/JP2020/026533 priority Critical patent/WO2022009300A1/fr
Publication of WO2022009300A1 publication Critical patent/WO2022009300A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks

Definitions

  • the present invention relates to a substrate with an insulating heat radiating block having insulating and heat radiating properties, and a method for manufacturing the same.
  • a component-embedded board containing heat-generating electronic components such as power devices is known. Further, such an electronic component may be mounted on the outside of the substrate by using solder reflow or the like (component mounting board). In order to release the heat generated from these electronic components that are heating elements, heat is dissipated on the substrate by various methods.
  • the heat-dissipating resin material which is highly filled with a ceramic filler and has heat-dissipating properties, has insulation and heat-dissipating properties by itself, so that it is possible to secure insulation to the outside of the circuit of the substrate and further heat-dissipating properties. Therefore, it is useful in such a case (see, for example, Patent Document 1).
  • the heat-dissipating resin material having the insulating property which is highly filled with the above-mentioned ceramic filler, is formed over the entire surface of the substrate. Since this heat-dissipating resin material is very hard, there is a problem in workability. In particular, the wear of the drill bit becomes remarkable due to the influence of the ceramic filler when forming the through hole, and when trying to form an appropriate through hole, the bit life must be set extremely short. Similarly, the same problem occurs in external router processing.
  • the present invention takes into consideration the above-mentioned prior art, and can arrange a heat radiating body having necessary heat radiating characteristics according to a necessary place, and can also improve the processability of a substrate. It is an object of the present invention to provide a substrate with a block and a method for manufacturing the same.
  • an insulating layer made of an insulating resin material, a conductive layer arranged on both sides of the insulating layer, a substrate main body composed of the conductive layer and the insulating layer, and the substrate.
  • a heat-generating electronic component disposed on one surface or inside of the main body, a heat dissipation path thermally connected to the electronic component and extending toward the other surface of the substrate body, and the most of the heat dissipation path.
  • Insulation having an insulating region defined by the outer edge and an outer edge outside the heat dissipation region and inside the edge of the board body and attached to the other surface of the board body.
  • a substrate with an insulating heat radiating block which is characterized by having a sexual heat radiating block.
  • the insulating heat dissipation block has an outer edge on the outer side of the outer edge of the electronic component.
  • a method for manufacturing a substrate with an insulating heat radiating block which comprises a substrate main body manufacturing step and a mounting step of mounting the insulating block on the other surface of the board main body.
  • the insulating heat dissipation block since the outer edge of the insulating heat dissipation block is formed outside the heat dissipation area and inside the edge of the substrate main body, the insulating heat dissipation block is arranged at a position corresponding to this for each electronic component. be able to. For this reason, since the insulating heat radiating block of the required shape is arranged at the required place, waste of resources can be saved, and the insulating heat radiating block is also processed when machining by forming a through hole or the like. It is no longer necessary and the workability of the substrate body is improved.
  • the outer edge of the insulating heat dissipation block is formed outside the outer edge of the electronic component, the area where heat is generated can be reliably captured and the heat dissipation is improved.
  • the insulating heat dissipation block in order to determine the thickness of the insulating heat dissipation block in consideration of the rated voltage of the electronic component, if the insulating heat dissipation block is arranged by changing the thickness for each electronic component, appropriate insulation and heat dissipation are provided. Can realize sex. Further, since the insulating heat dissipation block is mounted on the other surface of the board body, even if the heat dissipation characteristics of the insulating heat dissipation block prepared in the block preparation process are different from the heat dissipation characteristics required by the electronic components, it is easy to do so. Since it can be replaced, there is no need to review the structure of the board body.
  • an insulating heat radiating block 5 having an insulating property is attached to the surface of a substrate main body 4 composed of an insulating layer 2 and a conductive layer 3.
  • the insulating layer 2 is made of an insulating resin material, and is, for example, a prepreg which is an adhesive sheet semi-cured by impregnating a glass cloth as a reinforcing material with an uncured thermosetting resin.
  • the conductive layer 3 is formed of a conductive material such as copper and is arranged on both sides of the insulating layer 2.
  • the substrate main body 4 may be a multilayer board in which the insulating layer 2 and the conductive layer 3 are composed of a plurality of layers.
  • the board body 4 has an electronic component 6.
  • the electronic component 6 shows an example of a component built-in board arranged inside the substrate main body 4.
  • the electronic component 6 is accompanied by heat generation, and includes, for example, passive components such as resistors, capacitors, and inductors, and active components such as ICs, LSIs, and power devices.
  • the electronic component 6 may be a component mounting board mounted and mounted on one surface of the board body 4.
  • the electronic component 6 is thermally connected to the heat dissipation path 7 in order to release the generated heat.
  • the heat dissipation path 7 is formed of vias and extends from the electronic component 6 toward the other surface of the substrate body 4. As shown in FIG. 2, when a plurality of heat dissipation paths 7 are provided, the region defined by the outermost edges thereof is the heat dissipation region 8.
  • the above-mentioned insulating heat dissipation block 5 is attached to the surface on the side where the heat dissipation path 7 extends with respect to the substrate main body 4, that is, the other surface. Specifically, vias forming a heat dissipation path 7 are thermally connected to the metal foil 12 formed on the surface of the electronic component 6, and a plurality of heat dissipation paths 7 are formed on the other surface of the substrate body 4. All of them are connected to the conductive portion 13 formed of a part of the conductive layer 3. The insulating heat dissipation block 5 is thermally connected to the conductive portion 13.
  • a copper foil (or other metal foil) 10 is formed on the insulating heat dissipation block 5 by spattering, joining, or the like.
  • the insulating heat radiating block 5 is mounted on the conductive portion 13 of the substrate main body 4 with solder 11 via the copper foil 10. If the copper foil 10 is provided in this way, the insulating heat dissipation block 5 can be mounted by a simple method of using the solder 11. Instead of the copper foil 10, copper plating, tin plating, or NiAu plating may be used. Even if the insulating heat dissipation block 5 is not provided with the copper foil 10, it may be adhered to the conductive portion 13 by using a conductive adhesive such as Ag paste.
  • the outer edge of the insulating heat dissipation block 5 is located outside the heat dissipation area 8 and inside the edge of the substrate main body 4. That is, the insulating heat radiating block 5 is arranged corresponding to each electronic component 6.
  • the heat dissipation block is made of a material that has insulating properties and also has heat dissipation properties.
  • AIN aluminum nitride
  • Si3N4 silicon nitride
  • High heat dissipation prepreg material can also be used.
  • the insulating heat radiating block 5 With this insulating heat radiating block 5, the insulating property to the outside of the substrate main body 4 can be ensured, and heat dissipation can be further realized.
  • the insulating heat dissipation block 5 is not arranged at the position of the opening of the through hole 9 exposed on the surface of the substrate body 4 (the substrate body). 4 has a through hole 9, and the insulating heat dissipation block 5 is not arranged with respect to the opening of the through hole 9). This eliminates the need to process the insulating heat radiating block 5 when processing the through hole 9, and improves workability.
  • through-hole plating is formed in the through-hole 9, and electrical connection is made between both sides of the substrate main body 4.
  • the insulating heat radiating block 5 is located at a position corresponding to the outer edge of the insulating heat radiating block 5 for each electronic component 6. Can be arranged. For this reason, since the insulating heat radiating block 5 having the required shape is arranged at the required place, waste of resources can be eliminated, and the insulating heat radiating block 5 can be machined by forming a through hole 9 or the like. There is no need to process it, and the workability of the substrate body 4 is improved.
  • the insulating heat radiating block 5 may have an outer edge outside the outer edge of the electronic component 6. That is, even when the heat dissipation region 8 defined by the outer edges of the plurality of heat dissipation paths 7 is inside the outer edge of the electronic component 6, the outer edge of the insulating heat dissipation block 5 is outside the outer edge of the electronic component 6.
  • the heat-generating region 8 can be reliably captured regardless of the position of the heat-dissipating region 8, and the heat-dissipating property can be improved.
  • the present invention can be applied to the substrate main body 4 having various structures by arranging the insulating heat radiating block 5 in the right place in the right material.
  • it can be applied to a thick copper substrate as shown in FIG. 3 (mainly a conductive layer 3 having a thickness of 105 ⁇ m or more).
  • the electronic component 6 is mounted on one surface of the substrate body 4 (connected to the conductive layer 3 by the lead wire 14), and the heat dissipation path 7 extends from the electronic component 6 to the opposite surface of the substrate body 4. It is a through-hole plating formed in the through-hole 9. It can also be applied to the thermal via thickening structure of a thick copper substrate as shown in FIG.
  • the substrate body is provided with a through hole for heat dissipation provided on a package substrate such as BGA, and the through hole for heat dissipation is the heat dissipation path 7.
  • the heat dissipation path 7 is the heat dissipation pin 15 and the metal film 16 formed around the heat dissipation pin 15. Therefore, the insulating heat dissipation block 5 has an outer edge thereof outside the outer edge of the metal film 16 including the heat dissipation pin 15.
  • a solder resist 17 for insulation is arranged on the surface of the substrate main body 4. Further, as shown in FIG. 6, it can be applied to the substrate main body 4 in which the copper block 17 is built for heat dissipation.
  • the copper block 17 and a plurality of vias 18 extending from the copper block 17 toward the other surface of the substrate body 4 (two vias 18 via the conductive layer 3 in the figure) serve as the heat dissipation path 7.
  • the outer edge of the insulating heat dissipation block 5 is located outside the heat dissipation region 8 defined by the outer edge of the heat dissipation path 7 (located outside the outer edge of the electronic component 6). ..
  • a block preparation step is performed (step S1).
  • This step is a step of preparing an insulating heat radiating block 5 having a thickness having required heat radiating characteristics in consideration of the rated voltage of the electronic component 6.
  • the substrate main body manufacturing process is performed (step S2).
  • This step is a step of forming the substrate main body 4 including the electronic component 6. Whether the electronic component 6 is built in or mounted on the board body 4, the board body 4 is manufactured by a manufacturing process corresponding to the electronic component 6.
  • the mounting step is performed (step S3).
  • This step is a step of attaching the insulating block 5 to the other surface (radiation path 7 side) of the substrate main body 4.
  • various electronic components 6 are arranged on the substrate main body 4, so that the thickness of the insulating heat dissipation block 5 is determined in consideration of the rated voltage of the electronic components 6, and each electronic component 6 is determined.
  • Appropriate heat dissipation can be realized by arranging the insulating heat dissipation block 5 by changing the thickness.
  • the present invention is characterized in that it can realize the insulating property required by the thickness of the insulating heat radiating block 5. It is known that the larger the thickness, the higher the insulation. It is also known that the heat dissipation is enhanced by increasing the contact area of the insulating heat dissipation block 5 with the substrate main body 4.
  • the block preparation step it is preferable to consider not only the thickness of the insulating heat dissipation block 5 but also the heat dissipation due to the size of the contact area with the substrate main body 4.
  • a plurality of insulating heat radiating blocks 5 having a thickness corresponding to each of the electronic components 6 are arranged on the substrate main body 4. Further, since the insulating heat dissipation block 5 is mounted on the other surface of the substrate main body 4, it is assumed that the heat dissipation characteristics of the insulating heat dissipation block 5 prepared in the block preparation step are different from the heat dissipation characteristics required by the electronic component 6. However, since it can be easily replaced, it is not necessary to review the structure of the substrate body 4. In this way, by preparing each block 5 in consideration of the thickness and contact area of the insulating heat radiating block 5, appropriate heat insulating property and heat radiating property can be realized, and in combination with this, depending on the location. The block 5 can be easily replaced.
  • Substrate with insulating heat dissipation block 2 Insulation layer 3: Conductive layer 4: Board body 5: Insulation heat dissipation block, 6: Electronic components, 7: Heat dissipation path, 8: Heat dissipation area, 9: Through hole 10,: Copper foil, 11: Solder, 12: Metal foil, 13: Conductive part, 14: Lead wire, 15: Heat dissipation pin, 16: Metal film, 17: Copper block, 18: Via

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un substrat (1) doté d'un bloc de dissipation de chaleur isolant, ledit substrat comprenant : une couche isolante (2) formée d'un matériau de résine isolante ; des couches conductrices (3) disposées sur les deux surfaces de la couche isolante (2) ; un corps principal de substrat (4) composé des couches conductrices (3) et de la couche isolante (2) ; un composant électronique (6) disposé sur une surface du corps principal de substrat (4) ou à l'intérieur de ce dernier, ledit composant électronique générant de la chaleur ; un trajet de dissipation de chaleur (7) thermiquement connecté au composant électronique (6) et s'étendant vers l'autre surface du corps principal de substrat (4) ; une région de dissipation de chaleur (8) définie par le bord le plus à l'extérieur du trajet de dissipation de chaleur (7) ; et un bloc de dissipation de chaleur isolant (5) présentant des propriétés isolantes et adapté à l'autre surface du corps principal de substrat (4) de sorte que son bord extérieur se trouve à l'extérieur de la région de dissipation de chaleur (8), tout en se trouvant à l'intérieur du bord du corps principal de substrat (4).
PCT/JP2020/026533 2020-07-07 2020-07-07 Substrat doté d'un bloc de dissipation de chaleur isolant et procédé de production correspondant WO2022009300A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/026533 WO2022009300A1 (fr) 2020-07-07 2020-07-07 Substrat doté d'un bloc de dissipation de chaleur isolant et procédé de production correspondant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/026533 WO2022009300A1 (fr) 2020-07-07 2020-07-07 Substrat doté d'un bloc de dissipation de chaleur isolant et procédé de production correspondant

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WO2022009300A1 true WO2022009300A1 (fr) 2022-01-13

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0955459A (ja) * 1995-06-06 1997-02-25 Seiko Epson Corp 半導体装置
JP2000340896A (ja) * 1999-05-27 2000-12-08 Kyocera Corp 配線基板モジュール
JP2016207743A (ja) * 2015-04-17 2016-12-08 新光電気工業株式会社 配線基板及びその製造方法、半導体装置
JP2019029395A (ja) * 2017-07-26 2019-02-21 日本シイエムケイ株式会社 プリント配線板とその製造方法
JP6716045B1 (ja) * 2019-06-14 2020-07-01 株式会社メイコー 部品内蔵基板、及び部品内蔵基板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0955459A (ja) * 1995-06-06 1997-02-25 Seiko Epson Corp 半導体装置
JP2000340896A (ja) * 1999-05-27 2000-12-08 Kyocera Corp 配線基板モジュール
JP2016207743A (ja) * 2015-04-17 2016-12-08 新光電気工業株式会社 配線基板及びその製造方法、半導体装置
JP2019029395A (ja) * 2017-07-26 2019-02-21 日本シイエムケイ株式会社 プリント配線板とその製造方法
JP6716045B1 (ja) * 2019-06-14 2020-07-01 株式会社メイコー 部品内蔵基板、及び部品内蔵基板の製造方法

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