CN108054099B - 半导体功率器件的制作方法 - Google Patents
半导体功率器件的制作方法 Download PDFInfo
- Publication number
- CN108054099B CN108054099B CN201711325070.4A CN201711325070A CN108054099B CN 108054099 B CN108054099 B CN 108054099B CN 201711325070 A CN201711325070 A CN 201711325070A CN 108054099 B CN108054099 B CN 108054099B
- Authority
- CN
- China
- Prior art keywords
- layer
- polycrystalline silicon
- region
- oxide layer
- body region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims description 52
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 130
- 238000005530 etching Methods 0.000 claims abstract description 34
- 238000002513 implantation Methods 0.000 claims abstract description 26
- 230000003647 oxidation Effects 0.000 claims abstract description 20
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 20
- 238000002347 injection Methods 0.000 claims abstract description 16
- 239000007924 injection Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 229920005591 polysilicon Polymers 0.000 claims description 57
- 239000002184 metal Substances 0.000 claims description 19
- -1 boron ions Chemical class 0.000 claims description 17
- 150000002500 ions Chemical class 0.000 claims description 17
- 229910052796 boron Inorganic materials 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 10
- 230000001590 oxidative effect Effects 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000002210 silicon-based material Substances 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 230000005669 field effect Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711325070.4A CN108054099B (zh) | 2017-12-12 | 2017-12-12 | 半导体功率器件的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711325070.4A CN108054099B (zh) | 2017-12-12 | 2017-12-12 | 半导体功率器件的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108054099A CN108054099A (zh) | 2018-05-18 |
CN108054099B true CN108054099B (zh) | 2020-08-28 |
Family
ID=62132327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711325070.4A Expired - Fee Related CN108054099B (zh) | 2017-12-12 | 2017-12-12 | 半导体功率器件的制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108054099B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109119478A (zh) * | 2018-09-04 | 2019-01-01 | 深圳市南硕明泰科技有限公司 | 一种芯片及其制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5248627A (en) * | 1992-03-20 | 1993-09-28 | Siliconix Incorporated | Threshold adjustment in fabricating vertical dmos devices |
US8476697B1 (en) * | 2003-04-11 | 2013-07-02 | Purdue Research Foundation | Short-channel silicon carbide power MOSFET |
CN105470297A (zh) * | 2014-09-10 | 2016-04-06 | 北大方正集团有限公司 | 一种vdmos器件及其制作方法 |
-
2017
- 2017-12-12 CN CN201711325070.4A patent/CN108054099B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5248627A (en) * | 1992-03-20 | 1993-09-28 | Siliconix Incorporated | Threshold adjustment in fabricating vertical dmos devices |
US8476697B1 (en) * | 2003-04-11 | 2013-07-02 | Purdue Research Foundation | Short-channel silicon carbide power MOSFET |
CN105470297A (zh) * | 2014-09-10 | 2016-04-06 | 北大方正集团有限公司 | 一种vdmos器件及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN108054099A (zh) | 2018-05-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101811796B1 (ko) | 급경사 접합 프로파일을 갖는 소스/드레인 영역들을 구비하는 반도체 소자 및 그 제조방법 | |
KR100218260B1 (ko) | 트랜치 게이트형 모스트랜지스터의 제조방법 | |
US9583587B2 (en) | Method for manufacturing injection-enhanced insulated-gate bipolar transistor | |
CN104134688A (zh) | 制造双极晶体管的方法、双极晶体管和集成电路 | |
CN105679667A (zh) | 一种沟槽igbt器件的终端结构制造方法 | |
CN103871887B (zh) | Pmos晶体管、nmos晶体管及其各自的制作方法 | |
CN103579003A (zh) | 一种制作超结mosfet的方法 | |
CN106298479B (zh) | 一种功率器件的结终端扩展结构及其制造方法 | |
CN108054099B (zh) | 半导体功率器件的制作方法 | |
CN108155244B (zh) | 沟槽型联栅晶体管及其制作方法 | |
CN107293486B (zh) | 带有esd结构的沟槽型半导体器件及其制造方法 | |
CN107342224B (zh) | Vdmos器件的制作方法 | |
CN111128725B (zh) | 一种igbt器件制备方法 | |
CN108054210B (zh) | 沟槽型垂直双扩散金属氧化物晶体管及其制作方法 | |
CN112309853A (zh) | 屏蔽栅极沟槽结构的制备方法 | |
KR100636674B1 (ko) | 반도체 소자의 게이트 및 이의 형성 방법 | |
CN108133894B (zh) | 沟槽型垂直双扩散金属氧化物晶体管及其制作方法 | |
CN102543823B (zh) | 一种浅沟槽隔离制作方法 | |
CN106257646B (zh) | 嵌入pip电容的cmos制作方法 | |
CN105845569B (zh) | 鳍式场效应晶体管及其形成方法 | |
CN103377939B (zh) | 沟槽式功率半导体结构的制造方法 | |
KR100320436B1 (ko) | 모스팻(mosfet) 제조방법 | |
CN103165453A (zh) | 高介电金属栅mos及其制造方法 | |
CN108039372B (zh) | 沟槽型垂直双扩散金属氧化物晶体管及其制作方法 | |
CN108010968B (zh) | 鳍式场效应晶体管及其制作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200805 Address after: 210000 Kechuang building, Futian Road, Zhetang street, Lishui Economic Development Zone, Nanjing City, Jiangsu Province Applicant after: Nanjing Lishui hi tech Venture Capital Management Co.,Ltd. Address before: 518000 Electronic Commerce Incubation Base of Tenglong Road Gold Rush, Longhua Street, Longhua New District, Shenzhen City, Guangdong Province Applicant before: Shenzhen Meliao Technology Transfer Center Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210114 Address after: 211299 science and technology innovation center, No.5 Shiqiu Avenue, Shiqiu street, Lishui District, Nanjing City, Jiangsu Province Patentee after: Jiangsu Qinglian Optoelectronic Technology Research Institute Co., Ltd Address before: 210000 Kechuang building, Futian Road, Zhetang street, Lishui Economic Development Zone, Nanjing, Jiangsu Province Patentee before: Nanjing Lishui hi tech Venture Capital Management Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200828 Termination date: 20201212 |
|
CF01 | Termination of patent right due to non-payment of annual fee |