CN108140557A - 压印用的模板制造装置及模板制造方法 - Google Patents
压印用的模板制造装置及模板制造方法 Download PDFInfo
- Publication number
- CN108140557A CN108140557A CN201680040733.5A CN201680040733A CN108140557A CN 108140557 A CN108140557 A CN 108140557A CN 201680040733 A CN201680040733 A CN 201680040733A CN 108140557 A CN108140557 A CN 108140557A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- template
- liquid
- lyophoby
- ingredient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0204—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to the edges of essentially flat articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
- B29C2033/426—Stampers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/757—Moulds, cores, dies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-140425 | 2015-07-14 | ||
JP2015140425A JP6529843B2 (ja) | 2015-07-14 | 2015-07-14 | インプリント用のテンプレート製造装置及びテンプレート製造方法 |
PCT/JP2016/070800 WO2017010540A1 (ja) | 2015-07-14 | 2016-07-14 | インプリント用のテンプレート製造装置及びテンプレート製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108140557A true CN108140557A (zh) | 2018-06-08 |
CN108140557B CN108140557B (zh) | 2022-03-15 |
Family
ID=57757180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201680040733.5A Active CN108140557B (zh) | 2015-07-14 | 2016-07-14 | 压印用的模板制造装置及模板制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10773425B2 (zh) |
JP (1) | JP6529843B2 (zh) |
KR (1) | KR102035329B1 (zh) |
CN (1) | CN108140557B (zh) |
TW (1) | TW201711821A (zh) |
WO (1) | WO2017010540A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI795681B (zh) * | 2019-10-14 | 2023-03-11 | 義大利商沙克米機械合作伊莫拉公司 | 用於轉移一劑量的聚合物材料之系統及相關轉移方法以及用於供應一劑量的聚合物材料之方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6529842B2 (ja) * | 2015-07-14 | 2019-06-12 | 芝浦メカトロニクス株式会社 | インプリント用のテンプレート製造装置及びテンプレート製造方法 |
TWI646389B (zh) * | 2017-09-12 | 2019-01-01 | 友達光電股份有限公司 | 壓印模具以及壓印模具製造方法 |
CN108480139B (zh) * | 2018-05-29 | 2024-04-05 | 天津爱码信自动化技术有限公司 | 一种智能涂布刻印机 |
Citations (11)
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JP2008100378A (ja) * | 2006-10-17 | 2008-05-01 | Dainippon Printing Co Ltd | パターン形成体の製造方法 |
JP2010251601A (ja) * | 2009-04-17 | 2010-11-04 | Toshiba Corp | テンプレート及びその製造方法、並びにパターン形成方法 |
JP2011053266A (ja) * | 2009-08-31 | 2011-03-17 | Daikin Industries Ltd | 撥液−親液パターニング用トップコート組成物 |
CN102208335A (zh) * | 2010-03-31 | 2011-10-05 | 株式会社东芝 | 模板的表面处理方法及装置以及图案形成方法 |
US20120097336A1 (en) * | 2009-06-24 | 2012-04-26 | Tokyo Electron Limited | Template treatment apparatus and imprint system |
JP2012099729A (ja) * | 2010-11-04 | 2012-05-24 | Toshiba Corp | テンプレート、テンプレートの形成方法及び半導体装置の製造方法 |
JP2012164787A (ja) * | 2011-02-07 | 2012-08-30 | Dainippon Printing Co Ltd | インプリント用モールド、およびインプリント方法 |
CN103068556A (zh) * | 2010-08-06 | 2013-04-24 | 综研化学株式会社 | 纳米压印用树脂制模具及其制造方法 |
TW201428819A (zh) * | 2012-11-15 | 2014-07-16 | Fujifilm Corp | 奈米壓印方法及使用其之圖案化基板之製造方法 |
JP2014160754A (ja) * | 2013-02-20 | 2014-09-04 | Dainippon Printing Co Ltd | インプリントモールド、インプリント方法及び半導体装置の製造方法 |
US20150037540A1 (en) * | 2013-07-31 | 2015-02-05 | Kabushiki Kaisha Toshiba | Template, a method of processing a template, a method of producing a pattern, and resist |
Family Cites Families (18)
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JPS52154770A (en) | 1976-06-12 | 1977-12-22 | Niigata Engineering Co Ltd | Apparatus for producing compost |
JPS5537517A (en) | 1978-09-08 | 1980-03-15 | Hitachi Ltd | Driving circuit of compressor motor |
JPH0786147B2 (ja) * | 1991-02-20 | 1995-09-20 | 松下電器産業株式会社 | プラスチック製乗り物用部品の製造方法 |
JPH0786148B2 (ja) * | 1991-02-25 | 1995-09-20 | 松下電器産業株式会社 | プラスチック製事務用品の製造方法 |
JP4695679B2 (ja) * | 2008-08-21 | 2011-06-08 | 株式会社東芝 | テンプレートの洗浄方法及びパターン形成方法 |
JP5617239B2 (ja) * | 2009-12-25 | 2014-11-05 | 富士通株式会社 | 保護膜付きレジストパターン形成用部材とその製造方法、及びレジストパターンの製造方法 |
CN103079788B (zh) | 2010-08-06 | 2015-06-10 | 综研化学株式会社 | 树脂制模具、其制造方法及其使用方法 |
JP5537517B2 (ja) | 2011-09-09 | 2014-07-02 | 株式会社東芝 | テンプレート洗浄装置 |
JP2013074257A (ja) * | 2011-09-29 | 2013-04-22 | Fujifilm Corp | ナノインプリント用のモールドおよびその製造方法並びにナノインプリント方法 |
JP5520270B2 (ja) | 2011-09-30 | 2014-06-11 | 富士フイルム株式会社 | ナノインプリント用のモールドおよびその製造方法並びにそのモールドを用いたナノインプリント方法およびパターン化基板の製造方法 |
JP5951566B2 (ja) * | 2013-08-23 | 2016-07-13 | 株式会社東芝 | モールド洗浄装置及びモールド洗浄方法 |
JP2016157785A (ja) * | 2015-02-24 | 2016-09-01 | 株式会社東芝 | テンプレート形成方法、テンプレートおよびテンプレート基材 |
WO2016159312A1 (ja) * | 2015-03-31 | 2016-10-06 | 芝浦メカトロニクス株式会社 | インプリント用のテンプレート製造装置 |
JP6532419B2 (ja) * | 2015-03-31 | 2019-06-19 | 芝浦メカトロニクス株式会社 | インプリント用のテンプレート製造装置 |
JP2016195169A (ja) * | 2015-03-31 | 2016-11-17 | 芝浦メカトロニクス株式会社 | インプリント用のテンプレート |
WO2016159310A1 (ja) * | 2015-03-31 | 2016-10-06 | 芝浦メカトロニクス株式会社 | インプリント用のテンプレート製造装置 |
JP6486206B2 (ja) * | 2015-03-31 | 2019-03-20 | 芝浦メカトロニクス株式会社 | インプリント用のテンプレート製造装置 |
JP6529842B2 (ja) * | 2015-07-14 | 2019-06-12 | 芝浦メカトロニクス株式会社 | インプリント用のテンプレート製造装置及びテンプレート製造方法 |
-
2015
- 2015-07-14 JP JP2015140425A patent/JP6529843B2/ja active Active
-
2016
- 2016-07-14 TW TW105122238A patent/TW201711821A/zh unknown
- 2016-07-14 CN CN201680040733.5A patent/CN108140557B/zh active Active
- 2016-07-14 WO PCT/JP2016/070800 patent/WO2017010540A1/ja active Application Filing
- 2016-07-14 KR KR1020187004393A patent/KR102035329B1/ko active IP Right Grant
-
2018
- 2018-01-02 US US15/860,044 patent/US10773425B2/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008100378A (ja) * | 2006-10-17 | 2008-05-01 | Dainippon Printing Co Ltd | パターン形成体の製造方法 |
JP2010251601A (ja) * | 2009-04-17 | 2010-11-04 | Toshiba Corp | テンプレート及びその製造方法、並びにパターン形成方法 |
US20120097336A1 (en) * | 2009-06-24 | 2012-04-26 | Tokyo Electron Limited | Template treatment apparatus and imprint system |
JP2011053266A (ja) * | 2009-08-31 | 2011-03-17 | Daikin Industries Ltd | 撥液−親液パターニング用トップコート組成物 |
CN102208335A (zh) * | 2010-03-31 | 2011-10-05 | 株式会社东芝 | 模板的表面处理方法及装置以及图案形成方法 |
CN103068556A (zh) * | 2010-08-06 | 2013-04-24 | 综研化学株式会社 | 纳米压印用树脂制模具及其制造方法 |
JP2012099729A (ja) * | 2010-11-04 | 2012-05-24 | Toshiba Corp | テンプレート、テンプレートの形成方法及び半導体装置の製造方法 |
JP2012164787A (ja) * | 2011-02-07 | 2012-08-30 | Dainippon Printing Co Ltd | インプリント用モールド、およびインプリント方法 |
TW201428819A (zh) * | 2012-11-15 | 2014-07-16 | Fujifilm Corp | 奈米壓印方法及使用其之圖案化基板之製造方法 |
JP2014160754A (ja) * | 2013-02-20 | 2014-09-04 | Dainippon Printing Co Ltd | インプリントモールド、インプリント方法及び半導体装置の製造方法 |
US20150037540A1 (en) * | 2013-07-31 | 2015-02-05 | Kabushiki Kaisha Toshiba | Template, a method of processing a template, a method of producing a pattern, and resist |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI795681B (zh) * | 2019-10-14 | 2023-03-11 | 義大利商沙克米機械合作伊莫拉公司 | 用於轉移一劑量的聚合物材料之系統及相關轉移方法以及用於供應一劑量的聚合物材料之方法 |
Also Published As
Publication number | Publication date |
---|---|
KR102035329B1 (ko) | 2019-10-22 |
TW201711821A (zh) | 2017-04-01 |
WO2017010540A1 (ja) | 2017-01-19 |
US20180117795A1 (en) | 2018-05-03 |
JP2017022308A (ja) | 2017-01-26 |
JP6529843B2 (ja) | 2019-06-12 |
US10773425B2 (en) | 2020-09-15 |
CN108140557B (zh) | 2022-03-15 |
KR20180030138A (ko) | 2018-03-21 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: Kanagawa Applicant after: SHIBAURA MACHINE CO.,LTD. Applicant after: Kaixia Co.,Ltd. Address before: Kanagawa Applicant before: SHIBAURA MACHINE CO.,LTD. Applicant before: TOSHIBA MEMORY Corp. Address after: Kanagawa Applicant after: SHIBAURA MACHINE CO.,LTD. Applicant after: TOSHIBA MEMORY Corp. Address before: Kanagawa Applicant before: SHIBAURA MACHINE CO.,LTD. Applicant before: Japanese businessman Panjaya Co.,Ltd. |
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CB02 | Change of applicant information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220104 Address after: Kanagawa Applicant after: SHIBAURA MACHINE CO.,LTD. Applicant after: Japanese businessman Panjaya Co.,Ltd. Address before: Kanagawa Applicant before: SHIBAURA MACHINE CO.,LTD. Applicant before: TOSHIBA MEMORY Corp. |
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TA01 | Transfer of patent application right | ||
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