MY192268A - Lead frame and method for manufacturing the same - Google Patents

Lead frame and method for manufacturing the same

Info

Publication number
MY192268A
MY192268A MYPI2018700506A MYPI2018700506A MY192268A MY 192268 A MY192268 A MY 192268A MY PI2018700506 A MYPI2018700506 A MY PI2018700506A MY PI2018700506 A MYPI2018700506 A MY PI2018700506A MY 192268 A MY192268 A MY 192268A
Authority
MY
Malaysia
Prior art keywords
dam bar
leads
site
lead frame
same
Prior art date
Application number
MYPI2018700506A
Other languages
English (en)
Inventor
Fukuzaki Jun
Original Assignee
Ohkuchi Mat Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ohkuchi Mat Co Ltd filed Critical Ohkuchi Mat Co Ltd
Publication of MY192268A publication Critical patent/MY192268A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/433—Shapes or dispositions of deformation-absorbing parts, e.g. leads having meandering shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/042—Etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/465—Bumps or wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
MYPI2018700506A 2017-02-08 2018-02-08 Lead frame and method for manufacturing the same MY192268A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017021716A JP6798670B2 (ja) 2017-02-08 2017-02-08 リードフレーム及びその製造方法

Publications (1)

Publication Number Publication Date
MY192268A true MY192268A (en) 2022-08-15

Family

ID=63037345

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018700506A MY192268A (en) 2017-02-08 2018-02-08 Lead frame and method for manufacturing the same

Country Status (4)

Country Link
US (1) US10304760B2 (https=)
JP (1) JP6798670B2 (https=)
CN (1) CN108417553B (https=)
MY (1) MY192268A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11545418B2 (en) * 2018-10-24 2023-01-03 Texas Instruments Incorporated Thermal capacity control for relative temperature-based thermal shutdown
US11581195B2 (en) * 2020-12-21 2023-02-14 Alpha And Omega Semiconductor International Lp Semiconductor package having wettable lead flank and method of making the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6700186B2 (en) * 2000-12-21 2004-03-02 Mitsui High-Tec, Inc. Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device
KR20020093250A (ko) * 2001-06-07 2002-12-16 삼성전자 주식회사 리드 노출형 리드 프레임 및 그를 이용한 리드 노출형반도체 패키지
US7259460B1 (en) * 2004-06-18 2007-08-21 National Semiconductor Corporation Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package
US7968377B2 (en) * 2005-09-22 2011-06-28 Stats Chippac Ltd. Integrated circuit protruding pad package system
JP5214911B2 (ja) * 2006-12-27 2013-06-19 株式会社デンソー モールドパッケージの製造方法
JP2009088412A (ja) * 2007-10-02 2009-04-23 Renesas Technology Corp 半導体装置の製造方法
JP5899614B2 (ja) * 2010-11-26 2016-04-06 大日本印刷株式会社 リードフレームおよびリードフレームの製造方法
JP6087153B2 (ja) * 2013-01-10 2017-03-01 株式会社三井ハイテック リードフレーム
JP6143468B2 (ja) * 2013-01-11 2017-06-07 株式会社三井ハイテック リードフレーム
KR101486790B1 (ko) * 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
JP6319644B2 (ja) * 2013-10-01 2018-05-09 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置の製造方法
US9252063B2 (en) * 2014-07-07 2016-02-02 Infineon Technologies Ag Extended contact area for leadframe strip testing
CN104659010B (zh) * 2015-02-11 2018-03-16 江苏长电科技股份有限公司 一种四方扁平无引脚型态封装的引线框结构与封装体结构
JP6603538B2 (ja) * 2015-10-23 2019-11-06 新光電気工業株式会社 リードフレーム及びその製造方法

Also Published As

Publication number Publication date
JP6798670B2 (ja) 2020-12-09
CN108417553B (zh) 2022-04-26
CN108417553A (zh) 2018-08-17
US10304760B2 (en) 2019-05-28
US20180226327A1 (en) 2018-08-09
JP2018129405A (ja) 2018-08-16

Similar Documents

Publication Publication Date Title
SG11202001546WA (en) Ni-BASED CORROSION-RESISTANT ALLOY POWDER FOR ADDITIVE MANUFACTURING, AND METHOD FOR PRODUCING ADDITIVE MANUFACTURING PRODUCT OR MEMBER FOR SEMICONDUCTOR PRODUCTION DEVICES USING THE POWDER
EP3688168A4 (en) COMPOSITIONS AND METHODS FOR THE SCALABLE PRODUCTION AND RELEASE OF BIOLOGICS
WO2017095944A8 (en) Methods and compositions relating to chondrisomes from blood products
MX2016015970A (es) Unidades de troquel giratorio, metodos para usarlas y productos alimenticios elaborados con estas.
EP3425653A4 (en) GRAPHIC DISPERSION, PROCESS FOR THE PREPARATION THEREOF, METHOD FOR THE PRODUCTION OF PARTICLES FROM GRAPHIC / ACTIVE MATERIAL COMPOSITE AND METHOD FOR THE PRODUCTION OF AN ELECTRODE PASTE
PH12016501544A1 (en) Protective film forming film, protective film forming sheet and work product manufacturing method
EP3358650A4 (en) GRAPHIC DISPERSION, METHOD FOR THE PRODUCTION THEREOF, METHOD FOR THE PRODUCTION OF PARTICLES FROM GRAPHS / ACTIVE MATERIAL COMPOSITE AND METHOD FOR THE PRODUCTION OF AN ELECTRODE PASTE
GEP20196974B (en) A novel crystalline form of a benzimidazole derivative and a preparation method thereof
MY184081A (en) Food processing apparatus and food manufacturing method using the same
WO2017019540A3 (en) Inhibitors of n-linked glycosylation and methods using same
MX2022007337A (es) Formacion avanzada de goma.
SA517390475B1 (ar) نظام أكياس متعددة وطريقة لتحضير مكونات الدم
PT3444050T (pt) Método e máquina para produzir pelo menos uma parte em pelomenos um material cerâmico e/ou metal por fabricação aditiva
PH12020500074A1 (en) Peptide
WO2018097712A8 (en) PROCESS FOR PREPARING A GLUCIDIC AND / OR PROTEIN PRODUCT
MY192268A (en) Lead frame and method for manufacturing the same
MX375679B (es) Composicion novedosa de un producto de confiteria.
SMT202400236T1 (it) Geocomposito, nonché procedimento per la sua fabbricazione
PH12017501735A1 (en) Novel heterocyclic compound, method for preparing the same, and pharmaceutical composition comprising the same
HUE070369T2 (hu) Eljárás sajtolt termék elõállítására és elrendezés sajtolt termék gyártására
KR102265451B9 (ko) 3차원 섬유형 스캐폴드 및 이의 제조방법
MX395191B (es) Producto de avena enriquecido con avenantramidas.
MY173537A (en) Manufacturing apparatus and manufacturing method
EP3368254A4 (en) WORKED WOOD PRODUCTS AND METHOD FOR THE PRODUCTION THEREOF
PL3599828T3 (pl) Materiał roślinny produkujący węglowodany