CN108183998A - Electronic device - Google Patents
Electronic device Download PDFInfo
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- CN108183998A CN108183998A CN201711437453.0A CN201711437453A CN108183998A CN 108183998 A CN108183998 A CN 108183998A CN 201711437453 A CN201711437453 A CN 201711437453A CN 108183998 A CN108183998 A CN 108183998A
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- Prior art keywords
- light
- infrared
- infrared lamp
- electronic device
- lamp
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/74—Circuitry for compensating brightness variation in the scene by influencing the scene brightness using illuminating means
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a kind of electronic devices.Electronic device includes casing, output module, display screen and optical flame detector.It exports module and includes encapsulating housing, infrared lamp, light-guide device and structured light projector.Encapsulating housing includes package substrate.Infrared lamp, light-guide device and structured light projector are encapsulated in encapsulating housing.Infrared lamp and structured light projector are carried on package substrate.Light-guide device can be movably arranged in the luminous light path of infrared lamp.When light-guide device is located in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted from encapsulating housing using as infrared light compensating lamp or close to infrared lamp with the first field angle；When light-guide device is left in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted from encapsulating housing using as close to infrared lamp or infrared light compensating lamp with the second field angle.Optical flame detector is corresponding with the light transmission entity area of display screen, and optical flame detector is incident on the target light intensity of the light and output light on optical flame detector for reception.
Description
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of function element set
It is more and more, in order to realize the functions such as the facial 3D feature recognitions of distance detection, environment light detection and user, need to set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be occupied.
Invention content
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Module is exported, on the housing, the output module includes encapsulating housing, infrared for the output module installation
Lamp, light-guide device and structured light projector, the encapsulating housing include package substrate, the infrared lamp, the light-guide device and
The structured light projector is encapsulated in the encapsulating housing, and the infrared lamp and the structured light projector are carried on the envelope
It fills on substrate, the light-guide device can be movably arranged in the luminous light path of the infrared lamp, when the light-guide device position
When in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the first field angle from the encapsulating housing
Outgoing is using as infrared light compensating lamp or close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp,
The infrared light of infrared lamp transmitting is emitted from the encapsulating housing using as close to infrared lamp or infrared with the second field angle
Light compensating lamp；
Display screen, on the housing, the display screen is formed with light transmission entity area and including energy for the display screen setting
Enough show the front of picture and the back side opposite with the front；With
Optical flame detector, the optical flame detector are arranged on the side where the back side of the display screen, the optical flame detector and institute
Light transmission entity area correspondence is stated, the optical flame detector is used to receive the light being incident on the optical flame detector and the mesh for exporting the light
Mark light intensity.
In some embodiments, the light-guide device includes convex lens or the lens group with positive light coke, when described
When light-guide device is located in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the first field angle from institute
Encapsulating housing outgoing is stated using as close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, institute
The infrared light of infrared lamp transmitting is stated with the second field angle from encapsulating housing outgoing using as infrared light compensating lamp；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is positioned at described red
When in the luminous light path of outer lamp, the infrared light of the infrared lamp transmitting is emitted to make with the first field angle from the encapsulating housing
For infrared light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared lamp emits infrared
Light is emitted from the encapsulating housing using as close to infrared lamp with the second field angle.
In some embodiments, the output module further includes chip, the infrared lamp and the structured light projector
It is formed on the chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, and first is formed at the top of the encapsulation
Light-emitting window and the second light-emitting window, first light-emitting window is corresponding with the infrared lamp, second light-emitting window and institute
State structured light projector correspondence.
In some embodiments, the output module further includes metal shutter, and the metal shutter is located at described
In encapsulating housing, and between the infrared lamp and the structured light projector.
In some embodiments, the electronic device further includes the cover board of light transmission, and it is infrared that the casing offers casing
Through-hole and casing structure light through-hole, the infrared lamp is corresponding with the infrared through-hole of the casing, the structured light projector with it is described
Casing structure light through-hole corresponds to, and the cover board setting is on the housing.
In some embodiments, the cover board is formed with the surface that the casing is combined and only transmits the infrared of infrared light
Through ink, it is described it is infrared blocked through ink in the infrared through-hole of the casing and the casing structure light through-hole at least one
It is a.
In some embodiments, the electronic device further includes proximity sensor and imaging modules, the imaging modules
Lens barrel including microscope base, on the microscope base and the imaging sensor being housed in the microscope base, the microscope base include position
Mounting surface between the lens barrel and described image sensor, the proximity sensor are arranged on the mounting surface.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head
Kind.
In some embodiments, the light transmission entity area includes image pixel, and the electronic device further includes processor,
The optical flame detector receives the light to export the initial beam intensity of the environmental light intensity information including the external electronic device；It is described
Processor is used to handle the initial beam intensity to obtain the institute for the environmental light intensity information for only including the external electronic device
State target light intensity.
In some embodiments, the initial beam intensity includes the environmental light intensity information and the display screen shows image
When display intensity signal, the processor is used to obtain the display intensity signal when display screen shows image in real time, and
The display intensity signal is removed when handling the initial beam intensity to obtain the target light intensity.
In some embodiments, the electronic device further include receiver, infrared pick-up head, visible image capturing head and
The cover board of light transmission, the casing offer casing sound outlet hole, and the cover board offers cover board sound outlet hole, the receiver with it is described
The position of cover board sound outlet hole and the casing sound outlet hole corresponds to, the output module, the infrared pick-up head and described visible
The center of light video camera head is located on same line segment, and the receiver is between the line segment and the top of the casing.
In some embodiments, the electronic device further includes proximity sensor and imaging modules, the imaging modules
In the casing, the imaging modules include microscope base, the lens barrel on the microscope base and are partly arranged on described
Substrate in microscope base；The proximity sensor setting is on the substrate.
In the electronic device of embodiment of the present invention, pass through the position of mobile light-guide device so that infrared lamp can be used as connecing
Near-infrared lamp or infrared light compensating lamp, integrated structure light projector, output module group transmitting infrared light is with infrared distance measurement, infrared
The function of light filling and three-dimensional imaging, therefore, the integrated level for exporting module are higher, small volume, and it is red that output module has saved realization
The space of the function of outer ranging, infrared light filling and three-dimensional imaging.In addition, due to structured light projector be carried on infrared lamp it is same
On a package substrate, structured light projector compared to traditional handicraft is respectively adopted not close to infrared lamp, infrared light compensating lamp needs
With the encapsulation in wafer manufacture recombinant to PCB substrate, packaging efficiency is improved.Meanwhile optical flame detector is arranged on the back of the body of display screen
Side where face so as to which optical flame detector will not occupy the space between display platen edge and envelope edge, shows platen edge and machine
Gap between shell edge be can be made smaller, and in other words, the display area of display screen can increase, to improve electronic device
Screen accounting.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 3 and Fig. 4 is the status diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 5 and Fig. 6 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 7 is schematic cross-section of the electronic device of Fig. 1 along VII-VII lines；
Fig. 8 is schematic cross-section of the electronic device of Fig. 1 along VIII-VIII lines；
Fig. 9 is the proximity sensor of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 10 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 11 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Figure 12 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 13 is that the electronic device edge of another embodiment of the present invention is intercepted with the VII-VII line corresponding positions in Fig. 1
Partial sectional schematic view；
Figure 14 is that the electronic device edge of a further embodiment of this invention is intercepted with the VII-VII line corresponding positions in Fig. 1
Partial sectional schematic view；
Figure 15 is the stereoscopic schematic diagram of the proximity sensor and output module of the electronic device of embodiment of the present invention；
Figure 16 to Figure 23 is that the proximity sensor of the electronic device of embodiment of the present invention and the three-dimensional of imaging modules are illustrated
Figure.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the whole element for representing same or similar element or there is same or like function.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30, display screen 90 and electronics
Component.Electronic component includes output module 10, proximity sensor 51 (such as Fig. 9), optical flame detector 52, imaging modules 60 (as schemed
And receiver 70 8).Electronic device 100 can be mobile phone, tablet computer, laptop, smartwatch, Intelligent bracelet, teller
Machine etc., the embodiment of the present invention are illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the specific shape of electronic device 100
Formula can be other, and this is not restricted.
Fig. 2 and Fig. 5 are please referred to, output module 10 is single package body structure, including encapsulating housing 11, infrared lamp 12, leaded light
Element 13 and structured light projector 14.
Encapsulating housing 11 is in other words, infrared for encapsulating infrared lamp 12, light-guide device 13 and structured light projector 14 simultaneously
Lamp 12, light-guide device 13 and structured light projector 14 are encapsulated in encapsulating housing 11 simultaneously.Encapsulating housing 11 includes package substrate
111st, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference shield (Electromagnetic
Interference, EMI) material is made, output module 10 had an impact to avoid extraneous electromagnetic interference.
Package substrate 111 is used to carry infrared lamp 12 and structured light projector 14.When manufacture exports module 10, infrared lamp
12 and structured light projector 14 can be formed on chip 15, then by infrared lamp 12, structured light projector 14 and chip 15 together
It is arranged on package substrate 111, specifically, chip 15 can be bonded on package substrate 111.Meanwhile package substrate 111
It can be used for connecting with other parts (such as the casing 20 of electronic device 100, mainboard etc.) of electronic device 100, it will be defeated
Go out module 10 to be fixed in electronic device 100.
Package wall 112 can be set around infrared lamp 12, light-guide device 13 and structured light projector 14, package wall
112 extend from package substrate 111, and package wall 112 can be combined with package substrate 111, preferably, package wall 112 and encapsulation
Substrate 111 is detachably connected, in order to throw infrared lamp 12, light-guide device 13 and structure light after removing package wall 112
Emitter 14 is overhauled.The making material of package wall 112 can be the material of impermeable infrared light, to avoid infrared lamp 12 or knot
The infrared light that structure light projector 14 is sent out passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connect with package wall 112.Encapsulation top 113
The first light-emitting window 1131 and the second light-emitting window 1132 are formed with, the first light-emitting window 1131 is corresponding with infrared lamp 12, infrared
The infrared light that lamp 12 emits is pierced by from the first light-emitting window 1131；Second light-emitting window 1132 is corresponding with structured light projector 14,
The structure light (infrared light) that structured light projector 14 emits is pierced by from the second light-emitting window 1132.Encapsulation top 113 and package-side
Wall 112 integrally formed can obtain, can also split shape to obtain.In one example, the first light-emitting window 1131 and second
Light-emitting window 1132 is through-hole, and the making material at encapsulation top 113 is the material of impermeable infrared light.In another example, it encapsulates
Top 113 is formed by the material of impermeable infrared light and the material co-manufactured of saturating infrared light, specifically, the first light-emitting window 1131
It is made with the second light-emitting window 1132 of the material of saturating infrared light, remaining position is made of the material of impermeable infrared light, further
Ground, the first light-emitting window 1131 and the second light-emitting window 1132 could be formed with lens arrangement, to improve from the first light-emitting window
1131 and the second infrared light emission angle that projects of light-emitting window 1132, such as the second light-emitting window 1132 is formed with concavees lens knot
Structure, so that the divergence of beam across the second light-emitting window 1132 projects outward；First light-emitting window 1131 is formed with convex lens knot
Structure, so that the light across the first light-emitting window 1131 gathers outside injection.
Light-guide device 13 can be movably arranged in the luminous light path of infrared lamp 12.Fig. 5 and Fig. 6 are please referred to, exports mould
Group 10 further includes actuator 17, and actuator 17 is used to light-guide device 13 be driven to move can be movably arranged at infrared lamp 12
In the light path that shines.Wherein, actuator 17 drives light-guide device 13 to move the luminous light can be movably arranged at infrared lamp 12
Road includes：Under normal conditions, light-guide device 13 is arranged in the luminous light path of infrared lamp 12, and infrared lamp 12 is used as infrared light compensating lamp
(or close to infrared lamp), when infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), actuator 17 drives light-guide device
13 move the luminous light path to leave infrared lamp 12；Or under normal conditions, light-guide device 13 is not arranged in shining for infrared lamp 12
In light path, infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), when infrared lamp 12 is used as infrared light compensating lamp (or close to red
Outer lamp) when, actuator 17 drives light-guide device 13 to move in the luminous light path of infrared lamp 12.
Referring to Fig. 5, actuator 17 includes linear motor, linear motor includes stator 172 and mover 174, and stator 172 is pacified
In package wall 112, mover 174 is connect with light-guide device 13, and actuator 17 drives mover 174 to move to drive guide-lighting member
Part 13 moves.Referring to Fig. 6, the structure of above-mentioned actuator 17 could alternatively be：Actuator 17 includes linear motor, linear motor
Including stator 172 and mover 174, stator 172 is mounted in package wall 112, and output module 10 further includes shaft 18 and connection
Arm 19, the first end connection light-guide device 13 of linking arm 19, the second end of mover 174 and the separate light-guide device 13 of linking arm 19
Connection, linking arm 19 are set in shaft 18, and shaft 18 is between light-guide device 13 and mover 174, the mover of linear motor
174 are drivingly connected the second end motion of arm 19, and linking arm 19 is rotated around shaft 18, and the first end of linking arm 19 drives as a result,
Light-guide device 13 is rotated around shaft 18, to realize that light-guide device 13 is in the luminous light path of infrared lamp 12 or far from infrared lamp
12 luminous light path.In an embodiment of the present invention, output module 10 can also include loading plate (not shown), be opened on loading plate
Equipped with bearing holes, light-guide device 13 is mounted in bearing holes, and actuator 17 is used to that loading plate movement to be driven to drive light-guide device
13 movements.
Referring to Fig. 3, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 using as close to red
Outer lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 emits is with the second visual field
Angle is emitted from encapsulating housing 11 using as infrared light compensating lamp, at this point, the first field angle is less than the second field angle, wherein, first regards
Ranging from 10 degree -30 degree of rink corner, for example, the first field angle is 10 degree, 15 degree, 20 degree, 25 degree or 30 degree etc., the second visual field
Ranging from 60 degree -90 of angle degree, for example, the second field angle is 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree,
Or 90 degree etc..Light-guide device 13 is for converging light, and light-guide device 13 includes convex lens or the lens group with positive light coke, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light goes out optical window across first
The ranges that mouth 1131 is covered from the outgoing of encapsulating housing 11.
Referring to Fig. 4, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 using as infrared benefit
Light lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 emits is with the second visual field
Angle is emitted from encapsulating housing 11 using as close to infrared lamp, at this point, the first field angle is more than the second field angle, wherein, first regards
Ranging from 60 degree -90 of rink corner degree, for example, the first field angle is 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87
Degree or 90 degree etc., ranging from 10 the degree -30 of the second field angle spends, for example, the second field angle is 10 degree, 15 degree, 20 degree, 25 degree,
Or 30 degree etc..Light-guide device 13 is used for divergent rays, and light-guide device 13 includes concavees lens or the lens group with negative power, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light goes out optical window across first
The ranges that mouth 1131 is covered from the outgoing of encapsulating housing 11.
When infrared lamp 12 is opened and emits infrared light outside encapsulating housing 11 as infrared light compensating lamp, infrared light passes through
For first light-emitting window 1131 to project body surface, the infrared pick-up head 62 of electronic device 100 is (as shown in Figure 1) to receive quilt
The infrared light of object reflection is to obtain the image information of object (at this point, infrared lamp 12 be used for infrared light filling).When infrared lamp 12 is opened
Open and be used as close to infrared lamp emit infrared light outside encapsulating housing 11 when, infrared light is passed through and the first light-emitting window 1131 and is arrived
Up to body surface, the proximity sensor 51 of electronic device 100 the infrared light (as shown in Figure 9) that be reflected by the object that receives is with detectable substance
Body is to the distance (at this point, infrared lamp 12 be used for infrared distance measurement) of electronic device 100.
When infrared lamp 12 is used as infrared light compensating lamp and as close to can be with different power to encapsulating housing during infrared lamp
Transmitting infrared light outside 11.Specifically, infrared lamp 12 is used as with the first power outside encapsulating housing 11 emitting close to during infrared lamp
Infrared light emits infrared light with the second power when infrared lamp 12 is used as infrared light compensating lamp outside encapsulating housing 11, wherein, the
One power can be less than the second power.
Fig. 5 and Fig. 6 are please referred to, structured light projector 14 can be formed in infrared lamp 12 on a piece of chip 15, further
Reduce volume of the structured light projector 14 with infrared lamp 12 after integrated, and preparation process is simpler.Structured light projector 14 can be to
Outer transmitting structure light, structure light can form infrared laser speckle pattern, and project structured light to target object surface is taken the photograph by infrared light
Is acquired as head 62 is (as shown in Figure 1) by the modulated structured light patterns of target object, by the structured light patterns to being modulated into
Row analysis calculates the depth image (at this point, structured light projector 14 is used for three-dimensional imaging) for obtaining target object.Of the invention real
It applies in example, structured light projector 14 includes light source 141, mirror holder 142, lens 143 and diffraction optical element (diffractive
optical elements,DOE)144.The light beam that light source 141 is sent out is after lens 143 are collimated or converged by diffraction optical element
144 are expanded and are emitted outward with certain beam pattern.Specifically, light source 141 can be formed on chip 15,143 He of lens
Diffraction optical element 144 can be fixed on mirror holder 1422, such as is fixed on mirror holder 142 by way of gluing.
It please refers to Fig.1 and Fig. 5, casing 20 can be as the installation carrier of output module 10, in other words, output module 10 can
To be arranged in casing 20.Casing 20 includes top 21 and bottom 22, in the state of user's normal use electronic device 100,
Top 21 is located at the top of bottom 22, as shown in Figure 1, output module 10 is arranged between top 21 and bottom 22.Incorporated by reference to figure
8, casing 20 offers mounting groove 25, and mounting groove 25 is opened between top 21 and bottom 22.Casing 20 can be electronic device
100 middle shell or shell.
Referring to Fig. 8, display screen 90 is arranged on casing 20 and closes mounting groove 25 to form the installation space of closing.It is aobvious
Display screen 90 is formed with light transmission entity area 91 and alternatively non-transparent district 94, and light transmission entity area 91 does not include image pixel and by multiple images picture
Element surrounds, and image pixel is distributed in alternatively non-transparent district 94, and in other words, alternatively non-transparent district 94 is the viewing area of display screen 90, non-transparent
Area 94 is used to implement the display function of display screen 90.The material in light transmission entity area 91 includes but not limited to glass.Electronic device 100
Outer light may pass through light transmission entity area 91 and enter electronic device 100, without destroying the integrality of display screen 90.Display screen 90
Including can show picture front 92 and with the positive 92 opposite back sides 93.Specifically, when display screen 90 shines and shows picture
During face, the light that display screen 90 is sent out projects display screen 90 from front 92；When display screen 90 is installed on casing 20, mounting groove
25 are located at the opposite both sides (that is, the back side 93 is located between front 92 and mounting groove 25) at the back side 93 with front 92.Of the invention real
It applies in example, output module 10 can be arranged between display screen pane edge and top 21, due to the output of embodiment of the present invention
Module 10 can occupy smaller volume, therefore, for setting the volume of display screen 90 that can correspond to increase in casing 20, with
Improve the screen accounting of electronic device 100.In other embodiments, display screen 90 can be that screen opens up jagged, display comprehensively
Screen 90 surrounds output module 10, and exports module 10 and expose from the notch of display screen 90.In some embodiments, light transmission is real
94 uniform thickness of alternatively non-transparent district of body area 91 and surrounding and continuous.
Referring to Fig. 7, casing 20 is further opened with the infrared through-hole 23 of casing and casing structure light through-hole 24.Output module 10 is set
When putting in casing 20, the through-hole 23 infrared with casing of infrared lamp 12 is corresponding, structured light projector 14 and casing structure light through-hole 24
It is corresponding.Wherein the through-hole 23 infrared with casing of infrared lamp 12 is corresponding refers to the light that infrared lamp 12 is sent out and can be worn from the infrared through-hole 23 of casing
It crosses, specifically, can be infrared lamp 12 with infrared 23 face of through-hole of casing or the light of the transmitting of infrared lamp 12 is through leaded light
The infrared through-hole 23 of casing is passed through after device effect.Structured light projector 14 is corresponding with casing structure light through-hole 24 similarly, herein not
It repeats.In the embodiment as shown in figure 7, the infrared through-hole 23 of casing and casing structure light through-hole 24 can be apart from one another by
, certainly, in other embodiments, the infrared through-hole 23 of casing and casing structure light through-hole 24 can also interconnect.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set
It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated
Go out after the light that module 10 is sent out sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 7
In, cover board 30 covers the infrared through-hole 23 of casing and casing structure light through-hole 24, is coated on the inner surface 32 of cover board 30 infrared
Ink 40 is crossed, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and to visible ray
There is higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device
By the infrared region covered through ink 40 on 100.Specifically, it is infrared to be covered on inner surface 32 not with showing through ink 40
90 corresponding region of display screen.
It is infrared to block at least one of the infrared through-hole 23 of casing and casing structure light through-hole 24 through ink 40,
That is, infrared can block the infrared through-hole 23 of casing and casing structure light through-hole 24 (as shown in Figure 7), user simultaneously through ink 40
It is difficult to see by the infrared through-hole 23 of casing and casing structure light through-hole 24 internal structure of electronic device 100, electronic device 100
Shape it is more beautiful；It is infrared to cover the infrared through-hole 23 of casing, and do not cover casing structure light through-hole 24 through ink 40；
Or the infrared ink 40 that penetrates can also cover casing structure light through-hole 24, and do not cover the infrared through-hole 23 of casing.
Referring to Fig. 8, optical flame detector 52 is single package body structure.Optical flame detector 52 is mounted in mounting groove 25 and positioned at display screen
Side where 90 back side 93, in other words, optical flame detector 52 is located at the lower section of display screen 90.Optical flame detector 52 and light transmission entity area 91
Corresponding, specifically, the visible ray outside electronic device 100 can pass through light transmission entity area 91 and be transmitted on optical flame detector 52.Light sensation
Device 52 receives the visible ray in ambient light, and detects the intensity of visible ray, using the display brightness as control display screen 90 according to
According to.In present embodiment, optical flame detector 52 is first mounted in mounting groove 25 and display screen 90 is installed on casing 20 again, optical flame detector 52
It can contact or be arranged at intervals with display screen 90.In other embodiments, optical flame detector 52 can be first mounted on display screen 90 simultaneously
Make optical flame detector 52 corresponding with light transmission entity area 91, be then again installed to display screen 90 and optical flame detector 52 on casing 20 simultaneously.
Fig. 5 and Fig. 9 are please referred to, proximity sensor 51 is single package body structure.It is sent out close to infrared lamp 13 infrared
Light after being reflected by external object, is received by proximity sensor 51, and proximity sensor 51 is according to the infrared light reflected received
Judge the distance between external object and electronic device 100.
9 are please referred to, imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62.
Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, and imaging sensor 65 is received
Hold in microscope base 63.Microscope base 63 includes mounting surface 631, and mounting surface 631 is between lens barrel 64 and imaging sensor 65.Such as scheming
In embodiment shown in 9, proximity sensor 51 is arranged on mounting surface 631, and specifically, proximity sensor 51 is in mounting surface 631
The plane orthographic projection at place is at least partly dropped on mounting surface 631, in this way, proximity sensor 51 is set with imaging modules 60
Compacter, the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, receiver 70 is for sending out acoustic signals when being encouraged by power supply, user can by by
Words device 70 is conversed.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, defeated
The center for going out module 10, infrared pick-up head 62, visible image capturing head 61 and receiver 70 is located on same line segment.Specifically,
Output module 10, visible image capturing head 61, receiver 70, infrared pick-up head 62 are followed successively by from one end of line segment to the other end
(as shown in Figure 10)；Or output module 10, receiver 70, visible image capturing head are followed successively by from one end of line segment to the other end
61st, infrared pick-up head 62 (as shown in Figure 1)；Or infrared pick-up head 62, defeated is followed successively by from one end of line segment to the other end
Go out module 10, receiver 70, visible image capturing head 61.Certainly, module 10, infrared pick-up head 62, receiver 70 and can are exported
See that the arrangement mode of light video camera head 61 is not limited to above-mentioned citing, there can also be other, such as the central row of each electronic component
Arrange the shapes such as in the arc-shaped, center arrangement is rectangular.
Further, incorporated by reference to Fig. 9, proximity sensor 51 can be arranged on the mounting surface 631 of infrared pick-up head 62,
It can also be arranged on the mounting surface 631 of visible image capturing head 61, certainly, proximity sensor 51 can not also be arranged on mounting surface
On 631, proximity sensor 51 can be disposed adjacent with output module 10, to readily receive by emitting close to infrared lamp 13, and
The infrared light being reflected back by external object；Proximity sensor 51 can also be disposed adjacent with receiver 70, when user receives calls
When, proximity sensor 51 is readily detected the ear of user close to receiver 70.
To sum up, in the electronic device 100 of embodiment of the present invention, pass through the position of mobile light-guide device 13 so that infrared
Lamp 12 can be used as close to infrared lamp or infrared light compensating lamp, integrated structure light projector 14, and it is infrared that output module 10 has gathered transmitting
Light is with the function of infrared distance measurement, infrared light filling and three-dimensional imaging, and therefore, the integrated level for exporting module 10 is higher, and small volume is defeated
Go out the space that module 10 has saved the function of realizing infrared distance measurement, infrared light filling and three-dimensional imaging.In addition, due to project structured light
Device 14 and infrared lamp 12 are carried on a package substrate 111, structured light projector compared to traditional handicraft, close to infrared
Lamp, infrared light compensating lamp need the encapsulation being respectively adopted in different wafer manufacture recombinants to PCB substrate, improve packaging efficiency.
Meanwhile optical flame detector 52 is arranged on the side where the back side 93 of display screen 90, so as to which optical flame detector 52 will not occupy 90 side of display screen
Space between 20 edge of edge and casing, the gap between 20 edge of display screen pane edge and casing can be made smaller namely
It is to say, the display area of display screen 90 can increase, to improve the screen accounting of electronic device 100.
Referring to Fig. 5, in some embodiments, output module 10 further includes metal shutter 16, metal shutter 16
In encapsulating housing 11, and metal shutter 16 is between structured light projector 14 and infrared lamp 12.Metal shutter 16
Between structured light projector 14 and infrared lamp 12, metal shutter 16 on the one hand can with shielding construction light projector 14 with it is red
The luminous intensity and sequential of the mutual electromagnetic interference of outer lamp 12, structured light projector 14 and infrared lamp 12 will not mutual shadows
It rings, another aspect metal shutter 16 can be used for chamber of the 14 place cavity of isolation structures light projector where with infrared lamp 12
Body, light will not enter another cavity from a cavity.
1 is please referred to Fig.1, in some embodiments, output module 10 further includes optics sealing cover 1a.Optics sealing cover 1a is by saturating
Luminescent material is made, and optics sealing cover 1a is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1a wraps red
Outer lamp 12.Specifically, optics sealing cover 1a can be formed by encapsulating injection molding and forming technology, and optics sealing cover 1a may be used transparent
Thermosetting epoxy resin is made, and to be not easy to soften in use, optics sealing cover 1a can fix the position of infrared lamp 12, and cause
Infrared lamp 12 is not easy to shake in encapsulating housing 11.At this point, light-guide device 13 is arranged on other than optics sealing cover 1a and movably
It is housed in encapsulating housing 11.
It please refers to Fig.1 and Fig. 8, in some embodiments, light transmission entity area 91 includes image pixel, electronic device 100
Further include processor 96, optical flame detector 52 receives the light that is incident on optical flame detector 52 to export including outside electronic device 100
The initial beam intensity of environmental light intensity information.Processor 96 is only included with obtaining outside electronic device 100 for handling initial beam intensity
The target light intensity of environmental light intensity information.
Specifically, light transmission entity area 91 includes image pixel, and light transmission entity area 91 can be used for showing image information, meanwhile,
Ambient light can be from light transmission entity area 91 across and into electronic device 100.In some embodiments, light transmission entity area 91
Light transmittance can be more than or equal to 50%.It is appreciated that the light being incident on optical flame detector 52 had both included across light transmission entity area 91
Ambient light part, and include the image pixel in light transmission entity area 91 when showing content to the inside of electronic device 100
The part of the display light of transmitting.Processor 96 can determine that optical flame detector 52 receives according to the content that light transmission entity area 91 is shown
The display light that emits to optical flame detector 52 of light transmission entity area 91, so as to which processor 96 can be according to initial beam intensity and optical flame detector
52 receive the target light that the light intensity that display light generates determines to only include the environmental light intensity information outside electronic device 100 jointly
By force.The electronic device 100 of present embodiment can obtain the environmental light intensity information outside electronic device 100, to be shown as control
The foundation of the display brightness of display screen 90.
Referring to Fig. 1, in some embodiments, initial beam intensity includes environmental light intensity information and display screen 90 shows image
When the display intensity signal that receives of optical flame detector 52, processor 96 for obtaining optical flame detector 52 when display screen 90 shows image in real time
The display intensity signal received, and removal shows intensity signal to obtain target light intensity when handling initial beam intensity.
2 are please referred to Fig.1, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Cover board sound outlet hole 35 is offered, receiver 70 is corresponding with the position of cover board sound outlet hole 35 and casing sound outlet hole.Export module 10, red
The center of outer light video camera head 62 and visible image capturing head 61 is located on same line segment, and receiver 70 is located at the line segment and casing 20
Between top 21.
The center of receiver 70 is not located on the line segment, and it is (output module 10, red to have saved each electronic component on cover board 30
Outer light video camera head 62, visible image capturing head 61 etc.) occupy horizontal space.In embodiment as shown in figure 12, cover board goes out sound
Hole 35 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
3 are please referred to Fig.1, the infrared through-hole 33 of cover board can also be offered in some embodiments, on cover board 30, cover board is red
The through-hole 23 infrared with casing of accessibke porosity 33 is corresponding, and the infrared light that infrared lamp 12 emits can be from lid after passing through the infrared through-hole 23 of casing
Electronic device 100 is pierced by the infrared through-hole 33 of plate.At this point, it can be set with 24 corresponding position of casing structure light through-hole on cover board 30
Infrared transmission ink 40 is put, user is difficult to see that the structure light of the inside of electronic device 100 is thrown by casing structure light through-hole 24
Emitter 14, the shape of electronic device 100 are more beautiful.
4 are please referred to Fig.1, covering plate structure light through-hole 34, cover board knot can also be opened up in some embodiments, on cover board 30
Structure light through-hole 34 is corresponding with casing structure light through-hole 24, and the infrared light that structured light projector 14 emits passes through casing structure light through-hole
Electronic device 100 can be pierced by after 24 from covering plate structure light through-hole 34.At this point, through-hole 23 infrared with casing is corresponding on cover board 30
Position can set it is infrared penetrate ink 40, user is difficult to see by the infrared through-hole 23 of casing the inside of electronic device 100
Light-guide device 13 and infrared lamp 12, the shape of electronic device 100 it is more beautiful.
5 are please referred to Fig.1, in some embodiments, proximity sensor 51 can be arranged on package substrate 111.Specifically
Ground, a part for package substrate 111 are enclosed for bearing structure light projector 14 and infrared lamp 12 with package wall 112 in other words
Into space correspond to；Another part of package substrate 111 is protruding, and proximity sensor 51 can be fixed on package substrate 111
Above and outside encapsulating housing 11.On package substrate 111 can laying-out, circuit can be structured light projector 14, infrared lamp
12 and control and the driver circuit of actuator 17, in one example, circuit is the form of FPC, FPC can simultaneously with close to passing
Sensor 51 connects, control and drive signal for simultaneous transmission proximity sensor 51.
6 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, proximity sensor 51 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, the one of substrate 66
Part is located in microscope base 63, and another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and for carrying image biography
Sensor 65, the other end can be connect with the mainboard of electronic device 100.When proximity sensor 51 is arranged on substrate 66, close to biography
Sensor 51 is arranged on outside microscope base 63, and proximity sensor 51 can also be connect with FPC.
Imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62.Specifically,
Proximity sensor 51 can be fixed on the substrate 66 of visible image capturing head 61；Proximity sensor 51 can be fixed on infrared light and take the photograph
As first 62 substrate 66 on.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with proximity sensor 51, to increase
Add the integral strength of substrate 66 so that FPC is not susceptible to around folding, while when proximity sensor 51 is arranged on substrate 66 is not easy to send out
It is raw to shake.In one example, proximity sensor 51 may be also secured on the lateral wall of microscope base 63, such as pass through cohesive side
Formula is fixed on the lateral wall of microscope base 63.
7 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- top surface 672 and the sub- top surface 673 of third, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the sub- top surface 673 and second of third with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- top surface 671 and the sub- top surface 673 of third to connect first
Sub- top surface 671 and the sub- top surface 673 of third.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- top surface 672 and the sub- top surface 673 of third can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.The sub- top surface 673 of third offers out
Light through-hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through-hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens mould
Group 68 is simultaneously transmitted on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Proximity sensor 51 is set
At the first sub- top surface 671.In present embodiment, imaging modules 60 can be visible image capturing head 61.In other embodiment
In, imaging modules 60 can be infrared pick-up head 62.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 51 is arranged on the first son and is pushed up
On face 671, proximity sensor 51 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, section
Installation space about in electronic device 100.
Please continue to refer to Figure 17, in some embodiments, the proximity sensor 51 of the above embodiment is arranged on first
On sub- top surface 671 and positioned at the outside of camera case 67, specifically, entire proximity sensor 51 is along perpendicular to the first sub- top surface
671 projection can be located in the first sub- top surface 671 (as shown in figure 17)；Alternatively, part proximity sensor 51 along perpendicular to
The projection of first sub- top surface 671 is located in the first sub- top surface 671.It is located at that is, proximity sensor 51 is at least part of
The surface of first sub- top surface 671, in this way, proximity sensor 51 sets compacter with imaging modules 60, the two occupies jointly
Horizontal space it is smaller, further save the installation space in electronic device 100.
8 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, proximity sensor 51
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and transmit
Onto proximity sensor 51.The proximity sensor 51 of present embodiment is arranged in camera case 67, make proximity sensor 51 with
The structure of camera case 67 is more stablized and convenient for proximity sensor 51 and imaging modules 60 is installed on casing 20.
9 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, proximity sensor 51 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image
Sensor 65 is arranged on substrate 66, and proximity sensor 51 may be also secured on substrate 66 and be housed in camera case 67.
Specifically, FPC is provided on substrate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, another
End can be connect with the mainboard of electronic device 100.In other embodiments, proximity sensor 51 can also be connect with FPC.
The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and camera case 67
Structure more stablize and convenient for proximity sensor 51 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Proximity sensor 51 is simultaneously arranged on substrate 66 by setting substrate 66, and proximity sensor 51 is enable to be firmly mounted to camera shell
In body 67.
Figure 20 is please referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through-hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through-holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through-hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens module 68 and be transmitted on imaging sensor 65.This reality
It applies in mode, imaging modules 60 can be visible image capturing head 61, and two camera lens modules 68 are visible image capturing head 61 at this time
Corresponding camera lens module.Proximity sensor 51 is arranged on the second tread 678 and outside camera case 67.In other embodiment party
In formula, imaging modules 60 can be infrared pick-up head 62, and two camera lens modules 68 are that infrared pick-up head 62 corresponds at this time
Camera lens module.In yet another embodiment, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, at this time
Wherein camera lens module 68 is 62 corresponding camera lens module of infrared pick-up head, another camera lens module 68 is visible image capturing head 61
Corresponding camera lens module.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 51 is arranged on the second tread
On 678, proximity sensor 51 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves
Installation space in electronic device 100.
Figure 21 is please referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through-holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating proximity sensor 51 is arranged on the second tread
On 678.
Figure 20 and Figure 21 is please referred to, in some embodiments, the proximity sensor 51 of the above embodiment is arranged on
On two treads 678 and positioned at the outside of camera case 67.Specifically, when notch 675 is opened in the marginal position of top surface 670,
Entire proximity sensor 51 can be located in the second tread 678 (as shown in figure 20) along perpendicular to the projection of the second tread 678；
Alternatively, part proximity sensor 51 is located at along the projection perpendicular to the second tread 678 in the second tread 678.It is that is, close
At least part of surface for being located at the second tread 678 of sensor 51.When notch 675 is opened in the centre position of top surface 670
When upper, entire proximity sensor 51 can be located at (such as Figure 21 in the second tread 678 along perpendicular to the projection of the second tread 678
It is shown).In this way, proximity sensor 51 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, into
One step has saved the installation space in electronic device 100.
Figure 22 is please referred to, the second tread 678 of the above embodiment offers loophole 676, and proximity sensor 51 is located at
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be transmitted to
On proximity sensor 51.The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and phase
The structure of casing body 67 is more stablized and convenient for proximity sensor 51 and imaging modules 60 is installed on casing 20.
Figure 23 is please referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676,
Proximity sensor 51 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image sensing
Device 65 is arranged on substrate 66, and proximity sensor 51 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connect with the mainboard with electronic device 100.In other embodiments, proximity sensor 51 can also be connect with FPC.
The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and camera case 67
Structure more stablize and convenient for proximity sensor 51 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Proximity sensor 51 is simultaneously arranged on substrate 66 by setting substrate 66, and proximity sensor 51 is enable to be firmly mounted to camera shell
In body 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (11)
1. a kind of electronic device, which is characterized in that including：
Casing；
Module is exported, on the housing, the output module includes encapsulating housing, infrared lamp, leads for the output module installation
Optical element and structured light projector, the encapsulating housing include package substrate, the infrared lamp, the light-guide device and the knot
Structure light projector is encapsulated in the encapsulating housing, and the infrared lamp and the structured light projector are carried on the package substrate
On, the light-guide device can be movably arranged in the luminous light path of the infrared lamp, when the light-guide device is positioned at described
When in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting with the first field angle from the encapsulating housing be emitted with
As infrared light compensating lamp or close to infrared lamp；It is described red when the light-guide device is left in the luminous light path of the infrared lamp
The infrared light of outer lamp transmitting is emitted from the encapsulating housing using as close to infrared lamp or infrared light compensating lamp with the second field angle；
Display screen, on the housing, the display screen is formed with light transmission entity area and including that can show for the display screen setting
Show the front of picture and the back side opposite with the front；With
Optical flame detector, the optical flame detector are arranged on the side where the back side of the display screen, the optical flame detector with it is described
Light entity area corresponds to, and the optical flame detector is used to receive the light being incident on the optical flame detector and the target light for exporting the light
By force.
2. electronic device according to claim 1, which is characterized in that
The light-guide device includes convex lens or the lens group with positive light coke, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted from the encapsulating housing using as connecing with the first field angle
Near-infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing using as infrared light compensating lamp；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted from the encapsulating housing using as red with the first field angle
Outer light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing using as close to infrared lamp.
3. electronic device according to claim 1, which is characterized in that the output module further includes chip, described infrared
Lamp is formed on the chip with the structured light projector.
4. electronic device according to claim 3, which is characterized in that the encapsulating housing further includes package wall and encapsulation
Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute
It states encapsulation top and is formed with the first light-emitting window and the second light-emitting window, first light-emitting window is corresponding with the infrared lamp,
Second light-emitting window is corresponding with the structured light projector.
5. electronic device according to claim 3, which is characterized in that the output module further includes metal shutter, institute
Metal shutter is stated to be located in the encapsulating housing, and between the infrared lamp and the structured light projector.
6. electronic device according to claim 1, which is characterized in that the electronic device further includes the cover board of light transmission, institute
It states casing and offers the infrared through-hole of casing and casing structure light through-hole, the infrared lamp is corresponding with the infrared through-hole of the casing, institute
It is corresponding with the casing structure light through-hole to state structured light projector, the cover board setting is on the housing.
7. electronic device according to claim 6, which is characterized in that the cover board is formed with the surface that the casing is combined
Have and only transmit the infrared through ink of infrared light, the infrared ink that penetrates blocks the infrared through-hole of the casing and the casing knot
At least one of structure light through-hole.
8. electronic device according to claim 1, which is characterized in that the electronic device further include proximity sensor and into
As module, the imaging modules include microscope base, the lens barrel on the microscope base and the image biography being housed in the microscope base
Sensor, the microscope base include the mounting surface between the lens barrel and described image sensor, the proximity sensor setting
In the mounting surface.
9. electronic device according to claim 8, which is characterized in that the imaging modules include visible image capturing head and red
At least one of outer light video camera head.
10. electronic device according to claim 1, which is characterized in that the light transmission entity area includes image pixel, described
Electronic device further includes processor, and the optical flame detector receives the light to export the ambient light for including the external electronic device
The initial beam intensity of strong information；The processor only includes the external electronic device for handling the initial beam intensity to obtain
The target light intensity of the environmental light intensity information.
11. electronic device according to claim 10, which is characterized in that the initial beam intensity is believed including the environmental light intensity
Breath and the display screen show display intensity signal during image, and the processor is used to obtain the display screen display figure in real time
As when display intensity signal, and remove when handling the initial beam intensity display intensity signal to obtain the target light
By force.
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| CN201711437453.0A CN108183998A (en) | 2017-12-26 | 2017-12-26 | Electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113421416A (en) * | 2021-06-17 | 2021-09-21 | 维沃移动通信有限公司 | Electronic equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107480589A (en) * | 2017-07-07 | 2017-12-15 | 广东欧珀移动通信有限公司 | Infrared light supply component and electronic installation |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107480589A (en) * | 2017-07-07 | 2017-12-15 | 广东欧珀移动通信有限公司 | Infrared light supply component and electronic installation |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113421416A (en) * | 2021-06-17 | 2021-09-21 | 维沃移动通信有限公司 | Electronic equipment |
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Application publication date: 20180619 |