CN108650780A - 一种柔性印刷电路板 - Google Patents
一种柔性印刷电路板 Download PDFInfo
- Publication number
- CN108650780A CN108650780A CN201810499298.3A CN201810499298A CN108650780A CN 108650780 A CN108650780 A CN 108650780A CN 201810499298 A CN201810499298 A CN 201810499298A CN 108650780 A CN108650780 A CN 108650780A
- Authority
- CN
- China
- Prior art keywords
- substrate plate
- soft substrate
- circuit board
- printed circuit
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
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- 238000004804 winding Methods 0.000 claims abstract description 5
- 230000001788 irregular Effects 0.000 claims abstract description 4
- 239000010408 film Substances 0.000 claims description 25
- 238000005553 drilling Methods 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 238000004080 punching Methods 0.000 claims description 11
- 238000007639 printing Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 6
- 238000011161 development Methods 0.000 claims description 6
- 229920006267 polyester film Polymers 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 239000013039 cover film Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims description 4
- IDGUHHHQCWSQLU-UHFFFAOYSA-N ethanol;hydrate Chemical compound O.CCO IDGUHHHQCWSQLU-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000009958 sewing Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 210000004243 sweat Anatomy 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims 1
- 235000019441 ethanol Nutrition 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
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- 238000000034 method Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
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- 239000011889 copper foil Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
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- 239000011230 binding agent Substances 0.000 description 1
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- 238000010008 shearing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810499298.3A CN108650780B (zh) | 2018-05-23 | 2018-05-23 | 一种柔性印刷电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810499298.3A CN108650780B (zh) | 2018-05-23 | 2018-05-23 | 一种柔性印刷电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108650780A true CN108650780A (zh) | 2018-10-12 |
CN108650780B CN108650780B (zh) | 2019-07-16 |
Family
ID=63757704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810499298.3A Active CN108650780B (zh) | 2018-05-23 | 2018-05-23 | 一种柔性印刷电路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108650780B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111163583A (zh) * | 2020-02-17 | 2020-05-15 | 文柏新 | 一种柔性印刷电路板 |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04196596A (ja) * | 1990-11-28 | 1992-07-16 | Kitagawa Ind Co Ltd | 導電線内蔵筐体 |
KR100260347B1 (ko) * | 1992-06-05 | 2000-07-01 | 나까니시 히로유끼 | 입체인쇄기판, 이것을 사용한 전자회로패키지 및 인쇄기판의 제조방법 |
US6118665A (en) * | 1997-03-19 | 2000-09-12 | Fujitsu Limited | Flexible printed circuit and connected printed circuit structure |
CN101237743A (zh) * | 2007-01-31 | 2008-08-06 | 日东电工株式会社 | 柔性布线电路基板的连接结构以及电子设备 |
CN101466195A (zh) * | 2007-12-18 | 2009-06-24 | 三星电机株式会社 | 柔性印刷电路板及其制造方法 |
CN102687598A (zh) * | 2009-12-24 | 2012-09-19 | 日本梅克特隆株式会社 | 柔性电路基板及其制造方法 |
CN102870504A (zh) * | 2010-04-19 | 2013-01-09 | 日本梅克特隆株式会社 | 柔性电路基板及其制造方法 |
CN103607845A (zh) * | 2013-10-21 | 2014-02-26 | 溧阳市东大技术转移中心有限公司 | 一种柔性印刷电路板的制造方法 |
CN104865719A (zh) * | 2014-02-24 | 2015-08-26 | 三星电子株式会社 | 显示装置 |
CN104902670A (zh) * | 2014-03-03 | 2015-09-09 | 易鼎股份有限公司 | 可拉伸的软性电路板 |
CN205902196U (zh) * | 2016-08-19 | 2017-01-18 | 河源西普电子有限公司 | 一种柔性印刷电路板 |
CN106686879A (zh) * | 2015-11-05 | 2017-05-17 | 三星显示有限公司 | 柔性印刷电路板以及具有其的显示设备 |
CN107006120A (zh) * | 2014-12-12 | 2017-08-01 | 凸版印刷株式会社 | 配线印刷物及其制造方法 |
CN107278014A (zh) * | 2016-03-30 | 2017-10-20 | 日东电工株式会社 | 配线电路基板及其制造方法 |
US20170347444A1 (en) * | 2016-05-25 | 2017-11-30 | Mooretec Co.,Ltd. | Manufacturing method of curved circuit board and electronic product |
-
2018
- 2018-05-23 CN CN201810499298.3A patent/CN108650780B/zh active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04196596A (ja) * | 1990-11-28 | 1992-07-16 | Kitagawa Ind Co Ltd | 導電線内蔵筐体 |
KR100260347B1 (ko) * | 1992-06-05 | 2000-07-01 | 나까니시 히로유끼 | 입체인쇄기판, 이것을 사용한 전자회로패키지 및 인쇄기판의 제조방법 |
US6118665A (en) * | 1997-03-19 | 2000-09-12 | Fujitsu Limited | Flexible printed circuit and connected printed circuit structure |
CN101237743A (zh) * | 2007-01-31 | 2008-08-06 | 日东电工株式会社 | 柔性布线电路基板的连接结构以及电子设备 |
CN101466195A (zh) * | 2007-12-18 | 2009-06-24 | 三星电机株式会社 | 柔性印刷电路板及其制造方法 |
CN102687598A (zh) * | 2009-12-24 | 2012-09-19 | 日本梅克特隆株式会社 | 柔性电路基板及其制造方法 |
CN102870504A (zh) * | 2010-04-19 | 2013-01-09 | 日本梅克特隆株式会社 | 柔性电路基板及其制造方法 |
CN103607845A (zh) * | 2013-10-21 | 2014-02-26 | 溧阳市东大技术转移中心有限公司 | 一种柔性印刷电路板的制造方法 |
CN104865719A (zh) * | 2014-02-24 | 2015-08-26 | 三星电子株式会社 | 显示装置 |
CN104902670A (zh) * | 2014-03-03 | 2015-09-09 | 易鼎股份有限公司 | 可拉伸的软性电路板 |
CN107006120A (zh) * | 2014-12-12 | 2017-08-01 | 凸版印刷株式会社 | 配线印刷物及其制造方法 |
CN106686879A (zh) * | 2015-11-05 | 2017-05-17 | 三星显示有限公司 | 柔性印刷电路板以及具有其的显示设备 |
CN107278014A (zh) * | 2016-03-30 | 2017-10-20 | 日东电工株式会社 | 配线电路基板及其制造方法 |
US20170347444A1 (en) * | 2016-05-25 | 2017-11-30 | Mooretec Co.,Ltd. | Manufacturing method of curved circuit board and electronic product |
CN205902196U (zh) * | 2016-08-19 | 2017-01-18 | 河源西普电子有限公司 | 一种柔性印刷电路板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111163583A (zh) * | 2020-02-17 | 2020-05-15 | 文柏新 | 一种柔性印刷电路板 |
Also Published As
Publication number | Publication date |
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CN108650780B (zh) | 2019-07-16 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190618 Address after: 518000 Building No. 5 and No. 6, Phase I, Fuqiao Third Industrial Zone, Qiaotou Community, Fuyong Street, Baoan District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN ASSUNNY PRECISION CIRCUIT SCIEN-TECH CO.,LTD. Address before: 511400 Room 011, Jinlong 37 Nansha Street, Xiangjiang Financial and Business Center, Nansha District, Guangzhou City, Guangdong Province Applicant before: HUAPU GENERAL TECHNOLOGY RESEARCH (GUANGZHOU) Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240603 Address after: 128 Gangxing Road, Chengxigang District, Jiujiang Economic Development Zone, Jiangxi 332800 Patentee after: Jiangxi Aisheng precision circuit technology Co.,Ltd. Country or region after: China Address before: 518000 Building No. 5 and No. 6, Phase I, Fuqiao Third Industrial Zone, Qiaotou Community, Fuyong Street, Baoan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN ASSUNNY PRECISION CIRCUIT SCIEN-TECH CO.,LTD. Country or region before: China |