CN204014275U - 用于连接模块板和母板的焊盘连接结构 - Google Patents
用于连接模块板和母板的焊盘连接结构 Download PDFInfo
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106973498A (zh) * | 2017-04-25 | 2017-07-21 | 安徽宏鑫电子科技有限公司 | 一种双面印制电路板 |
CN112235938A (zh) * | 2019-07-15 | 2021-01-15 | 中兴通讯股份有限公司 | Pcb板的焊接方法和pcb城堡板 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106973498A (zh) * | 2017-04-25 | 2017-07-21 | 安徽宏鑫电子科技有限公司 | 一种双面印制电路板 |
CN112235938A (zh) * | 2019-07-15 | 2021-01-15 | 中兴通讯股份有限公司 | Pcb板的焊接方法和pcb城堡板 |
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Address after: A8 music building 1002 No. 518000 Guangdong city of Shenzhen province Nanshan District Guangdong streets, road 5 building 601 room Patentee after: Shenzhen Ding Zhi Link Communications Inc Address before: 518000 Guangdong city of Shenzhen province Futian District Che Kung Temple Tairan nine road Tang Commercial East Building 5 layer 503 Patentee before: SHENZHEN DINGZHI COMMUNICATION CO., LTD. |
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Address after: 518000 Room 501, east block, Shengtang business building, Tairan 9th Road, Tian'an community, Shatou street, Futian District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Dingzhi Communication Co.,Ltd. Address before: Room 1005, Yuehai building, Yueshan street, Shenzhen, Guangdong Province Patentee before: SHENZHEN TOPWISE COMMUNICATION Co.,Ltd. |