CN108384248B - 导热性片以及导热性片的制造方法 - Google Patents

导热性片以及导热性片的制造方法 Download PDF

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Publication number
CN108384248B
CN108384248B CN201810153894.6A CN201810153894A CN108384248B CN 108384248 B CN108384248 B CN 108384248B CN 201810153894 A CN201810153894 A CN 201810153894A CN 108384248 B CN108384248 B CN 108384248B
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China
Prior art keywords
thermally conductive
conductive sheet
filler
composition
thickness direction
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CN201810153894.6A
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Chinese (zh)
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CN108384248A (zh
Inventor
荒卷庆辅
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Dexerials Corp
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Dexerials Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN201810153894.6A 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法 Active CN108384248B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-278788 2011-12-20
JP2011278788A JP6034562B2 (ja) 2011-12-20 2011-12-20 熱伝導性シート及び熱伝導性シートの製造方法
CN201280061296.7A CN103975429B (zh) 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法

Related Parent Applications (1)

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CN201280061296.7A Division CN103975429B (zh) 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法

Publications (2)

Publication Number Publication Date
CN108384248A CN108384248A (zh) 2018-08-10
CN108384248B true CN108384248B (zh) 2021-10-19

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CN201810153894.6A Active CN108384248B (zh) 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法
CN201280061296.7A Active CN103975429B (zh) 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法

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JP (1) JP6034562B2 (enrdf_load_stackoverflow)
CN (2) CN108384248B (enrdf_load_stackoverflow)
TW (1) TWI611013B (enrdf_load_stackoverflow)
WO (1) WO2013094613A1 (enrdf_load_stackoverflow)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6069112B2 (ja) * 2013-06-19 2017-02-01 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
JP2015073067A (ja) * 2013-09-06 2015-04-16 バンドー化学株式会社 熱伝導性樹脂成形品
CN106573779B (zh) * 2014-12-02 2021-06-18 积水化学工业株式会社 导热片材及其制造方法
JP6178389B2 (ja) * 2014-12-25 2017-08-09 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
CN106810876B (zh) * 2015-12-02 2020-11-10 中国科学院金属研究所 一种填料定向排布的复合材料及其制备方法
EP3412733B1 (en) * 2016-02-01 2021-10-20 Bando Chemical Industries, Ltd. Thermally conductive molded resin article
CN107022196A (zh) * 2016-02-02 2017-08-08 中兴通讯股份有限公司 导热材料、其制备方法及导热件
KR20190103402A (ko) * 2017-01-19 2019-09-04 고쿠리츠다이가쿠호징 후쿠이다이가쿠 고열전도성 재료 및 그 제조 방법
DE112019004695T5 (de) * 2018-11-16 2021-06-10 Fuji Polymer Industries Co., Ltd. Wärmeleitende Folie und Verfahren für ihre Herstellung
US11781053B2 (en) 2018-12-25 2023-10-10 Fuji Polymer Industries Co., Ltd. Thermally conductive composition and thermally conductive sheet using the same
CN112041411B (zh) * 2018-12-25 2022-04-01 富士高分子工业株式会社 导热性组合物及使用了其的导热性片材
CN110625877B (zh) * 2019-09-05 2021-06-08 上海阿莱德实业股份有限公司 一种导热界面材料的制备方法
JP7458775B2 (ja) * 2019-12-24 2024-04-01 デクセリアルズ株式会社 熱伝導性成形体の製造方法
DE112020005651T5 (de) * 2020-02-21 2022-10-13 Sekisui Polymatech Co., Ltd. Wärmeleitende folie und verfahren, um diese zu erzeugen
CN112712944B (zh) * 2020-12-24 2022-04-08 武汉肯达科讯科技有限公司 一种高导热绝缘垫片及其制备方法
CN115141460B (zh) * 2021-03-30 2023-09-01 太阳油墨（苏州）有限公司 热固性树脂组合物、固化物以及电子部件
CN114106564B (zh) * 2021-11-17 2023-08-29 深圳市鸿富诚新材料股份有限公司 一种取向型导热凝胶、制备方法及其应用
JP2023120623A (ja) * 2022-02-18 2023-08-30 信越化学工業株式会社 熱伝導性シート及び熱伝導性シートの製造方法
JP2023179992A (ja) * 2022-06-08 2023-12-20 デクセリアルズ株式会社 積層体及びその製造方法
JP2023179989A (ja) * 2022-06-08 2023-12-20 デクセリアルズ株式会社 積層体及びその製造方法
JP2023179996A (ja) * 2022-06-08 2023-12-20 デクセリアルズ株式会社 積層体及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000345040A (ja) * 1999-06-02 2000-12-12 Denki Kagaku Kogyo Kk 熱伝導性シリコーン成形体の製造方法
JP2006124206A (ja) * 2004-10-27 2006-05-18 Sumitomo Electric Ind Ltd 窒化アルミニウム脱脂中間体及び焼結体
CN101087511A (zh) * 2006-06-08 2007-12-12 保力马科技株式会社 导热性成形体及其制造方法
CN101275035A (zh) * 2007-03-27 2008-10-01 丰田合成株式会社 低导电性高散热性高分子材料及成型体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001294676A (ja) * 2000-04-13 2001-10-23 Jsr Corp 熱伝導性シート、熱伝導性シートの製造方法および熱伝導性シートを用いた放熱構造
EP2118191A1 (en) * 2007-01-10 2009-11-18 Momentive Performance Materials Inc. Thermal interface materials and methods for making thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000345040A (ja) * 1999-06-02 2000-12-12 Denki Kagaku Kogyo Kk 熱伝導性シリコーン成形体の製造方法
JP2006124206A (ja) * 2004-10-27 2006-05-18 Sumitomo Electric Ind Ltd 窒化アルミニウム脱脂中間体及び焼結体
CN101087511A (zh) * 2006-06-08 2007-12-12 保力马科技株式会社 导热性成形体及其制造方法
CN101275035A (zh) * 2007-03-27 2008-10-01 丰田合成株式会社 低导电性高散热性高分子材料及成型体

Also Published As

Publication number Publication date
CN108384248A (zh) 2018-08-10
JP6034562B2 (ja) 2016-11-30
TW201341519A (zh) 2013-10-16
CN103975429A (zh) 2014-08-06
JP2013131563A (ja) 2013-07-04
WO2013094613A1 (ja) 2013-06-27
TWI611013B (zh) 2018-01-11
CN103975429B (zh) 2018-03-30

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Address after: Maple County, Japan

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