CN108417553B - 引线框及其制造方法 - Google Patents

引线框及其制造方法 Download PDF

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Publication number
CN108417553B
CN108417553B CN201810127202.0A CN201810127202A CN108417553B CN 108417553 B CN108417553 B CN 108417553B CN 201810127202 A CN201810127202 A CN 201810127202A CN 108417553 B CN108417553 B CN 108417553B
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CN
China
Prior art keywords
lead
lead frame
dam material
thickness
metal plate
Prior art date
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Active
Application number
CN201810127202.0A
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English (en)
Chinese (zh)
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CN108417553A (zh
Inventor
福崎润
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chang Wah Technology Co Ltd
Original Assignee
Oguchi Electric Materials Co ltd
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Publication date
Application filed by Oguchi Electric Materials Co ltd filed Critical Oguchi Electric Materials Co ltd
Publication of CN108417553A publication Critical patent/CN108417553A/zh
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Publication of CN108417553B publication Critical patent/CN108417553B/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/433—Shapes or dispositions of deformation-absorbing parts, e.g. leads having meandering shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/042—Etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/465—Bumps or wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
CN201810127202.0A 2017-02-08 2018-02-08 引线框及其制造方法 Active CN108417553B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017021716A JP6798670B2 (ja) 2017-02-08 2017-02-08 リードフレーム及びその製造方法
JP2017-021716 2017-02-08

Publications (2)

Publication Number Publication Date
CN108417553A CN108417553A (zh) 2018-08-17
CN108417553B true CN108417553B (zh) 2022-04-26

Family

ID=63037345

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810127202.0A Active CN108417553B (zh) 2017-02-08 2018-02-08 引线框及其制造方法

Country Status (4)

Country Link
US (1) US10304760B2 (https=)
JP (1) JP6798670B2 (https=)
CN (1) CN108417553B (https=)
MY (1) MY192268A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11545418B2 (en) * 2018-10-24 2023-01-03 Texas Instruments Incorporated Thermal capacity control for relative temperature-based thermal shutdown
US11581195B2 (en) * 2020-12-21 2023-02-14 Alpha And Omega Semiconductor International Lp Semiconductor package having wettable lead flank and method of making the same

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020093250A (ko) * 2001-06-07 2002-12-16 삼성전자 주식회사 리드 노출형 리드 프레임 및 그를 이용한 리드 노출형반도체 패키지
US7259460B1 (en) * 2004-06-18 2007-08-21 National Semiconductor Corporation Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package
JP2008182175A (ja) * 2006-12-27 2008-08-07 Denso Corp モールドパッケージの製造方法
JP2012114354A (ja) * 2010-11-26 2012-06-14 Dainippon Printing Co Ltd リードフレームおよびリードフレームの製造方法
CN103928420A (zh) * 2013-01-11 2014-07-16 株式会社三井高科技 引线框
CN103928419A (zh) * 2013-01-10 2014-07-16 株式会社三井高科技 引线框
JP2015072946A (ja) * 2013-10-01 2015-04-16 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置の製造方法
CN104659010A (zh) * 2015-02-11 2015-05-27 江苏长电科技股份有限公司 一种四方扁平无引脚型态封装的引线框结构与封装体结构
CN105244296A (zh) * 2014-07-07 2016-01-13 英飞凌科技股份有限公司 用于引线框条测试的延伸接触区域

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6700186B2 (en) * 2000-12-21 2004-03-02 Mitsui High-Tec, Inc. Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device
US7968377B2 (en) * 2005-09-22 2011-06-28 Stats Chippac Ltd. Integrated circuit protruding pad package system
JP2009088412A (ja) * 2007-10-02 2009-04-23 Renesas Technology Corp 半導体装置の製造方法
KR101486790B1 (ko) * 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
JP6603538B2 (ja) * 2015-10-23 2019-11-06 新光電気工業株式会社 リードフレーム及びその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020093250A (ko) * 2001-06-07 2002-12-16 삼성전자 주식회사 리드 노출형 리드 프레임 및 그를 이용한 리드 노출형반도체 패키지
US7259460B1 (en) * 2004-06-18 2007-08-21 National Semiconductor Corporation Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package
JP2008182175A (ja) * 2006-12-27 2008-08-07 Denso Corp モールドパッケージの製造方法
JP2012114354A (ja) * 2010-11-26 2012-06-14 Dainippon Printing Co Ltd リードフレームおよびリードフレームの製造方法
CN103928419A (zh) * 2013-01-10 2014-07-16 株式会社三井高科技 引线框
CN103928420A (zh) * 2013-01-11 2014-07-16 株式会社三井高科技 引线框
JP2015072946A (ja) * 2013-10-01 2015-04-16 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置の製造方法
CN105244296A (zh) * 2014-07-07 2016-01-13 英飞凌科技股份有限公司 用于引线框条测试的延伸接触区域
CN104659010A (zh) * 2015-02-11 2015-05-27 江苏长电科技股份有限公司 一种四方扁平无引脚型态封装的引线框结构与封装体结构

Also Published As

Publication number Publication date
JP6798670B2 (ja) 2020-12-09
CN108417553A (zh) 2018-08-17
US10304760B2 (en) 2019-05-28
US20180226327A1 (en) 2018-08-09
MY192268A (en) 2022-08-15
JP2018129405A (ja) 2018-08-16

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Effective date of registration: 20231121

Address after: The road development processing zone Kaohsiung city Taiwan China No. 24

Patentee after: CHANG WAH TECHNOLOGY Co.,Ltd.

Address before: Japan Kagoshima

Patentee before: Oguchi Electric Materials Co.,Ltd.

TR01 Transfer of patent right