CN108173988A - Electronic device - Google Patents

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Publication number
CN108173988A
CN108173988A CN201711433448.2A CN201711433448A CN108173988A CN 108173988 A CN108173988 A CN 108173988A CN 201711433448 A CN201711433448 A CN 201711433448A CN 108173988 A CN108173988 A CN 108173988A
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CN
China
Prior art keywords
infrared
casing
head
module
close
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711433448.2A
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Chinese (zh)
Inventor
吴安平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201711433448.2A priority Critical patent/CN108173988A/en
Publication of CN108173988A publication Critical patent/CN108173988A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly

Abstract

The invention discloses a kind of electronic devices.Electronic device includes casing, output module, vibration module, piezoelectric element, mainboard, imaging modules and receiving module.Output module is arranged in casing, including encapsulating housing, structured light projector and close to infrared lamp.Encapsulating housing includes package substrate, and structured light projector close to infrared lamp with being encapsulated in encapsulating housing and being carried on package substrate, and can emit infrared light outside encapsulating housing with different power.Module is vibrated to be mounted on casing.Piezoelectric element is combined with vibration module and with exporting module interval, and for being deformed upon when being applied in electric signal so as to vibrate module vibration.Since output module integrated level is higher, small volume, and imaging modules and receiving module partly overlap on the depth direction of installation gap, have saved the space inside electronic device.In addition, electronic device realizes that osteoacusis is transaudient using piezoelectric element and vibration module, the privacy of dialog context can effectively ensure that.

Description

Electronic device
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of function element set It is more and more, in order to realize the functions such as the facial 3D feature recognitions of distance detection, environment light detection and user, need to set in electronics The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth Numerous function elements is put, the excessive space of mobile phone can be occupied.
Invention content
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Module is exported, the output module is arranged in the casing, and the output module includes encapsulating housing, structure light The projector and close to infrared lamp, the encapsulating housing include package substrate, the structured light projector with it is described close to infrared lamp Be encapsulated in the encapsulating housing and carry on the package substrate, the structured light projector with it is described close to infrared lamp energy It is enough that infrared light is emitted outside the encapsulating housing with different power；
Module is vibrated, the vibration module installation is on the housing；
Piezoelectric element, the piezoelectric element are combined with the vibration module and export module interval, the piezoelectricity with described Element is used to deform upon when being applied in electric signal so that the vibration module vibration；
Mainboard, the mainboard are mounted in the casing and are formed with installation gap；
Imaging modules, the imaging modules are mounted in the casing and corresponding with the installation gap；With
Receiving module, the receiving module are incorporated on the mainboard, and are stretched into from the edge of the installation gap described Installation gap, along the depth direction of the installation gap, the receiving module partly overlaps with the imaging modules, described to connect It receives module and includes proximity sensor and/or optical flame detector.
In some embodiments, the vibration module includes display screen and the cover board of light transmission, the display screen are arranged on Host cavity is collectively formed on the casing and with the casing, the cover board setting is on the housing and positioned at the display screen The side far from the host cavity, the display screen combined with the cover board, and the casing offers spaced casing Through-hole is vibrated close to through-hole, casing structure light through-hole and casing, it is described corresponding close to through-hole with the casing close to infrared lamp, The structured light projector is corresponding with the casing structure light through-hole, and the piezoelectric element is housed in the casing vibration through-hole And it is combined with the cover board.
In some embodiments, the piezoelectric element and the display screen are attached to by fastener on the cover board.
In some embodiments, the output module further includes chip, and the structured light projector is with described close to red Outer lamp is formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly The package substrate extends and is connected at the top of the encapsulation between the package substrate, and structure is formed at the top of the encapsulation Light window and close to window, the structure light window is corresponding with the structured light projector, it is described close to window with it is described close Infrared lamp corresponds to.
In some embodiments, the output module is further included close to lamp lens, described to be arranged on institute close to lamp lens State in encapsulating housing and with it is described corresponding close to infrared lamp.
In some embodiments, the output module further includes metal shutter, and the metal shutter is located at described In encapsulating housing and positioned at the structured light projector and described close between infrared lamp.
In some embodiments, grounding pin, structure light pin are formed with and close to lamp pin on the output module, When the grounding pin and the structure light pin are enabled, the structured light projector emits infrared light；The grounding lead Foot and it is described close to lamp pin be enabled when, it is described close to infrared lamp emit infrared light.
In some embodiments, the cover board is formed with the surface that the casing is combined and only transmits the infrared of infrared light Through ink, the infrared transmission ink blocks the casing and shakes close to through-hole, the casing structure light through-hole and the casing At least one of dynamic through-hole.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head Kind.
In some embodiments, the imaging modules include infrared pick-up head and visible image capturing head, the electronics Device further includes infrared light compensating lamp, the output module, the infrared pick-up head, the visible image capturing head, the piezoelectricity The center of element and the infrared light compensating lamp is located on same line segment, is followed successively by from one end of the line segment to the other end：
The output module, the infrared light compensating lamp, the piezoelectric element, the infrared pick-up head, the visible ray Camera；Or
It is the output module, the infrared pick-up head, the piezoelectric element, the visible image capturing head, described infrared Light compensating lamp；Or
It is the infrared pick-up head, the output module, the piezoelectric element, the visible image capturing head, described infrared Light compensating lamp；Or
The infrared pick-up head, the visible image capturing head, the piezoelectric element, the output module, described infrared Light compensating lamp.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head, infrared light filling Lamp, the center for exporting module, the infrared pick-up head, the visible image capturing head and the infrared light compensating lamp are located at same On one line segment, the piezoelectric element is between the line segment and the top of the casing.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and infrared benefit Light lamp, the quantity of the piezoelectric element be it is multiple, the quantity of the casing vibration through-hole be it is multiple, multiple piezoelectric elements with Multiple casing vibration through-holes correspond to, and each piezoelectric element is housed in the corresponding casing vibration through-hole, described Export module, the infrared pick-up head, the visible image capturing head, multiple piezoelectric elements and the infrared light compensating lamp Center is located on same line segment, and the output module, the infrared pick-up are provided between the two neighboring piezoelectric element At least one of head, the visible image capturing head and described infrared light compensating lamp.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and infrared benefit Light lamp, the piezoelectric element include piezoelectric body and the piezoelectricity convex block stretched out from the piezoelectric body, and the casing vibrates through-hole Quantity to be multiple, multiple piezoelectricity convex blocks are corresponding with multiple casings vibration through-holes, each the piezoelectricity convex portion Be housed in corresponding casing vibration through-hole and combined with the cover board, it is described export module, the infrared pick-up head, The visible image capturing head and the infrared light compensating lamp between the cover board and the piezoelectric body, it is described output module, The infrared pick-up head, the visible image capturing head, multiple piezoelectricity convex blocks and the infrared light compensating lamp center be located at On same line segment, be provided between the two neighboring piezoelectricity convex block it is described output module, the infrared pick-up head, it is described can See at least one of light video camera head and the infrared light compensating lamp.
In the electronic device of embodiment of the present invention, output module is by structured light projector with being integrated into one close to infrared lamp A list package body structure has gathered transmitting infrared light with the function of infrared distance measurement and three-dimensional imaging, therefore, has exported the integrated of module Higher, small volume is spent, output module has saved the space for the function of realizing three-dimensional imaging and infrared distance measurement.In addition, due to knot Structure light projector and be carried on same package substrate close to infrared lamp, compared to traditional handicraft structured light projector with connecing Near-infrared lamp, which needs to be respectively adopted in different wafer manufacture recombinants to PCB substrate, to be encapsulated, and improves packaging efficiency.It is further more, electric Sub-device realizes that osteoacusis is transaudient using piezoelectric element and vibration module, instead of traditional receiver knot by air transmitted sound On the one hand the privacy of dialog context is effectively ensured in structure, on the other hand, due to eliminating the receiver of script, avoid and covering Open up through-hole corresponding with receiver on plate, it is simpler in technique, it is also more aesthetically pleasing in appearance.Finally, due to imaging modules and Receiving module partly overlaps on the depth direction of installation gap, and receiving module sets compacter with imaging modules, and the two is common It is smaller with the horizontal space occupied, save the space inside electronic device.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 3 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 4 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 5 is schematic cross-section of the electronic device along V-V lines in Fig. 1；
Fig. 6 is partial sectional schematic view of the electronic device in Fig. 1 along line VI -- VI；
Fig. 7 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Fig. 8 is the electronic component of the electronic device of embodiment of the present invention and the arrangement schematic diagram of piezoelectric element；
Fig. 9 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 10 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 11 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 12 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 13 is partial sectional schematic view of the electronic device along XIII-XIII lines in Figure 12；
Figure 14 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Figure 15 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 16 to Figure 17 is that the electronic device edge of embodiment of the present invention is intercepted with XVI-XVI lines corresponding position in Fig. 1 Partial sectional schematic view；
Figure 18 is the output module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of receiving module；
Figure 19 to Figure 27 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 28 is the stereoscopic schematic diagram of the receiving module of the electronic device of embodiment of the present invention, imaging modules and mainboard； With
Figure 29 is the partial sectional schematic view of the electronic device of embodiment of the present invention.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing To the whole element for representing same or similar element or there is same or like function.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30, electronic component, shakes Dynamic model group 30a (such as Fig. 5) and piezoelectric element 70.Electronic component includes output module 10, receiving module 50 (such as Fig. 7), imaging Module 60 (such as Fig. 7) and infrared light compensating lamp 80.Electronic device 100 can be mobile phone, tablet computer, laptop, intelligent hand Table, Intelligent bracelet, automatic teller machine etc., the embodiment of the present invention are illustrated so that electronic device 100 is mobile phone as an example, it will be understood that electricity The concrete form of sub-device 100 can be other, and this is not restricted.
Fig. 2 and Fig. 3 are please referred to, output module 10 is single package body structure, including encapsulating housing 11, structured light projector 12 With close to infrared lamp 13.
Encapsulating housing 11 is for encapsulating structure light projector 12 simultaneously and close to infrared lamp 13, in other words, project structured light Device 12 and close to infrared lamp 13 simultaneously be encapsulated in encapsulating housing 11.Encapsulating housing 11 includes package substrate 111, package wall 112 and at the top of encapsulation 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic Interference, EMI) Shielding material is made, and output module 10 is had an impact to avoid extraneous electromagnetic interference.
Package substrate 111 is for bearing structure light projector 12 and close to infrared lamp 13.When manufacture exports module 10, knot Structure light projector 12 and can be formed on a piece of chip 14 close to infrared lamp 13, then by structured light projector 12, close to infrared Lamp 13 and chip 14 are set along on package substrate 111, and specifically, chip 14 can be bonded on package substrate 111.Together When, package substrate 111 can be used for (such as the casing 20 of electronic device 100, main with other parts of electronic device 100 Plate 110 (as shown in figure 28)) connection, module 10 will be exported and be fixed in electronic device 100.
Package wall 112 can be set with coil structure light projector 12 and close to infrared lamp 13, and package wall 112 encapsulates certainly Substrate 111 extends, and package wall 112 can be combined with package substrate 111, preferably, package wall 112 is with package substrate 111 It is detachably connected, in order to remove to structured light projector 12 after package wall 112 and overhauled close to infrared lamp 13.Envelope The making material of dress side wall 112 can be the material of impermeable infrared light, to avoid structured light projector 12 or close to infrared lamp 13 The infrared light sent out passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connect with package wall 112.Encapsulation top 113 It is formed with structure light window 1131 and close to window 1132, structure light window 1131 is corresponding with structured light projector 12, structure light The structure light (infrared light) that the projector 12 emits is pierced by from structure light window 1131；Close to window 1132 with it is right close to infrared lamp 13 Should, the infrared light emitted close to infrared lamp 13 is pierced by from close to window 1132.Encapsulation top 113 can be with one with package wall 112 Body shapes to obtain, can also split shape to obtain.In one example, structure light window 1131 and close to window 1132 be logical Hole, the making material at encapsulation top 113 is the material of impermeable infrared light.In another example, encapsulation top 113 is by impermeable infrared The material co-manufactured of the material of light and saturating infrared light forms, specifically, structure light window 1131 and close to window 1132 by saturating The material of infrared light is made, remaining position is made of the material of impermeable infrared light, further, structure light window 1131 and close Window 1132 could be formed with lens arrangement, be sent out with the infrared light for improving from structure light window 1131 and being projected close to window 1132 Firing angle degree, such as structure light window 1131 are formed with concavees lens structure so that across structure light window 1131 divergence of beam to Outer injection；Convex lens structures are formed with close to window 1132, so as to gather outside injection across the light close to window 1132.
Structured light projector 12 further reduces structure light and throws with that can be formed on a piece of chip 14 close to infrared lamp 13 Emitter 12 and the volume close to infrared lamp 13 after integrated, and preparation process is simpler.Structured light projector 12 can outside emitter junction Structure light, structure light can form infrared laser speckle pattern, project structured light to target object surface, by infrared pick-up head 62 Acquisition (as shown in Figure 1) is by the modulated structured light patterns of target object, by analyzing the structured light patterns modulated Calculate the depth image (at this point, structured light projector 12 is used for three-dimensional imaging) for obtaining target object.In embodiments of the present invention, Structured light projector 12 includes light source 121, mirror holder 122, lens 123 and diffraction optical element (diffractive optical elements,DOE)124.The light beam that light source 121 is sent out is expanded after lens 123 are collimated or converged by diffraction optical element 124 And emitted outward with certain beam pattern.Specifically, light source 121 can be formed on chip 14, lens 123 and diffraction optics Element 124 can be fixed on mirror holder 122, such as is fixed on mirror holder 122 by way of gluing.It can be sent out close to infrared lamp 13 Infrared light is penetrated, infrared light passes through close to window 1132 and reaches body surface, 51 (such as Fig. 7 of proximity sensor of electronic device 100 It is shown) infrared light being reflected by the object is received with the distance of detection object to electronic device 100 (at this point, being used close to infrared lamp 13 In infrared distance measurement).
Structured light projector 12 can emit infrared light with different power from close to infrared lamp 13 outside encapsulating housing 11 Line, specifically, with that can emit infrared light simultaneously close to infrared lamp 13, output module 10 is used for structured light projector 12 simultaneously Three-dimensional imaging and infrared distance measurement；Can also structured light projector 12 emit light and do not emit light close to infrared lamp 13, export Module 10 is only used for three-dimensional imaging；Can also structured light projector 12 do not emit light and emit light close to infrared lamp 13, it is defeated Go out module 10 and be only used for infrared distance measurement.Incorporated by reference to Fig. 4, in embodiments of the present invention, export and be formed with grounding pin on module 10 15th, structure light pin 16 and close to lamp pin 17.It grounding pin 15, structure light pin 16 and can be formed in close to lamp pin 17 On package substrate 111, when grounding pin 15 and structure light pin 16 are enabled (that is, grounding pin 15 and structure light pin 16 When accessing circuit turn-on), structured light projector 12 emits infrared light；When grounding pin 15 and when being enabled close to lamp pin 17 (that is, grounding pin 15 and close to lamp pin 17 access circuit turn-on when), close to infrared lamp 13 emit infrared light；Work as grounding lead Foot 15, structure light pin 16 and close to lamp pin 17 be enabled when (that is, grounding pin 15, structure light pin 16 and drawing close to lamp When foot 17 accesses circuit turn-on), structured light projector 12 emits infrared light, and emits infrared light close to infrared lamp 13.
It please refers to Fig.1 and Fig. 5, casing 20 can be as the installation carrier of output module 10, in other words, output module 10 can To be arranged in casing 20.Casing 20 can be the shell of electronic device 100.
Incorporated by reference to Fig. 6, casing 20 includes top 21 and bottom 22, and in position corresponding with electronic component, casing 20 is opened Equipped with spaced casing through-hole 2a is vibrated close to through-hole 23, casing structure light through-hole 24 and casing.Output module 10 is set It is corresponding close to through-hole 23 with casing close to infrared lamp 13 when in casing 20, structured light projector 12 and casing structure light through-hole 24 correspond to.It can wherein be connect close to infrared lamp 13 and casing close to the corresponding light sent out close to infrared lamp 13 that refers to of through-hole 23 from casing Nearly through-hole 23 passes through, and can be close to infrared lamp 13 and casing close to 23 face of through-hole or close to infrared lamp specifically The light of 13 transmittings passes through casing close to through-hole 23 after light-guide device acts on.Structured light projector 12 and casing structure light through-hole 24 correspond to similarly, and therefore not to repeat here.In the embodiment illustrated in fig. 6, casing is close to through-hole 23 and casing structure light through-hole 24 can be apart from one another by certainly, in other embodiments, casing can also close to through-hole 23 and casing structure light through-hole 24 It interconnects.
Module 30a is vibrated to be mounted on casing 20.Vibration module 30a may include display screen 90 and cover board 30, show in other words Display screen 90 is combined formation vibration module 30a with cover board 30, to promote the rigidity of vibration module 30a.Display screen 90 is arranged on casing Host cavity 91 is formed on 20 and with casing 20, cover board 30 is arranged on casing 20 and is located at the separate host cavity 91 of display screen 90 Side, to protect display screen 90.Since the output module 10 of embodiment of the present invention can occupy smaller volume, machine For setting the volume of display screen 90 that can correspond to increase in shell 20, to improve the screen accounting of electronic device 100.Specifically, Display screen 90, output module 10 and piezoelectric element 70 are arranged between top 21 and bottom 22, are filled in user's normal use electronics In the state of putting 100, top 21 is located at the top of bottom 22, as shown in Figure 1, output module 10 can be arranged on display screen 90 with Between top 21.In other embodiments, display screen 90 can open up jagged for screen comprehensively, and display screen 90 surrounds output Module 10, and export module 10 and expose from the notch of display screen 90.
Piezoelectric element 70 is made of ceramics or quartz crystal materials, and piezoelectric element 70 can be single-chip, twin crystal sheet or layer The piezoelectric element 70 of pressure.Piezoelectric element 70 is combined with vibration module 30a and is spaced with output module 10.Specifically, piezoelectric element 70 are housed in casing vibration through-hole 2a and are combined, and be spaced with casing 20, Ke Yishi with cover board 30：It receives 70 part of piezoelectric element Hold in casing vibration through-hole 2a or piezoelectric element 70 is housed in completely in the logical 2a holes of casing vibration.When the two of piezoelectric element 70 When end is applied with electric signal (voltage), due to inverse piezoelectric effect, mechanical deformation, such as expansion or shrinkage occur for piezoelectric element 70, The vibration module 30a combined with piezoelectric element 70 is driven to be vibrated according to the frequency of the electric signal as a result,.When the body of user is with shaking When dynamic model group 30a is contacted, the part that osteoacusis sound is contacted by the body of user with vibration module 30a is (for example, external ear is soft Bone, tooth) it is sent to the auditory nerve of user.In this way, user can realize voice by piezoelectric element 70 and vibration module 30a It the functions such as converses, listen to music.In embodiments of the present invention, the processor of electronic device 100 is used to obtain voice signal, and pressing The both ends of electric device 70 apply electric signal corresponding with the voice signal.Processor is mounted on mainboard 110.
It is appreciated that traditional telephone receiver structure, using air transmitted sound, part acoustic pressure usually exists when receiver works 90dB~100dB or so, in ambient enviroment quieter (under the working environment as 50dB or so) even if sound is transmitted to week It encloses 1 meter of range and also still remains with 50dB~60dB or so, the chat script between caller is caused to be perceived by surrounding, secret is caused to be let out Dew.The electronic device 100 of embodiment of the present invention realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a, call Sound be mainly perceived by the user by the osteoacusis vibrated, can effectively ensure that the privacy of dialog context.
Referring to Fig. 5 and Fig. 6, piezoelectric element 70 and display screen 90 are attached to by fastener 30b on cover board 30. Fastener 30b is with heat curable properties, the adhesive of UV-curing characteristics, double faced adhesive tape, viscose etc..For example, fastener 30b can To be Photoelasticity resin (the UV curable acrylic adhesive of colorless and transparent).Cover board 30 is combined with piezoelectric element 70 Region and cover board 30 combined with display screen 90 it is interregional every to prevent the display of display screen 90 by piezoelectric element 70 Interference.Certainly, cover board 30 can also be bonded to casing 20 by fastener 30b, be set up directly on casing 20 compared to cover board 30, The vibration of vibration module 30a can be prevented to be transmitted directly onto casing 20, to reduce user because of the Oscillation Amplitude of casing 20 Possibility that is excessive and falling electronic device 100.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated Go out after the light that module 10 is sent out sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 6 In, cover board 30 covers casing structure light through-hole 24 and casing close to through-hole 23, is coated on the inner surface 32 of cover board 30 infrared Ink 40 is crossed, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and to visible ray There is higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device By the infrared region covered through ink 40 on 100.Specifically, it is infrared to be covered on inner surface 32 not with showing through ink 40 90 corresponding region of display screen.
It is logical close to the vibration of through-hole 23, casing structure light through-hole 24 and casing that infrared transmission ink 40 can also block casing At least one of hole 2a, that is, infrared to cover casing simultaneously close to through-hole 23, casing structure light through-hole 24 through ink 40 With casing vibration through-hole 2a (as shown in Figure 6), user is difficult to through casing close to through-hole 23, casing structure light through-hole 24 and casing Vibration through-hole 2a sees the internal structure of electronic device 100, and the shape of electronic device 100 is more beautiful；It is infrared to penetrate ink 40 Casing can be covered close to through-hole 23, and do not cover casing structure light through-hole 24 and casing vibration through-hole 2a；It is infrared to penetrate ink 40 can also cover casing structure light through-hole 24, and not cover casing close to through-hole 23 and casing vibration through-hole 2a；Infrared transmission Ink 40 can also cover casing vibration through-hole 2a, and not cover casing close to through-hole 23 and casing structure light through-hole 24；It is infrared Casing can also be covered close to through-hole 23 and casing structure light through-hole 24 through ink 40, and does not cover casing vibration through-hole 2a； It is infrared to cover casing structure light through-hole 24 and casing vibration through-hole 2a through ink 40, and casing is not covered close to through-hole 23；It is infrared to cover casing close to through-hole 23 and casing vibration through-hole 2a through ink 40, and casing structure light is not covered Through-hole 24.
Referring to Fig. 7, receiving module 50 is integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and optical flame detector 52 are collectively formed single package body structure.The infrared light sent out close to infrared lamp 13 after being reflected by external object, is passed by close Sensor 51 receives, proximity sensor 51 according to the infrared light reflected received judge external object and electronic device 100 it Between distance.Optical flame detector 52 receives the visible ray in ambient light, and detects the intensity of visible ray, using as control display screen 90 The foundation of display brightness.Proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, when reduction the two is individually assembled Gap, save electronic device 100 in installation space.
It please refers to Fig.1 and Fig. 7, imaging modules 60 can be visible image capturing head 61 and one in infrared pick-up head 62 Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, and image passes Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it Between.In the embodiment as shown in figure 7, receiving module 50 is arranged on mounting surface 631, and specifically, receiving module 50 is being installed Plane orthographic projection where face 631 is at least partly dropped on mounting surface 631, in this way, receiving module 50 is set with imaging modules 60 Put compacter, the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, infrared light compensating lamp 80 emits infrared light for outside, after infrared light is reflected by external object surface, The infrared pick-up head 62 of electronic device 100 receives the infrared light that is reflected by the object to obtain the image information of object.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, defeated Go out the center of module 10, infrared pick-up head 62, visible image capturing head 61, piezoelectric element 70 and infrared light compensating lamp 80 positioned at same On line segment.Specifically, output module 10, infrared light compensating lamp 80, piezoelectric element 70, red is followed successively by from one end of line segment to the other end Outer light video camera head 62, visible image capturing head 61 (as shown in Figure 8)；Or output module is followed successively by from one end of line segment to the other end 10th, infrared pick-up head 62, piezoelectric element 70, visible image capturing head 61, infrared light compensating lamp 80 (as shown in Figure 1)；Or from line One end of section is followed successively by infrared pick-up head 62 to the other end, exports module 10, piezoelectric element 70, visible image capturing head 61, red Outer light compensating lamp 80；Or infrared pick-up head 62, visible image capturing head 61, piezoelectricity member are followed successively by from one end of line segment to the other end Part 70, output module 10, infrared light compensating lamp 80.Certainly, module 10, infrared pick-up head 62, piezoelectric element 70, visible ray are exported Camera 61, infrared light compensating lamp 80 arrangement mode be not limited to above-mentioned citing, can also have other, such as each electronic component The shapes such as center arrangement in the arc-shaped, center arrangement is rectangular.
Referring to Fig. 9, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62.Export module 10, red The center of outer light video camera head 62, visible image capturing head 61 and infrared light compensating lamp 80 is located on same line segment, and piezoelectric element 70 is located at Between line segment and the top 21 of casing 20.Specifically, output module 10, infrared light filling are followed successively by from one end of line segment to the other end Lamp 80, infrared pick-up head 62, visible image capturing head 61；Or be followed successively by from one end of line segment to the other end output module 10, Infrared pick-up head 62, visible image capturing head 61, infrared light compensating lamp 80 (as shown in Figure 9)；Or from one end of line segment to another End is followed successively by infrared pick-up head 62, output module 10, visible image capturing head 61, infrared light compensating lamp 80；Or one from line segment The other end is held to be followed successively by infrared pick-up head 62, visible image capturing head 61, output module 10, infrared light compensating lamp 80.Certainly, it is defeated Go out module 10, infrared pick-up head 62, visible image capturing head 61, infrared light compensating lamp 80 arrangement mode be not limited to above-mentioned act Example.In embodiments of the present invention, the center of piezoelectric element 70 is not located on the line segment, has saved piezoelectric element 70 and each electronics member The horizontal space that device (output module 10, infrared pick-up head 62, visible image capturing head 61, infrared light compensating lamp 80 etc.) occupies.
Further, incorporated by reference to Fig. 7, receiving module 50 can be arranged on the mounting surface 631 of infrared pick-up head 62, It can be arranged on the mounting surface 631 of visible image capturing head 61, certainly, receiving module 50 can not also be arranged on mounting surface 631 On, receiving module 50 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received by being sent out close to infrared lamp 13 It penetrates, and the infrared light being reflected back by external object；Receiving module 50 can also be disposed adjacent with piezoelectric element 70, not limited herein System.
To sum up, in the electronic device 100 of embodiment of the present invention, output module 10 by structured light projector 12 with close to red Outer lamp 13 is integrated into a single package body structure, has gathered transmitting infrared light with the function of infrared distance measurement and three-dimensional imaging, therefore, The integrated level for exporting module 10 is higher, small volume, and output module 10 has saved the function of realizing three-dimensional imaging and infrared distance measurement Space.In addition, since structured light projector 12 close to infrared lamp 13 with being carried on same package substrate 111, compared to The structured light projector 12 of traditional handicraft needs to be respectively adopted different wafers manufacture recombinants to PCB substrate from close to infrared lamp 13 Upper encapsulation, improves packaging efficiency.Further more, electronic device 100 realizes that osteoacusis passes using piezoelectric element 70 and vibration module 30a Sound, instead of traditional telephone receiver structure by air transmitted sound, on the one hand, can effectively ensure that the privacy of dialog context； On the other hand, it due to eliminating the receiver of script, avoids and through-hole corresponding with receiver is opened up on cover board 30, in technique It is simpler, it is also more aesthetically pleasing in appearance, and can prevent dust or moisture from entering in electronic device 100.
Fig. 6 and Figure 10 are please referred to, in some embodiments, imaging modules 60 include visible image capturing head 61 and infrared light Camera 62.Casing 20 offers spaced casing and vibrates through-hole close to through-hole 23, casing structure light through-hole 24 and casing 2a.Corresponding close to through-hole 23 with casing close to infrared lamp 13, structured light projector 12 is corresponding with casing structure light through-hole 24.Piezoelectricity The quantity of element 70 is multiple, and the quantity of casing vibration through-hole 2a is multiple, and multiple piezoelectric elements 70 and the vibration of multiple casings are logical Hole 2a is corresponded to, and each piezoelectric element 70 is housed in corresponding casing vibration through-hole 2a.Export module 10, infrared pick-up head 62nd, the center of visible image capturing head 61, multiple piezoelectric elements 70 and infrared light compensating lamp 80 is located on same line segment, two neighboring pressure It is provided between electric device 70 in output module 10, infrared pick-up head 62, visible image capturing head 61 and infrared light compensating lamp 80 It is at least one.For example, the quantity of piezoelectric element 70 is two, piezoelectric element 70, defeated is followed successively by from one end of line segment to the other end Go out module 10, infrared light compensating lamp 80, infrared pick-up head 62, visible image capturing head 61, piezoelectric element 70 (as shown in Figure 10)；Or Person is followed successively by piezoelectric element 70, output module 10, infrared pick-up head 62, visible image capturing head from one end of line segment to the other end 61st, piezoelectric element 70, infrared light compensating lamp 80 etc..In another example the quantity of piezoelectric element 70 is three, from one end of line segment to another End is followed successively by piezoelectric element 70, output module 10, infrared light compensating lamp 80, piezoelectric element 70, infrared pick-up head 62, visible ray and takes the photograph As head 61, piezoelectric element 70 (as shown in figure 11)；Or piezoelectric element 70, output mould are followed successively by from one end of line segment to the other end Group 10, piezoelectric element 70, infrared pick-up head 62, visible image capturing head 61, piezoelectric element 70, infrared light compensating lamp 80 etc..Certainly, It is the quantity and piezoelectric element 70 of piezoelectric element 70, output module 10, infrared pick-up head 62, visible image capturing head 61, infrared The arrangement mode of light compensating lamp 80 is not limited to above-mentioned citing.In embodiments of the present invention, multiple piezoelectric elements 70 and 30 knot of cover board It closes, in particular multiple piezoelectric elements 70 are attached to by fastener 30b on cover board 30 respectively.The processor of electronic device 100 For obtaining voice signal, and apply electric signal corresponding with the voice signal at the both ends of multiple piezoelectric elements 70 simultaneously, it is more Mechanical deformation occurs for a piezoelectric element 70, and multiple piezoelectric elements 70 are from the multiple and different band of positions combined with cover board 30 as a result, Dynamic vibration module 30a is vibrated according to the frequency of the electric signal.When the body of user is contacted with vibration module 30a, osteoacusis sound The sense of hearing god of user is sent to the vibration module 30a parts (for example, the cartilage of external ear, tooth) contacted by the body of user Through.
In embodiments of the present invention, multiple piezoelectric elements 70 drive simultaneously from the multiple and different positions combined with cover board 30 Vibrate module 30a vibration, the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts To the auditory nerve of user.
Fig. 6, Figure 12 and Figure 13 are please referred to, in some embodiments, imaging modules 60 include 61 He of visible image capturing head Infrared pick-up head 62.Casing 20 offers spaced casing and shakes close to through-hole 23, casing structure light through-hole 24 and casing Dynamic through-hole 2a.Corresponding close to through-hole 23 with casing close to infrared lamp 13, structured light projector 12 and casing structure light through-hole 24 are right It should.Piezoelectric element 70 includes piezoelectric body 71 and the piezoelectricity convex block 72 stretched out from piezoelectric body 71, the quantity of piezoelectricity convex block 72 are Multiple, the quantity of casing vibration through-hole 2a is multiple, and multiple piezoelectricity convex blocks 72 are corresponding with multiple casings vibration through-hole 2a, each to press Electric 72 partial receipt of convex block is combined in corresponding casing vibration through-hole 2a and with cover board 30.Export module 10, infrared pick-up First 62, visible image capturing head 61 and infrared light compensating lamp 80 are between cover board 30 and piezoelectric body 71.Export module 10, infrared Light video camera head 62, visible image capturing head 61, multiple piezoelectricity convex blocks 72 and infrared light compensating lamp 80 center be located on same line segment, phase Output module 10, infrared pick-up head 62, visible image capturing head 61 and infrared light filling are provided between adjacent two piezoelectricity convex blocks 72 At least one of lamp 80.For example, the quantity of piezoelectricity convex block 72 is two, it is convex to be followed successively by piezoelectricity from one end of line segment to the other end Block 72, output module 10, infrared light compensating lamp 80, infrared pick-up head 62, visible image capturing head 61, piezoelectricity convex block 72；Or from One end of line segment to the other end be followed successively by piezoelectricity convex block 72, output module 10, infrared pick-up head 62, visible image capturing head 61, Piezoelectricity convex block 72, infrared light compensating lamp 80 etc..In another example the quantity of piezoelectricity convex block 72 is three, from one end of line segment to the other end It is followed successively by piezoelectricity convex block 72, output module 10, infrared light compensating lamp 80, piezoelectricity convex block 72, infrared pick-up head 62, visible image capturing First 61, piezoelectricity convex block 72；Or piezoelectricity convex block 72, output module 10, piezoelectricity convex block are followed successively by from one end of line segment to the other end 72nd, infrared pick-up head 62, visible image capturing head 61, piezoelectricity convex block 72, infrared light compensating lamp 80 etc..For another example piezoelectricity convex block 72 Quantity for five, piezoelectricity convex block 72, output module 10, piezoelectricity convex block 72, infrared is followed successively by from one end of line segment to the other end Light compensating lamp 80, piezoelectricity convex block 72, infrared pick-up head 62, piezoelectricity convex block 72, visible image capturing head 61, piezoelectricity convex block 72 are (as schemed Shown in 13).Certainly, the quantity of piezoelectricity convex block 72 and piezoelectricity convex block 72, output module 10, infrared pick-up head 62, visible ray Camera 61, infrared light compensating lamp 80 arrangement mode be not limited to above-mentioned citing.In embodiments of the present invention, multiple piezoelectricity convex blocks 72 are combined with cover board 30, and more specifically multiple piezoelectricity convex blocks 72 are attached to by fastener 30b on cover board 30 respectively.Electronics fills 100 processor is put for obtaining voice signal, and electric signal corresponding with the voice signal is applied to piezoelectric element 70, including Mechanical deformation occurs for piezoelectric element 70 including piezoelectric body 71 and piezoelectricity convex block 72, as a result, multiple piezoelectricity convex blocks 72 from lid Multiple and different positions that plate 30 combines drive vibration module 30a to be vibrated according to the frequency of the electric signal.When the body of user is with shaking When dynamic model group 30a is contacted, the part that osteoacusis sound is contacted by the body of user with vibration module 30a is (for example, external ear is soft Bone, tooth) it is sent to the auditory nerve of user.
In as shown for example in fig.13, casing 20 offers spaced casing vibration through-hole 2a, output through-hole 25th, light filling through-hole 26, infrared light through-hole 27, visible ray through-hole 28.Casing vibration through-hole 2a is corresponding with piezoelectricity convex block 72, and output is logical Hole 25 is corresponding with output module 10, and light filling through-hole 26 is corresponding with infrared light compensating lamp 80, infrared light through-hole 27 and infrared pick-up head 62 correspond to, it is seen that light through-hole 28 is corresponding with visible image capturing head 61.Wherein, output through-hole 25 is alternatively into above-mentioned spaced Casing is close to through-hole 23 and casing structure light through-hole 24 or output through-hole 25 by said machine casing close to through-hole 23 and casing structure The connection of light through-hole 24 is formed.In addition, the structure light for referring to infrared light compensating lamp 80 and sending out corresponding with infrared light compensating lamp 80 of light filling through-hole 26 It can be passed through from light filling through-hole 26, the infrared pick-up head 62 that refers to corresponding with infrared pick-up head 62 of infrared light through-hole 27 can be from infrared light Through-hole 27 receives the infrared light being reflected by the object, it is seen that light through-hole 28 is corresponding with visible image capturing head 61 to refer to visible image capturing head 61 The visible ray being reflected by the object can be received from visible ray through-hole 28.
In embodiments of the present invention, multiple piezoelectricity convex blocks 72 drive vibration from the multiple and different positions combined with cover board 30 Module 30a vibrates, and the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts to use The auditory nerve at family；In addition, multiple piezoelectricity convex blocks 72 are stretched out from same piezoelectric body 71, convenient for multiple piezoelectricity convex blocks 72 simultaneously Apply electric signal, to be vibrated from multiple and different position synchronous drives vibration module 30a；Further more, output module 10, infrared pick-up First 62, visible image capturing head 61 and infrared light compensating lamp 80 are between cover board 30 and piezoelectric body 71, and intert and be provided with piezoelectricity Convex block 72,100 overall volume of electronic device is smaller, saves space.
Referring to Fig. 3, in some embodiments, output module 10 is further included close to lamp lens 19.Close to lamp lens 19 It is arranged in encapsulating housing 11 and corresponding with close to infrared lamp 13.Close to the infrared light that infrared lamp 13 emits close to lamp lens 19 Under the action of converge to close in window 1132 and project, reduce other regions for being emitted to package wall 112 and encapsulation top 113 Light quantity.
Referring to Fig. 3, in some embodiments, output module 10 further includes metal shutter 18, metal shutter 18 In encapsulating housing 11, and metal shutter 18 is located at structured light projector 12 and close between infrared lamp 13.Metal blocks Plate 18 is located at structured light projector 12 and close between infrared lamp 13, and metal shutter 18 on the one hand can be with shielding construction light projection Device 12 with close to the mutual electromagnetic interference of infrared lamp 13, structured light projector 12 and the luminous intensity close to infrared lamp 13 and Sequential will not interact, and another aspect metal shutter 18 can be used for the cavity at 12 place of isolation structures light projector with connecing Cavity where near-infrared lamp 13, light will not enter another cavity from a cavity.
4 are please referred to Fig.1, in some embodiments, output module 10 further includes optics sealing cover 1a.Optics sealing cover 1a is by saturating Luminescent material is made, and optics sealing cover 1a is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1a, which is wrapped, to be connect Near-infrared lamp 13.Specifically, optics sealing cover 1a can be formed by encapsulating injection molding and forming technology, and optics sealing cover 1a may be used Bright thermosetting epoxy resin is made, and to be not easy to soften in use, optics sealing cover 1a can fix the position close to infrared lamp 13 It puts, and to be not easy to shake in encapsulating housing 11 close to infrared lamp 13.
5 are please referred to Fig.1, in some embodiments, proximity sensor 51 can be not integrated in reception mould with optical flame detector 52 In group 50, in other words, proximity sensor 51 is separately set with optical flame detector 52.At this point, proximity sensor 51 can be arranged on microscope base On 63 mounting surface 631；Optical flame detector 52 can also be arranged on the mounting surface 631 of microscope base 63；Or proximity sensor 51 and light Sensor 52 is arranged on the mounting surface 631 of microscope base 63 simultaneously.Microscope base 63 can be the microscope base 63 of infrared pick-up head 62, can also It is the microscope base 63 of visible image capturing head 61.
6 are please referred to Fig.1, covering plate structure light through-hole 34, cover board can also be offered in some embodiments, on cover board 30 Structure light through-hole 34 is corresponding with casing structure light through-hole 24, and the infrared light that structured light projector 12 emits leads to across casing structure light Electronic device 100 can be pierced by behind hole 24 from covering plate structure light through-hole 34.It is at this point, right close to through-hole 23 with casing on cover board 30 The position answered can set infrared transmission ink 40, and user is difficult to close to through-hole 23 see in electronic device 100 by casing Portion close to infrared lamp 13, the shape of electronic device 100 is more beautiful.
7 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to through-hole 33, cover board approaches Through-hole 33 is corresponding close to through-hole 23 with casing, and the infrared light emitted close to infrared lamp 13 passes through casing can be from close to after through-hole 23 Cover board is pierced by electronic device 100 close in through-hole 33.It at this point, can be with 24 corresponding position of casing structure light through-hole on cover board 30 Infrared transmission ink 40 is set, and user is difficult to see by casing structure light through-hole 24 structure light of the inside of electronic device 100 The projector 12, the shape of electronic device 100 are more beautiful.
8 are please referred to Fig.1, in some embodiments, receiving module 50 can be arranged on package substrate 111.Specifically, A part for package substrate 111 is enclosed for bearing structure light projector 12 and close to infrared lamp 13 with package wall 112 in other words Into space correspond to；Another part of package substrate 111 is protruding, and receiving module 50 can be fixed on package substrate 111 And outside encapsulating housing 11.On package substrate 111 can laying-out, circuit can be structured light projector 12 and close to infrared The control of lamp 13 and driver circuit, in one example, circuit are the form of FPC, and FPC can connect with receiving module 50 simultaneously It connects, control and drive signal for simultaneous transmission receiving module 50.
At this point, receiving module 50 can be integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and optical flame detector 52 are collectively formed single package body structure, reduce gap when the two is individually assembled；Receiving module 50 can also be only included close to biography Sensor 51, optical flame detector 52 can separately be arranged on other positions；Receiving module 50 can also only include optical flame detector 52, close to sensing Device 51 can separately be arranged on other positions.
9 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on On substrate 66, receiving module 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, one of substrate 66 Divide and be located in microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and is used to carry image sensing Device 65, the other end can be connect with the mainboard 110 of electronic device 100.When receiving module 50 is arranged on substrate 66, receiving module 50 are arranged on outside microscope base 63, and receiving module 50 can also be connect with FPC.
Further, the receiving module 50 for being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, close to sensing Single package body structure is collectively formed with optical flame detector 52 in device 51, reduces gap when the two is individually assembled, saves in electronic device 100 Installation space.In other embodiments, the receiving module 50 for being arranged on substrate 66 includes proximity sensor 51 or/and light sensation Device 52, proximity sensor 51 and optical flame detector 52 are respectively single package body structure.That is, the receiving module 50 for being arranged on substrate 66 is single The proximity sensor 51 of package body structure；Alternatively, the receiving module 50 for being arranged on substrate 66 is the optical flame detector of single package body structure 52；Alternatively, the receiving module 50 for being arranged on substrate 66 is the proximity sensor 51 of single package body structure and single package body structure Optical flame detector 52.
Imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62.Specifically, Receiving module 50 can be fixed on the substrate 66 of visible image capturing head 61；Receiving module 50 can be fixed on infrared pick-up head On 62 substrate 66.When proximity sensor 51 and optical flame detector 52 are encapsulated for split, proximity sensor 51 can be fixed on visible On the substrate 66 of light video camera head 61, optical flame detector 52 can be fixed on the substrate 66 of infrared pick-up head 62；Alternatively, optical flame detector 52 It can be fixed on the substrate 66 of visible image capturing head 61, proximity sensor 51 can be fixed on the substrate of infrared pick-up head 62 On 66；Alternatively, proximity sensor 51 is each attached to optical flame detector 52 on the substrate 66 of visible image capturing head 61；Alternatively, close to passing Sensor 51 is each attached to optical flame detector 52 on the substrate 66 of infrared pick-up head 62.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with receiving module 50, to increase The integral strength of substrate 66 so that FPC is not susceptible to around folding, while receiving module 50 (or proximity sensor 51 or optical flame detector 52) It is not susceptible to shake when being arranged on substrate 66.In one example, receiving module 50 (or proximity sensor 51 or optical flame detector 52) it may be also secured on the lateral wall of microscope base 63, such as be fixed on the lateral wall of microscope base 63 by cohesive mode.
Figure 20 is please referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67 Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- top surface 672 and the sub- top surface 673 of third, the second son top 672 and first sub- top surface 671 of face tilts connection and forms notch 675, the sub- top surface 673 and second of third with the first sub- top surface 671 Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- top surface 671 and the sub- top surface 673 of third to connect first Sub- top surface 671 and the sub- top surface 673 of third.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight Angle, the angle between the second sub- top surface 672 and the sub- top surface 673 of third can be obtuse angle or right angle.Notch 675 is opened in camera shell On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.The sub- top surface 673 of third offers out Light through-hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through-hole 674.Imaging sensor 65 is housed in In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens mould Group 68 is simultaneously transmitted on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Receiving module 50 is arranged on At first sub- top surface 671, receiving module 50 includes proximity sensor 51 and optical flame detector 52.In present embodiment, imaging modules 60 Can be visible image capturing head 61, receiving module 50 is single packaging body knot that proximity sensor 51 is collectively formed with optical flame detector 52 Structure.Proximity sensor 51 can be consistent with the extending direction of notch 675 (such as Figure 20 institutes with the center line connecting direction of optical flame detector 52 Show)；Alternatively, proximity sensor 51 can be vertical with the extending direction of notch 675 with the center line connecting direction of optical flame detector 52 or be in The angle that the two is formed is acute angle or obtuse angle.In other embodiments, imaging modules 60 can be infrared pick-up head 62.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the first sub- top surface On 671, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves Installation space in electronic device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce The installation space in electronic device 100 is saved in gap when the two is individually assembled.
Please continue to refer to Figure 20, in some embodiments, the receiving module 50 of the above embodiment is arranged on the first son On top surface 671 and positioned at the outside of camera case 67, specifically, entire receiving module 50 is along perpendicular to the first sub- top surface 671 Projection can be located in the first sub- top surface 671 (as shown in figure 20)；Alternatively, part receiving module 50 is pushed up along perpendicular to the first son The projection in face 671 is located in the first sub- top surface 671.That is, receiving module 50 is at least part of to be located at the first sub- top surface 671 surface, in this way, receiving module 50 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly compared with It is small, further save the installation space in electronic device 100.In other embodiments, receiving module 50 is included close to biography Sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two individual single package body structures, at this point, being respectively The proximity sensor 51 and optical flame detector 52 of single package body structure can also be all disposed on the first sub- top surface 671.
Figure 21 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes proximity sensor 51, not comprising optical flame detector 52, tied at this point, proximity sensor 51 (or receiving module 50) is respectively monomer encapsulation with optical flame detector 52 Structure, proximity sensor 51 are arranged on the first sub- top surface 671, and optical flame detector 52 is arranged on any other except the first sub- top surface 671 Position.
Please continue to refer to Figure 21, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, and not comprising proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively monomer envelope with proximity sensor 51 Assembling structure, optical flame detector 52 are arranged on the first sub- top surface 671, proximity sensor 51 be arranged on except the first sub- top surface 671 other Any position.
Figure 22 is please referred to, the first sub- top surface 671 of the above embodiment offers loophole 676, and receiving module 50 is located at It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without light sensation Device 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 The light in portion can pass through loophole 676 and be transmitted on proximity sensor 51.The receiving module 50 of present embodiment is arranged on In camera case 67, receiving module 50 and the structure of camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging mould Group 60 is installed on casing 20.
Please continue to refer to Figure 22, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without connecing Nearly sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electricity Light outside sub-device 100 can pass through loophole 676 and be transmitted on optical flame detector 52.The receiving module 50 of present embodiment Be arranged in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with Imaging modules 60 are installed on casing 20.
Figure 23 is please referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 be integrated with it is close When sensor 51 is with optical flame detector 52, loophole 676 can be one and proximity sensor 51 and the corresponding light transmission of optical flame detector 52 Hole or two it is spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that light can pass through loophole 676 and be transmitted in receiving module 50.In other realities It applies in mode, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two Individually list package body structure, at this point, being respectively the proximity sensor 51 of single package body structure and optical flame detector 52 can also all set It puts in camera case 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, is made Receiving module 50 and the structure of camera case 67 are more stablized and convenient for receiving module 50 and imaging modules 60 are installed to casing On 20.
Figure 23 is please referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connect with the mainboard 110 with electronic device 100.In other embodiments, receiving module 50 can also be connect with FPC.This reality Apply in mode, be arranged on receiving module 50 on substrate 66 and include proximity sensor 51 and optical flame detector 52, proximity sensor 51 with Single package body structure is collectively formed in optical flame detector 52, reduces gap when the two is individually assembled, saves the installation in electronic device 100 Space.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 is also encapsulated for monomer Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at Outside camera case 67.
In yet another embodiment, optical flame detector 52 is only included in receiving module 50, proximity sensor 51, which is not integrated into, to be connect It receives in module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 is also sealed for monomer Assembling structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when one of substrate 66 Divide and be located in camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate On 66 and outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.
Figure 24 is please referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677 678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677 Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle. Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two A light extraction through-hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through-holes 674 Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions Through-hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68, Light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens module 68 and be transmitted on imaging sensor 65.This reality It applies in mode, imaging modules 60 can be visible image capturing head 61, and two camera lens modules 68 are visible image capturing head 61 at this time Corresponding camera lens module.Receiving module 50 is arranged on the second tread 678 and outside camera case 67.Receiving module 50 is connects Single package body structure that nearly sensor 51 is collectively formed with optical flame detector 52.The line of centres side of proximity sensor 51 and optical flame detector 52 To can be consistent with the extending direction of notch 675；Alternatively, the center line connecting direction of proximity sensor 51 and optical flame detector 52 can be with The angle that the extending direction of notch 675 vertical (as shown in figure 24) or the two are formed is acute angle or obtuse angle.In other embodiment In, imaging modules 60 can be infrared pick-up head 62, and two camera lens modules 68 are that infrared pick-up head 62 is corresponding at this time Camera lens module.In yet another embodiment, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, at this time its In camera lens module 68 be 62 corresponding camera lens module of infrared pick-up head, another camera lens module 68 is visible image capturing head 61 corresponding camera lens modules.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the second tread 678 On, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, has saved electronics Installation space in device 100；Both meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce The installation space in electronic device 100 is saved in individually gap during assembling.
Figure 25 is please referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670 On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through-holes 674 are opened in the first son respectively On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675 Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face 679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678, Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating receiving module 50 is arranged on the second tread On 678.
Figure 24 and Figure 25 is please referred to, in some embodiments, the receiving module 50 of the above embodiment is arranged on second On tread 678 and positioned at the outside of camera case 67.Specifically, it is whole when notch 675 is opened in the marginal position of top surface 670 A receiving module 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part receives mould Group 50 is located at along the projection perpendicular to the second tread 678 in the second tread 678 (as shown in figure 24).That is, receiving module The 50 at least part of surfaces for being located at the second tread 678.It is whole when notch 675 is opened on the centre position of top surface 670 A receiving module 50 can be located in the second tread 678 (as shown in figure 25) along perpendicular to the projection of the second tread 678.Such as This, receiving module 50 sets compacter with imaging modules 60, and the horizontal space that the two occupies jointly is smaller, further saves Installation space in electronic device 100.In other embodiments, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two individual single package body structures, at this point, being respectively single package body structure Proximity sensor 51 and optical flame detector 52 can also be all disposed on the second tread 678.
Figure 25 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes close to sensing Device 51, receiving module 50 does not include optical flame detector 52, at this point, proximity sensor 51 (or receiving module 50) is respectively with optical flame detector 52 Cell packaging configuration, proximity sensor 51 are arranged on the second tread 678, and optical flame detector 52 is arranged on the casing outside imaging modules 60 On 20.
Figure 25 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, Receiving module 50 does not include proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively with proximity sensor 51 Cell packaging configuration, optical flame detector 52 are arranged on the second tread 678, and proximity sensor 51 is arranged on the casing outside imaging modules 60 On 20.
Figure 26 is please referred to, the second tread 678 of the above embodiment offers loophole 676, and receiving module 50 is located at phase It is in casing body 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without optical flame detector 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 Light can pass through and loophole 676 and be transmitted on proximity sensor 51.The receiving module 50 of present embodiment is arranged on phase In casing body 67, the structure of receiving module 50 and camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging modules 60 are installed on casing 20.
Please continue to refer to Figure 26, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics Light outside device 100 can pass through loophole 676 and be transmitted on optical flame detector 52.The receiving module 50 of present embodiment is set Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with into As module 60 is installed on casing 20.
Figure 27 is please referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, Receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 is integrated with close to sensing When device 51 and optical flame detector 52, loophole 676 can be one with proximity sensor 51 and the corresponding loophole of optical flame detector 52 or Two spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, the light outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that loophole 676 can be passed through and be transmitted in receiving module 50.In other embodiment party In formula, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are independent for two Single package body structure, at this point, being respectively the proximity sensor 51 of single package body structure and optical flame detector 52 can also be all disposed within It is in camera case 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, makes reception The structure of module 50 and camera case 67 is more stablized and convenient for receiving module 50 and imaging modules 60 are installed on casing 20.
Please continue to refer to Figure 27, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connect with the mainboard 110 with electronic device 100.In other embodiments, receiving module 50 can also be connect with FPC.This reality Apply in mode, be arranged on receiving module 50 on substrate 66 and include proximity sensor 51 and optical flame detector 52, proximity sensor 51 with Single package body structure is collectively formed in optical flame detector 52, reduces gap when the two is individually assembled, saves the installation in electronic device 100 Space.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 is also encapsulated for monomer Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at Outside camera case 67.
In yet another embodiment, receiving module 50 only includes optical flame detector 52, and proximity sensor 51 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 is also encapsulated for monomer Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 In camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66 It goes up and is located at outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.
Also referring to Fig. 1, Figure 28 and Figure 29, in some embodiments, the electronic device 100 of the above embodiment is also Including the mainboard 110 being mounted in casing 20.Mainboard 110 is formed with installation gap 110a.Imaging modules 60 are mounted on casing 20 It is interior and corresponding with installation gap 110a.Receiving module 50 is incorporated on mainboard 110, and stretches into peace from the edge of installation gap 110a Fill notch 110a.Along along the depth direction (Z-direction in such as Figure 28) of installation gap 110a, receiving module 50 and imaging modules 60 It partly overlaps.
Specifically, mainboard 110 can be printed wiring board, and printed wiring board can be hardboard, soft board or Rigid Flex, Electronic component, such as output module 10, receiving module 50, imaging modules 60, receiver 70, infrared light compensating lamp 80 etc. can be with It is connect with mainboard 110, electronic component can be directly installed on mainboard 110 or mounted on electronic device 100 In other structures, then it is connect with mainboard 110 by circuit.Installation gap 110a is formed on mainboard 110, and installation gap 110a can To run through mainboard 110.Imaging modules 60 are in casing 20 and corresponding with installation gap 110a, can be that imaging modules 60 are worn If installation gap 110a；Can also be that (in some embodiments, incidence hole leads to above-mentioned light extraction for the incidence holes of imaging modules 60 Hole 674 corresponds to) it is aligned with installation gap 110a, but do not penetrate installation gap 110a.
Receiving module 50 is incorporated on mainboard 110, and specifically, the pin of receiving module 50 can be welded on mainboard 110 On pad, so that receiving module 50 is fixedly connected with mainboard 110.Receiving module 50 stretches into installation from the edge of installation gap 110a Notch 110a has saved the installation site on mainboard 110.Along the depth direction (Z-direction in such as Figure 29) of installation gap 110a On, receiving module 50 partly overlaps with imaging modules 60, and receiving module 50 can be contacted with each other with imaging modules 60, receiving module 50 with imaging modules 60 can also be interval.Receiving module 50 sets compacter with imaging modules 60, and the two occupies jointly Horizontal space it is smaller (perpendicular to the direction of Z-direction), saved the space inside electronic device 100.
Certainly, receiving module 50 can be integrated with proximity sensor 51 and optical flame detector 52；Receiving module 50 can also be Individually include proximity sensor 51；Receiving module 50, which can also be, individually includes optical flame detector 52.On imaging modules 60 can also be Imaging modules 60 and its deformation of any embodiment are stated, details are not described herein.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention. In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side Formula combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims (14)

1. a kind of electronic device, which is characterized in that including：
Casing；
Module is exported, the output module is arranged in the casing, and the output module includes encapsulating housing, project structured light Device and close to infrared lamp, the encapsulating housing includes package substrate, and the structured light projector is encapsulated with described close to infrared lamp In the encapsulating housing and carry on the package substrate, the structured light projector with it is described can be with close to infrared lamp Different power emits infrared light outside the encapsulating housing；
Module is vibrated, the vibration module installation is on the housing；
Piezoelectric element, the piezoelectric element are combined with the vibration module and export module interval, the piezoelectric element with described For being deformed upon when being applied in electric signal so that the vibration module vibration；
Mainboard, the mainboard are mounted in the casing and are formed with installation gap；
Imaging modules, the imaging modules are mounted in the casing and corresponding with the installation gap；With
Receiving module, the receiving module are incorporated on the mainboard, and stretch into the installation from the edge of the installation gap Notch, along the depth direction of the installation gap, the receiving module partly overlaps with the imaging modules, the reception mould Group includes proximity sensor and/or optical flame detector.
2. electronic device according to claim 1, which is characterized in that the vibration module includes display screen and the lid of light transmission Host cavity is collectively formed on the housing and with the casing in plate, the display screen setting, and the cover board is arranged on the machine On shell and positioned at the side far from the host cavity of the display screen, the display screen is combined with the cover board, the casing It offers spaced casing and vibrates through-hole close to through-hole, casing structure light through-hole and casing, it is described close to infrared lamp and institute It states casing to correspond to close to through-hole, the structured light projector is corresponding with the casing structure light through-hole, the piezoelectric element receiving It is combined in casing vibration through-hole and with the cover board.
3. electronic device according to claim 2, which is characterized in that the piezoelectric element and the display screen pass through engagement Part is attached on the cover board.
4. electronic device according to claim 1, which is characterized in that the output module further includes chip, the structure Light projector is formed in close to infrared lamp on a piece of chip with described.
5. electronic device according to claim 1, which is characterized in that the encapsulating housing further includes package wall and encapsulation Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute It states encapsulation top and is formed with structure light window and close to window, the structure light window is corresponding with the structured light projector, institute State close to window with it is described corresponding close to infrared lamp.
6. electronic device according to claim 1, which is characterized in that the output module is further included close to lamp lens, institute State be arranged in the encapsulating housing close to lamp lens and with it is described corresponding close to infrared lamp.
7. electronic device according to claim 1, which is characterized in that the output module further includes metal shutter, institute Metal shutter is stated to be located in the encapsulating housing and positioned at the structured light projector and described close between infrared lamp.
8. electronic device according to claim 1, which is characterized in that be formed with grounding pin, knot on the output module Structure light pin and close to lamp pin, the grounding pin and the structure light pin be enabled when, structured light projector hair Penetrate infrared light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp emit infrared light.
9. electronic device according to claim 2, which is characterized in that the cover board is formed with the surface that the casing is combined Have and only transmit the infrared through ink of infrared light, the infrared ink that penetrates blocks the casing close to through-hole, the casing knot At least one of structure light through-hole and casing vibration through-hole.
10. electronic device according to claim 1, which is characterized in that the imaging modules include visible image capturing head and At least one of infrared pick-up head.
11. electronic device according to claim 2, which is characterized in that the imaging modules include infrared pick-up head and Visible image capturing head, the electronic device further include infrared light compensating lamp, the output module, the infrared pick-up head, described The center of visible image capturing head, the piezoelectric element and the infrared light compensating lamp is located on same line segment, from the one of the line segment The other end is held to be followed successively by：
The output module, the infrared light compensating lamp, the piezoelectric element, the infrared pick-up head, the visible image capturing Head；Or the output module, the infrared pick-up head, the piezoelectric element, the visible image capturing head, the infrared light filling Lamp；Or the infrared pick-up head, the output module, the piezoelectric element, the visible image capturing head, the infrared light filling Lamp；Or the infrared pick-up head, the visible image capturing head, the piezoelectric element, the output module, the infrared light filling Lamp.
12. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head and infrared light compensating lamp, the output module, the infrared pick-up head, the visible image capturing head and institute The center for stating infrared light compensating lamp is located on same line segment, the piezoelectric element be located at the line segment and the casing top it Between.
13. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head and infrared light compensating lamp, the quantity of the piezoelectric element is multiple, and the quantity of the casing vibration through-hole is more A, multiple piezoelectric elements are corresponding with multiple casing vibration through-holes, and each piezoelectric element is housed in corresponding institute It states in casing vibration through-hole, the output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectricity The center of element and the infrared light compensating lamp is located on same line segment, is provided between the two neighboring piezoelectric element described defeated Go out at least one of module, the infrared pick-up head, the visible image capturing head and described infrared light compensating lamp.
14. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head and infrared light compensating lamp, the piezoelectric element include piezoelectric body and the piezoelectricity stretched out from the piezoelectric body Convex block, the quantity of the casing vibration through-hole is multiple, and multiple piezoelectricity convex blocks are corresponding with multiple casing vibration through-holes, Each piezoelectricity convex portion is housed in the corresponding casing vibration through-hole and is combined with the cover board, the output mould Group, the infrared pick-up head, the visible image capturing head and the infrared light compensating lamp are located at the cover board and the piezoelectricity sheet Between body, the output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectricity convex blocks and described The center of infrared light compensating lamp is located on same line segment, and the output module, institute are provided between the two neighboring piezoelectricity convex block State at least one of infrared pick-up head, the visible image capturing head and described infrared light compensating lamp.
CN201711433448.2A 2017-12-26 2017-12-26 Electronic device Pending CN108173988A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711433448.2A CN108173988A (en) 2017-12-26 2017-12-26 Electronic device

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Application Number Priority Date Filing Date Title
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Publications (1)

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Country Status (1)

Country Link
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103515371A (en) * 2012-06-27 2014-01-15 格科微电子（上海）有限公司 Integrated optical sensor package
CN204145746U (en) * 2014-07-29 2015-02-04 东莞劲胜精密组件股份有限公司 A kind of electroacoustic sensing device and there is the mobile phone of this device
CN106550228A (en) * 2015-09-16 2017-03-29 上海图檬信息科技有限公司 Obtain the equipment of the depth map of three-dimensional scenic

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103515371A (en) * 2012-06-27 2014-01-15 格科微电子（上海）有限公司 Integrated optical sensor package
CN204145746U (en) * 2014-07-29 2015-02-04 东莞劲胜精密组件股份有限公司 A kind of electroacoustic sensing device and there is the mobile phone of this device
CN106550228A (en) * 2015-09-16 2017-03-29 上海图檬信息科技有限公司 Obtain the equipment of the depth map of three-dimensional scenic

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