CN108598178B - 微电子器件用整流芯片 - Google Patents

微电子器件用整流芯片 Download PDF

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CN108598178B
CN108598178B CN201710932476.2A CN201710932476A CN108598178B CN 108598178 B CN108598178 B CN 108598178B CN 201710932476 A CN201710932476 A CN 201710932476A CN 108598178 B CN108598178 B CN 108598178B
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welding
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CN108598178A (zh
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何洪运
程琳
刘玉龙
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Suzhou Goodark Electronics Co ltd
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Abstract

本发明公开一种微电子器件用整流芯片，其二极管芯片一端通过焊料层与该支撑区电连接，第一引线条另一端是第一引脚区，该第一引线条的第一引脚区作为所述整流器的电流传输端；第二引线条一端是焊接区，该第二引线条另一端为第二引脚区，该第二引线条的第二引脚区作为所述整流器的电流传输端；所述连接片两端之间依次为条形区、梯形区和宽体区，所述宽体区的宽度至少为条形区的宽度的3倍；焊接区两侧边均设置有侧挡块，此第二引线条的焊接区末端设置有端挡块；所述焊料层5%锡、92.5%铅、2.5%银组成。本发明避免在入炉焊接过程中连接片偏位造成连接片上的连接点偏出芯片焊接区导致产品电性失效，从而大大提高了良率。

Description

微电子器件用整流芯片
技术领域
本发明涉及一种整流芯片，尤其涉及一种微电子器件用整流芯片。
背景技术
整流器件广泛应用于家电、办公、通讯器材的充电器，电源等模块；小信号二极管产品芯片尺寸极小，仅0.4mm左右，难以实现连接片工艺批量生产。打线结构一般使用金线和银胶，成本较高，且打线工艺工序复杂，效率低下。目前小信号二极管产品通常为打线结构，存在工艺效率低下，成本较高等弊端。由于芯片尺寸极小，连接片结构工艺难度高，难以实现批量生产。
在设计开发连接片结构半导体产品时，为了最大限度的利用芯片面积，通常把连接片与芯片的连接点尺寸放大到与芯片焊接区面积相当。由此带来的问题是，对连接片与芯片的相对位置精准度要求很高。现有连接片限位结构通常只能在一个方向上限位，难以达到工艺要求。现有连接片结构半导体产品通常对连接片无限位或采用简单沟槽结构限位，其缺点为只能对连接片做一个方向的限位，限位的目的在于避免在入炉焊接过程中连接片偏位造成连接片上的连接点偏出芯片焊接区导致产品电性失效。
发明内容
本发明目的是提供一种微电子器件用整流芯片，该微电子器件采用特定的连接片代替了现有0.4mm尺寸以及以下的芯片通过金线和银胶的方案，从工艺设计上解决了由于焊料用量极小、焊料分配稳定性差和精度差的技术问题。
为达到上述目的，本发明采用的技术方案是：一种微电子器件用整流芯片，包括：第一引线条、第二引线条、连接片和二极管芯片，该第一引线条一端是与二极管芯片连接的支撑区，所述二极管芯片一端通过焊料层与该支撑区电连接，第一引线条另一端是第一引脚区，该第一引线条的第一引脚区作为所述整流器的电流传输端；
所述第二引线条一端是焊接区，该第二引线条另一端为第二引脚区，该第二引线条的第二引脚区作为所述整流器的电流传输端，所述二极管芯片的尺寸为0.3~1mm；
所述连接片两端之间依次为条形区、梯形区和宽体区，所述宽体区的宽度至少为条形区的宽度的3倍，所述条形区末端具有向下的第一弯曲部，所述宽体区末端具有向下的第二弯曲部；
位于第一弯曲部末端的第一焊接端与二极管芯片另一端通过焊料层电连接，位于第二弯曲部末端的第二焊接端与第二引线条的焊接区之间通过焊料层电连接，所述第二弯曲部的长度大于第一弯曲部，从而使得第一焊接端高于第二焊接端，所述焊接区两侧边均设置有侧挡块，此第二引线条的焊接区末端设置有端挡块；所述焊料层5 %锡、92.5 %铅、2.5 %银组成。
上述技术方案中进一步改进的方案如下：
1. 上述方案中，所述宽体区的宽度为条形区的宽度的5~8倍。
2. 上述方案中，所述第一弯曲部与梯形区夹角为90°~110°，所述第二弯曲部与梯形区夹角为90°~110°。
由于上述技术方案运用，本发明与现有技术相比具有下列优点和效果：
本发明微电子器件用整流芯片，其采用特定的连接片代替了现有0.4mm尺寸以及以下的芯片通过金线和银胶的方案，从工艺设计上解决了由于焊料用量极小、焊料分配稳定性差和精度差的技术问题；其次，其连接片与第二引线条通过特定的结构连接，实现了对连接片在X、Y两个方向限位同时对连接片转角做限位，达到了高精度限位的要求，实现最大限度的利用芯片面积和降低芯片成本的目的，避免在入炉焊接过程中连接片偏位造成连接片上的连接点偏出芯片焊接区导致产品电性失效，从而大大提高了良率；再次，其焊料层由5 %锡、92.5 %铅、2.5 %银组成相对现有焊料成本比单一银低96%左右，材质为铜的连接片仅为材质为金的金线成本的3%以内，金线线径一般0.025mm左右，能承受的熔断电流约0.5A，铜连接片的厚度在0.1mm左右，平均宽度0.5mm左右，能承受2A以上的电流，也克服了金线线径细，塑封成型时容易发生金线弯曲现象造成短路不良。
附图说明
附图1为现有小信号二极管器件结构示意图；
附图2为附图2的仰视结构示意图；
附图3为本发明微电子器件用整流芯片结构示意图；
附图4为附图3的仰视结构示意图。
以上附图中：1、第一引线条；11、第一引脚区；12、支撑区；2、第二引线条；21、第二引脚区；22、焊接区；3、连接片；31、条形区；32、梯形区；33、宽体区；4、二极管芯片；5、第一弯曲部；51、第一焊接端；6、第二弯曲部；61、第二焊接端；7、侧挡块；8、端挡块；9、焊料层。
具体实施方式
下面结合附图及实施例对本发明作进一步描述：
实施例：一种微电子器件用整流芯片，包括：第一引线条1、第二引线条2、连接片3和二极管芯片4，该第一引线条1一端是与二极管芯片4连接的支撑区12，所述二极管芯片4一端通过焊料层9与该支撑区12电连接，第一引线条1另一端是第一引脚区11，该第一引线条1的第一引脚区11作为所述整流器的电流传输端；
所述第二引线条2一端是焊接区22，该第二引线条2另一端为第二引脚区21，该第二引线条2的第二引脚区21作为所述整流器的电流传输端，所述二极管芯片4的尺寸为0.3~1mm；
所述连接片3两端之间依次为条形区31、梯形区32和宽体区33，所述宽体区33的宽度至少为条形区31的宽度的3倍，所述条形区31末端具有向下的第一弯曲部5，所述宽体区33末端具有向下的第二弯曲部6；
位于第一弯曲部5末端的第一焊接端51与二极管芯片4另一端通过焊料层9电连接，位于第二弯曲部6末端的第二焊接端61与第二引线条2的焊接区22之间通过焊料层9电连接，所述第二弯曲部6的长度大于第一弯曲部5，从而使得第一焊接端51高于第二焊接端61，所述焊接区22两侧边均设置有侧挡块7，此第二引线条2的焊接区22末端设置有端挡块8；所述焊料层9由5 %锡、92.5 %铅、2.5 %银组成。
上述宽体区33的宽度为条形区31的宽度的6倍。
上述第一弯曲部5与梯形区32夹角为100°，所述第二弯曲部6与梯形区32夹角为100°。
采用上述微电子器件用整流芯片时，其采用特定的连接片代替了现有0.4mm尺寸以及以下的芯片通过金线和银胶的方案，从工艺设计上解决了由于焊料用量极小、焊料分配稳定性差和精度差的技术问题；其次，其连接片与第二引线条通过特定的结构连接，实现了对连接片在X、Y两个方向限位同时对连接片转角做限位，达到了高精度限位的要求，实现最大限度的利用芯片面积和降低芯片成本的目的，避免在入炉焊接过程中连接片偏位造成连接片上的连接点偏出芯片焊接区导致产品电性失效，从而大大提高了良率；再次，其焊料层由5 %锡、92.5 %铅、2.5 %银组成相对现有焊料成本比单一银低96%左右，材质为铜的连接片仅为材质为金的金线成本的3%以内，金线线径一般0.025mm左右，能承受的熔断电流约0.5A，铜连接片的厚度在0.1mm左右，平均宽度0.5mm左右，能承受2A以上的电流，也克服了金线线径细，塑封成型时容易发生金线弯曲现象造成短路不良。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (1)

1.一种微电子器件用整流芯片，包括：第一引线条（1）、第二引线条（2）、连接片（3）和二极管芯片（4），该第一引线条（1）一端是与二极管芯片（4）连接的支撑区（12），所述二极管芯片（4）一端通过焊料层（9）与该支撑区（12）电连接，第一引线条（1）另一端是第一引脚区（11），该第一引线条（1）的第一引脚区（11）作为所述整流器的电流传输端；
所述第二引线条（2）一端是焊接区（22），该第二引线条（2）另一端为第二引脚区（21），该第二引线条（2）的第二引脚区（21）作为所述整流器的电流传输端，所述二极管芯片（4）的尺寸为0.3~1mm；其特征在于：
所述连接片（3）两端之间依次为条形区（31）、梯形区（32）和宽体区（33），所述宽体区（33）的宽度至少为条形区（31）的宽度的3倍，所述条形区（31）末端具有向下的第一弯曲部（5），所述宽体区（33）末端具有向下的第二弯曲部（6）；
位于第一弯曲部（5）末端的第一焊接端（51）与二极管芯片（4）另一端通过焊料层（9）电连接，位于第二弯曲部（6）末端的第二焊接端（61）与第二引线条（2）的焊接区（22）之间通过焊料层（9）电连接，所述第二弯曲部（6）的长度大于第一弯曲部（5），从而使得第一焊接端（51）高于第二焊接端（61），所述焊接区（22）两侧边均设置有侧挡块（7），此第二引线条（2）的焊接区（22）末端设置有端挡块（8）；所述焊料层（9）由5 %锡、92.5 %铅、2.5 %银组成；所述宽体区（33）的宽度为条形区（31）的宽度的6倍，所述第一弯曲部（5）与梯形区（32）夹角为100°，所述第二弯曲部（6）与梯形区（32）夹角为90°~110°。
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